M426868 五、新型說明： 【新型所屬之技術領域】 本創作係關於一種晶片搬運裝置，特別是關於一種 多軸旋轉式的晶片搬運裝置。 【先前技術】 晶片是半導體製程所常用的物料，可製作為集成電 路所用的載體。晶片的生產流程包含了許多種處理方 式，包括感光劑塗佈、曝光、顯影、腐蝕、及滲透等等， 以製成具有多層線路的元件，並經由檢測、封裝，而製 成實際可用的積體電路成品。 為了避免人為操作而產生的錯誤，以及環境中微 塵於製造過程中所產生的影響，晶片的製程大多利用自 動化的設備並於無塵室中進行。且由於晶片製程中之各 種處理方式所使用的設備不同以及使用設備分佈於不 同位置，因而通常藉由一搬運裝置以運輸晶片，以使晶 片製程之各個處理步驟可相互銜接。其中，晶片的檢測 分類也一項重要的處理步驟，其通常也需藉由搬運裝置 以搬運檢測篩選後的晶片至其他位置以分群歸類。 晶片製程之各個步驟有回流的特性，亦即早'一晶 片需多次循環地重複進行各種處理方式，因而晶片生產 流程的規劃對於縮短製程時間就顯得相當重要。例如以 混線生產的方式，將需以相同方式處理之不同晶片合併 一起生產加工，而可減少許多生產時間及提高加工設備 的使用率。所以搬運裝置需要根據生產流程的規劃而作 設計，以達到相互配合的功效。 【新型内容】 3 M426868 * 本創作所欲解決之技術問題 鑒於以上所述，晶片製程中所使用的搬運裝置之 結構及作動方式需根據生產流程之規劃而設計。若搬運 裝置設計不適當，則會使得搬運晶片的距離過長、晶片 提取及置放之間的時間間隔過長，而耗費多餘的時間， 使產品的總加工時間增加，而增加了製程成本。 緣此，本創作之目的即是提供一種晶片搬運裝 • 置，以解決習知技術之問題。 - 本創作解決問題之技術手段 • 本創作為解決習知技術之問題所採用之技術手段 為一種晶片搬運裝置，包含一旋轉搬運機構，其中旋轉 搬運機構具有至少主個之晶片取放構件，晶片取放構件 之端部位置處設置有一取放件，取放件經旋轉而在一晶 片取料處與一晶片放料處之間移動，以使取放件在晶片 取料處提取一晶片而於晶片放料處置放晶片。 在本創作的一實施例中，每個晶片取放構件以旋 轉搬運機構之旋轉中心而呈等夾角分佈。 在本創作的一實施例中，每個晶片取放構件之取 • 放件與旋轉搬運機構之旋轉中心之距離相同。 在本創作的一實施例中，取放件在晶片取料處與 晶片放料處時為停留。 在本創作的一實施例中，更包括一驅動機構，連 接於旋轉搬運機構，藉由驅動機構之驅動而使旋轉搬運 機構旋轉。 在本創作的一實施例中，驅動機構連接於旋轉搬 運機構之旋轉中心。 在本創作的一實施例中，旋轉搬運機構之晶片取 放構件之數目為4個。 4 在本創作的一實施例中，更包括一拍攝機構，設 置對應於晶片取料處及/或晶片放料處。 本創作對照先前技術之功效 經由本創作所採用之技術手段，藉由晶片搬運裝 置之旋轉搬運機構以多轴的幾何形狀配合旋轉式的作 動方式設計，使取放件可於旋轉搬運機構旋轉一小於 180°的角度後，在同一時間點時至少二個取放件可分 別對應於晶片取料處及晶片放料處，而同時提取晶片及 置放晶片。相較於習知技術中所使用的晶片搬運裝置因 只有單軸’需來回旋轉各180。的角度，方能往返於晶 片取料處及晶片放料處而提取及置放晶片。在相同轉速 及相同的晶片取放時間之狀況下，本創作之晶片搬運裝 置搬運晶片物料的時間更為縮短。多轴旋轉式的晶片搬 運裝置所對應之晶片取料處及晶片放料處設置在同一 圓形周緣上’使與晶片搬運裝置搭配之半導體製程之各 設備位置可用圓形方式佈設，進而降低晶片在製程中所 搬運的總距離。多軸式的取放方式更適用於混線生產之 場合’使晶片的分群歸類更快速方便，相當適用於多種 加工處理方式之生產流程中。因而本創作之晶片搬運裝 置除了可減少搬運晶片之時間成本外，並在相同的晶片 搬運量下’可提高搬運裝置本身的使用率以及減少其他 半導體製輕設備的設置量，而降低了製造設備的成本。 本創作所採用的具體實施例，將藉由以下之實施 例及附呈圖式作進一步之說明。 【實施方式】 同時參閱第1圖至第3圖所示，第1圖係顯示本創 作之晶片搬運裝置之立體圖，第2圖係顯示本創作之晶 M426868 片搬運裝置之侧視圖，第3圖係顯示本創作之旋轉搬運 機構之俯視圖。本創作之晶片搬運裝置100包含一旋轉 搬運機構1 ’旋轉搬運機構1具有至少三個之晶片取放 構件，而在本創作之一實施例中，旋轉搬運機構1之晶 片取放構件之數目為4個，分別為晶片取放構件lla、 lib、11c、lid。晶片取放構件 11a、lib、11c、lid 之 端部位置處分別設置有取放件111a、111b、111b、llld° 在本實施例中，每個晶片取放構件以旋轉搬運機構1之 旋轉中心12而呈等夾角分佈，每個晶片取放構件之間 之夾角0 1係大小相同，且每個晶片取放構件之取放件 與旋轉搬運機構之旋轉中心12之距離D1相同’以使 取放件Ilia、111b、111c、llld經旋轉定位而可對應於 一晶片取料處P1，並再經旋轉後對應於一晶片放料處 P2 ,而在晶片取料處P1提取一晶片5而於晶片放料處 P2置放晶片6，其詳細作動狀態將於以下描述。 在本實施例中，晶片搬運裝置100更包括一驅動 機構2，連接於旋轉搬運機構1之旋轉中心12。旋轉搬 運機構1是精由驅動機構2之驅動而旋轉，旋轉搬運機 構1之取放件111a、111b、111c、llld經旋轉而在一晶 片取料處P1與一晶片放料處P2之間移動。在本實施例 中’驅動機構2是一種直驅式馬達，直驅式馬達具有高 定位精度、南回應速度等特點’而可峰保取放件llla、 111b、111c、llld可快速地精準定位於晶片取料處ρι 或晶片放料處P2。 在本實施例中，取放件111a、liib、111c、llld 為一種吸嘴’一吸放機構（圖未示）藉由一氣體管連通於 取放件11 la(圖未示）、一氣體管3b連通於取放件1 Hb、 一氣體管3c連通於取放件111c、一氣體管3d連通於取 6 放件llld。而吸放機構為—種可將氣體增壓排出或減壓 吸入之機器。藉由吸放機構將氣體減壓而使氣體管中之 氣體於取放件處為負壓，而使定位於晶片取料處pl之 取放件提取晶片5。及藉由吸放機構將氣體增壓而使氣 體管中之氣體於取放件處為正壓，而使定位於晶片放料 處P2之取放件置放晶片6。 在本實施例中’晶片取料處P1及晶片放料處P2 分別位於一種可前後及左右橫移的取料機台及放料機 台（圖未示）上’藉由取料機台及放料機台之位移作動， 可確保取放件111a、lllb、illc、llld精準定位於晶片 5或晶片6之所欲置放點。在本實施例中，晶片取料處 P1及晶片放料處P2位於旋轉搬運機構1之下方位置 處。晶片搬運裝置100更包括一拍攝機構4，拍攝機構 4包括二組攝影機41、42。拍攝機構4之攝影機41設 置對應於晶片取料處P1，以拍攝晶片取料處ρι之晶片 5之影像。當取放件ina、1Ub、lllc、lnd之其中之 一個取放件旋轉移動至晶片取料處P1時，藉由拍攝機 構4之攝影機41可判斷此取放件是否精準定位於晶片 5,從而選擇此取放件是否提取晶片5。拍攝機構4之 攝影機42設置對應於晶片放料處p2。當提取晶片6之 取放件旋轉移動至晶片放料處p2時，藉由拍攝機構4 之攝影機42可判斷此取放件是否精準定位於晶片6之 所欲置放點，從而選擇此取放件是否置放晶片6。 同時參閱第4A圖至第4D圖所示，第4A圖係顯 示本創作之旋轉搬運機構於第一時間之作動狀態圖，第 4B圖係顯示本創作之旋轉搬運機構於第二時間之作動 狀態圖’第4C圖係顯示本創作之旋轉搬運機構於第三 時間之作動狀態圖，第4D圖係顯示本創作之旋轉搬運 機構於第四時間之作動狀態圖。