M428951 ___ 101年.03月2—7日接正替換頁 五、新型說明： 【新型所屬之技術領域】 [0001] 本創作係有關玻璃或玻璃陶資》等可塑性材料成型的裝置 ’尤其是有關具有多孔性模具的可塑性材料成型的裝置 〇 [先前技術] [0002] 玻璃或玻璃陶瓷等材料，可被加熱變形，置於模具上形 成所要的形狀。申請人獲准的台灣專利1323726，揭示一 • 種可塑性材料成型的裝置，包括一多孔性模具結合於一 座體的内部’多孔性模具的下端面备座體的底板之間具 有間隙形成一封閉空間；座體具備有至少一與間隙連通 的真空連接部；當一可塑性基材置於多孔性模具的成型 面上端，被加熱至它的變形溫度以上，使可塑性基材向 下方彎曲變形.，同時由多孔性模具的下方抽出多孔性模 具上端的成型面與可塑性基材之間的空氣，使可塑性基 材的下端面與成型面緊密的貼合，再使該可塑性基材冷 • 卻至常溫而為一成品。 ·.M428951 ___ 101 years. March 2nd-7th, the replacement page is 5, the new description: [New technical field] [0001] This creation is related to the plastic material forming equipment such as glass or glass ceramics' especially relevant Device for molding a plastic material having a porous mold 先前 [Prior Art] [0002] A material such as glass or glass ceramic can be heat-deformed and placed on a mold to form a desired shape. Applicant's approved Taiwan Patent No. 1,323,726 discloses a device for molding a plastic material, comprising a porous mold bonded to the inner portion of the inner body of the porous mold. The bottom surface of the spare body has a gap to form a closed space. The seat body is provided with at least one vacuum connection portion communicating with the gap; when a plastic substrate is placed on the molding surface end of the porous mold, it is heated to above its deformation temperature, and the plastic substrate is bent and deformed downward. The air between the molding surface of the upper end of the porous mold and the plastic substrate is taken out from the lower side of the porous mold, and the lower end surface of the plastic substrate is closely bonded to the molding surface, and the plastic substrate is cooled to normal temperature. For a finished product. ·.
[0003] 如第1、2圖所示，已知可塑性材料的成型裝置1 ,包括上 模11、下模12及加熱器13所組成。上模π及下模a分別 具有相對應的上成型面111及下成型面122。放置於下模 12的第一上端面121的可塑性基材20被加熱器丨3加熱變 死^後被上模11向下模12的方向擠壓，而在上成型面ill 及下成型面121之間形成所需的形狀。 [0004] 如第3、4圖，當呈下凹弧狀的成型後的可塑性基材2〇在 1013115798-0 脫模時’若可塑性基材2〇的膨脹係數大於下模12的膨脹 10022511产單編號A0101 第3頁/共38頁 M428951 101年03月27日按正替換頁 係數或小於上模11的膨脹係數，成型後的可塑性基材20 容易卡止於下模12 (如第3圖所示）或卡止於上模11 (如 第4圖所示），不易脫模，需另外進行使成型後的可塑性 基材20分離下模12或上模11的作業，而增加成型作業的 時間。 [0005] 上述台灣專利揭示的裝置亦有可能卡止於多孔性模具的 情形。 【新型内容】 [0006] 為了進一步改良習知可塑性材料成型的裝置，而提出本 〇 創作。 [0007] 本創作的主要目的，在提供一種可塑性材料成型的裝置 ，包括一上模、一下模及加熱器所組成，上模及下模中 至少有一是多孔性者、或包括一上氣密罩、一多孔性下 模、一下氣密罩及加熱器所組成；利用多孔性上模及多 孔性下模的透氣性，在可塑性基材受熱成型時施予空氣 壓力，使可塑性基材與下成型面緊密的貼合、或進一步 與上成型面緊密的貼合，以提升成型的品質；在成型後 的可塑性基材脫模時施予空氣壓力，使成型後的可塑性 基材快速的脫離多扎性上模或多孔性下模，以提升成型 作業的速度。 [0008] 本創作的另一目的，在提供一種可塑性材料成型的裝置 ，利用上座體結合多孔性上模，下座體結合多孔性下模 ，以分別增強多孔性上模及多孔性下模的耐壓強度。 [0009] 本創作的其他目的、功效，請參閱圖式及實施例，詳細 100225111^^ Α〇101 第4頁/共38頁 1013115798-0 M428951 101年03月27日修正替換頁 說明如下。 【實施•方式】 [0010] 如第5、6、7圖所示，本創作第一實施例的可塑性材料成 型的裝置A1，包括一上氣密罩21、多孔性下模22、下氣 密罩23及加熱器13所組成；上氣密罩21及下氣密罩23分 別具有上氣孔211及下氣孔231，且分別結合多孔性下模 22的第一上端面221及第一下端面222而分別形成上内部 空間212及下内部空間2 3 2 ;上内部空間212及下内部空 間232分別為均壓區。多孔性下模22的第一上端面221具 有下成型面223。 [0011] 多孔性下模22的第一上端面221設有下凹的下成型面223 ，可塑性基材20置於多孔性下模22的第一上端面221被加 熱器13加熱後，將向下方彎曲變形，同時由上氣孔211對 上内部空間212充氣加壓及由下氣孔231經由下内部空間 232對多孔性下模22抽氣降壓，使可塑性基材20的下端面 更快速的緊密貼合於多孔性下模22的下成型面223，形成 所需形狀，如第6圖所示，再使可塑性基材20冷卻至常溫 而成為一成品。 [0012] 成型後的可塑性基材20脫模時，由下氣孔231經由下内部 空間232對多孔性下模22充氣加壓及由上氣孔211對上内 部空間212抽氣降壓，就能使成型後的可塑性基材20快速 的脫離多孔性下模22，如第7圖所示，即使可塑性基材20 的膨脹係數大於多孔性下模22的膨脹係數，成型後的可 塑性基材20也不會卡止於多孔性下模22，可以提升成型 作業的速度。 1()。22511产：單編號A0101 第5頁/共38頁 1013115798-0 M428951 __ 101年.03月2>日核正替換頁 [0013] 如第8、9、10圖所示，本創作第二實施例的可塑性材料 成型的裝置A2，包括一上模11、多礼性下模22及加熱器 13所組成。上模11及多孔性下模22分別具有相對應的上 成型面111及下成型面223。As shown in Figs. 1 and 2, a molding apparatus 1 for a plastic material is known, which comprises an upper mold 11, a lower mold 12, and a heater 13. The upper mold π and the lower mold a have corresponding upper molding faces 111 and lower molding faces 122, respectively. The plastic substrate 20 placed on the first upper end surface 121 of the lower mold 12 is heated by the heater 丨3 and then pressed by the upper mold 11 in the direction of the lower mold 12, and the upper molding surface ill and the lower molding surface 121 are pressed. The desired shape is formed between. [0004] As shown in FIGS. 3 and 4, when the molded plastic substrate 2 having a concave arc shape is demolded at 1013115798-0, the expansion coefficient of the plastic substrate 2〇 is greater than the expansion of the lower mold 12 by 10022511. Single No. A0101 Page 3 of 38 M428951 On March 27, 101, according to the positive replacement page coefficient or the expansion coefficient of the upper mold 11, the molded plastic substrate 20 is easily locked to the lower mold 12 (as shown in Fig. 3). (shown) or locked in the upper mold 11 (as shown in Fig. 4), it is not easy to demold, and it is