M429314 五、新型說明： 【新型所屬之技術領域】 本創作是有關一種導熱裝置，尤指一種將導熱管裝配 基座與蓋板之間的導熱裝置。 【先前技術】 隨著生活的進步，現代社會對於電力能源的開發及節 能產品的需求節節上升。然而電力的使用常伴隨著熱的產 生，過多的熱則會使溫度過度上昇導致機器產品的故障損 壞，為排除多餘的熱，現今使用的電力產品多數都裝設有 導熱裝置，導熱裝置的種類更是不勝牧舉。 習知的導熱管在其裝配導熱座時，是將導熱管穿置於 導熱座的固定槽後用膠水粘貼或是錫膏焊接，再行衝壓或 銑切，可能造成導熱管結構的損壞及導熱效果不佳。 緣是，本創作人有感上述缺失之可改善，乃特潛心研 究並配合學理之運用，終於提出一種設計合理且有效改善 上述缺失之本創作。 【新型内容】 本創作實施例在於提供一種導熱裝置，尤指一種便利 組裝，可省略用膠水粘貼或是錫膏焊接，使導熱管固定接 合的結構。 本創作實施例提供一種導熱裝置，用以設置於一發熱 單元上，該導熱裝置包含：一基座，包含一承載部及一 固定部，該承載部形成有一穿孔，該固定部自該承載部 延伸所形成；一蓋板，包含一定位部，該定位部裝設於 該墓座之固定部；至少一導熱管，包含一接觸部/該接 觸部夾設於該基座與該蓋板之間，且該接觸部穿設於該 3/11 M429314 基座的穿孔，用以抵接於該發熱單元；其 抵接於該發鮮大致平面狀。x觸。f5 综上所述，本創作可具有以下有益的效果： 本創作的導熱裝置直接卡合固定導熱管，因此 用膠水粘貼咬是錫春士曰# -T/i ^ 不而要 疋錫《坏接，可使成本降低，且蓋板以 方式固定於基座上’喊上方便容易。 ° 、為使能更進-㈣解本創作之特徵及_内容，請參 閱以下有關本創作謂細說明與附圖，但是此等說明與所 附圖式僅係用來說明本創作，而非對本創作的權利圍 任何的限制。 【實施方式】 〔第—實施例〕 二麥閱圖1至圖8，本創作提供一種導熱裝置，本會 1的導熱，置用於-發熱單元5的導熱與散熱，該發熱單 元:以是中央處理器或電子元件，但不以此為限。 月> 閱圖1至圖3’在本實施例中揭示為一種導熱裝 ’ ^括有-基座1、-蓋板2及三個導熱管3。 其中，上述基座1可利用金屬製成。基座1形成有一 及—固定部12，承載部11為一板體，其内部形 穿孔112，固定部丨2為承載部11延伸形成，固定部 四個凸體121 ’在本實施例中是以設有四個&體121 二番Γ不文限於此。承栽部11相對兩侧且鄰近穿孔112 μ形成有一個斜面111，在本實施例中總共設有二個 I;為：’基座1的型式並不限制。· 盍板2為對應基座1的承載部1〗而形成的板體 4/11 M429314 ，蓋板2上具有一定位部21，定位部21為自蓋板2周緣凹 設所形成的4個定位槽211，本實施例中係以四個定位槽 211為例，但不受限於此。該些定位槽211分別對應固定部 12的該些凸體121，定位槽211緊配地套設於凸體121。 每一導熱管3具有一接觸部31及一延伸部32。該延伸 部32由接觸部31的兩端各別延伸形成，本實施例中基座1 與盖板2之間夹設有二個導熱官3。 請參閱圖4及圖5，該些導熱管3的接觸部31並排且 穿設於承載部11的穿孔112,該些導熱管3的接觸部31抵 接於承載部11的穿孔112側壁，接觸部31抵接於發熱單 元5的部位大致呈平面狀，藉以達到較佳的散熱效果。該 些導熱管3的接觸部.31抵接於發熱單元5的部位與承載部 11鄰近發熱單元5的表面大致平行。該些導熱管3的型式 並不限制。 請參閱圖6至圖8，上述導熱裝置可裝設有一散熱片 組合。所述散熱片組合包含數個相互堆疊的散熱片，每一 散熱片4為一片狀，且每一散熱片4包括一基板4]、形成 於基板41的三個貫穿孔42、三組自基板41翻孔成喇叭狀 的鰭片43、一堆疊部44以及一折疊部45。在本實施例中 設有導熱管3的數量與貫穿孔42的數量相同且各為三個。 散熱片4的型式並不以此為限。 貫穿孔42用以套設於導熱管3的延伸部32，且基板 41於每一貫穿孔42旁設有一組翻孔成°刺σ八狀的籍片43。 〇 所述每組鰭片43開設數個小槽431，亦即，任兩鰭片 43之間以一個小槽431分隔，藉以使每一鰭片43具有一定 5/11 M429314- 的彈性，進而令散熱片4套設於導熱管3 管3之延伸部32，散熱片4與延伸部32大致=裎緊抵導熱 片4套設導熱管3,鰭片43使貫穿孔42^^王垂直。散熱 使每一散熱片4均緊配地套設導熱管3， 外擴變形，並 效率，達到較佳的散熱效果。 n政熱片4使用 在本實施例令堆疊部44設有六個小 小方孔441旁的該基板丨延伸形成的六、孔44]及自 堆疊部44的型式並不限制。換言之，每合邊料2， 兩側分別開出一個小方孔441，並將位方f貫穿孔42的 的疊合邊442折彎成一個片距。 】、方孔441旁 藉此，任兩相堆疊的散熱片4係由复 的堆疊部44之疊合邊442頂抵於另—:、中—散熱片4 部44之疊合邊442,以加強分隔兩散=熱片4的堆疊 —折疊部45為數個位於基板41邊緣的作用。 貫施例中係設有四個折邊451，該折疊 邊45】，在本 緣彎折延伸形成，任兩相堆疊的散敛^ 係由基板1邊 片4的折疊部《頂抵於另_散熱片二二，中一散熱 45的型式並不限制。 宜。卩45。折疊部 〔苐二貫施例〕 請參閱圖9，其為本創作的第二實施 第-實施例不同之處主要在於本實施例散熱實施例與 -卡扣部46，用以取代折疊部45，具體說明株供有 卡扣部46具有一卡接體461與-卡接幻 體⑹是以基板41相對兩端面沖壓與^ 卡接 ，可逹到節省材料的目的。卡接槽· “ = 圍所形成’且對應相鄰接之卡接體461，任兩“。 M429314 . > 散熱片4忐其中一散熱片的卡接體461與另一散熱片4 的卡接槽462結合，達到維持任兩堆疊散熱片4之相對 位置的目的。此外，卡扣部46的型式旅不眼制° 本創作實施例中，多個散熱片4可〆农袭設於三個導 熱管3 ’因此不需要散熱片4單片分次裝設’开使時間成本 有效的降低，且透過基座1和蓋板2卡合固定三個導熱管3 ，不需要用膠水粘貼或是錫膏焊接，節省製造成本，導熱M429314 V. New description: [New technical field] This creation is related to a heat-conducting device, especially a heat-conducting device that assembles a heat-conducting tube between a base and a cover. [Prior Art] With the advancement of life, the demand for power energy development and energy-saving products in modern society has increased. However, the use of electricity is often accompanied by the generation of heat. Excessive heat causes the temperature to rise excessively and causes damage to the machine product. To eliminate excess heat, most of the power products used today are equipped with heat-conducting devices. Even more is the pastoral move. When the heat pipe is assembled, the heat pipe is placed in the fixing groove of the heat conducting seat, and then glued or soldered, and then stamped or milled, which may cause damage and heat conduction of the heat pipe structure. not effectively. The