旋轉搬運機構〗以一旋 轉方向幻旋轉。於第一時間時，取放件1IIa定位於晶 片取料處P1並停留而提取晶片。於萆二時間時，取放 件111b定位於晶片取料處？1並停留而提取晶片此時 取放件111a則於卡間點P3停留。於第三時間時，取放 件111a定位於晶片放料處P2並停留而置放晶片，取放 件111c定位於晶片取料處P1並停留而提取晶片，取放 件11^)則於中間點P3停留。於第四時間時，取放件 定位於晶片放料處P2並停留而置放晶片，取 =定位於晶片取料處P1並停留而提取晶片，此時取 =叫於中_ P4停留、以絲放件nie於中間 ·: P3巧留。其中’於第一時間至第二時間之間、第二 絲間至第三時間之間、及第三時間 轉搬運機構1所旋轉之角度皆為9〇。^ % Ϊ於旋轉搬運機構之構造幾何形狀及作動方 ^，使付每個取放件於旋轉搬運機構 中二個取放件之位置於同-時間 片、 取料處及晶片放料處，而同時分二m曰曰片 片。相較於習知技術中所使用的晶片=署， 軸，需來回旋轉各180。的角声卞〇 ’、有單 處及晶片放料處而提取及置玫:片 本創作-搬運= 裝置:二實：：本故=::= 凡精於此藝者當可㈣， 之改良’惟這些改變仍屬於本創作之創作精神二下^ M426868 界定之專利範圍中。 【圖式簡單說明】 第1圖係顯示本創作之晶片搬運裝置之立體圖。 第2圖係顯示本創作之晶片搬運裝置之側視圖。 第3圖係顯示本創作之旋轉搬運機構之俯視圖。 第4A圖係顯示本創作之旋轉搬運機構於第一時間之作 動狀態圖。 第4B圖係顯示本創作之旋轉搬運機構於第二時間之作 動狀態圖。 第4C圖係顯示本創作之旋轉搬運機構於第三時間之作 動狀態圖。 第4D圖係顯示本創作之旋轉搬運機構於第四時間之作 動狀態圖。 【主要元件符號說明】 100 晶片搬運裝置 1 旋轉搬運機構 11a 、 lib 、 11c 、 lid 晶片取放構件 111a、111b、111c、llld 取放件 12 旋轉中心 2 驅動機構 3 氣體管 4 拍攝機構 41、42 攝影機 5、6 晶片 D1 距離 M426868 PI 晶片取料處 P2 晶片放料處 P3、P4 中間點 R1 旋轉方向 Θ1 夾角 Θ2 角度M426868 V. New Description: [New Technology Field] This paper is about a wafer handling device, and more particularly to a multi-axis rotary wafer handling device. [Prior Art] Wafers are materials commonly used in semiconductor processes and can be fabricated as carriers for integrated circuits. The wafer production process includes a variety of processing methods, including sensitizer coating, exposure, development, etching, and infiltration, etc., to fabricate components with multilayer wiring, and to make practically available products through inspection and packaging. The finished body circuit. In order to avoid errors caused by human operation and the effects of dust in the environment during the manufacturing process, the wafer process is mostly carried out using an automated device and in a clean room. Moreover, since the various processing methods used in the wafer processing process are different and the use equipment is distributed in different locations, the wafer is usually transported by a handling device so that the various processing steps of the wafer processing can be joined to each other. Among them, the detection classification of wafers is also an important processing step, which is usually also carried out by means of a handling device to carry out inspection of the screened wafers to other locations for grouping. Each step of the wafer process has the characteristics of reflow, that is, the early process of the wafer is repeated several times, and the planning of the wafer production process is very important for shortening the process time. For example, in the case of mixed-line production, different wafers that need to be processed in the same manner are combined and produced together, which can reduce many production time and increase the utilization rate of processing equipment. Therefore, the handling device needs to be designed according to the planning of the production process to achieve mutual cooperation. [New Content] 3 M426868 * Technical Problems to be Solved by the Creation In view of the above, the structure and operation of the handling device used in the wafer manufacturing process must be designed according to the