necessary to separately perform the operation of separating the molded plastic substrate 20 from the lower mold 12 or the upper mold 11, thereby increasing the molding operation. time. [0005] The device disclosed in the above Taiwan patent is also likely to be stuck in a porous mold. [New content] [0006] In order to further improve the device for molding a plastic material, the present invention was proposed. [0007] The main purpose of the present invention is to provide a device for molding a plastic material, comprising an upper mold, a lower mold and a heater, at least one of the upper mold and the lower mold being porous, or including an upper airtight a cover, a porous lower mold, a lower airtight cover and a heater; and utilizing the permeability of the porous upper mold and the porous lower mold, the air pressure is applied when the plastic substrate is thermoformed, so that the plastic substrate and the plastic substrate are The lower molding surface is closely adhered or further adhered to the upper molding surface to improve the quality of the molding; the air pressure is applied during the demolding of the plastic substrate after molding, so that the molded plastic substrate is quickly separated. Multi-slung upper mold or porous lower mold to increase the speed of molding operations. [0008] Another object of the present invention is to provide a device for molding a plastic material, wherein the upper body is combined with the porous upper mold, and the lower body is combined with the porous lower mold to respectively enhance the porous upper mold and the porous lower mold. Compressive strength. [0009] For other purposes and functions of this creation, please refer to the drawings and examples. Details 100225111^^ Α〇101 Page 4 of 38 1013115798-0 M428951 Correction replacement page on March 27, 2011 is as follows. [Embodiment and Mode] [0010] As shown in Figures 5, 6, and 7, the apparatus A1 for molding a plastic material according to the first embodiment of the present invention includes an upper airtight cover 21, a porous lower mold 22, and a lower airtight The upper airtight cover 21 and the lower airtight cover 23 respectively have an upper air hole 211 and a lower air hole 231, and respectively coupled with the first upper end surface 221 and the first lower end surface 222 of the porous lower mold 22, respectively. The upper inner space 212 and the lower inner space 2 3 2 are respectively formed; the upper inner space 212 and the lower inner space 232 are respectively equalization zones. The first upper end surface 221 of the porous lower mold 22 has a lower molding surface 223. [0011] The first upper end surface 221 of the porous lower mold 22 is provided with a concave lower molding surface 223, and the plastic substrate 20 is placed on the first upper end surface 221 of the porous lower mold 22 and heated by the heater 13, The lower end is bent and deformed, and the upper inner space 212 is inflated and pressurized by the upper air hole 211, and the porous lower mold 22 is sucked and lowered by the lower air hole 231 through the lower inner space 232, so that the lower end surface of the plastic substrate 20 is more quickly closed. The lower molding surface 223 of the porous lower mold 22 is bonded to a desired shape, and as shown in Fig. 6, the plastic substrate 20 is cooled to a normal temperature to become a finished product. [0012] When the molded plastic substrate 20 is released from the mold, the porous lower mold 22 is inflated and pressurized by the lower air hole 231 through the lower inner space 232, and the upper inner space 212 is sucked and lowered by the upper air hole 211, so that the upper inner space 212 can be evacuated. The molded plastic substrate 20 is quickly detached from the porous lower mold 22, and as shown in Fig. 7, even if the expansion coefficient of the plastic substrate 20 is larger than the expansion coefficient of the porous lower mold 22, the molded plastic substrate 20 is not formed. It will be stuck in the porous lower mold 22, which can increase the speed of the forming operation. 1(). 22511 Product: Single No. A0101 Page 5 / Total 38 Page 1013115798-0 M428951 __ 101 years. March 2> Japanese Nuclear Replacement Page [0013] As shown in Figures 8, 9, and 10, the second embodiment of the present creation The plastic material forming device A2 comprises an upper die 11, a multi-functional lower die 22 and a heater 13. The upper mold 11 and the porous lower mold 22 have corresponding upper molding surfaces 111 and lower molding surfaces 223, respectively.
