TWM422750U - Laminating apparatus of multi-layers plate - Google Patents
Laminating apparatus of multi-layers plate Download PDFInfo
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- TWM422750U TWM422750U TW100214699U TW100214699U TWM422750U TW M422750 U TWM422750 U TW M422750U TW 100214699 U TW100214699 U TW 100214699U TW 100214699 U TW100214699 U TW 100214699U TW M422750 U TWM422750 U TW M422750U
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Description
M422750 五、新型說明： 【新型所屬之技術領域】 [0001]本創作係有關於一蘀多層板貼合裝置。 [先前技術] [0002] 在光電產品製造過程中，經常需要利用黏膠組裝兩 個基板。例如，在液晶顯示器製造過程，使用封膠貼合 兩基板並填充液晶於兩基板之間；在行動電話製造過程 ，使用黏膠貼合保護屏幕與觸控面板。M422750 V. New Description: [New Technology Field] [0001] This creation is about a multi-layer board bonding device. [Prior Art] [0002] In the manufacturing process of an optoelectronic product, it is often necessary to assemble two substrates using an adhesive. For example, in the manufacturing process of the liquid crystal display, the two substrates are bonded together with a sealant and filled with liquid crystal between the two substrates; in the manufacturing process of the mobile phone, the adhesive screen is used to protect the screen and the touch panel.
[0003] 第一A圖與第一B圖顯示一種習知的基板貼合裝置與 方法，其中第一A圖為上視圖，第一B圖為側視圖。如圖 所示，基板貼合裝置1〇包含下基板定位機構101與上基板 定位機構102。基板貼合方法包含：先將下基板12置於基 板貼合裝置10的下基板定位機構101内，之後於上基板14 的一表面上塗上液態黏膠16 ’再將上基板14以具有液態 黏膠16的表面朝向下基板12，置於上基板定位機構1〇2内 ’使上基板14位於下基板12之上’之後液態黏膠16會溢 滿分布於兩基板之間並固化。此裝置與方法僅是透過定 位機構來定位，具有上下基板對位不精確的缺點。 [0004] 帛二謂至第二C圖顯示另—種習知的貼合裝置與方 法。參見第二A圖’基板貼合裝置2〇包含—下治具2〇2與 -上治具204 ’其中下治具2〇2為透明材質加工製作，並 且與上治具204是透過一槐紐裝置2〇6相連接，上治具 204上方設置《轴微調機獅8、γ輪微調機構m、角 度微調機構212以及拍攝相機組214 ;下治具別2上方μ 置有拍攝相機組216 ^ 表單編號Α0101 第3頁/共27頁 1100年.12月ok日梭正替g頁 承上述之架構，基板貼合方法包含三個步驟：第一 步驟’控制樞紐裝置206使上治具204與下治具202呈水 平排列後，將下基板12與上基板14分別置於下治具202與 上治具204上’分別使用拍攝相機組216與拍攝相機組 214記錄下基板12與上基板14的位置，再利用X軸微調機 構208、Y軸微調機構210與角度微調機構212調整上基板 14至所需位置；第二步驟，參見第二b圖，將液態黏膠16 塗佈於上基板14或下基板12的表面後，控制樞紐:裝置2〇6 使上治具204與下治具202呈上下排列，使上基板14壓迫 下基板12、使液態黏膠16溢滿於兩基板12/14之間；第 | 三步驟，參見第二C圖，使用光源18照射，使液態黏膠16 固化。此裝置與方法的缺點在於，上下基板14/12在液態 黏膠16固化後會殘留應力，影響產品品質β [0006] 第二Α圖至第三C圖顯示另一種習知的貼合裝置與方 法其屬於第二A圖至第二C圖所示裝置與方法的變化。 [0007] 參見第三A圖，基板貼合裝置30包含一下治具3〇2與[0003] The first A diagram and the first B diagram show a conventional substrate bonding apparatus and method, in which the first A diagram is a top view and the first B diagram is a side view. As shown in the figure, the substrate bonding apparatus 1A includes a lower substrate positioning mechanism 101 and an upper substrate positioning mechanism 102. The substrate bonding method comprises: placing the lower substrate 12 in the lower substrate positioning mechanism 101 of the substrate bonding apparatus 10, then applying a liquid adhesive 16 on one surface of the upper substrate 14 and then having the upper substrate 14 as a liquid adhesive. The surface of the glue 16 faces the lower substrate 12, and is placed in the upper substrate positioning mechanism 1'2' after the upper substrate 14 is positioned on the lower substrate 12'. The liquid adhesive 16 is then distributed between the two substrates and solidified. The device and method are only positioned by the positioning mechanism, and have the disadvantage that the alignment of the upper and lower substrates is inaccurate. [0004] The second to the second C diagram shows another conventional bonding apparatus and method. Referring to FIG. 2A, the substrate bonding apparatus 2 includes a lower fixture 2〇2 and an upper fixture 204. The lower fixture 2〇2 is made of a transparent material, and is passed through the upper fixture 204. The new device is connected by 2〇6, and the upper