planning of the production process. If the design of the handling device is not appropriate, the distance between the wafer handling is too long, the time interval between wafer extraction and placement is too long, and the extra time is spent, which increases the total processing time of the product and increases the processing cost. Accordingly, the purpose of this creation is to provide a wafer handling apparatus to solve the problems of the prior art. - The technical means for solving the problem in the present invention. The technical means adopted by the present invention to solve the problems of the prior art is a wafer transfer device comprising a rotary transport mechanism, wherein the rotary transport mechanism has at least a main wafer pick-and-place member, the wafer A pick-and-place member is disposed at an end of the pick-and-place member, and the pick-up member is rotated to move between a wafer take-off and a wafer discharge to allow the pick-and-place member to extract a wafer at the wafer take-up. The wafer is placed on the wafer discharge disposal. In an embodiment of the present invention, each of the wafer pick-and-place members is disposed at an equiangular angle by rotating the center of rotation of the transport mechanism. In an embodiment of the present invention, the pick-and-place member of each of the wafer pick-and-place members is at the same distance from the center of rotation of the rotary transport mechanism. In an embodiment of the present invention, the pick and place member is stopped at the wafer take-off and at the wafer discharge. In an embodiment of the present invention, a drive mechanism is further included, coupled to the rotary transport mechanism, and the rotary transport mechanism is rotated by the drive mechanism. In an embodiment of the present creation, the drive mechanism is coupled to the center of rotation of the rotary transport mechanism. In an embodiment of the present creation, the number of wafer pick-up members of the rotary transport mechanism is four. 4 In an embodiment of the present invention, a photographing mechanism is further included, the setting corresponding to the wafer take-off and/or the wafer discharge. According to the technical means adopted by the present invention, the design of the present invention is designed by the rotary transport mechanism of the wafer transfer device in a multi-axis geometry with a rotary operation, so that the pick-and-place member can be rotated by the rotary transport mechanism. After the angle of less than 180°, at least two pick-and-place members may correspond to the wafer take-off and the wafer discharge at the same time point, while simultaneously extracting the wafer and placing the wafer. Compared to the wafer handling apparatus used in the prior art, there is only one single axis 'rotating 180 each. From the perspective, the wafer can be extracted and placed at and from the wafer take-off and wafer discharge. At the same rotational speed and the same wafer pick-and-place time, the wafer handling apparatus of the present invention has a shorter time for handling wafer materials. The wafer retracting portion and the wafer discharge portion corresponding to the multi-axis rotary wafer transfer device are disposed on the same circular circumference. 