TWM428312U - Light emitting apparatus - Google Patents

Light emitting apparatus Download PDF

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Publication number
TWM428312U
TWM428312U TW100221021U TW100221021U TWM428312U TW M428312 U TWM428312 U TW M428312U TW 100221021 U TW100221021 U TW 100221021U TW 100221021 U TW100221021 U TW 100221021U TW M428312 U TWM428312 U TW M428312U
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Taiwan
Prior art keywords
light
illuminating device
circuit board
illuminating
disposed
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TW100221021U
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Chinese (zh)
Inventor
Qiang-Fei Duan
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Cooler Master Co Ltd
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Priority to TW100221021U priority Critical patent/TWM428312U/en
Publication of TWM428312U publication Critical patent/TWM428312U/en

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  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Description

M428312 . 101_.02月10日梭正#頁~| 五、新型說明: 【新型所屬之技術頜域】 [〇〇〇1]本創作係有關於一種發光裝置,尤指一種製作工序簡易 、具有良好散熱效果及絕緣性,並使用發光二極體作為 發光濾之發光裝置。 【先前技術】 [0002]發光二極體(light emitting di〇de,LED)具有體積小 — 、使用壽命長、不易破損、不含汞及省電等優點,因此 - 逐漸地取代日光燈官及白蠘燈泡的地位,被廣泛地應用 於照明光源及裝飾光源。 _3] g己合參閱第-圖’為習知之發光二極體燈泡之剖視圖。 έ亥發光二極體燈泡包含-座體5〇、一電路板52、複數之 發光二極體54、-導電接_、―燈罩58及—電源驅動 單元59。該座體50為一中空管體,該座體5〇之外壁面環 ,繞排列有複數之散熱片51,該等散熱片51可以有效地增 加該座體50的政熱面積,使該等發光二極體54點亮時產 生的熱此快速地傳導至外界空氣中。該電路板52設置於 該座體50 ’並通過複數導線53與該電源驅動單元59形成 電性連接。該等發光二極體54設置於該電路板52並電連 接於該電路板52 ;該導電接頭56連接該座體50相反設置 該電路板52之一侧,並通過二電源線57與該電源驅動單 7059形成電性連接。該燈罩58設置於該座體50設置該等 發光二極體54之一側,並使得該等發光二極體54位於該 燈罩58與該座體5〇之間。 1013050308-0 [0004]然而’由於該電源驅動單元59與該電路板52及該導電接 10022102产單編號Α0101 帛4頁/共40頁 M428312 101年02月10日修正替換頁 頭56係必須分別通過該等導線53及電源線57以形成電性 連接,如此一來,不僅增加製作工序及製作的困難度, 並使得整體的製作成本增加。 【新型内容】 [0005] 鑒於先前技術所述,本創作之一目的,在於提供一種發 光裝置,該發光裝置之製作工序簡易且可有效地降低製 作成本,且更具有重量輕及絕緣性佳之優點。 [0006] 為達上述目的,本創作提供一種發光裝置,該發光裝置 包含至少一發光元件及一燈具,該燈具包含一塑膠座體 、一金屬基電路板及一電源驅動單元,該塑膠座體具有 一第一側及一相反於該第一側之第二側,該金屬基電路 板設置於該塑膠座體之該第一側,該金屬基電路板包含 一基部及複數個由該基部周緣彎折成型且間隔設置之延 伸部,該基部具有複數穿孔,該延伸部埋設於該塑膠座 體内,該發光元件設置於該基部;該電源驅動單元包含 一電路基板,該電路基板之一第一端部具有複數之凸柱 ,該等凸枉對應地貫穿該等穿孔並與該金屬基電路板形 成電性連接。 [0007] 本創作之發光裝置之該燈具係直接地組裝該電源驅動單 元之該電路基板及該金屬基電路板並形成電性連接,如 此一來,不但可以有效地簡化工序並可以降低製作成本 【實施方式】 [0008] 參閱隨附圖示,本創作之目的、特徵及優點將透過本創 作之較佳實施例之以下闡釋性及非限制性詳述描述與以 1013050308-0 1()。221()2产單編號A0101 第5頁/共40頁 M428312 ^__ 101·年.02月10日梭正_頁 更好地理解,在隨附圖示中,相同參考數字係用於同一 元件或類似元件。 [0009] 配合參閱第二圖、第三圖及第四圖,分別為本創作第一 實施例之發光裝置之局部立體分解圖'局部立體組合圖 及剖視圖。於本實施例中,該發光裝置10aGui〇燈泡為 例說明,實際實施時該發光裝置10可以為PAR系列(PAR series)燈泡、A19、A20、A60、G30等不同類型之燈泡 。該發光裝置10包含一燈具11及至少一發光元件12,該 燈具11包含一金屬基電路板(metal core printed circui t board,MCPCB>110、一 電源驅動單元130及 一座體140。 [0010] 該金屬基電路板110具有良好的熱傳導性且其上預先形成 之複數電路佈線(圖未示)及複數之焊墊(圖未示),該金 屬基電路板110包含一基部112及複數之自該基部112周 緣考折成型且間隔設置之延伸部114。該基部112包含複 數之穿孔Π 6,於本實施例中,穿孔116以二個為例。於 實際實施時,該金屬基電路板110係通過衝壓製程預先形 成複數個間隔設置之開槽115,並彎折該等延伸部114使 該金屬基電路板110的外觀大致呈杯狀。 [0011] 該發光元件12設置於該金屬基電路板110,且較佳地,該 發光元件12設置於該基部112之一上表面113並與該金屬 基電路板110形成電性連接;其中,該發光元件】2的數量 可以為一個或多個,於本實施例中,發光元件12以一個 為例’且該發光元件12較佳地為高功率發光二極體。 [0012] 該電源驅動單元130包含一電路基板132及設置於該電路 100221021^^^^ Α0101 第 6 頁 / 共 40 頁 1013050308-0 M428312 101年.02月10日按正替換頁 基板132之至少一板面1326之複數之電子元件134,該電 路基板132較佳地可以為印刷電路板(PCB)且其上預先形 成有複數之電路佈線1325及焊墊(圖未示),於本實施例 中,係以兩個電路佈線為例說明,實際實施時不以此限 。該電路基板132包含一第一端部1 320及一相反於該第一 端部1 320之第二端部1 322,該第一端部1 320具有複數個 凸柱1321且該等凸柱1321係對應該等穿孔11 6設置;於 本實施例中,該第一端部1 320以包含二個凸柱1321為例 ,且該二凸柱1321分別對應該二穿孔116設置。 [0013] 該等凸柱1321貫穿該等穿孔116,使得該板面1326大致 垂直該金屬基電路板110之該上表面131,並且該等電路 佈線1 325係通過該等凸柱1321與該金屬基電路板110形 成電性連接。其中,該金屬基電\路板110及該電路基板 132可以通過焊接或塗佈導電膠以形成電性連接;再者, 該等電路佈線1 325可以僅設置於該電路基板132之其中一 板面1 326 ;或者,該等電路佈線1 325可以同時設置於該 電路基板132之二板面1326,且該其中一板面1 326之電 路佈線1 325可以通過一絕緣件,如:絕緣膠帶,以與該金 屬基電路板110達到絕緣效果,進而避免產生短路效果。 於本實施例中,該電路基板132之該第二端部1 322更包含 複數之凹槽1 323,該等凹槽1 323係供該發光裝置10之二 導電接腳150設置,且該二導電接腳150係與該電源驅動 單元130形成電性連接。 [0014] 該座體140係使用具有高導熱係數之高分子材料,如:熱 塑性塑膠、熱固性塑膠等,通過射出成型方式一體成型 10022102^·單編號 A〇101 第7頁V共40頁 1013050308-0 M428312 101年.02月10日核正替換頁 之結構,其具有重量輕、製作簡單及良好絕緣效果等優 點。並且,該高分子材料内添加有複數之導熱粒子141, 如:金屬氧化物粉末、石墨粉末或陶瓷粉末等,使射出成 型後之座體140可以快速地導離該發光元件12點亮時產生 的熱能。 [0015] 同時配合參閱第四圖及第五圖,該座體140具有一第一側 142及相反於該第一側之一第二侧144,該第一側142大 致呈杯狀並具有一環繞壁1420,該環繞壁1420之一内壁 面1421具有複數之卡槽1422 ;該環繞壁1420之一外壁面 1423具有複數之散熱片1424,該等散熱片1424與該座體 140為一體成型,且其内具有該等導熱粒子141,該等散 熱片1424主要用以增加該座體140的散熱面積,進而提升 該座體140的散熱效果。該金屬基電路板110設置於該第 一側142,並且該延伸部114埋設於該座體140内。該第 二側144連接該第一側142並大致呈管狀,且該等導電接 腳150貫穿該第二側144之底緣以供插設於一外部燈座(未 圖示)。 [0016] 實際製作該發光裝置10之流程細述如下:首先,通過衝壓 製程於該金屬基電路板110上形成複數個間隔設置之開槽 115,沿著該開槽115彎折該金屬基電路板110使形成一 基部112及複數個延伸部114,並於該基部112形成複數 個穿孔116。接著,將一電源驅動單元130之一電路基板 132之複數個凸柱1321貫穿該等穿孔116並與該金屬基電 路板110形成電性連接。 [0017] 之後,將結合之該金屬基電路板110及該電源驅動單元 1013050308-0 10022102产單编號A0101 第8頁/共40頁 M428312 i〇l年.02月10日修正替換頁 130埋入該座體140的射出成型模具中,使得該座體140 直接包覆於該金屬基電路板110之該延伸部114及該電源 驅動單元130 ;如此一來,可以提升該金屬基電路板110 與該座體140之間的接合力,避免因外力擠壓而脫落,並 且,可以使點亮該發光元件12時產生的熱能快速地經由 該延伸部114傳遞至該座體140,並由形成於該座體140 之複數個散熱片1424散逸致外界空氣中。接著,將該發 光元件12經由焊接製程以設置於該金屬基電路板110。或 者,該發光元件12可以先通過焊接製程以設置於該金屬 基電路板110,之後,再將設置有該發光元件12之金屬基 電路板110與該電源驅動單元130結合並埋入該座體140 的射出成型模具中,使得該座體140包覆於該金屬基電路 板110之該等延伸部114及該電源驅動單元130。 [0018] 再者,由於該電路基板132的厚度遠小於其寬度,因此, 避免包覆該電源驅動單元130之該座體140的厚度過厚, 在該座體140射出成型之前,可於該電路基板132的兩側 分別設置一填充件160,如第五圖所示,該填充件160較 佳地可以為一塑膠件、矽膠或環氧樹脂,實際實施時則 不以此限,如此一來,可以使該座體140的厚度一致,並 可以有效地降低製作成本及防止該座體140變形。 [0019] 此外,該發光裝置10更包含一擴散元件170,該擴散元件 170設置於該座體140之該第一側142並包覆該發光元件 12,該擴散元件170包含複數個卡扣172,該等卡扣172 對應地卡掣於該等卡槽1422,使得該擴散元件170位於該 發光元件12上方,該擴散元件170可以發散發光元件12所 10022102产單編號删1 第9頁./共40頁 1013050308-0 M428312 101年.02月10日梭正替換頁 提供之光線,以提升該發光裝置10之整體顏色均勻度, 進而得到較為理想的光斑質量。 [0020] 配合參閱第六圖及第七圖,分別為本創作第二實施例之 發光裝置之局部立體分解圖及剖視圖。本實施例之發光 裝置10a大致與上述第一實施例相同,不同之處在於本實 施例之發光裝置更包含一光學元件180,該光學元件180 設置於該座體140之該第一侧142,且位於該發光元件 12與該擴散元件170之間並包覆該發光元件12,從而改變 通過之光線的光強度分佈。該光學元件180可以依發光裝 置10 a之出光效果而為具有聚光效果、散光效果之透鏡。 [0021] 於本實施例中,該光學元件180具有一光軸I,且該光軸I 大致與該發光元件12之出光軸重合。該光學元件180包含 一透光之本體181,其可以採用玻璃、塑膠等可透光材質 製成。該本體181具有一入光部182、一第一出光部184 及一第二出光部186,該入光部182具有一底面1820及一 反射面1822,該底面1820具有一凹槽1821,該發光元件 t 12設置於該凹槽1821。該反射面1822連接於該底面1820 及該第一出光部184,且該反射面1 822與該光軸I的距離 隨著逐漸遠離該底面1820而增加。該第一出光部184連接 於該反射面1 822,並具有一頂面185,且該頂面185係隨 著逐漸接近該光軸I而往該底面1820的方向逐漸靠近。該 頂面185包含有複數個交錯排列第一出光面1842及第二出 光面1844 ;於本實施例中,該第一出光面1842大致平行 於該底面1820,該第二出光面1844大致垂直於該底面 1 820,使該第一出光部184呈階梯狀;並且,該第二出光 10022102^·單编號 A〇101 第10頁/共40頁 1013050308-0 M428312 ιοί年〇2月ia日按正替換頁 面1844於垂直該底面1 820之方向的長度係隨著逐漸接近 該光軸I而遞減。藉此,可以縮短光線傳遞至該第一出光 部184的距離,使降低光線於光學元件180内傳遞時所產 生的損耗,進一步地降低該光學元件180整體的厚度及重 量。於實際實施時,可以透過調整該光學元件180之第一 出光部184之該等第一出光面1842相對於垂直該光軸I的 一平面的傾斜角度以控制通過之光線的行進方向。 [0022] 該第二出光部186連接該頂面185並大致位於該凹槽1821 上方,該第二出光部186為一菲涅爾透鏡(Fresnel Lens),並且,該第二出光部186可以為具有聚光功能或 發散光功能之菲涅爾透鏡。 [0023] 配合參閱第八圖、第九圖、第十圖及第十一圖,分別為 本創作第三實施例之發光裝置之局部分解圖、局部組合 圖、局部分解圖及剖視圖。該發光裝置20包含一燈具21 、複數之發光元件22、一光學元件280及一卡合件290, 該燈具21包令—金屬基電路板210、一電源驅動單元230 及一座體240。 [0024] 該金屬基電路板210係預先形成有複數之電路佈線(圖未 示)及焊墊(圖未示),該金屬基電路板210包含一基部 21 2及複數之自該基部212周緣彎折成型且間隔設置之延 伸部214,該基部212具有複數之穿孔216,於本實施例 中,穿扎21 6以二個為例。