fixture 200 is provided with “axis fine-tuning machine lion 8, γ wheel fine adjustment mechanism m, angle fine adjustment mechanism 212 and shooting camera group 214; lower fixture 2 above μ is provided with shooting camera group 216 ^ Form No. Α0101 Page 3/Total 27 Page 1100. December ok. The rug is replacing the above structure. The substrate bonding method consists of three steps: the first step 'controls the hinge device 206 to make the upper fixture 204 After being horizontally aligned with the lower fixture 202, the lower substrate 12 and the upper substrate 14 are respectively placed on the lower jig 202 and the upper jig 204. The lower substrate 12 and the upper substrate are recorded using the camera group 216 and the camera group 214, respectively. 14 position, and then use the X-axis fine adjustment mechanism 208, the Y-axis fine adjustment mechanism 210 and the angle fine adjustment mechanism 212 to adjust the upper substrate 14 to the desired position; the second step, see the second b diagram, the liquid adhesive 16 is coated on the After the surface of the substrate 14 or the lower substrate 12, the control hub: the device 2〇6 makes the upper fixture 20 4 is arranged up and down with the lower fixture 202, so that the upper substrate 14 presses the lower substrate 12, so that the liquid adhesive 16 overflows between the two substrates 12/14; the third step, see the second C diagram, using the light source 18 , the liquid glue 16 is cured. The disadvantage of this device and method is that the upper and lower substrates 14/12 will have residual stress after the liquid adhesive 16 is solidified, which affects the product quality. [0006] The second to third C-pictures show another conventional bonding device and The method belongs to the changes of the apparatus and method shown in the second A to the second C. [0007] Referring to FIG. 3A, the substrate bonding apparatus 30 includes a lower fixture 3〇2 and
上治具304透過一樞紐裝置3〇6相連接，上治具3〇4上方 設置有X轴微調機構308、γ轴微調機構31〇、角度微調機 構312 #攝相機組314，以及至少一穿孔318通過上治 具304 ΥΙ*微調機構310、X轴微調機構讓、角度微調 機構312，下治具3G2上方設置有拍攝相機組316。 [0008] 迷之架構，基板貼合方法包含三個步驟：第— 二驟參見第三八圖，控制插给裝置3〇6使上治具3〇4與下 ^3G2呈水平排列後，將下基板咖上基板μ分別置於 下、302與上治具304，分別使用拍攝相機組316與 表單編就麵1 第4頁,共27頁 M422750The upper fixture 304 is connected through a hinge device 3〇6, and the upper fixture 3〇4 is provided with an X-axis fine adjustment mechanism 308, a γ-axis fine adjustment mechanism 31〇, an angle fine adjustment mechanism 312# camera group 314, and at least one perforation. 318 is provided with a shooting camera group 316 through the upper jig 304 ΥΙ* fine adjustment mechanism 310, the X-axis fine adjustment mechanism, the angle fine adjustment mechanism 312, and the lower fixture 3G2. [0008] The architecture of the substrate, the substrate bonding method comprises three steps: the first two steps refer to the third eight figure, and the control insertion device 3〇6 is arranged such that the upper fixture 3〇4 and the lower ^3G2 are horizontally arranged, The lower substrate is placed on the lower substrate 302 and the upper fixture 304, respectively, using the camera group 316 and the form to be edited. Page 4, a total of 27 pages M422750
100年.12月02日梭正替換頁I 攝相機组314記錄下基如與上基韻^ 轴微調機構308、Y轴微調機構31〇與角度微調機構312調 整上基板14至所需位置；第二步驟’參見第三b圖將液100 years. December 02, the shuttle is replacing the page I. The camera group 314 records the base and the base rhyme ^ axis fine adjustment mechanism 308, the Y-axis fine adjustment mechanism 31 and the angle fine adjustment mechanism 312 to adjust the upper substrate 14 to the desired position; The second step 'see the third b diagram