[0014] 放置於多孔性下模22的第一上端面221的可塑性基材20被 加熱器13加熱變形後，被上模11向多孔性下模22的方向 擠壓，而在上成型面111及下成型面223之間形成所需的 形狀，如第9圖所示。再使可塑性基材20冷卻至常溫而成 為一成品。 [0015] 成型後的可塑性基材20脫模時，由多孔性下模22的第一 下端面222向上方充氣，就能使成型後的可塑性基材20快 速的脫離多孔性下模22，如第10圖所示，即使可塑性基 材20的膨脹係數大於多孔性下模22的膨脹係數，成型後 的可塑性基材20也不會卡止於多孔性下模22，而可以提 升成型作業的速度。 [0016] 如第11、12、13圖所示，本創作第三實施例的可塑性材 料成型的裝置A3，包括一多孔性上模24、下模12及加熱 器13所組成。多孔性上模24及下模12分別具有相對應的 上成型面241及下成型面122。 [0017] 放置於下模12的第一上端面121的可塑性基材20被加熱器 13加熱變形後，被多孔性上模24向下模12的方向擠壓， 而在上成型面241及下成型面122之間形成所需的形狀， 如第12圖所示。再使可塑性基材20冷卻至常溫而成為一 成品。 10022511产單编號麵 第6頁/共38頁 1013115798-0 M428951 [0018] 101年.03月2>日修正替換頁 成型後的可塑性基材20脫模時，由多孔性上模24的第二 上端面242向下方充氣，就能使成型後的可塑性基材20快 速的脫離多孔性上模24，如第13圖所示，即使可塑性基 材20的膨脹係數小於多孔性上模24的膨脹係數，成型後 的可塑性基材20也不會卡止於多孔性上模24，而可以提 升成型作業的速度。 [0019] 如第14、15、16圖所示，本創作第四實施例的可塑性材 料成型的裝置A4，包括一上模11、多孔性下模22 '下氣 密罩23及加熱器13所組成。上模11及多孔性下模22分別 具有相對應的上成型面111及下成型面223。下氣密罩23 具有下氣孔231且結合多孔性下模22的第一下端面222。 [0020] 放置於多孔性下模22的第一上端面221的可塑性基材20被 加熱器13加熱變形後，被上模11向多孔性下模22的方向 擠壓及由下氣孔231抽氣降壓，使可塑性基材20的下端面 快速在上成型面111及下成型面223之間形成所需的形狀 ，如第15圖所示。再使可塑性基材20冷卻至常溫而成為 一成品。 [0021] 成型後的可塑性基材20脫模時，由下氣孔231經由下内部 空間232對多孔性下模22充氣加壓，就能使成型後的可塑 性基材2 0快速的脫離多孔性下模22，如第16圖所示，即 使可塑性基材20的膨脹係數大於多孔性下模22的膨脹係 數，成型後的可塑性基材20也不會卡止於多孔性下模22 ，可以提升成型作業的速度。 [0022] 如第17、18、19圖所示，本創作第五實施例的可塑性材 料成型的裝置A5，包括一多孔性上模24、多孔性下模22 1QQ22511i^單編號A0101 第7頁/共38頁 1013115798-0 M428951 101年03月27日街E替換頁 、下氣密罩23及加熱器13所組成《多孔性上模24及多孔 眭下模22分別具有相對應的上成型面241及下成型面223 。下氟密罩23具有下氧孔231且結合多孔性下模22的第一 下端面222。 [0023]放置於多孔性下模22的第一上端面221的可塑性基材2〇被 加熱器13加熱變形後，被多孔性上模24向多孔性下模22 的方向播壓及由下氣孔231抽氣降壓，使可塑性基材2〇的 下端面更快速在上成型面241及下成型面223之間形成所 需的形狀，如第18圖所示。再使可塑性基材2〇冷卻至常 溫而成為一成品。[0014] The plastic substrate 20 placed on the first upper end surface 221 of the porous lower mold 22 is heated and deformed by the heater 13, and then pressed by the upper mold 11 in the direction of the porous lower mold 22, and the upper molding surface 111 is formed. The desired shape is formed between the lower molding surface 223 as shown in FIG. The plastic substrate 20 is then cooled to normal temperature to form a finished product. [0015] When the molded plastic substrate 20 is released from the mold, the first lower end surface 222 of the porous lower mold 22 is inflated upward, so that the molded plastic substrate 20 can be quickly separated from the porous lower mold 22, such as As shown in Fig. 10, even if the expansion coefficient of the plastic substrate 20 is larger than the expansion coefficient of the porous lower mold 22, the molded plastic substrate 20 does not stick to the porous lower mold 22, and the speed of the molding operation can be increased. . [0016] As shown in Figs. 11, 12, and 13, the apparatus A3 for forming a plastic material according to the third embodiment of the present invention comprises a porous upper mold 24, a lower mold 12, and a heater 13. The porous upper mold 24 and the lower mold 12 have corresponding upper molding surfaces 241 and lower molding surfaces 122, respectively. [0017] The plastic substrate 20 placed on the first upper end surface 121 of the lower mold 12 is heated and deformed by the heater 13, and then pressed by the porous upper mold 24 in the direction of the lower mold 12, and is formed on the upper molding surface 241 and below. The desired shape is formed between the molding faces 122 as shown in Fig. 12. Further, the plastic substrate 20 is cooled to a normal temperature to become a finished product. 10022511 Production No. No. page 6/38: 1013115798-0 M428951 [0018] 101.03.2> The date of the replacement of the plastic substrate 20 after the replacement sheet molding is released by the porous upper mold 24 The second upper end surface 242 is inflated downward, so that the molded plastic substrate 20 can be quickly separated from the porous upper mold 24, as shown in Fig. 13, even if the expansion coefficient of the plastic substrate 20 is smaller than that of the porous upper mold 24. The coefficient, the molded plastic substrate 20 is also not locked to the porous upper mold 24, and the speed of the molding work can be increased. [0019] As shown in FIGS. 14, 15, and 16, the apparatus A4 for molding a plastic material according to the fourth embodiment of the present invention includes an upper mold 11, a porous lower mold 22', a lower airtight cover 23, and a heater 13 composition. The upper mold 11 and the porous lower mold 22 have corresponding upper molding surfaces 111 and lower molding surfaces 223, respectively. The lower airtight cover 23 has a lower air hole 231 and is coupled to the first lower end surface 222 of the porous lower mold 22. [0020] The plastic substrate 20 placed on the first upper end surface 221 of the porous lower mold 22 is heated and deformed by the heater 13, and then pressed by the upper mold 11 in the direction of the porous lower mold 22 and evacuated by the lower air holes 231. The pressure reduction causes the lower end surface of the plastic substrate 20 to rapidly form a desired shape between the upper molding surface 111 and the lower molding surface 223, as shown in Fig. 15. Further, the plastic substrate 20 is cooled to a normal temperature to become a finished product. [0021] When the molded plastic substrate 20 is released from the mold, the porous lower mold 22 is inflated and pressurized by the lower air hole 231 through the lower inner space 232, so that the molded plastic substrate 20 can be quickly released from the porous state. The mold 22, as shown in Fig. 16, even if the expansion coefficient of the plastic substrate 20 is larger than the expansion coefficient of the porous lower mold 22, the molded plastic substrate 20 does not stick to the porous lower mold 22, and the molding can be improved. The speed of the job. [0022] As shown in FIGS. 17, 18, and 19, the apparatus A5 for molding a plastic material according to the fifth embodiment of the present invention includes a porous upper mold 24, a porous lower mold 22, a single-numbered A0101, and a seventh page. / Total 38 pages 1013115798-0 M428951 On March 27, 101, the street E replacement page, the lower airtight cover 23 and the heater 13 are composed of "the porous upper mold 24 and the porous lower mold 22 respectively have corresponding upper molding surfaces. 241 and lower molding surface 223. The fluorocarbon cover 23 has a lower oxygen hole 231 and is coupled to the first lower end surface 222 of the porous lower mold 22. The plastic substrate 2〇 placed on the first upper end surface 221 of the porous lower mold 22 is heated and deformed by the heater 13, and then is embossed by the porous upper mold 24 in the direction of the porous lower mold 22 and the lower air vent 231 is pumped down to lower the lower end surface of the plastic substrate 2 更 to form a desired shape between the upper molding surface 241 and the lower molding surface 223, as shown in Fig. 18. Further, the plastic substrate 2 is cooled to a normal temperature to become a finished product.