'The position of each device in the semiconductor process matched with the wafer transfer device can be arranged in a circular manner to further reduce the wafer. The total distance carried in the process. The multi-axis pick-and-place method is more suitable for mixed-line production occasions. It makes the grouping of wafers faster and more convenient, and is suitable for the production process of various processing methods. Therefore, in addition to reducing the time cost of handling the wafer, the wafer handling device of the present invention can improve the utilization rate of the handling device itself and reduce the installation amount of other semiconductor light equipment under the same wafer handling amount, thereby reducing the manufacturing equipment. the cost of. The specific embodiments used in the present application will be further illustrated by the following examples and accompanying drawings. [Embodiment] Referring also to Figs. 1 to 3, Fig. 1 is a perspective view showing the wafer transfer device of the present invention, and Fig. 2 is a side view showing the M426868 wafer transfer device of the present invention, Fig. 3 A top view showing the rotary transport mechanism of the present creation. The wafer transfer apparatus 100 of the present invention includes a rotary transport mechanism 1 'the rotary transport mechanism 1 has at least three wafer pick-and-place members, and in one embodiment of the present invention, the number of wafer pick-and-place members of the rotary transport mechanism 1 is Four are wafer pick-and-place members 11a, lib, 11c, and lid. The end portions of the wafer pick-and-place members 11a, lib, 11c, and lid are respectively provided with the pick-and-place members 111a, 111b, 111b, and llld. In the present embodiment, each wafer pick-and-place member is rotated at the center of rotation of the transport mechanism 1. 12 is equally angularly distributed, the angle between the wafer pick-and-place members is the same, and the distance between the pick-and-place member of each wafer pick-and-place member and the center of rotation 12 of the rotating transport mechanism is the same. The spacers Ilia, 111b, 111c, and llld are rotationally positioned to correspond to a wafer reclaiming portion P1, and then rotated to correspond to a wafer discharge portion P2, and a wafer 5 is extracted at the wafer reclaiming portion P1. The wafer discharge place P2 places the wafer 6, and its detailed actuation state will be described below. In the present embodiment, the wafer transfer apparatus 100 further includes a drive mechanism 2 coupled to the rotation center 12 of the rotary transport mechanism 1. The rotary transport mechanism 1 is rotated by the drive mechanism 2, and the pick-and-place members 111a, 111b, 111c, 111d of the rotary transport mechanism 1 are rotated to move between a wafer take-up portion P1 and a wafer discharge portion P2. . In the present embodiment, the 'drive mechanism 2 is a direct drive type motor, and the direct