態黏膠16塗佈於上基板14或下基板12的表面後，控制樞 紐裝置306使上治具304與下治具302呈上下排列，使上 基板14壓迫下基板12、使液態黏膠16溢滿於兩基板 12/14之間，之後.，局部固化設備320(例如點光源）伸入 穿孔318，使液態黏膠16局部固化；第三步驟，參見第三 C圖，控制樞紐裝置306使上治具304與下治具3〇2呈水平 排列，使用光源18照射，使液態黏膠16完全固化。此裝 置與方法的缺點在於上下基板的塵迫使黏膠產生應力。 另外，液態黏膠16會先經過局部固化之後再進行全面固 化’導致整體固化程度不均勻，產生外觀與可靠性的問 題；並且，局部固化時’沒有輔助定位機構，對位容易 偏移 鑒於先前技術存在的問題，亟需提供一種新的基板 貼合裝置與方法，解決基板貼合時的應力問題，以及定 位不夠精確，或對位偏移的缺陷’以提商產品良率與可 靠性。 【新型内容】 本創作的目的之一在於提供一種新的基板貼合裝置 與方法，解決基板貼合時的應力問題，以及定位不夠精 確’或對位偏移的缺陷，以提高產品良率與可靠性。 根據上述目的，本創作一實施例提供一種多層板貼 合裝置，包含一初步貼合治具、至少一影像擷取裝置、 表單編號A0101 第5頁/共27頁 [0011] M422750 100年12月02日梭正替換頁 一對位模組。初步貼合治具用於承載及定位一第一基板 與一第二基板，且包含一輔助機構使該第一基板與該初 步貼合治具的相對位置保持固定，該第二基板被置放於 該第一基板上，藉此當一液態黏膠設置於該第一基板與 該第二基板之間，可以無應力方式溢滿於該第一基板與 該第二基板之間。該影像擷取裝置對應於該初步貼合治 具來設置，用於決定該第一基板與該第二基板的相對位 置。該對位模組承載該初步貼合治具，並根據該第一基 板與該第二基板的相對位置，進行一對位程序。After the state of the adhesive layer 16 is applied to the surface of the upper substrate 14 or the lower substrate 12, the control hinge device 306 arranges the upper jig 304 and the lower jig 302 up and down, so that the upper substrate 14 presses the lower substrate 12 to make the liquid adhesive 16 The overflow between the two substrates 12/14, after which the partial curing device 320 (such as a point source) extends into the perforation 318 to partially cure the liquid adhesive 16; the third step, see the third C diagram, the control hinge device 306 The upper jig 304 and the lower jig 3〇2 are horizontally arranged, and the light source 18 is irradiated to completely cure the liquid adhesive 16. A disadvantage of this device and method is that the dust of the upper and lower substrates forces the adhesive to stress. In addition, the liquid adhesive 16 will be partially cured before being fully cured', resulting in uneven degree of overall curing, resulting in appearance and reliability problems; and, when partially cured, there is no auxiliary positioning mechanism, and the alignment is easily offset. In the technical problems, it is urgent to provide a new substrate bonding device and method, to solve the stress problem when the substrate is bonded, and to locate the defect with insufficient accuracy or alignment offset to improve the product yield and reliability. [New content] One of the purposes of this creation is to provide a new substrate bonding device and method, to solve the stress problem when the substrate is bonded, and to locate the defect that is not accurate enough or offset, so as to improve the product yield and reliability. According to the above objective, an embodiment of the present invention provides a multi-layer board bonding apparatus, comprising a preliminary bonding fixture, at least one image capturing device, and a form number A0101, page 5 of 27 [0011] M422750, December, 100 02-day shuttle is replacing the one-page module. The first bonding fixture is configured to carry and position a first substrate and a second substrate, and includes an auxiliary mechanism for maintaining a relative position of the first substrate and the preliminary bonding fixture, and the second substrate is placed On the first substrate, when a liquid adhesive is disposed between the first substrate and the second substrate, the first substrate and the second substrate can be overflowed without stress. The image capturing device is disposed corresponding to the preliminary bonding tool for determining a relative position of the first substrate and the second substrate. The alignment module carries the preliminary bonding fixture and performs a one-way procedure according to the relative position of the first substrate and the second substrate.