[0024] 成型後的可塑性基材20脫模時’由下氣孔231經由下内部 空間232對多孔性下模22充氣加壓，就能使成型後的可塑 性基材20快速的脫離多孔性下模22，即使可塑性基材20 的膨脹係數大於多孔性下模22的膨脹係數，成型後的可 塑性基材20也不會卡止於多孔性下模22 ;也可同時由多 孔性上模24的第二上端面242向下方充氣，就能使成型後 的可塑性基材20快速的脫離多孔性上模24，即使可塑性 基材20的膨脹係數小於多孔性上模24的膨脹係數，成型 後的可塑性基材20也不會卡止於多孔性上模24，如第19 圖所示，而可以提升成型作業的速度。 第8頁/共38頁 1013115798-0 [0025] 如第20、21、22圖所示’本創作第六實施例的可塑性材 料成型的裝置A6，包括一上氣密罩21、多孔性下模25、 下座體26、下氣密罩23及加熱器13所組成。上氣密罩21 及下氣密罩23分別具有上氣孔211及下氣孔231，且分別 結合多孔性下座體26的第三上端面261及第二下端面262 10022511#單編號A01〇l 笛8頁/共38頁 M428951 101年.03月2>日接正替換頁 而分別形成上内部空間212及下内部空間232 ;上内部空 間212及下内部空間232分別為均壓區。多孔性下模25的 第一上端面251具有下成型面252。下座體26的上端結合 多孔性下模25，且設有多條下穿透孔263。下穿透孔263 連通多孔性下模25，使多孔性下模25連通下氣密罩23的 下内部空間232。 [0026] 多孔性下模25的第一上端面251設有下凹的下成型面252 ’可塑性基材2〇置於多孔性下模25的第一上端面251被加 熱器13加熱後，將向下方彎曲變形，同時由上氣孔211充 氣加壓及由下氣孔231抽氣降壓，使可塑性基材20的下端 面快速的緊密貼合於多孔性下模25的下成型面252 ,形成 所需形狀’如第21圖所示。再使可塑性基材20冷卻至常 溫而成為一成品。 [0027] 成型後的可塑性基材2〇脫模時，由下氣孔231經由下内部 空間232對多孔性下模22充氣加壓及由上氣孔211對上内 二間21 2抽氣降壓’使成型後的可塑性基材2 〇快速的脫 離多孔性下模25 ,如第22圖所示，即使可塑性基材2〇的 膨服係數大於多孔性下模25的膨脹係數，成型後的可塑 陳基材2G也不會卡止於多孔性下模25，可以提升成型作 業的速度。 [0028]如第 23、24、？⑽“ Α圖所不，本創作第七實施例的可塑性材 料成型的裝置A7,包括-上模u、多孔性下模25、下座 體26及加熱113所組成。上模11及多孔性下模25分別具 子〜的上成型面111及下成型面252。下座體26的上 端結合多孔性 10〇22511 产單編號 A0101 1013115798-0 下模25，且設有多條下穿透孔263，下穿透 第9頁/共38頁 M428951 101年.03月27日按正替換頁 孔263連通多孔性下模25 ’使多孔性下模25連通下座體 26的第二下端面262外部的空間。 [0029] 放置於多孔性下模25的第一上端面251的可塑性基材20被 加熱器13加熱變形後，被上模11向多孔性下模25的方向 擠壓’而在上成型面111及下成型面252之間形成所需的 形狀，如第24圖所示。再使可塑性基材2〇冷卻至常溫而 成為一成品。 [0030] 成型後的可塑性基材20脫模時，由下座體26的下穿透孔 263向多孔性下模25充氣，使成型後的可塑性基材2〇快速 . 的脫離多孔性下模25，如第25圖所示，即使可塑性基材 20的膨脹係數大於多孔性下模25的膨脹係數，成型後的 可塑性基材20也不會卡止於多孔性下模25 ’而可以提升 成型作業的速度。 [_如第26、27、28圖所示，本創作第八實施例的可塑性材 料成型的裝置A8，包括一多孔性上模27、上座體28、下 模12及加熱器13所組成。多孔性上模27及下模12分別具 有相對應的上成型面271及下成型面122。上座體28的下 ί 端結合多孔性上模27，且設有多條上穿透孔281。上穿透 孔281連通多孔性上模27，使多孔性上模27連通上座體 28的第四上端面282外部的空間。 _放置於下模12的第-上端面121的可塑性基材㈣加熱器 13加熱變形後，被多孔性上模27向下模12的方向擠壓， 而在上《面271及下成型面122之間形成所需的形狀， 如第27圖所示。再使可紐基材20冷卻至常溫而成為一 成品》 10〇22511产單編號Α0101 第頁/共38頁 1013115798-0 M428951 |101年.03月云日 [0033] 成型後的可塑性基材20脫模時，由上座體28的上穿透孔 281向多孔性上模27充氣’就能使成型後的可塑性基材20 快速的脫離多孔性上模27，如第28圖所示，即使可塑性 基材20的膨脹係數小於多孔性上模27的膨脹係數，成型 後的可塑性基材20也不會卡止於多孔性上模27，可以提 升成型作業的速度。 [0034] • 如第29、30、31圖所示，本創作第九實施例的可塑性材 料成型的裝置Α9，包括一上模11、多孔性下模25、下座 體26、下氣密罩23及加熱器13所組成。下氣密罩23具有 下氣孔231，且結合下座體26的第二下端面262。上模11 及多孔性下模25分別具有相對應的上成型面111及下成型 面252 »下座體26的上端結合多孔性下模25，且設有多條 下穿透孔263。下穿透孔263連通多孔性下模25，使多孔 性下模25連通下氣密罩23下内部空間232。 [0035] • 放置於多孔性下模25的第一上端面251的可塑性基材2〇被 加熱器1 3加熱變形後，被上模Π向多孔性下模2 5的方向 擠壓及由下氣孔231抽氣降壓，而快迷在上成型面in及 下成型面252之間形成所需的形狀’如第30圖所示》再使 可塑性基材20冷卻至常溫而成為一成品。 [0036] 成型後的可塑性基材20脫模時’由下氣孔231經由下内部 空間232及多條下穿透孔263對多孔性下模25充氣加壓， 就能使成型後的可塑性基材20快速的脫離多孔性下模25 ，如第31圖所示，即使可塑性基材2〇的膨脹係數大於多 孔性下模25的膨脹係數，成型後的可塑性基材20也不會 卡止於多孔性下模25，而可以提补成型作業的速度。 10022511产單編號A0101 第11頁/共38頁 1013115798-0 M428951 1101年03月2·7日按正替換頁 [0037]如第32、33、34圖所示，本創作第十實施例的可塑性材 料成型的裝置Α10，包括一多孔性上模27、上座體28、多 孔性下模25 '下座體26 '下氣密罩23及加熱器13所組成 。下氣密罩23具有下氣孔231，且結合下座體26的第二下 端面262。多孔性上模27及多孔性下模25分別具有相對應 的上成型面271及下成型面252。下座體26的上端結合多 孔性下模25，且設有多條下穿透孔263。下穿透孔263連 通多孔性下模25，使多孔性下模25連通下氣密罩23下内 部空間232。上座體28的下端結合多孔性上模27，且設有 多條上穿透孔281。上穿透孔281連通多孔性上模27，使 着 多孔性上模27連通上座體28的第四上端面282外部的空間 [0038] 放置於多孔性下模25的第一上端面251的可塑性基材20被 加熱器13加熱變形後，被多孔性上模27向多孔性下模25 的方向擠壓及由下氣孔231抽氣降壓，快速在上成型面 271及下成型面252之間形成所需的形狀，如第33圖所示 °再使可塑性基材2〇冷卻至常溫而成為一成品。 [0039] 成型後的可塑性基材20脫模時，由下氣孔231經由下内部 空間232及多條下穿透孔263對多孔性下模25充氣加壓， 就能使成型後的可塑性基材20快速的脫離多孔性下模25 ’即使可塑性基材20的膨脹係數大於多孔性下模25的膨 脹係數’成型後的可塑性基材20也不會卡止於多孔性下 模25 ;且由上座體28的上穿透孔281向多孔性上模27充 氣’使成型後的可塑性基材20快速的脫離多孔性上模27 ’即使可塑性基材20的膨脹係數小於多孔性上模27的膨 1013115798-0 10022511产單编號Α0101 第12頁/共38頁 服係數，成型後的可塑性基材20也不會+ 杈27,如第34圖所示，而可以提升成型作業的速度。 ]本創作使上座體28的下端結合多孔性上模27，下座體μ 的上端結合多孔性下模25，利用上座體28及下座體26分 別增強多孔性上模27及多孔性下模25的耐壓強度。[0024] When the molded plastic substrate 20 is released from the mold, the porous lower mold 22 is inflated and pressurized by the lower air hole 231 through the lower inner space 232, so that the molded plastic substrate 20 can be quickly separated from the porous lower mold. 22. Even if the expansion coefficient of the plastic substrate 20 is larger than the expansion coefficient of the porous lower mold 22, the molded plastic substrate 20 does not stick to the porous lower mold 22, and may also be composed of the porous upper mold 24 at the same time. The second upper end surface 242 is inflated downward, so that the molded plastic substrate 20 can be quickly separated from the porous upper mold 24 even if the expansion coefficient of the plastic substrate 20 is smaller than the expansion coefficient of the porous upper mold 24, and the plasticity base after molding. The material 20 is also not locked to the porous upper mold 24, as shown in Fig. 19, and the speed of the forming operation can be increased. Page 8 of 38 1013115798-0 [0025] As shown in Figures 20, 21, and 22, the apparatus A6 for molding a plastic material according to the sixth embodiment of the present invention includes an upper airtight cover 21 and a porous lower mold. 25. The lower body 26, the lower airtight cover 23 and the heater 13 are formed. The upper airtight cover 21 and the lower airtight cover 23 respectively have an upper air hole 211 and a lower air hole 231, and respectively engage the third upper end surface 261 and the second lower end surface 262 of the porous lower seat body 26 162 10022511# single number A01〇l flute 8 pages/38 pages M428951 101.03.2> The upper inner space 212 and