drive type motor has the characteristics of high positioning accuracy, south response speed, etc.' and the peak protection pick-and-place parts llla, 111b, 111c, and llld can be quickly and accurately positioned. At the wafer take-up ρι or wafer discharge P2. In the present embodiment, the pick-and-place members 111a, liib, 111c, and llld are a type of suction nozzles (a suction and discharge mechanism (not shown) are connected to the pick-and-place member 11 la (not shown) by a gas pipe, a gas The tube 3b is connected to the pick-and-place member 1 Hb, a gas tube 3c is connected to the pick-and-place member 111c, and a gas tube 3d is connected to the take-up unit 11ld. The suction and discharge mechanism is a machine that can pressurize or depressurize the gas. The gas is depressurized by the suction and discharge mechanism so that the gas in the gas pipe is at a negative pressure at the pick-and-place member, and the pick-up member positioned at the wafer take-up portion pl picks up the wafer 5. And the gas is pressurized by the suction and discharge mechanism to make the gas in the gas pipe at a positive pressure at the pick-and-place member, and the pick-up member positioned at the wafer discharge portion P2 is placed on the wafer 6. In the present embodiment, 'the wafer reclaiming place P1 and the wafer discharging place P2 are respectively located on a reclaimer table and a discharge machine table (not shown) which can be moved back and forth and left and right respectively, by the reclaimer and The displacement of the discharge machine can ensure that the pick-and-place members 111a, 111b, illc, and llld are accurately positioned at the desired placement point of the wafer 5 or the wafer 6. In the present embodiment, the wafer take-out portion P1 and the wafer discharge portion P2 are located below the rotary transport mechanism 1. The wafer handling apparatus 100 further includes a photographing mechanism 4 including two sets of cameras 41, 42. The camera 41 of the photographing mechanism 4 is disposed corresponding to the wafer take-up portion P1 to take an image of the wafer 5 of the wafer take-up position. When one of the pick-and-place members ina, 1Ub, lllc, and lnd is rotationally moved to the wafer reclaiming portion P1, the camera 41 of the photographing mechanism 4 can determine whether the pick-and-place member is accurately positioned on the wafer 5, thereby Select whether this pick and place piece extracts the wafer 5. The camera 42 of the photographing mechanism 4 is disposed corresponding to the wafer discharge portion p2. When the pick-up member of the pick-up wafer 6 is rotationally moved to the wafer discharge portion p2, the camera 42 of the photographing mechanism 4 can determine whether the pick-and-place member is accurately positioned at the desired placement point of the wafer 6, thereby selecting the pick-and-place. Whether the chip 6 is placed. Referring to FIG. 4A to FIG. 4D at the same time, FIG. 4A shows the state of operation of the rotating transport mechanism of the present invention at the first time, and FIG. 4B shows the state of the rotary transport mechanism of the