II
[0012] 根據本創作以上所述的多層板貼合裝置，利用自然 流淌溢滿的方式，使得液態黏膠溢滿於兩基板之間，解 決習知技術以外力壓迫使黏膠產生應力，造成對位不精 的問題；同時，對位機台提供快速的對位矯正，且固化 程序可以在對位程序時，同步進行固化，增加對位精確 度，使提高產品良率與可靠度。 【實施方式】 [0013][0012] According to the above-mentioned multi-layer board bonding apparatus, the liquid glue overflows between the two substrates by means of a natural flow overflow, which solves the problem that the pressure is forced by the force of the prior art to cause the adhesive to generate stress. At the same time, the alignment machine provides fast alignment correction, and the curing program can be simultaneously solidified in the alignment program to increase the alignment accuracy, so as to improve product yield and reliability. Embodiments [0013]
以下將詳述本案的各實施例，並配合圖式作為例示 。除了這些詳細描述之外，本創作還可以廣泛地實行在 其他的實施例中，任何所述實施例的輕易替代、修改、 等效變化都包含在本案的範圍内，並以之後的專利範圍 為準。在說明書的描述中，為了使讀者對本創作有較完 整的了解，提供了許多特定細節；然而，本創作可能在 省略部分或全部這些特定細節的前提下，仍可實施。此 外，眾所周知的程序步驟或元件並未描述於細節中，以 避免造成本創作不必要之限制。 表單编號A0101 第6頁/共27頁 M422750 100年.12月0>日修正替_頁 [0014] 以下說明本創作實施例的多層板貼合裝置與方法。 本創作實施例的多層板貼合裝置可包含一對位機台與一 貼合機台，前者用於調整基板至所需的位置，後者用於 貼合兩基板。但在結構上也可以結合成僅一個機構。 [0015] 第四A圖至第九圖顯示根據本創作實施例的多層板貼 合裝置與方法。首先，以機械手臂（未圖示）將下基板12 置於一初步定位治具402上，如第四A圖與第四B圖所示， 其中第四A圖為初步定位治具402的側視圖，第四B圖為俯 • • 視圖。初步定位治具402的上方可設置有第一定位機構 404、第二定位機構406，另外，初步定位治具402可利 用一輔助機構（未圖示）使下基板12與初步定位治具402的 相對位置保持固定，該輔助機構的結構並不受限，例如 第四A圖之實施例所述，該輔助機構包含一孔道408連接 一真空設備，例如真空泵（未圖示）。此外，若依實際設 計的需求，該輔助機構亦可設計為包含一低黏性膠體（未 圖示）暂時固定下基板12與初步定位治具；或者，該輔助 機構包含卡閂、夾鉗等輔助機構，使下基板12與初步定 位治具402的相對位置保持固定。 [0016] 複參考第四A圖及第四B圖，下基板12被置於第一定 位機構404所定義的範圍内，以進行初步定位，同時利用 真空設備所產生的真空引力，使下基板12與初步定位治 具402的相對位置保持固定。另外，下基板12具有下靶標 122，初步定位治具402具有治具靶標410，其用處於稍 後提及。 [0017] 接著，參照第五圖，將初步定位治具402移動至一對 表單编號A0101 第7頁/共27頁 位機台50,其夏有· 角产“ 調機構504、γ袖微調機構502、 月度微調機構506以及至，丨、^ 久主）一影像擷取裝置508，較佳者 為拍攝相機組508。其中的χ軸微調機構5〇4、 構及角度微調機構5〇6可視為一對位模組。拍攝相機 組508具有感光元件’例如電荷耦合元件 (charge-coupled device)，可記錄目標的影像。此時 ，先後移動拍攝相機組508，以記錄治具靶標41〇與下靶 標122的座標，以獲得初步定位治具4〇2與下基板丨^的相 對位置。注意到在移動的過程中，孔道4〇8始終保持真介 ，使初步定位治具402與下基板12的相對位置保持不變 另外，在另一實施例，第四A圖與第四B圖所示的初步定 位步驟亦可直接在對位機台5 〇上進行》 [0018] 再參照第六A圖，初步定位治具402被移動至—The embodiments of the present invention will be described in detail below, with reference to the drawings as an illustration. In addition to the detailed description, the present invention can be widely practiced in other embodiments, and any easy substitutes, modifications, and equivalent changes of any of the embodiments are included in the scope of the present invention, and the scope of the following patents is quasi. In the description of the specification, a number of specific details are provided in order to provide the reader with a complete understanding of the present invention; however, the present invention may be practiced without omitting some or all of these specific details. In addition, well-known program steps or elements are not described in detail in order to avoid unnecessary limitation of the present invention. Form No. A0101 Page 6 of 27 M422750 100. December 0> Day Correction_Page [0014] The multi-layer board bonding apparatus and method of the present embodiment will be described below. The multi-layer board bonding apparatus of the present embodiment may include a pair of positioning machines for adjusting the substrate to a desired position and a laminating machine for bonding the two substrates. However, it can also be combined into only one mechanism in terms of structure. [0015] The fourth to fifth figures show a multilayer board bonding apparatus and method according to the presently-created embodiment. First, the lower substrate 12 is placed on a preliminary positioning fixture 402 by a robot arm (not shown), as shown in FIGS. 4A and 4B, wherein the fourth A is the side of the preliminary positioning fixture 402. View, the fourth B picture is the view of the • • •. The first positioning mechanism 404 and the second positioning mechanism 406 may be disposed above the preliminary positioning fixture 402. In addition, the preliminary positioning fixture 402 may utilize an auxiliary mechanism (not shown) to enable the lower substrate 12 and the preliminary positioning fixture 402. The relative position remains fixed and the structure of the auxiliary mechanism is not limited. For example, as described in the embodiment of Fig. A, the auxiliary mechanism includes a tunnel 408 connected to a vacuum device such as a vacuum pump (not