於實際實施時,該金屬基電路 板210係通過衝壓製程預先形成複數個間隔設置之開槽 215,並彎折該延伸部214使該延伸部214大致垂直於該 基部212。 100221021^^^ A0101 第11頁/共40頁 1013050308-0 M428312 101年.02月io日梭正_百 [〇〇25]該等發光元件22設置於該基部212之一上表面213 ’並與 該金屬基電路板210形成電性連接,於本實施例中,發光 元件22以四個為例’實際實施時則不以此限,並且,該 等發光元件22較佳地為高功率發光二極體。 [〇〇26]該電源驅動單元230包含一電路基板232及設置於該電路 基板232之’至少一板面2326之至少一電子元件234,該電 路基板232較佳地可以為印刷電路板且其上預先形成有複 數之電路佈線2325及焊墊(圖未示);於本實施例中,係 以兩個電路佈線2325為例說明,實際實施時不以此限。 ,該電路基板232包含一第一端部2320及相反於該第一端 部2320之第二端部2322,該第一端部2320具有對應該等 穿孔216設置之複數凸柱2321,於本實施例中,該第一端 部2320以包含二個凸柱2321為例。該等凸柱2321係貫穿 该等穿孔216,使得該板面2326大致垂直該金屬基電路板 210之該上表面213,並且該等電路佈線2325係通過該等 凸柱2321與遠金屬基電路板210形成電性連接。該電路基 板232之該第二端部2322更包含複數之凹槽2323,該等 凹槽2323係供該發光裝置20之二導電接腳250設置,且 該一導電接腳250係與該電源驅動單元230形成電性連接 〇 [0027]該座體240係使用具有高導熱係數之高分子材料通過射出 成型方式一體成型之結構,其具有重量輕 '製作簡單及 良好絕緣效果等優點,並且該高分子材料内添加有複數 之導熱粒子241。該座體240具有一第一側242及相反於 該第一側之一第二側244,該第一側242大致呈杯狀並具 10〇221〇2产單編號 A0101 第12頁/共40頁 1013050308-0 M428312 _____ 1101年02月10日修正_頁 有一環繞壁2420,並且,該環繞壁2420之一内壁面2421 具有複數之卡槽2422。該環繞壁2420之一外壁面2423具 有複數之散熱片2424,該等散熱片2424主要用以增加該 座體240的散熱面積,進而提升該座體240的散熱效果》 該金屬基電路板210設置於該第一側242,並且該延伸部 214埋設於該座體240内。該第二側244連接該第一側 • 242並大致呈管狀,且該等導電接腳250貫穿該第二側 244之底緣以供插設於一外部燈座(未圖示)。 [0028]該座體240係包覆於該金屬基電路板210之該延伸部21 4 及該電源驅動單元230,藉以提升金屬基電路板21〇與該 座體240之間的接合力,避免因外力擠壓而脫落。 [0029]此外’該光學元件280設置於該座體240之該第一側242 並包覆該等發光元件22,該光學元件包含複數之入光部 282及一出光部284,於本實施例中,該等入光部之“的 數量等於該等發光元件230的數量。該等入光部282連接 該出光部284並朝著遠離該出光部284之方向呈圓弧狀凸 出,各該入光部282具有一凹穴2820,該等發光元件22 δ交置於該凹穴2820。 [3〇3該光學元件28〇更包含複數個支撐件286,該等支撐件 286抵頂於該金屬基電路板21〇,以將該光學元件28〇樓 立於該等發光元件22上方。 [0031]M428312 . 101_.02月10日梭正#页~| V. New description: [New type of technical jaw domain] [〇〇〇1] This creation is about a kind of light-emitting device, especially a simple manufacturing process. Good heat dissipation and insulation, and use LED as a light-emitting device. [Prior Art] [0002] Light-emitting diodes (LEDs) have the advantages of small size, long service life, low damage, mercury-free and power-saving, and therefore - gradually replace fluorescent lamps and whites. The position of the light bulb is widely used in illumination sources and decorative light sources. _3] g has been referred to as a cross-sectional view of a conventional light-emitting diode bulb. The έ illuminating diode bulb comprises a body 5 〇, a circuit board 52, a plurality of light emitting diodes 54, a conductive connection _, a lamp cover 58 and a power supply unit 59. The base body 50 is a hollow tube body. The base body 5 is surrounded by a wall ring, and a plurality of fins 51 are arranged. The heat sinks 51 can effectively increase the thermal area of the seat body 50. The heat generated when the light-emitting diode 54 is turned on is quickly conducted to the outside air. The circuit board 52 is disposed on the base 50' and electrically connected to the power drive unit 59 via a plurality of wires 53. The light-emitting diodes 54 are disposed on the circuit board 52 and electrically connected to the circuit board 52; the conductive connector 56 is connected to the side of the body 50 opposite to the circuit board 52, and is connected to the power source through the two power lines 57. The drive unit 7059 forms an electrical connection. The lamp cover 58 is disposed on one side of the base body 50 on which the light-emitting diodes 54 are disposed, and the light-emitting diodes 54 are located between the lamp cover 58 and the base body 5〇. 1013050308-0 [0004] However, due to the power supply unit 59 and the circuit board 52 and the conductive connection 10022102 production number Α 0101 帛 4 pages / a total of 40 pages M428312 101 February 101 revised replacement page head 56 must be separate The wires 53 and the power source wires 57 are electrically connected to each other, which not only increases the difficulty in the manufacturing process and production, but also increases the overall manufacturing cost. [New Content] [0005] In view of the prior art, an object of the present invention is to provide a light-emitting device which is easy to manufacture and can effectively reduce the manufacturing cost, and has the advantages of light weight and good insulation. . [0006] In order to achieve the above object, the present invention provides a light emitting device comprising at least one light emitting component and a light fixture, the light fixture comprising a plastic base, a metal base circuit board and a power driving unit, the plastic body a first side and a second side opposite to the first side, the metal base circuit board is disposed on the first side of the plastic body, the metal base circuit board includes a base portion and a plurality of peripheral edges of the base a bent portion and a spaced-apart extension portion, the base portion having a plurality of perforations, the extension portion being embedded in the plastic body, the light emitting element being disposed at the base portion; the power source driving unit comprising a circuit substrate, the circuit substrate The one end portion has a plurality of protrusions, and the protrusions correspondingly penetrate the through holes and form an electrical connection with the metal base circuit board. [0007] The lamp of the illuminating device of the present invention directly assembles the circuit substrate of the power driving unit and the metal-based circuit board and forms an electrical connection, so that the process can be simplified and the manufacturing cost can be reduced. The objects, features, and advantages of the present invention will be described by the following illustrative and non-limiting detailed description of the preferred embodiments of the present invention with 1013050308-0 1(). 221 () 2 production order number A0101 page 5 / total 40 pages M428312 ^ __ 101 · year. February 10th shuttle _ page better understand, in the accompanying drawings, the same reference numerals are used for the same component Or similar components. [0009] Referring to the second, third, and fourth figures, respectively, a partial perspective exploded view and a cross-sectional view of a portion of the illuminating device of the first embodiment of the present invention. In the embodiment, the light-emitting device 10aGui bulb is used as an example. In actual implementation, the light-emitting device 10 can be a PAR series bulb, A19, A20, A60, G30 and the like. The illuminating device 10 includes a luminaire 11 and at least one illuminating element 12. The illuminating unit 11 includes a metal core printed circui t board (MCPCB) 110, a power driving unit 130 and a body 140. [0010] The metal base circuit board 110 has a good thermal conductivity and a plurality of circuit wirings (not shown) formed thereon and a plurality of pads (not shown). The metal base circuit board 110 includes a base portion 112 and a plurality of The base portion 112 is formed by a plurality of peripherally formed and spaced apart extensions 114. The base portion 112 includes a plurality of perforated openings 6. In the present embodiment, the perforations 116 are exemplified by two. In actual implementation, the metal base circuit board 110 is A plurality of spaced apart slits 115 are formed in advance by a stamping process, and the extending portions 114 are bent to make the appearance of the metal base circuit board 110 substantially cup-shaped. [0011] The light emitting element 12 is disposed on the metal base circuit board. 