the lower inner space 232 are respectively formed by the replacement page; the upper inner space 212 and the lower inner space 232 are the pressure equalization areas, respectively. The first upper end surface 251 of the porous lower mold 25 has a lower molding surface 252. The upper end of the lower body 26 is joined to the porous lower mold 25, and a plurality of lower penetration holes 263 are provided. The lower penetration hole 263 communicates with the porous lower mold 25 to connect the porous lower mold 25 to the lower inner space 232 of the lower airtight cover 23. The first upper end surface 251 of the porous lower mold 25 is provided with a concave lower molding surface 252. The plastic substrate 2 is placed on the first upper end surface 251 of the porous lower mold 25 and heated by the heater 13, The lower end surface of the plastic substrate 20 is quickly and closely adhered to the lower molding surface 252 of the porous lower mold 25, and the lower end surface of the plastic substrate 20 is quickly and closely adhered to the bottom surface of the porous lower mold 25, and is formed by bending and deforming downward. Need shape ' as shown in Figure 21. The plastic substrate 20 is then cooled to a normal temperature to become a finished product. [0027] When the molded plastic substrate 2 is demolded, the porous lower mold 22 is inflated and pressurized by the lower air hole 231 through the lower inner space 232, and the upper and lower inner portions 21 2 are evacuated by the upper air hole 211. The formed plastic substrate 2 is quickly detached from the porous lower mold 25, and as shown in Fig. 22, even if the expansion coefficient of the plastic substrate 2〇 is larger than the expansion coefficient of the porous lower mold 25, the molded plastic substrate after molding 2G will not be stuck in the porous lower mold 25, which can increase the speed of the forming operation. [0028] As in the 23rd, 24th, ? (10) "The apparatus A7 of the plastic material molding of the seventh embodiment of the present invention comprises the upper mold u, the porous lower mold 25, the lower seat 26 and the heating 113. The upper mold 11 and the porosity The mold 25 has an upper molding surface 111 and a lower molding surface 252. The upper end of the lower body 26 is combined with a porous 10〇22511 production order number A0101 1013115798-0 lower mold 25, and a plurality of lower penetration holes 263 are provided. Next, penetrating page 9/38 pages M428951 101. March 27th, according to the replacement page hole 263, the porous lower mold 25' is connected to connect the porous lower mold 25 to the second lower end surface 262 of the lower body 26 [0029] The plastic substrate 20 placed on the first upper end surface 251 of the porous lower mold 25 is heated and deformed by the heater 13, and then pressed by the upper mold 11 in the direction of the porous lower mold 25, and is on the upper side. The desired shape is formed between the molding surface 111 and the lower molding surface 252, as shown in Fig. 24. The plastic substrate 2 is cooled to a normal temperature to become a finished product. [0030] The molded plastic substrate 20 is demolded. At this time, the porous lower mold 25 is inflated by the lower penetration hole 263 of the lower seat body 26, so that the molded plastic substrate 2 is fastened. The detachment of the porous lower mold 25, as shown in Fig. 25, even if the expansion coefficient of the plastic substrate 20 is larger than the expansion coefficient of the porous lower mold 25, the molded plastic substrate 20 does not stick to the porosity. The mold 25' can increase the speed of the molding operation. [_] As shown in Figs. 26, 27, and 28, the plastic material forming apparatus A8 of the eighth embodiment of the present invention includes a porous upper mold 27 and an upper body 28 The lower mold 12 and the lower mold 12 respectively have a corresponding upper molding surface 271 and a lower molding surface 122. The lower end of the upper body 28 is combined with the porous upper mold 27, and A plurality of upper penetration holes 281 are provided. The upper penetration holes 281 communicate with the porous upper mold 27 to connect the porous upper mold 27 to the space outside the fourth upper end surface 282 of the upper body 28. _ - the plastic substrate of the upper end surface 121 (4) after the heater 13 is heated and deformed, is pressed by the porous upper mold 27 in the direction of the lower mold 12, and forms a desired shape between the upper surface 271 and the lower molding surface 122, As shown in Fig. 27, the substrate 20 is cooled to a normal temperature to become a finished product. 10〇2251 1Bill No. Α0101 Page/Total 38 Page 1013115798-0 M428951 | 101.03 Cloud Day [0033] When the molded plastic substrate 20 is released from the mold, the upper penetrating hole 281 of the upper body 28 is made porous. The upper mold 27 is inflated to enable the molded plastic substrate 20 to be quickly separated from the porous upper mold 27, as shown in Fig. 28, even if the expansion coefficient of the plastic substrate 20 is smaller than the expansion coefficient of the porous upper mold 27, molding The subsequent plastic substrate 20 is also not locked to the porous upper mold 27, and the speed of the molding work can be increased. [0034] As shown in Figures 29, 30, and 31, the apparatus 9 for molding a plastic material according to the ninth embodiment of the present invention includes an upper mold 11, a porous lower mold 25, a lower seat 26, and a lower airtight cover. 