shown). In addition, the auxiliary mechanism may be designed to include a low-viscosity colloid (not shown) to temporarily fix the lower substrate 12 and the preliminary positioning fixture according to actual design requirements; or, the auxiliary mechanism includes a latch, a clamp The auxiliary mechanism maintains the relative position of the lower substrate 12 and the preliminary positioning jig 402. [0016] Referring to FIGS. 4A and 4B, the lower substrate 12 is placed within the range defined by the first positioning mechanism 404 for preliminary positioning while utilizing the vacuum attraction generated by the vacuum device to make the lower substrate The relative position of 12 to the preliminary positioning fixture 402 remains fixed. In addition, the lower substrate 12 has a lower target 122, and the preliminary positioning jig 402 has a jig target 410, which is used later. [0017] Next, referring to the fifth figure, the preliminary positioning jig 402 is moved to a pair of form number A0101, page 7 / a total of 27 page machine 50, and the summer has a "production mechanism 504, γ sleeve fine adjustment" The mechanism 502, the monthly fine-tuning mechanism 506, and the image capturing device 508 are preferably the camera group 508. The cymbal fine-tuning mechanism 5〇4 and the angle fine-tuning mechanism 5〇6 It can be regarded as a one-way module. The shooting camera group 508 has a photosensitive element 'for example, a charge-coupled device, which can record an image of a target. At this time, the shooting camera group 508 is sequentially moved to record the fixture target 41〇. And the coordinates of the lower target 122 to obtain the relative position of the preliminary positioning fixture 4〇2 and the lower substrate 。^. It is noted that during the movement, the tunnel 4〇8 remains true, so that the preliminary positioning fixture 402 and the lower substrate are provided. The relative position of 12 remains unchanged. In another embodiment, the preliminary positioning steps shown in the fourth A and fourth B diagrams can also be performed directly on the alignment machine 5 》 [0018] In Figure A, the preliminary positioning fixture 402 is moved to -
Ό CJ 機台（未圖示），在移動的過程中，孔道4〇8始終保持真处 ，使初步定位治具402與下基板12的相對位置保持不變 此時，液態黏膠16被塗佈於上基板14表面上，接著、 機械手臂（未圖示）抓取上基板14，使其具有液態黏膠16 的表面朝向下基板12，將上基板14置於第二定值機構 所定義的範圍内。之後，液態黏膠16在沒有施加任何外 力的情形下’會自然溢滿於上基板14與下基板12之間， 如第六B圖所示。值得注意的是，在另一實施例，此初+ 貼合步驟可直接在對位機台50上進行，不需移動至貼八 機台。另外’在另一實施例，液態黏膠16也可以塗佈在 下基板12的上表面上。 [0019] Υ軸微調機 再參照第七圖，初步定位治具4〇2被移動至對位機二 表單编號A0101 第8頁/共27頁 M422750 100年.12月02日梭正_^頁 50，在移動的過程中，孔道408保持真空，使初步定位治 具402與下基板12的相對位置保持不變；此時，以機械手 臂510固定上基板14的位置，移動拍攝相機組508記錄上 基板14的上靶標142與治具靶標410的座標，以獲得初步 定位治具402與上基板14的相對位置關係。 [0020] • 接著，根據先前所獲得的下基板12與初步定位治具 402的相對位置關係，以及初步定位治具402與上基板14 的相對位置關係，可獲得下基板12與上基板14的相對位 置關係；藉此，可據以調整兩基板或其中之一至所需位 置。於此實施例，兩基板的相對位置調整是經由調整下 基板12的位置達成，利用X軸微調機構504、Y軸微調機構 502、角度微調機構506分別調整下基板12在X軸、Y軸、 0方向的偏差，如第八圖所示。 [0021] • 接著，參照第九圖，當上基板14與下基板12的相對 位置已經被調整達到所求，以固化設備512，將液態黏膠 16固化。固化設備512視所使用的液態黏膠16種類而異， 在此並非為本創作所限制。若液態黏膠16為光固型黏膠（ 例如紫外光勝（Ultraviolent light curing adhes-ives))，則固化設備512為一可見光源；若液態黏膠16 為熱固型黏膠，則固化設備51 2為一加熱設備；若液態黏 膠16為濕固型黏膠，則固化設備512為一濕氣產生設備。 [0022] 上述的多層板貼合裝置，初步定位治具402的第一定 位機構404與第二定位機構406可依照所欲貼合基板的尺 寸與形狀，設計合適的初步定位機構，位置上也可改為 上基板14在下方，下基板12在上方。 表單編號A0101 第9頁/共27頁 M422750 [0023] 100年.12月02日核正替換頁 上述的多層板貼合方法，可歸納成如第十圖所示的 流程圖。於步驟602，固定第一基板於初步定位治具上。 步驟604，獲取第一基板與初步定位治具的相對位置。步 驟606，塗佈液態黏膠於第二基板或第一基板的表面。步 驟608，將第二基板置放於第一基板表面上，在無施加外 力的條件下，使液態黏膠自然溢滿於兩基板之間。步驟 610，固定第二基板的位置，例如，以機械手臂固定其位 置。步驟612，獲取第二基板與初步定位治具的相對位置 ，再加上先前所獲取的第一基板與初步定位治具的相對 位置，可獲得第一基板與第二基板的相對位置。步驟614 ，根據第一基板與第二基板的相對位置進行對位程序。 步驟616，固化液態黏膠。Ό CJ machine (not shown), during the movement, the hole 4〇8 is always kept true, so that the relative position of the preliminary positioning fixture 402 and the lower substrate 12 is kept unchanged. At this time, the liquid adhesive 16 is coated. Deployed on the surface of the upper substrate 14, and then the robot arm (not shown) grasps the upper substrate 14 so that the surface of the liquid adhesive 16 faces the lower substrate 12, and the upper substrate 14 is defined by the second setting mechanism. In the range. Thereafter, the liquid adhesive 16 naturally overflows between the upper substrate 14 and the lower substrate 12 without applying any external force, as shown in Fig. 6B. It