110, and preferably, the light-emitting element 12 is disposed on an upper surface 113 of the base 112 and electrically connected to the metal-based circuit board 110; wherein the number of the light-emitting elements 2 may be one Or, in the embodiment, the light-emitting element 12 is exemplified as one example, and the light-emitting element 12 is preferably a high-power light-emitting diode. [0012] The power supply driving unit 130 includes a circuit substrate 132 and is disposed on The circuit 100221021^^^^ Α0101 Page 6 / Total 40 page 1013050308-0 M428312 101. On February 10th, the electronic component 134 of the plurality of board faces 1326 of the page substrate 132 is replaced, and the circuit board 132 is compared. Preferably, the circuit board (PCB) can be a plurality of circuit wires 1325 and pads (not shown). In this embodiment, two circuit wires are taken as an example for description. The circuit board 132 includes a first end portion 1 320 and a second end portion 1 322 opposite to the first end portion 1 320. The first end portion 1 320 has a plurality of studs 1321 and the The first end portion 1 320 is exemplified by two protrusions 1321 , and the two protrusions 1321 are respectively disposed corresponding to the two through holes 116 . [0013] the studs 1321 extend through the perforations 116 such that the face 1326 is substantially Straight to the upper surface 131 of the metal base circuit board 110, and the circuit wiring 1 325 is electrically connected to the metal base circuit board 110 through the protrusions 1321. The metal base circuit board 110 and The circuit substrate 132 may be electrically connected by soldering or coating a conductive paste; further, the circuit wirings 1 325 may be disposed only on one of the board faces 1 326 of the circuit substrate 132; or, the circuit wiring 1 325 can be disposed on the second board surface 1326 of the circuit board 132 at the same time, and the circuit wiring 1 325 of the one board surface 1 326 can be insulated from the metal base circuit board 110 by an insulating member, such as an insulating tape. To avoid short circuit effects. In this embodiment, the second end portion 1 322 of the circuit board 132 further includes a plurality of recesses 1 323 for the two conductive pins 150 of the light-emitting device 10, and the two The conductive pin 150 is electrically connected to the power driving unit 130. [0014] The base body 140 is made of a polymer material having a high thermal conductivity, such as a thermoplastic plastic or a thermosetting plastic, and is integrally molded by injection molding. 10022102^.Single number A〇101 Page 7V Total 40 pages 1013050308- 0 M428312 101. On February 10th, the structure of the replacement page is verified, which has the advantages of light weight, simple fabrication and good insulation effect. Further, a plurality of heat conductive particles 141 such as metal oxide powder, graphite powder or ceramic powder are added to the polymer material, so that the base 140 after injection molding can be quickly guided away from the light emitting element 12 to be lighted. Thermal energy. [0015] Referring to the fourth and fifth figures, the base 140 has a first side 142 and a second side 144 opposite to the first side. The first side 142 is substantially cup-shaped and has a An inner wall surface 1421 of the surrounding wall 1420 has a plurality of card slots 1422; an outer wall surface 1423 of the surrounding wall 1420 has a plurality of fins 1424, and the fins 1424 are integrally formed with the base body 140. The heat-dissipating particles 141 are mainly used to increase the heat dissipation area of the base 140, thereby improving the heat dissipation effect of the base 140. The metal base circuit board 110 is disposed on the first side 142, and the extension portion 114 is embedded in the base body 140. The second side 144 is connected to the first side 142 and is substantially tubular. The conductive pins 150 extend through the bottom edge of the second side 144 for insertion into an external lamp holder (not shown). [0016] The flow of actually fabricating the light-emitting device 10 is as follows: First, a plurality of spaced apart slits 115 are formed on the metal-based circuit board 110 by a stamping process, and the metal-based circuit is bent along the slits 115. The plate 110 is formed with a base portion 112 and a plurality of extension portions 114, and a plurality of perforations 116 are formed in the base portion 112. Then, a plurality of studs 1321 of one of the circuit boards 132 of the power driving unit 130 are inserted through the through holes 116 and electrically connected to the metal base circuit board 110. [0017] Thereafter, the metal-based circuit board 110 and the power supply driving unit 1013050308-0 10022102 will be combined with the order number A0101, page 8 / total 40 pages, M428312 i〇l year, February 10, revised replacement page 130 buried In the injection molding die of the base 140, the base 140 is directly coated on the extending portion 114 of the metal base circuit board 110 and the power driving unit 130; thus, the metal base circuit board 110 can be lifted. The engaging force with the seat body 140 is prevented from being detached by the external force, and the heat energy generated when the light-emitting element 12 is illuminated can be quickly transmitted to the seat body 140 via the extending portion 114, and formed by A plurality of fins 1424 of the body 140 are dissipated into the outside air. Next, the light-emitting element 12 is placed on the metal-based circuit board 110 via a soldering process. Alternatively, the light-emitting element 12 may be first disposed on the metal-based circuit board 110 by a soldering process, and then the metal-based circuit board 110 provided with the light-emitting element 12 is combined with the power source driving unit 130 and buried in the body. In the injection molding die of 140, the base 140 is wrapped around the extensions 114 of the metal base circuit board 110 and the power driving unit 130. [0018] Moreover, since the thickness of the circuit