reason is that this creator feels that the above-mentioned deficiencies can be improved. He is devoted to research and using the theory, and finally proposes a creation that is reasonable in design and effective in improving the above-mentioned defects. [New Content] The present embodiment is to provide a heat conducting device, in particular, a convenient assembly, which can omit the structure in which the heat pipe is fixedly joined by glue sticking or solder paste soldering. The embodiment of the present invention provides a heat conducting device for being disposed on a heat generating unit. The heat conducting device includes: a base, including a bearing portion and a fixing portion, the bearing portion is formed with a through hole, and the fixing portion is from the bearing portion Formed by the extension; a cover plate includes a positioning portion, the positioning portion is mounted on the fixed portion of the tomb; at least one heat pipe includes a contact portion/the contact portion is sandwiched between the base and the cover plate And the contact portion is disposed through the through hole of the 3/11 M429314 base for abutting against the heat generating unit; the abutting portion is substantially planar. x touch. F5 In summary, the creation can have the following beneficial effects: The heat-conducting device of the present invention directly engages and fixes the heat-conducting tube, so the adhesive bite with the glue is the tin spring 曰#-T/i ^ not the 疋 tin "bad" The connection can reduce the cost, and the cover plate is fixed on the base in a manner of 'speaking conveniently and easily. °, in order to be more advanced - (d) to solve the characteristics of this creation and _ content, please refer to the following description of the creation of the details and drawings, but these descriptions and drawings are only used to illustrate the creation, not Any restrictions on the rights of this creation. [Embodiment] [First Embodiment] Two wheats are shown in Fig. 1 to Fig. 8. The present invention provides a heat conducting device. The heat conduction of the present invention 1 is used for heat conduction and heat dissipation of the heat generating unit 5, and the heat generating unit is Central processor or electronic components, but not limited to this. Month> Referring to Figures 1 to 3', in the present embodiment, a heat-conducting package is disclosed as a base 1, a cover plate 2, and three heat transfer tubes 3. Wherein, the susceptor 1 can be made of metal. The base 1 is formed with a fixing portion 12, the bearing portion 11 is a plate body, and the inner portion is formed with a through hole 112. The fixing portion 2 is formed by extending the bearing portion 11 and the fixing portion 4 is formed by a convex portion 121' in this embodiment. To have four & body 121 is not limited to this. A slope 111 is formed on opposite sides of the bearing portion 11 and adjacent to the through hole 112 μ. In the present embodiment, a total of two I are provided; the following: The type of the base 1 is not limited. The sill plate 2 is a plate body 4/11 M429314 formed corresponding to the bearing portion 1 of the susceptor 1. The cover plate 2 has a positioning portion 21, and the positioning portion 21 is formed by recessing the periphery of the cover plate 2 The positioning slot 211 is exemplified by four positioning slots 211 in this embodiment, but is not limited thereto. The positioning grooves 211 