should be noted that in another embodiment, the initial + bonding step can be performed directly on the registration machine 50 without moving to the eight-machine station. Further, in another embodiment, the liquid adhesive 16 may also be coated on the upper surface of the lower substrate 12. [0019] The Υ axis fine-tuning machine refers to the seventh figure again, the preliminary positioning fixture 4〇2 is moved to the alignment machine 2 form number A0101 page 8 / total 27 pages M422750 100 years. December 02 shuttle _^ In the process of moving, the hole 408 is kept in a vacuum, so that the relative position of the preliminary positioning fixture 402 and the lower substrate 12 is kept unchanged; at this time, the position of the upper substrate 14 is fixed by the robot arm 510, and the camera group 508 is moved. The coordinates of the upper target 142 of the upper substrate 14 and the fixture target 410 are recorded to obtain the relative positional relationship between the preliminary positioning fixture 402 and the upper substrate 14. [0020] Next, according to the relative positional relationship between the lower substrate 12 and the preliminary positioning jig 402 obtained previously, and the relative positional relationship between the preliminary positioning jig 402 and the upper substrate 14, the lower substrate 12 and the upper substrate 14 can be obtained. Relative positional relationship; thereby, the two substrates or one of them can be adjusted to a desired position. In this embodiment, the relative position adjustment of the two substrates is achieved by adjusting the position of the lower substrate 12, and the X-axis fine adjustment mechanism 504, the Y-axis fine adjustment mechanism 502, and the angle fine adjustment mechanism 506 are respectively adjusted to adjust the lower substrate 12 on the X-axis and the Y-axis. The deviation in the 0 direction is shown in the eighth figure. [0021] Next, referring to the ninth figure, when the relative positions of the upper substrate 14 and the lower substrate 12 have been adjusted to achieve the curing device 512, the liquid adhesive 16 is cured. The curing device 512 varies depending on the type of liquid adhesive 16 used, and is not limited by this creation. If the liquid adhesive 16 is a UV-curable adhesive (for example, Ultraviolent light curing adhes-ives), the curing device 512 is a visible light source; if the liquid adhesive 16 is a thermosetting adhesive, the curing device 51 2 is a heating device; if the liquid adhesive 16 is a wet-solid adhesive, the curing device 512 is a moisture generating device. [0022] In the above-mentioned multi-layer board bonding apparatus, the first positioning mechanism 404 and the second positioning mechanism 406 of the preliminary positioning fixture 402 can design a suitable preliminary positioning mechanism according to the size and shape of the substrate to be attached, and the position is also The upper substrate 14 may be changed to the lower side and the lower substrate 12 may be upper. Form No. A0101 Page 9 of 27 M422750 [0023] 100 years. December 02, the replacement of the page The above-mentioned multi-layer board bonding method can be summarized into the flow chart shown in the tenth figure. In step 602, the first substrate is fixed on the preliminary positioning fixture. Step 604: Obtain a relative position of the first substrate and the preliminary positioning fixture. In step 606, a liquid adhesive is applied to the surface of the second substrate or the first substrate. In step 608, the second substrate is placed on the surface of the first substrate, and the liquid glue naturally overflows between the two substrates without applying an external force. Step 610, fixing the position of the second substrate, for example, fixing the position with a robot arm. In step 612, the relative position of the second substrate and the preliminary positioning fixture is obtained, and the relative positions of the first substrate and the preliminary positioning fixture are obtained, and the relative positions of the first substrate and the second substrate are obtained. Step 614: Perform an alignment procedure according to the relative positions of the first substrate and the second substrate. Step 616, curing the liquid glue.