substrate 132 is much smaller than the width thereof, the thickness of the base 140 covering the power driving unit 130 is prevented from being too thick, and before the housing 140 is injection molded, A filler member 160 is disposed on each side of the circuit board 132. As shown in FIG. 5 , the filler member 160 may preferably be a plastic member, a silicone rubber or an epoxy resin. Therefore, the thickness of the seat body 140 can be made uniform, and the manufacturing cost can be effectively reduced and the deformation of the seat body 140 can be prevented. [0019] In addition, the illuminating device 10 further includes a diffusing element 170 disposed on the first side 142 of the base 140 and covering the illuminating element 12, the diffusing element 170 includes a plurality of 172 The latches 172 are correspondingly latched in the card slots 1422 such that the diffusing elements 170 are located above the light emitting elements 12, and the diffusing elements 170 can diverge the light-emitting elements 12 by the number of the single-numbered pages. A total of 40 pages 1013050308-0 M428312 101. On February 10, the shuttle is replacing the light provided by the page to improve the overall color uniformity of the light-emitting device 10, thereby obtaining a better spot quality. [0020] Referring to the sixth and seventh figures, respectively, a partial exploded perspective view and a cross-sectional view of the light-emitting device of the second embodiment of the present invention. The illuminating device 10a of the present embodiment is substantially the same as the first embodiment described above, except that the illuminating device of the embodiment further includes an optical component 180 disposed on the first side 142 of the housing 140. And between the light-emitting element 12 and the diffusing element 170 and covering the light-emitting element 12, thereby changing the light intensity distribution of the light passing therethrough. The optical element 180 can be a lens having a condensing effect and a astigmatism effect depending on the light-emitting effect of the light-emitting device 10a. [0021] In the embodiment, the optical element 180 has an optical axis I, and the optical axis I substantially coincides with the optical axis of the light-emitting element 12. The optical component 180 includes a light transmissive body 181 which can be made of a light transmissive material such as glass or plastic. The 181 has a light incident portion 182, a first light exit portion 184, and a second light exit portion 186. The light incident portion 182 has a bottom surface 1820 and a reflective surface 1822. The bottom surface 1820 has a recess 1821. The element t 12 is disposed in the recess 1821. The reflective surface 1822 is coupled to the bottom surface 1820 and the first light exiting portion 184, and the distance between the reflective surface 1822 and the optical axis I increases as it gradually moves away from the bottom surface 1820. The first light exiting portion 184 is coupled to the reflecting surface 1822 and has a top surface 185 which gradually approaches the direction of the bottom surface 1820 as it gradually approaches the optical axis I. The top surface 185 includes a plurality of staggered first light-emitting surfaces 1842 and a second light-emitting surface 1844. In this embodiment, the first light-emitting surface 1842 is substantially parallel to the bottom surface 1820, and the second light-emitting surface 1844 is substantially perpendicular to The bottom surface 1 820 makes the first light exiting portion 184 stepped; and the second light output 10022102^·single number A〇101 10th page/total 40 page 1013050308-0 M428312 ιοί year 〇 February ia day press The length of the positive replacement page 1844 in the direction perpendicular to the bottom surface 1 820 decreases as it approaches the optical axis I. Thereby, the distance that light is transmitted to the first light-emitting portion 184 can be shortened, and the loss generated when light is transmitted through the optical element 180 can be reduced, and the thickness and weight of the entire optical element 180 can be further reduced. In actual implementation, the direction of inclination of the passing light may be controlled by adjusting the inclination angle of the first light-emitting surface 1842 of the first light-emitting portion 184 of the optical element 180 with respect to a plane perpendicular to the optical axis I. [0022] The second light exiting portion 186 is connected to the top surface 185 and is located substantially above the recess 1821. The second light exiting portion 186 is a Fresnel lens, and the second light exiting portion 186 can be Fresnel lens with concentrating function or divergent function. [0023] Referring to the eighth, ninth, tenth, and eleventh drawings, respectively, a partial exploded view, a partial combined view, a partially exploded view, and a cross-sectional view of the light-emitting device of the third embodiment of the present invention. The illuminating device 20 includes a luminaire 21, a plurality of illuminating elements 22, an optical component 280, and a latching member 290. The illuminating device 21 includes a metal-based circuit board 210, a power driving unit 230, and a body 240. [0024] The metal base circuit board 210 is formed with a plurality of circuit wirings (not shown) and pads (not shown). The metal base circuit board 210 includes a base portion 21 2 and a plurality of peripheral edges of the base portion 212. The base portion 212 has a plurality of perforations 216. In the present embodiment, the punctures 21 6 are exemplified by two. In actual implementation, the metal base circuit board 210 is pre-formed into a plurality of spaced apart slots 215 by a stamping process, and the extension portion 214 is bent such that the extension portion 214 is substantially perpendicular to the base portion 212. 100221021^^^ A0101 Page 11/Total 40 Page 1013050308-0 M428312 101.02月 io日梭正_百 [〇〇25] The light-emitting elements 22 are disposed on one of the upper surfaces 213' of the base 212 and The metal-based circuit board 210 is electrically connected. In the embodiment, the light-emitting elements 22 are exemplified by the following four embodiments, and the light-emitting elements 22 are preferably high-power light-emitting devices. Polar body. The power driving unit 230 includes a circuit substrate 232 and at least one electronic component 234 disposed on the at least one surface 2326 of the circuit substrate 232. The circuit substrate 232 may preferably be a printed circuit board and A plurality of circuit wires 2325 and pads (not shown) are formed in advance. In the present embodiment, the two circuit wires 2325 are exemplified, and the actual implementation is not limited thereto. The circuit board 232 includes a first end portion 2320 and a second end portion 2322 opposite to the first end portion 2320. The first end portion 2320 has a plurality of protrusions 2321 corresponding to the through holes 216. For example, the first end portion 2320 is exemplified by two protrusions 2321. The studs 2321 extend through the through holes 216 such that the plate faces 2326 are substantially perpendicular to the upper surface 213 of the metal base circuit board 210, and the circuit wires 2325 pass through the studs 2321 and the far metal based circuit board. 