respectively correspond to the protrusions 121 of the fixing portion 12, and the positioning grooves 211 are tightly sleeved on the protrusions 121. Each heat pipe 3 has a contact portion 31 and an extension portion 32. The extending portion 32 is formed by extending the two ends of the contact portion 31. In the embodiment, two heat conducting members 3 are interposed between the base 1 and the cover plate 2. Referring to FIG. 4 and FIG. 5 , the contact portions 31 of the heat transfer tubes 3 are arranged side by side and pass through the through holes 112 of the bearing portion 11 . The contact portions 31 of the heat transfer tubes 3 abut against the side walls of the through holes 112 of the bearing portion 11 and are in contact with each other. The portion of the portion 31 that abuts on the heat generating unit 5 is substantially planar, thereby achieving a better heat dissipation effect. The portion of the heat transfer pipe 3 where the contact portion 31 abuts against the heat generating unit 5 is substantially parallel to the surface of the load bearing portion 11 adjacent to the heat generating unit 5. The types of the heat transfer tubes 3 are not limited. Referring to Figures 6-8, the heat conducting device may be provided with a heat sink assembly. The heat sink assembly includes a plurality of heat sinks stacked on each other, each heat sink 4 being in the form of a sheet, and each heat sink 4 includes a substrate 4], three through holes 42 formed in the substrate 41, and three groups. The substrate 41 is turned into a flared fin 43, a stacking portion 44, and a folded portion 45. In the present embodiment, the number of the heat transfer pipes 3 is the same as the number of the through holes 42 and each is three. The type of the heat sink 4 is not limited thereto. The through hole 42 is sleeved on the extending portion 32 of the heat pipe 3, and the substrate 41 is provided with a set of sheets 43 which are turned into a shape. Each of the fins 43 defines a plurality of small grooves 431, that is, any two fins 43 are separated by a small groove 431, so that each fin 43 has a certain elasticity of 5/11 M429314-, and further The heat sink 4 is sleeved on the extending portion 32 of the heat pipe 3, and the heat sink 4 and the extending portion 32 are substantially tightly pressed against the heat conducting sheet 4, and the heat conducting tube 3 is disposed. The fin 43 is perpendicular to the through hole 42. Heat dissipation Each heat sink 4 is tightly fitted with a heat pipe 3, which is externally expanded and deformed, and has an efficiency to achieve a better heat dissipation effect. n The use of the heat sheet 4 in the present embodiment is such that the stacking portion 44 is provided with six small square holes 441 which are formed by the extension of the substrate 丨, and the pattern of the self-stacking portion 44 is not limited. In other words, each of the side materials 2 has a small square hole 441 formed on both sides, and the overlapping side 442 of the square side through hole 42 is bent into a sheet pitch. By the side of the square hole 441, any two-phase stacked heat sink 4 is erected by the overlapping side 442 of the complex stacking portion 44 against the overlapping side 442 of the other, middle-heat sink 4 portion 44, The separation of the two dispersions = the stack of the hot sheets 4 - the folded portions 45 are located at the edges of the substrate 41. In the embodiment, there are four flanges 451, which are formed by bending at the edge, and the stacking of the two phases is performed by the folded portion of the side panel 4 of the substrate 1 _ heat sink 22, the type of heat sink 45 is not limited. should.