[0024] 第十圖所示的方法，適用於當第一基板（例如下基板 )的尺寸小於第二基板（例如上基板）的尺寸，且第二基板 為不透明基板的情況之下。因為此時的第二基板會阻礙 獲取第一基板上的靶標之座標，因而才藉由步驟604中的 第一基板及步驟612中的第二基板分別與初步定位治具的 位置關係，來順利獲得第一基板與第二基板的相對位置[0024] The method illustrated in the tenth embodiment is applicable to a case where the size of the first substrate (for example, the lower substrate) is smaller than the size of the second substrate (for example, the upper substrate), and the second substrate is an opaque substrate. Because the second substrate at this time hinders the acquisition of the coordinates of the target on the first substrate, the positional relationship between the first substrate in step 604 and the second substrate in step 612 and the preliminary positioning fixture is smooth. Obtaining a relative position of the first substrate and the second substrate
〇 [0025] 反之，如果第一基板的尺寸大於第二基板的尺寸， 或第二基板為透明的基板，則步驟604與步驟612可合併 為一個步驟，如第Η —圖的流程圖所示。於步驟702，固 定第一基板於初步定位治具上。步騾704，塗佈液態黏膠 於第二基板或第一基板表面。步驟706，將第二基板置放 於第一基板表面上，在無施加外力的條件下，使液態黏 表單编號Α0101 第10頁/共27頁 M422.750 100’年12月02日修正替頁 膠自然溢滿於兩基板之間。步驟708，固定第二基板的位 置，例如，以機械手臂固定其位置。步驟710，藉由影像 擷取裝置，較佳者為拍攝相機組，獲取第一基板與第二 基板的座標，獲取第一基板與第二基板的相對位置。步 驟712，根據第一基板與第二基板的相對位置進行對位程 序。步驟714，固化液態黏膠。根據第十一圖所示的方法 ，其與第十圖的方法不同處僅在於，第一基板與第二基 板的相對位置是在同一個步驟710，藉由拍攝相機組獲取 第一基板與第二基板的座標而得。〇[0025] Conversely, if the size of the first substrate is larger than the size of the second substrate, or the second substrate is a transparent substrate, step 604 and step 612 may be combined into one step, as shown in the flowchart of FIG. . In step 702, the first substrate is fixed on the preliminary positioning fixture. Step 704, applying a liquid adhesive to the surface of the second substrate or the first substrate. Step 706, placing the second substrate on the surface of the first substrate, and under the condition that no external force is applied, the liquid paste form number is Α0101, page 10/27 pages, M422.750, 100' year, December 2, revised The page glue naturally overflows between the two substrates. Step 708, fixing the position of the second substrate, for example, by mechanical arm fixing its position. In step 710, the image capturing device, preferably the camera group, captures the coordinates of the first substrate and the second substrate, and obtains the relative positions of the first substrate and the second substrate. In step 712, an alignment process is performed according to the relative positions of the first substrate and the second substrate. Step 714, curing the liquid glue. According to the method shown in FIG. 11 , the method differs from the method of the tenth embodiment only in that the relative positions of the first substrate and the second substrate are in the same step 710, and the first substrate and the first substrate are obtained by the camera group. The coordinates of the two substrates are obtained.