23 and heater 13 are composed. The lower airtight cover 23 has a lower air hole 231 and is coupled to the second lower end surface 262 of the lower base body 26. The upper mold 11 and the porous lower mold 25 respectively have a corresponding upper molding surface 111 and a lower molding surface 252. The upper end of the lower body 26 is joined to the porous lower mold 25, and a plurality of lower penetration holes 263 are provided. The lower penetration hole 263 communicates with the porous lower mold 25 to connect the porous lower mold 25 to the lower inner space 232 of the lower airtight cover 23. [0035] The plastic substrate 2〇 placed on the first upper end surface 251 of the porous lower mold 25 is heated and deformed by the heater 13 and then pressed by the upper mold to the direction of the porous lower mold 25 and The pores 231 are evacuated and depressurized, and the fan forms a desired shape between the upper molding surface in and the lower molding surface 252 as shown in Fig. 30, and the plastic substrate 20 is cooled to a normal temperature to become a finished product. [0036] When the molded plastic substrate 20 is demolded, the porous lower mold 25 is inflated and pressurized by the lower air hole 231 through the lower inner space 232 and the plurality of lower through holes 263, so that the molded plastic substrate can be formed. 20 rapid detachment from the porous lower mold 25, as shown in Fig. 31, even if the expansion coefficient of the plastic substrate 2〇 is larger than the expansion coefficient of the porous lower mold 25, the molded plastic substrate 20 does not stick to the porous The lower mold 25 can compensate for the speed of the forming operation. 10022511 Production Order No. A0101 Page 11 / Total 38 Page 1013115798-0 M428951 March 1st, 2nd, 2011, according to the replacement page [0037] As shown in Figures 32, 33, and 34, the plasticity of the tenth embodiment of the present creation The material forming device 10 comprises a porous upper mold 27, an upper body 28, a porous lower mold 25' lower seat 26' lower airtight cover 23 and a heater 13. The lower airtight cover 23 has a lower air hole 231 and is coupled to the second lower end surface 262 of the lower base body 26. The porous upper mold 27 and the porous lower mold 25 have corresponding upper molding surfaces 271 and lower molding surfaces 252, respectively. The upper end of the lower body 26 is combined with the porous lower mold 25, and a plurality of lower penetration holes 263 are provided. The lower penetration hole 263 is connected to the porous lower mold 25 to connect the porous lower mold 25 to the lower inner space 232 of the lower airtight cover 23. The lower end of the upper body 28 is joined to the porous upper mold 27, and a plurality of upper penetration holes 281 are provided. The upper penetration hole 281 communicates with the porous upper mold 27 so that the porous upper mold 27 communicates with the space outside the fourth upper end surface 282 of the upper seat body 28 [0038] The plasticity of the first upper end surface 251 placed on the porous lower mold 25 After the base material 20 is heated and deformed by the heater 13, it is pressed by the porous upper mold 27 in the direction of the porous lower mold 25 and sucked down by the lower air hole 231, and rapidly between the upper molding surface 271 and the lower molding surface 252. The desired shape is formed, and as shown in Fig. 33, the plastic substrate 2 is cooled to a normal temperature to become a finished product. [0039] When the molded plastic substrate 20 is released from the mold, the porous lower mold 25 is inflated and pressurized by the lower air hole 231 through the lower inner space 232 and the plurality of lower through holes 263, so that the molded plastic substrate can be formed. 20 rapid detachment from the porous lower mold 25' even if the expansion coefficient of the plastic substrate 20 is larger than the expansion coefficient of the porous lower mold 25', the molded plastic substrate 20 is not locked to the porous lower mold 25; The upper penetrating hole 281 of the body 28 is inflated to the porous upper mold 27 to rapidly disengage the molded plastic substrate 20 from the porous upper mold 27' even if the expansion coefficient of the plastic substrate 20 is smaller than that of the porous upper mold 27 1013115798 -0 10022511 Production order number Α 0101 Page 12 / 38 page service factor, the plastic substrate 20 after molding will not be + 杈 27, as shown in Figure 34, and the speed of the molding operation can be improved. In the present invention, the lower end of the upper body 28 is coupled to the porous upper mold 27, the upper end of the lower body μ is coupled to the porous lower mold 25, and the upper upper body 28 and the lower seat 26 are respectively used to reinforce the porous upper mold 27 and the porous lower mold. 25 pressure strength.