210 forms an electrical connection. The second end portion 2322 of the circuit board 232 further includes a plurality of recesses 2323 for the two conductive pins 250 of the illuminating device 20, and the conductive pin 250 is driven by the power source. The unit 230 forms an electrical connection. [0027] The base 240 is a structure integrally formed by injection molding using a polymer material having a high thermal conductivity, which has the advantages of light weight, simple fabrication, good insulation effect, and the like. A plurality of thermally conductive particles 241 are added to the molecular material. The base body 240 has a first side 242 and a second side 244 opposite to the first side. The first side 242 is substantially cup-shaped and has a number of 〇221〇2. The order number is A0101. Page 12 of 40 Page 1013050308-0 M428312 _____ The correction of the February 10, 1101 page has a surrounding wall 2420, and an inner wall surface 2421 of the surrounding wall 2420 has a plurality of card slots 2422. The outer wall surface 2423 of the surrounding wall 2420 has a plurality of heat sinks 2424. The heat sinks 2424 are mainly used to increase the heat dissipation area of the base body 240, thereby improving the heat dissipation effect of the base body 240. The metal base circuit board 210 is disposed. The first side 242 is disposed, and the extension portion 214 is embedded in the base 240. The second side 244 is connected to the first side 242 and is substantially tubular. The conductive pins 250 extend through the bottom edge of the second side 244 for insertion into an external lamp holder (not shown). The base 240 is wrapped around the extension portion 214 of the metal base circuit board 210 and the power driving unit 230, thereby improving the bonding force between the metal base circuit board 21 and the base 240, thereby avoiding Falling off due to external force. [0029] In addition, the optical element 280 is disposed on the first side 242 of the body 240 and covers the light-emitting elements 22, and the optical element includes a plurality of light-injecting portions 282 and a light-emitting portion 284. The number of the light incident portions is equal to the number of the light emitting elements 230. The light incident portions 282 are connected to the light exit portion 284 and protrude in an arc shape away from the light exit portion 284. The light incident portion 282 has a recess 2820, and the light-emitting elements 22 δ are disposed in the recess 2820. [3〇3 The optical component 28 further includes a plurality of support members 286, and the support members 286 abut the The metal base circuit board 21 is configured to stand the optical element 28 above the light emitting elements 22. [0031]

[0032]配合參閱第十 1〇〇221〇2产單編號A0UU •亥卡合件290具有複數個卡榫292,該等卡榫292卡人於 該座體240之該等卡槽2422並緊固該光學元件28〇。 二圖、第十三圖及第十四圖 ’分別為本創 第13頁./共40頁 1013050308-0 M428312 101年.02启10日接正頁 作第四實施例之發光裝置之局部分解圖、局部組合圖及 剖視圖。於本實施例中,該發光裝置30以MR16燈泡為例 說明,實際實施時則不以此限。該發光裝置30包含一燈 具31及至少一發光元件32,該燈具31包含一金屬基電路 板310、一電源驅動單元330、一座體340及一光學元件 380 〇 [0033] 該金屬基電路板310包含一基部312及複數之自該基部 312周緣彎折成型且間隔設置之延伸部314,於本實施例 中’該延伸部314大致垂直於該基部312。該基部312包 含複數傭穿孔316及複數個開孔318,於本實施例中,穿 孔316以二個為例,開孔318以四個為例,實際實施時則 不以此限。 [0034] 該等發光元件32設置於該基部31 2之一上表面313並與該 金屬基電路板310形成電性連接,且於本實施例中,發光 元件32以七個為例,且較佳地可以為高功率發光二極艘 ,實際實施時則不以此限。 [0035] 該電源驅動單元330包含一電路基板332及設置於該電路 基板332之至少一板面3326之至少一電子元件334 ’該電 子元件334可例如為電源轉換器或其它主動式、被動式電 子元件。該電路基板332較佳地可以為印刷電路板且其上 預先形成有複數之電路佈線3325及焊墊(圖未示);於本 實施例中’係以兩個電路佈線3325為例說明,實際實施 時不以此限。 [0036] 該電路基板332之一第一端部3320包含複數個凸柱3321 ,於本實施例中,凸柱3321以二個為例《該等凸枉3321 10022102^單编號 Α〇101 第 頁 / 共 40 頁 1013050308-0 M428312 「 __ 1101年.02月10日接正雜百 係貫穿該等穿孔316 ’使得該板面3326大致垂直該金屬基 電路板310之該上表面313,並且該等電路佈線3325係通 過該等凸柱3321與該金屬基電路板310形成電性連接。 [0037] 該光學元件380包含複數之入光部382、一出光部384及 複數個卡合部386,該等入光部382連接該出光部384並 朝著遠離該出光部384之方向呈圓弧狀凸出,各該入光部 ' 382具有一凹穴3820,各該發光元件32設置於該凹穴 3820 ;於本實施例中,該等入光部382的數量等於該等發 光元件330的數量。該等卡合部386對應該等開孔318設 置,且該等卡合部386的數量等於該等開孔318的數量, 該等卡合部386卡合於該等開孔318使該光學元件380與 該金屬基電路板310結合,於本實施例中,該等卡合部 386以四個為例》 [0038] 該座體340係使用具有高導熱係數之高分子材料通過射出 成型方式一體成型之結構,其具有重量輕、製作簡單及 良好絕緣效果等優點,並且該高分子材料内添加有複數 之導熱粒子341。該座體340包覆該等延伸部314、該電 源驅動單元330及該光學元件380,藉以提升金屬基電路 板310、該光學元件380與該座體340之間的接合力,避 免因外力擠壓而脫落。該座體340之一第一側342大致呈 杯狀並具有一環繞壁3420,該環繞壁3420之一外壁面具 有複數之散熱片3424,該等散熱片3424可以有效地提升 該座體340的散熱效果。該金屬基電路板310設置於該第 一側342,並且該延伸部314埋設於該座體340内,該光 學元件380設置於該第一側342並包覆該等發光元件32。 100221021^^ A〇101 第15頁/共40頁 1013050308-0 101年.02月10日接正^頁 3玄座體340之一第二側344相反於該第一側342並連接該 第—側342且大致呈管狀,複數之導電接腳35〇貫穿該第 一側344之底緣,並連接該電路基板332之第二端部3322 而與該電路基板332形成電性連接;於本實施例中,該等 導電接腳350為對應MR16燈泡之接腳。 39]實際製作該發光裝置30之流程細述如下:首先,通過衝壓 製程於該金屬基電路板310上形成複數個間隔設置之開槽 315,沿著該開槽31 5彎折該金屬基電路板31 〇使形成一 基部312及複數個延伸部314,並於該基部312形成複數 俩穿孔316及複數個開孔318。接著,將一電源驅動單元 330之一電路基板332之複數個凸柱3321貫穿該等穿孔 316與該金屬基電路板310形成電性連接。 [0040] 將複數個發光元件32設置於該基部312並與該金屬基電路 板310形成電性連接;並且,將一光學元件380之卡合部 386對應地卡合於該等開孔318,從而固定該光學元件 380 » [0041] 之後,將結合之該金屬基電路板310及該電源驅動單元 330埋入該座體340的射出成型模具中,使得該座體340 直接包覆於該金屬基電路板310之該延伸部314、該電源 驅動單元330及部份之該光學元件380。 [0042] 配合參閱第十五圖、第十六圖及第十七圖,為本創作第 五實施例之發光裝置之局部分解圖、局部組合圖及剖視 圖。本實施例之發光裝置30a大致與上述第四實施例相似 ,不同之處在於其導電接腳350a,該導電接腳350a為 GU10燈泡之接腳,以供插設於GU5. 3或GX5. 3之類的嵌燈 10022102产單编號 A0101 第 16 頁 / 共 40 頁- 1013050308-0 M428312 101年.02月10日梭正替^頁 座,此部份僅為舉例,但不限於此。 [0043] 綜合以上所述,本創作之發光裝置之該電源驅動單元之 該電路基板係直接地與該金屬基電路板形成電性連接, 如此一來,不但可以有效地簡化工序並可以降低製作成 本;並且,該座體係使用混合有導熱粒子的塑膠材料製 成,可以有效地導離點亮發光元件時產生的熱能,且具 有加工容易、重量輕、具有較佳的耐屈撓悻及絕緣性佳 等優點;並且,透過彎折該金屬基電路板,並使該金屬 基電路板之該等延伸部埋入該座體,如此一來,可以快 速地導離發光元件產生的熱能,避免發光元件因工作於 高溫環境中產生亮度降低、壽命變短及波長飄移,甚至 損壞的情形產生。 [0044] 然以上所述者,僅為本創作之較佳實施例,當不能限定 本創作實施之範圍,即凡依本創作申請專利範圍所作之 均等變化與修飾等,皆應仍屬本創作之專利涵蓋範圍意 圖保護之範疇。 【圖式簡單說明】 [0045] 第一圖為習知之發光二極體燈泡之剖視圖。 [0046] 第二圖為本創作第一實施例之發光裝置之局部立體分解 圖。 [0047] 第三圖為本創作第一實施例之發光裝置之局部組合圖。 [0048] 第四圖為本創作第一實施例之發光裝置之剖視圖。 [0049] 第五圖為本創作第一實施例之發光裝置之局部分解圖。 臓麗單編號A0101 第17頁/共40頁 1013050308-0 M428312 101'年.02月10日核正替換頁 [0050] 第六圖為本創作第二實施例之發光裝置之局部分解圖。 [0051] 第七圖為本創作第二實施例之發光裝置之剖視圖。 [0052] 第八圖為本創作第三實施例之發光裝置之局部分解圖。 [0053] 第九圖為本創作第三實施例之發光裝置之局部組合圖。 [0054] 第十圖為本創作第三實施例之發光裝置之局部分解圖。 [0055] 第十一圖為本創作第三實施例之發光裝置之剖視圖。 [0056] 第十二圖為本創作第四實施例之發光裝置之局部分解圖 〇 [0057] 第十三圖為本創作第四實施例之發光裝置之局部組合圖 〇 [0058] 第十四圖為本創作第四實施例之發光裝置之剖視圖。 [0059] 第十五圖為本創作第五實施例之發光裝置之局部分解圖 〇 [0060] 第十六圖為本創作第五實施例之發光裝置之局部組合圖 〇 [0061] 第十七圖為本創作第五實施例之發光裝置之剖視圖。 