卩45. Folding portion (refer to FIG. 9 ) Referring to FIG. 9 , the second embodiment of the present invention differs mainly in the heat dissipation embodiment and the fastening portion 46 of the present embodiment in place of the folding portion 45 . Specifically, the clip-providing portion 46 has a snap-fit body 461 and a snap-on phantom (6) for punching and snapping the opposite end faces of the substrate 41 to save material. The card slot "" = formed" and corresponds to the adjacent card connector 461, either "". M429314. > The heat sink 4 忐 one of the heat sink engaging bodies 461 is combined with the engaging groove 462 of the other heat sink 4 to achieve the purpose of maintaining the relative positions of any two stacked heat sinks 4. In addition, the type of the buckle portion 46 is not eye-catching. In the present embodiment, the plurality of fins 4 can be disposed on the three heat pipes 3' so that the heat sink 4 is not required to be installed in a single piece. The time cost is effectively reduced, and the three heat pipes 3 are locked and fixed through the base 1 and the cover plate 2, and no glue paste or solder paste welding is required, thereby saving manufacturing cost and heat conduction.
官3平行貼設於發熱單元5上，可提升於導熱裝置的散熱 夕文率。 —惟以场述僅為本解讀好關，非帛欲偏限本 ====本創作說明書及圖式内 圍内，合予陳明。ΰ仏3於本創作的權利保護範 L圖式簡單說明】 為本創作導歸置之立體分麻意圖。 -2為本創作導熱裝置之立體分解示意圖 圖3為本創作導熱裝置之立體分解示意圖（I): 圖4為本創作導熱裝置之局部平面示意圖（―）。 圖5為本創作導熱裝置之局部平面示意圖（二） 圖6為^料熱裝置裝設有散熱片組合之立體分解示意 圖7為=創作導熱裝置裝設有散熱片組合之立體组合示意 圖8為本創作導熱裝置裝設有散熱片組合之 立 圖9為本創作第：實施例之刪組合的立體分 7/Π M429314 【主要元件符號說明】 1基座 11承載部 111斜面 112穿孔 12固定部 121凸體 2蓋板 21定位部 211定位槽 3導熱管 31接觸部 32延伸部 4散熱片 41基板 42貫穿孔 43緣-片_______ _ 431小槽 44堆疊部 441小方孔 442疊合邊 45折疊部 45]折邊 46卡扣部The official 3 is attached to the heat generating unit 5 in parallel, which can improve the heat dissipation rate of the heat conducting device. - Only the interpretation of this is a good example of this interpretation, and it is not intended to limit the book. ==== Within the scope of this creation manual and the drawings, it is given to Chen Ming. ΰ仏3 The rights protection model of this creation L. The simple description of the schema] is the stereoscopic intention of the creation of the creative guide. -2 is a three-dimensional exploded view of the heat-conducting device of the present invention. Figure 3 is a three-dimensional exploded view of the heat-conducting device (I): Figure 4 is a partial plan view (-) of the heat-conducting device. FIG. 5 is a partial plan view of the heat conducting device of the present invention. FIG. 6 is a three-dimensional exploded view of the heat sink assembly with the heat sink assembly. The vertical heat transfer device is provided with a heat sink combination. FIG. 9 is a three-dimensional sub-section of the creation of the present embodiment: 7/Π M429314 [Main component symbol description] 1 base 11 bearing portion 111 bevel 112 perforation 12 fixing portion 121 Protrusion 2 cover plate 21 positioning portion 211 positioning groove 3 heat pipe 31 contact portion 32 extension portion 4 heat sink 41 substrate 42 through hole 43 edge - sheet _______ _ 431 small groove 44 stack portion 441 small square hole 442 overlap side 45 Folding portion 45] Folding portion 46 buckle portion