_]本創作利用多孔性上模及多孔性下模的透氣性，在可塑 性基材受熱成型時可施予空氣壓力，使可塑性基材與下 成型面緊密的貼合或進一步與上成型面緊密的貼合，以 提升成型的品質；在成型後的可㈣基材賴時可施予 空氣廢力，使成型後的可塑性基材快速的脫離多孔性上 模或多孔性下模，以提升成型作業的速度。 [0042] U上所a己載’僅為利用本創作技術内容之實施例，任何 熟悉本項技藝者運用本創作所為之修飾、變化，皆屬本 創作主張之專利範圍，而不限於實施例所揭示者。 【圖式簡單說明】 [0043] [0044] [0045] 圖1為已知可塑性材料的成型裝置的示意圖。 圖2為已知可塑性材料的成型裝置成型時的示意圖 裝置脫模時可塑性材料卡止 圖3為已知可塑性材料的成型 於下模的示意圖。 [0046] 圖4為已知可塑性材料的成型裝 於上模的示意圖。 置脫模時可塑性材料卡止 [0047] 圖5為本創作第_實施例可塑性材料成型的裝 〇 置的示意圖 第丨3頁/.共38頁 100225111^^^ A〇101 1013115798-0 M428951 101年03月27日修正替换頁 [0048] 圖6為本創作第一實施例可塑性材料的成型裝置成型時的 示意圖。 [0049] 圖7為本創作第一實施例可塑性材料的成型裝置脫模時的 示意圖。 [0050] 圖8為本創作第二實施例可塑性材料成型的裝置的示意圖 [0051] 圖9為本創作第二實施例可塑性材料的成型裝置成型時的 示意圖。 [0052] 圖1 0為本創作第二實施例可塑性材料的成型裝置脫模時 的示意圖。 [0053] 圖11為本創作第三實施例可塑性材料成型的裝置的示意 圖。 [0054] 圖12為本創作第三實施例可塑性材料的成型裝置成型時 的示意圖。 [0055] 圖13為本創作第三實施例可塑性材料的成型裝置脫模時 的示意圖。 [0056] 圖14為本創作第四實施例可塑性材料成型的裝置的示意 圖。 [0057] 圖15為本創作第四實施例可塑性材料的成型裝置成型時 的示意圖。 [0058] 圖16為本創作第四實施例可塑性材料的成型裝置脫模時 的示意圖。 10022511^^ A〇101 第14頁/共38頁 1013115798-0 M428-951 101年.03月27日修正替換頁 [0059] 圖17為本創作第五實施例可塑性材料成型的裝置的示意 圖。 [0060] 圖18為本創作第五實施例可塑性材料的成型裝置成型時 的示意圖。 [0061] 圖1.9為本創作第五實施例可塑性材料的成型裝置脫模時 的示意圖。 [0062] 圖20為本創作第六實施例可塑性材料成型的裝置的示意 圖。 # [0063] 圖21為本創作第六實施例可塑性材料的成型裝置成型時 的示意圖。 [0064] 圖2 2為本創作第六實施例可塑性材料的成型裝置脫模時 的示意圖。 [0065] 圖23為本創作第七實施例可塑性材料成型的裝置的示意 圖。 • [0066] 圖24為本創作第七實施例可塑性材料的成型裝置成型時 的示意圖。 - [0067] 圖25為本創作第七實施例可塑性材料的成型裝置脫模時 的示意圖。 [0068] 圖26為本創作第八實施例可塑性材料成型的裝置的示意 圖。 [0069] 圖27為本創作第八實施例可塑性材料的成型裝置成型時 的示意圖。 100225111^^ A〇101 第15頁/共38頁 1013115798-0 M428951 [0070] [0071] 101年.03月27日修正替換頁 圖28為本創作第八實施例可塑性材料的成型裝置脫模時 的示意圖。 圖29為本創作第九實施例可塑性材料成型的裝置的示意 圖 [0072] 圖30為本創作第九實施例可塑性材料的成型裝置成型時 的示意圖。 [0073] 圖31為本創作第九實施例可塑性材料的成型裝置脫模時 的示意圖。 [0074] 圖32為本創作第十實施例可塑性材料成型的裝置的示意 圖。 [0075] 圖3 3為本創作第十實施例可塑性材料的成型裝置成型時 的示意圖。 [0076] 圖34為本創作第十實施例可塑性材料的成型裝置脫模時 的示意圖。_] This creation utilizes the permeability of the porous upper mold and the porous lower mold, and can apply air pressure when the plastic substrate is thermoformed, so that the plastic substrate and the lower molding surface are closely adhered or further close to the upper molding surface. The conformity is to improve the quality of the molding; the air waste force can be applied to the (4) substrate after molding, so that the molded plastic substrate can be quickly separated from the porous upper mold or the porous lower mold to enhance the molding. The speed of the job. [0042] U has been described as an embodiment using only the content of the present invention, and any person skilled in the art who uses the present invention to modify and change it is a patent scope of the present invention, and is not limited to the embodiment. Revealed. BRIEF DESCRIPTION OF THE DRAWINGS [0045] FIG. 1 is a schematic view of a molding apparatus for a known plastic material. Fig. 2 is a schematic view showing a molding apparatus for a known plastic material. The plastic material is locked during demolding. Fig. 3 is a schematic view showing molding of a known plastic material to a lower mold. 4 is a schematic view showing the molding of a known plastic material in an upper mold. Plastic material is locked during demolding [0047] FIG. 5 is a schematic view of a mounting device for forming a plastic material according to the first embodiment of the present invention. Page 3 of 38 pages. 100225111^^^ A〇101 1013115798-0 M428951 101 Correction Replacement Page of March 27, 2017 [0048] FIG. 6 is a schematic view showing the molding apparatus of the plastic material according to the first embodiment of the present invention. 7 is a schematic view showing a molding apparatus for a plastic material according to a first embodiment of the present invention. 8 is a schematic view of a device for molding a plastic material according to a second embodiment of the present invention. [0051] FIG. 9 is a schematic view showing a molding apparatus for a plastic material according to a second embodiment of the present invention. 10 is a schematic view showing a molding apparatus for a plastic material according to a second embodiment of the present invention. [0053] Figure 11 is a schematic view of the apparatus for molding a plastic material according to a third embodiment of the present invention. [0054] FIG. 12 is a schematic view showing the molding apparatus of the plastic material according to the third embodiment of the present invention. [0055] FIG. 13 is a schematic view showing the molding apparatus of the plastic material according to the third embodiment of the present invention. 