【主要元件符號說明】 [0062] 〈先前技術〉 [0063] 50座體 [0064] 52電路板 [0065] 53 導線 、 100221021^單编號酬1 第18頁/共40頁 1013050308-0 M428312 [0066] 54發光二極體 [0067] 56導電接頭 [0068] 5 7電源線 [0069] 58燈罩 [0070] 5 9電源驅動單元 [0071] 〈本創作〉 [0072] 10、10a、20、30、30a發光裝置 [0073] 11 ' 21、31 燈具 [0074] 110、210、310金屬基電路板 [0075] 112、212、312基部 [0076] 113、213、313上表面 [0077] 114、214、314延伸部 [0078] 115、215、315開槽 [0079] 116、216、316 穿子L [0080] 12 ' 22 ' 32發光元件 [0081] 130、230、330電源驅動單元 [0082] 132、232、332電路基板 [0083] 1320、2320、3320 第一端部 [0084] 1321、2321、3321 凸柱 [0085] 100221021^^ 1322、2322、3322 第二端部 A0101 第19頁/共40頁 101年.02月10日修正替換頁 1013050308-0 M428312 [0086] 101年.02月10日修正替換頁 1 323、2323凹槽 [0087] 1 325、2325、3325電路佈線 [0088] 1 326、2326、3326板面 [0089] 134、234、334電子元件 [0090] 140、240、340座體 [0091] 141、241、341導熱粒子 [0092] 142、242、342 第一側 [0093] 1420、2420、3420環繞壁 [0094] 1421、2421内壁面 [0095] 1422、2422卡槽 [0096] 1423、2423外壁面 [0097] 1424、2424、3424散熱片 [0098] 144、244、344第二側 [0099] 150、250、350、350a導電接腳 [0100] 160填充件 [0101] 170擴散元件 [0102] 172卡扣 [0103] 180、280、380光學元件 [0104] 181本體 [0105] 182、282、382入光部 10022102#單編號 A〇101 M428312 [0106] 101年.02月10日梭正替換頁 1820底面 [0107] 1821凹槽 [0108] 1822反射面 [0109] 184第一出光部 [0110] 1842第一出光面 [0111] 1844第二出光面 [0112] 185頂面 [0113] 186第二出光部 [0114] 2820、3820凹穴 [0115] 284、384出光部 [0116] 286支撐件 [0117] 290卡合件 [0118] 292卡榫 . [0119] 318開孔 . [0120] 386卡合部 [0121] I光抽 100221021^^ A〇101 第21頁./共40頁 1013050308-0[0032] Referring to the tenth 1 〇〇 221 产 产 编号 产 • • 亥 亥 亥 亥 亥 亥 290 290 290 290 290 290 290 290 290 290 290 290 290 290 292 292 292 292 292 292 292 292 292 292 292 292 292 292 292 292 292 292 292 292 The optical element 28 is fixed. The second, the thirteenth and the fourteenth drawings respectively are the 13th page of the original. The total decomposition of the illuminating device of the fourth embodiment is the first page of the 10th page of 1013050308-0 M428312. Figure, partial combination diagram and section view. In the embodiment, the illuminating device 30 is exemplified by an MR16 bulb, and the actual implementation is not limited thereto. The illuminating device 30 includes a luminaire 31 and at least one illuminating component 32. The illuminating device 31 includes a metal base circuit board 310, a power driving unit 330, a body 340, and an optical component 380. [0033] The metal base circuit board 310 A base portion 312 and a plurality of extensions 314 that are bent and formed from the periphery of the base portion 312 are formed. In the present embodiment, the extension portion 314 is substantially perpendicular to the base portion 312. The base 312 includes a plurality of puncturing 316s and a plurality of openings 318. In this embodiment, the two through holes 316 are exemplified, and the openings 318 are exemplified by four. [0034] The light-emitting elements 32 are disposed on an upper surface 313 of the base portion 31 2 and electrically connected to the metal-based circuit board 310. In the embodiment, the light-emitting elements 32 are exemplified by seven. Jiadi can be a high-power light-emitting diode ship, but it is not limited to the actual implementation. The power driving unit 330 includes a circuit substrate 332 and at least one electronic component 334 disposed on at least one surface 3326 of the circuit substrate 332. The electronic component 334 can be, for example, a power converter or other active or passive electronic device. element. The circuit board 332 is preferably a printed circuit board and has a plurality of circuit wires 3325 and pads (not shown) formed thereon. In the present embodiment, the two circuit wires 3325 are taken as an example to illustrate the actual It is not limited by this implementation. [0036] The first end portion 3320 of the circuit board 332 includes a plurality of protrusions 3321. In the embodiment, the protrusions 3321 are exemplified by two examples: "The tenons 3321 10022102^ are numbered Α〇101. Page / Total 40 pages 1013050308-0 M428312 " __ 1101. February 10th is connected to the perforations 316 ' such that the plate surface 3326 is substantially perpendicular to the upper surface 313 of the metal base circuit board 310, and The circuit wiring 3325 is electrically connected to the metal base circuit board 310 through the protrusions 3321. The optical element 380 includes a plurality of light incident portions 382, a light exit portion 384, and a plurality of engaging portions 386. The light incident portion 382 is connected to the light exit portion 384 and protrudes in an arc shape away from the light exit portion 384. Each of the light incident portions 382 has a recess 3820, and each of the light emitting elements 32 is disposed in the concave portion. In the present embodiment, the number of the light incident portions 382 is equal to the number of the light emitting elements 330. The engaging portions 386 are disposed corresponding to the openings 318, and the number of the engaging portions 386 is equal to The number of the openings 318, the engaging portions 386 are engaged with the openings 318 to make the optical The member 380 is combined with the metal base circuit board 310. In the embodiment, the engaging portions 386 are exemplified by four. [0038] The base 340 is formed by injection molding using a polymer material having a high thermal conductivity. The integrally formed structure has the advantages of light weight, simple fabrication, good insulation effect, and the like, and a plurality of heat conductive particles 341 are added to the polymer material. The base body 340 covers the extension portions 314 and the power source driving unit 330. And the optical component 380, thereby improving the bonding force between the metal base circuit board 310, the optical component 380 and the base 340, and avoiding falling off due to external force. One of the first sides 342 of the base 340 is substantially a cup. And having a surrounding wall 3420, the outer wall surface of the surrounding wall 3420 has a plurality of heat sinks 3424, which can effectively enhance the heat dissipation effect of the base 340. The metal base circuit board 310 is disposed on the first One side 342, and the extension portion 314 is embedded in the base body 340. The optical element 380 is disposed on the first side 342 and covers the light-emitting elements 32. 