present invention at the second time. Fig. 4C shows the actuation state diagram of the rotary transport mechanism of the present creation at the third time, and Fig. 4D shows the actuation state diagram of the rotary transport mechanism of the present creation at the fourth time. The rotating transport mechanism rotates in a rotating direction. At the first time, the pick-and-place member 1IIa is positioned at the wafer take-up portion P1 and stays to extract the wafer. At time two, the pick and place piece 111b is positioned at the wafer reclaiming point. 1 and staying to extract the wafer, at this time, the pick-and-place member 111a stays at the inter-card point P3. At the third time, the pick-up member 111a is positioned at the wafer discharge point P2 and stays to place the wafer, the pick-up member 111c is positioned at the wafer take-up portion P1 and stays to extract the wafer, and the pick-up member 11^) is in the middle Point P3 to stay. At the fourth time, the pick-and-place member is positioned at the wafer discharge point P2 and stays to place the wafer, and is taken at the wafer take-up point P1 and stayed to extract the wafer. At this time, the call is called zhongzhong_P4, and Silk release piece nie in the middle ·: P3 cleverly stay. The angles of the rotation of the transport mechanism 1 between the first time and the second time, between the second wire and the third time, and the third time are all 9 〇. ^ % Ϊ 构造 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的At the same time, it is divided into two pieces. Compared to the wafer = unit used in the prior art, the shaft needs to be rotated 180 each time. The angle of the sound 卞〇 ', there is a single place and the wafer discharge area to extract and set the rose: film creation - handling = device: two real:: the original =:: = where the fine can be (4), Improvements, but these changes still fall within the scope of the patent defined by M426868. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing the wafer transfer device of the present invention. Figure 2 is a side view showing the wafer carrier of the present invention. Fig. 3 is a plan view showing the rotary transport mechanism of the present invention. Fig. 4A is a diagram showing the state of operation of the rotary transport mechanism of the present invention at the first time. Fig. 4B is a diagram showing the state of operation of the rotary transport mechanism of the present invention at the second time. Fig. 4C is a diagram showing the state of operation of the rotary transport mechanism of the present invention at the third time. Fig. 4D is a diagram showing the state of operation of the rotary transport mechanism of the present invention at the fourth time. [Description of main component symbols] 100 wafer transfer device 1 rotary transport mechanism 11a, lib, 11c, lid wafer pick-and-place members 111a, 111b, 111c, llld pick-and-place member 12 rotation center 2 drive mechanism 3 gas tube 4 photographing mechanisms 41, 42 Camera 5, 6 wafer D1 distance M426868 PI wafer reclaiming station P2 wafer discharge point P3, P4 intermediate point R1 rotation direction Θ 1 angle Θ 2 angle