14 is a schematic view of an apparatus for molding a plastic material according to a fourth embodiment of the present invention. 15 is a schematic view showing a molding apparatus for a plastic material according to a fourth embodiment of the present invention. [0058] FIG. 16 is a schematic view showing the molding apparatus of the plastic material according to the fourth embodiment of the present invention. 10022511^^ A〇101 Page 14 of 38 1013115798-0 M428-951 101. March 27th Revision Replacement Page [0059] Figure 17 is a schematic view of a device for molding a plastic material according to a fifth embodiment of the present invention. 18 is a schematic view showing a molding apparatus for a plastic material according to a fifth embodiment of the present invention. 1.9 is a schematic view showing the molding apparatus of the plastic material according to the fifth embodiment of the present invention when the molding apparatus is demolded. 20 is a schematic view of an apparatus for molding a plastic material according to a sixth embodiment of the present invention. [0063] Fig. 21 is a schematic view showing the molding apparatus of the plastic material according to the sixth embodiment of the present invention. [0064] FIG. 2 is a schematic view showing the molding apparatus of the plastic material according to the sixth embodiment of the present invention. 23 is a schematic view of an apparatus for molding a plastic material according to a seventh embodiment of the present invention. [0066] Fig. 24 is a schematic view showing the molding apparatus of the plastic material according to the seventh embodiment of the present invention. [0067] FIG. 25 is a schematic view showing the molding apparatus of the plastic material according to the seventh embodiment at the time of demolding. 26 is a schematic view of an apparatus for molding a plastic material according to an eighth embodiment of the present invention. 27 is a schematic view showing the molding apparatus of the plastic material according to the eighth embodiment of the present invention. 100225111^^ A〇101 Page 15/38 pages 1013115798-0 M428951 [0071] 101. March 27th revised replacement page FIG. 28 is a molding apparatus for the plastic material according to the eighth embodiment of the present invention. Schematic diagram. Figure 29 is a schematic view showing the apparatus for molding a plastic material according to a ninth embodiment of the present invention. [0072] Figure 30 is a schematic view showing the molding apparatus of the plastic material according to the ninth embodiment. [0073] FIG. 31 is a schematic view showing the molding apparatus of the plastic material according to the ninth embodiment of the present invention. 32 is a schematic view of an apparatus for molding a plastic material according to a tenth embodiment of the present invention. [0035] FIG. 3 is a schematic view showing the molding apparatus of the plastic material according to the tenth embodiment. [0076] FIG. 34 is a schematic view showing a molding apparatus for a plastic material according to a tenth embodiment of the present invention.
【主要元件符號說明】 [0077] 1、Al、A2、A3、A4、A5、A6、A7、A8、A9、A10可塑 性材料的成型裝置 [0078] 11 上模 111、241、271 上成型面 [0079] 12下模 121、221、251 第一上端面 [0080] 122、223、252下成型面 [0081] 13加熱器20可塑性基材 [0082] 21上氣密罩211上氣孔 薩2511产單编號顯 第16頁/共38頁 1013115798-0 M428951 [0083] [0084] [0085] [0086] [0087] - [0088] _ [0089][Description of main component symbols] [0077] 1. Forming device for plastic materials of Al, A2, A3, A4, A5, A6, A7, A8, A9, A10 [0078] 11 Upper molding surface 111, 241, 271 0079] 12 lower molds 121, 221, 251 first upper end surface [0080] 122, 223, 252 lower molding surface [0081] 13 heater 20 plastic substrate [0082] 21 upper airtight cover 211 on the air hole Sa 2511 production order Numbering page 16/38 pages 1013115798-0 M428951 [0083] [0086] [0088] [0088] [0089]
[0090] 101年.03月27日修正替換頁 212上内部空間22、25多孔性下模 222第一下端面 23下氣密罩231下氣孔 232下内部空間24、27多孔性上模 242第二上端面26下座體 261第三上端面262第二下端面 263下穿透孔28上座體 281穿透孔282第四上端面[0090] 101 years. March 27th revised replacement page 212 on the inner space 22, 25 porous lower mold 222 first lower end surface 23 under the airtight cover 231 lower air hole 232 lower internal space 24, 27 porous upper mold 242 Second upper end surface 26 lower seat 261 third upper end surface 262 second lower end surface 263 lower penetration hole 28 upper body 281 penetration hole 282 fourth upper end surface
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