100221021^^ A〇101 Page 15 of 40 1013050308-0 1 01. February 10th, the first side 344 of the squat block 340 is opposite to the first side 342 and connected to the first side 342 and is substantially tubular, and the plurality of conductive pins 35 〇 extend through the The bottom edge of the first side 344 is connected to the second end portion 3322 of the circuit board 332 to form an electrical connection with the circuit board 332. In this embodiment, the conductive pins 350 are corresponding to the MR16 bulb. . The process of actually fabricating the illuminating device 30 is as follows: First, a plurality of spaced apart slots 315 are formed on the metal base circuit board 310 by a stamping process, and the metal base circuit is bent along the slot 31 5 The plate 31 is configured to form a base portion 312 and a plurality of extension portions 314, and a plurality of two through holes 316 and a plurality of openings 318 are formed in the base portion 312. Then, a plurality of studs 3321 of a circuit board 332 of a power driving unit 330 are electrically connected to the metal base circuit board 310 through the through holes 316. [0040] A plurality of light-emitting elements 32 are disposed on the base 312 and electrically connected to the metal-based circuit board 310; and the engaging portions 386 of an optical component 380 are correspondingly engaged with the openings 318, Therefore, the optical component 380 is fixed. [0041] After that, the metal-based circuit board 310 and the power driving unit 330 are embedded in the injection molding die of the base 340, so that the base 340 is directly coated on the metal. The extension portion 314 of the base circuit board 310, the power source driving unit 330, and a portion of the optical element 380. [0042] Referring to the fifteenth, sixteenth and seventeenth aspects, a partial exploded view, a partial assembled view and a cross-sectional view of the illuminating device of the fifth embodiment of the present invention are provided. The illuminating device 30a of the present embodiment is substantially similar to the above-mentioned fourth embodiment, except that it has a conductive pin 350a, the conductive pin 350a is a pin of the GU10 bulb, and is inserted into the GU5. 3 or GX5. Such a recessed light 10022102 production order number A0101 page 16 / total 40 pages - 1013050308-0 M428312 101. February 10th shuttle is the ^ page seat, this part is only an example, but not limited to this. [0043] In summary, the circuit board of the power driving unit of the light-emitting device of the present invention is directly electrically connected to the metal-based circuit board, so that the process can be simplified and the production can be reduced. Cost; and the system is made of a plastic material mixed with heat-conducting particles, which can effectively guide the heat energy generated when the light-emitting element is lighted, and has the advantages of easy processing, light weight, better resistance to flexing and insulation. And the advantages of goodness; and, by bending the metal base circuit board and embedding the extension portions of the metal base circuit board into the base body, the heat energy generated by the light emitting element can be quickly guided away from the heat source, thereby avoiding The light-emitting element is produced by operating in a high-temperature environment, resulting in reduced brightness, shortened life, wavelength drift, and even damage. [0044] However, the above descriptions are only preferred embodiments of the present invention, and the scope of the present invention cannot be limited, that is, the equal changes and modifications made by the scope of the patent application of the present invention should still belong to the present creation. The patent covers the scope of the intent to protect. BRIEF DESCRIPTION OF THE DRAWINGS [0045] The first figure is a cross-sectional view of a conventional light-emitting diode bulb. [0046] The second figure is a partial exploded perspective view of the light-emitting device of the first embodiment of the present invention. [0047] The third figure is a partial combination diagram of the light-emitting device of the first embodiment of the present invention. [0048] The fourth figure is a cross-sectional view of the light-emitting device of the first embodiment of the present invention. [0049] FIG. 5 is a partially exploded view of the light-emitting device of the first embodiment of the present invention.单丽单号 A0101 Page 17 of 40 1013050308-0 M428312 101'. February 10th Nuclear Replacement Page [0050] The sixth figure is a partially exploded view of the illuminating device of the second embodiment of the present invention. [0051] FIG. 7 is a cross-sectional view of the light-emitting device of the second embodiment of the present invention. [0052] FIG. 8 is a partially exploded view of the light-emitting device of the third embodiment of the present invention. [0053] FIG. 9 is a partial assembled view of the light-emitting device of the third embodiment of the present invention. [0054] FIG. 10 is a partially exploded view of the light-emitting device of the third embodiment of the present invention. 11 is a cross-sectional view of a light-emitting device of a third embodiment of the present invention. 12 is a partial exploded view of a light-emitting device according to a fourth embodiment of the present invention. [0057] FIG. 13 is a partial combination diagram of a light-emitting device according to a fourth embodiment of the present invention [0058] The figure is a cross-sectional view of a light-emitting device of a fourth embodiment of the present invention. 15 is a partial exploded view of a light-emitting device according to a fifth embodiment of the present invention. [0060] FIG. 16 is a partial combination diagram of a light-emitting device according to a fifth embodiment of the present invention [0061] The figure is a cross-sectional view of a light-emitting device of a fifth embodiment of the present invention. [Major component symbol description] [0062] <Prior Art> [0063] 50-seat body [0064] 52 circuit board [0065] 53 wire, 100221021^ single-numbered 1 page 18/total 40 page 1013050308-0 M428312 [ 0066] 54 light-emitting diode [0067] 56 conductive connector [0068] 5 7 power cable [0069] 58 lampshade [0070] 5 9 power driver unit [0071] <this creation> [0072] 10, 10a, 20, 30 30a illuminating device [0073] 11 ' 21, 31 luminaire [0074] 110, 210, 310 metal-based circuit board [0075] 112, 212, 312 base [0076] 113, 213, 313 upper surface [0077] 114, 214 314 extension [0078] 115, 215, 315 slot [0079] 116, 216, 316 wearer L [0080] 12 '22' 32 light-emitting element [0081] 130, 230, 330 power drive unit [0082] 132 , 232, 332 circuit board [0083] 1320, 2320, 3320 first end [0084] 1321, 2321, 3321 studs [0085] 100221021 ^ ^ 1322, 2322, 3322 second end A0101 page 19 / a total of 40 Page 101. February 10th Revision Replacement Page 1013050308-0 M428312 [0086] 101. February 10th Revision Replacement Page 1 323, 2323 Groove [0087] 1 325, 2325, 3325 Circuit Cloth [0088] 1 326, 2326, 3326 board surface [0089] 134, 234, 334 electronic component [0090] 140, 240, 340 body [0091] 141, 241, 341 heat conducting particles [0092] 142, 242, 342 One side [0093] 1420, 2420, 3420 surround wall [0094] 1421, 2421 inner wall surface [0095] 1422, 2422 card slot [0096] 1423, 2423 outer wall surface [0097] 1424, 2424, 3424 heat sink [0098] 144 244, 344 second side [0099] 150, 250, 350, 350a conductive pin [0100] 160 filler [0101] 170 diffusing element [0102] 172 snap [0103] 180, 280, 380 optical component [0104 181 body [0105] 182, 282, 382 light-in part 10022102# single number A〇101 M428312 [0106] 101 years. February 10th shuttle replacement page 1820 bottom surface [0107] 1821 groove [0108] 1822 reflection surface [0109] 184 first light exiting portion [0110] 1842 first light exiting surface [0111] 1844 second light emitting surface [0112] 185 top surface [0113] 186 second light exiting portion [0114] 2820, 3820 recess [0115] 284 , 384 light exit [0116] 286 support [0117] 290 snap [0118] 292 card. [0119] 318 opening. [0120] 386 engagement [0121] I light pumping 100221021^^ A〇1 01 Page 21 of 40 pages 1013050308-0

Claims (1)

M428312 10Ϊ年02月10日核正_頁 六、申請專利範圍: 1 . 一種發光裝置,包含: 至少一發光元件; 一燈具,包含: 一塑膠座體,具有一第一側及一相反於該第一側之第二側 一金屬基電路板,設置於該塑膠座體之該第一側,該金屬 基電路板包含一基部及複數個由該基部周緣彎折成型且間 隔設置之延伸部,該基部具有複數之穿孔,該延伸部埋設 於該座體内,該發光元件設置於該基部; 一電源驅動單元,包含一電路基板,該電路基板之一第一 端部具有複數之凸枉,該等凸柱對應地貫穿該等穿孔並與 該金屬基電路板形成電性連接。 2. 如申請專利範圍第1項所述之發光裝置,更包含一擴散元 件,設置於該塑膠座體之該第一側並包覆該發光元件。 3. 如申請專利範圍第2項所述之發光裝置,其中該擴散元件 包含複數個卡扣,該等卡扣對應地卡掣於該塑膠座體之一 内壁面之複數卡槽。 4. 如申請專利範圍第1項所述之發光裝置,更包含一光學元 件,設置於該塑膠座體之該第一側並包覆該發光元件。 5. 如申請專利範圍第4項所述之發光裝置,其中該光學元件 具有一光軸,該光學元件包含: 一本體,包含: 一入光部,包含一底面及一反射面,該底面具有一凹槽, 該反射面連接於該底面且該反射面與該光軸的距離隨著逐 1013050308-0 漸遠離該底面而增加,該發光元件設置於該凹槽; 10022102!^單編號A〇1〇l 第22頁/共40頁 M428312 101年.02月10日梭正替換頁 一第一出光部,連接於該反射面,該第一出光部具有一頂 面,且該頂面係隨著逐漸接近該光軸而往該底面的方向逐 漸靠近;以及 一第二出光部,連接該頂面並大致位於該凹槽上方。 6 .如申請專利範圍第5項所述之發光裝置,其中該頂面包含 複數個交錯排列之第一出光面及第二出光面,該第二出光 面大致垂直於該底面,該第一出光面大致平行於底面,使 該第一出光部呈階梯狀。 7. 如申請專利範圍第4項所述之發光裝置,其中該光學元件 包含複數之入光部及一出光部,該等入光部連接該出光部 並朝著遠離該出光部之方向凸出,且各該入光部具有一凹 穴,該發光元件設置於該凹穴。 8. 如申請專利範圍第7項所述之發光裝置,更包含一卡合件 ,該卡合件具有複數之卡榫,該等卡榫卡合於該塑膠座體 之複數卡槽。 9. 如申請專利範圍第1項所述之發光裝置,其中該塑膠座體 包含複數個形成於一外壁面之散熱片。 1〇 .如申請專利範圍第1項所述之發光裝置,其中該塑膠座體 包含複數之具有高導熱係數之導熱粒子。 11 .如申請專利範圍第1項所述之發光裝置,其中該電路基板 之至少一板面大致垂直該基部之一上表面。 12.如申請專利範圍第1項所述之發光裝置,其中該燈具更包 含一光學元件,該光學元件包含複數之入光部及一出光部 ,該等入光部連接該出光部並朝著遠離該出光部之方向凸 出,且各該入光部具有一凹穴,該發光元件設置於該凹穴 10022102^^ A〇101 第23頁/共40頁 1013050308-0M428312 10th Anniversary, February 10th, _6, the scope of application for patents: 1. A illuminating device comprising: at least one illuminating element; a luminaire comprising: a plastic body having a first side and a opposite a metal-based circuit board disposed on the second side of the first side is disposed on the first side of the plastic body, the metal-based circuit board includes a base portion and a plurality of extending portions formed by the periphery of the base portion and spaced apart, The base has a plurality of perforations, the extension is embedded in the housing, the light emitting element is disposed on the base; a power driving unit includes a circuit substrate, and the first end of the circuit substrate has a plurality of protrusions, The studs extend through the perforations and form an electrical connection with the metal-based circuit board. 2. The illuminating device of claim 1, further comprising a diffusing element disposed on the first side of the plastic body and covering the illuminating element. 3. The illuminating device of claim 2, wherein the diffusing element comprises a plurality of buckles correspondingly latched in a plurality of card slots on an inner wall surface of the plastic body. 4. The illuminating device of claim 1, further comprising an optical element disposed on the first side of the plastic body and covering the illuminating element. 5. The illuminating device of claim 4, wherein the optical component has an optical axis, the optical component comprising: a body comprising: a light incident portion comprising a bottom surface and a reflective surface, the bottom surface having a groove, the reflecting surface is connected to the bottom surface, and the distance of the reflecting surface from the optical axis increases as the distance from the bottom surface is increased from 1013050308-0, and the light emitting element is disposed in the groove; 10022102!^ single number A〇 1〇l Page 22 of 40 M428312 101. On February 10th, the shuttle is replacing the first light exiting portion, which is connected to the reflective surface. The first light exiting portion has a top surface, and the top surface is replaced by Gradually approaching the optical axis and gradually approaching the bottom surface; and a second light exiting portion connecting the top surface and located substantially above the recess. 6. The illuminating device of claim 5, wherein the top surface comprises a plurality of staggered first illuminating surfaces and a second illuminating surface, the second illuminating surface being substantially perpendicular to the bottom surface, the first illuminating light The surface is substantially parallel to the bottom surface, and the first light exiting portion is stepped. 7. The illuminating device of claim 4, wherein the optical component comprises a plurality of light incident portions and a light exiting portion, the light incident portions are coupled to the light exiting portion and protrude in a direction away from the light exiting portion. And each of the light incident portions has a recess, and the light emitting element is disposed at the recess. 8. The illuminating device of claim 7, further comprising a latching member, the latching member having a plurality of latches, the latches being engaged with the plurality of latching slots of the plastic body. 9. The illuminating device of claim 1, wherein the plastic body comprises a plurality of fins formed on an outer wall surface. The illuminating device of claim 1, wherein the plastic body comprises a plurality of thermally conductive particles having a high thermal conductivity. The illuminating device of claim 1, wherein at least one of the surface of the circuit substrate is substantially perpendicular to an upper surface of the base. 12. The illuminating device of claim 1, wherein the illuminating device further comprises an optical component, the optical component comprising a plurality of light incident portions and a light exiting portion, the light incident portions connecting the light exiting portions and facing A light is protruded away from the light exiting portion, and each of the light incident portions has a recess, and the light emitting element is disposed at the recess 10022102^^A〇101 page 23/total 40 page 1013050308-0
TW100221021U 2011-11-08 2011-11-08 Light emitting apparatus TWM428312U (en)

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