[0026] 根據本創作以上所述的多層板貼合裝置與方法，利 用自然流淌溢滿的方式，使得液態黏膠溢滿於兩基板之 間，解決習知技術以外力壓迫使黏膠產生應力，造成對 位不精的問題；同時，對位機台提供快速的對位矯正， 且固化程序可以在對位程序時，同步進行固化，增加對 位精確度，使提高產品良率與可靠度。 [0027] 上述眾實施例僅係為說明本創作之技術思想及特點 ，其目的在使熟悉此技藝之人士能了解本創作之内容並 據以實施，當不能以之限定本創作之專利範圍，即凡其 他未脫離本創作所揭示精神所完成之各種等效改變或修 飾都涵蓋在本創作所揭露的範圍内，均應包含在下述之 申請專利範圍内。 【圖式簡單說明】· [0028] 第一 A圖至第一B圖顯示一種習知的基板貼合裝置與方法 第二A圖至第二C圖顯示另一種習知的基板貼合裝置與方 表單編號A0101 第11頁/共27頁 M422750 __ 100年.12月02日核正替換頁 法； 第三A圖至第三C圖顯示另一種習知的基板貼合裝置與方 法； 第四A圖與第四B圖分別顯示利用一初步定位治具固定一 下基板的側視圖與上視圖； 第五圖顯示利用一對位機台的影像擷取裝置獲取下基板 與初步定位治具的相對位置； 第六A圖顯示塗佈有一液態黏膠的上基板被置放於下基板 上； 第六B圖顯示該液態黏膠以自然淌流溢滿於上基板與下基 4 板之間； 第七圖顯示利用對位機台的影像擷取裝置獲取:上基板與 初步定位治具的相對位置； 第八圖顯示對位程序的矯正方向； 第九圖顯示利用對位機台的一固化設備使液態黏膠固化[0026] According to the above-mentioned multi-layer board bonding apparatus and method, the liquid glue overflows between the two substrates by using a natural flow overflow method, and the pressure is forced by the conventional technology to force the adhesive to generate stress. The problem is that the alignment is not refined; at the same time, the alignment machine provides fast alignment correction, and the curing program can be simultaneously solidified in the alignment program to increase the alignment accuracy, so as to improve product yield and reliability. [0027] The above embodiments are merely illustrative of the technical idea and the features of the present invention, and the purpose of the present invention is to enable those skilled in the art to understand the contents of the present invention and implement it according to the scope of the patent. That is, all other equivalent changes or modifications that are made without departing from the spirit of the present invention are intended to be included in the scope of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS [0028] FIGS. 1A to 1B show a conventional substrate bonding apparatus and method. FIGS. 2A to 2C show another conventional substrate bonding apparatus and Square Form No. A0101 Page 11 / Total 27 pages M422750 __ 100 years. December 2nd nuclear replacement page method; Third A to third C diagrams show another conventional substrate bonding apparatus and method; A and 4B respectively show a side view and a top view of the substrate fixed by a preliminary positioning fixture; the fifth figure shows the relative position of the lower substrate and the preliminary positioning fixture obtained by the image capturing device of the pair of positioning machines. Position; Figure 6A shows that the upper substrate coated with a liquid adhesive is placed on the lower substrate; Figure 6B shows that the liquid adhesive overflows between the upper substrate and the lower substrate 4 by natural turbulence; The figure 7 shows the image capturing device of the alignment machine to obtain the relative position of the upper substrate and the preliminary positioning fixture; the eighth figure shows the correction direction of the alignment program; the ninth figure shows a curing device using the alignment machine. Curing liquid adhesive
第十圖顯示根據本創作一實施例多層板貼合方法的流程 圖；以及 第十一圖顯示根據本創作另一實施例多層板貼合方法的 流程圖。 【主要元件符號說明】 [0029] 10 基板貼合裝置 12 下基板 14 上基板 16 液態黏膠 18 光源 表單编號A0101 第12頁/共27頁 M422750Fig. 11 is a flow chart showing a method of laminating a multi-layer board according to an embodiment of the present invention; and an eleventh drawing showing a flow chart of a method of laminating a multi-layer board according to another embodiment of the present invention. [Main component symbol description] [0029] 10 Substrate bonding device 12 Lower substrate 14 Upper substrate 16 Liquid adhesive 18 Light source Form No. A0101 Page 12 of 27 M422750
20 基板貼合裝置 30 基板貼合裝置 50 對位機台 101 下基板定位機構 102 上基板定位機構 122 下靶標 142 上靶標 202 下治具 204 上治具 206 樞紐裝置 208 X轴微調機構 210 Y軸微調機構 212 角度微調機構 214 拍攝相機組 216 拍攝相機組 302 下治具 304 上治具 306 樞紐裝置 308 X軸微調機構 310 Y轴微調機構 312 角度微調機構 314 拍攝相機組 316 拍攝相機組 318 穿孔 320 局部固化設備 402 初步定位治具 表單編號A0101 第13頁/共27頁 ‘ ldo年.12月h日修正脊換頁 M422750 ______ 100年.12月02日修正替換頁20 Substrate bonding device 30 Substrate bonding device 50 Alignment machine 101 Lower substrate positioning mechanism 102 Upper substrate positioning mechanism 122 Lower target 142 Upper target 202 Lower fixture 200 Upper fixture 206 Hub device 208 X-axis fine adjustment mechanism 210 Y-axis Fine adjustment mechanism 212 angle fine adjustment mechanism 214 shooting camera group 216 shooting camera group 302 lower fixture 304 upper fixture 306 pivot device 308 X axis fine adjustment mechanism 310 Y axis fine adjustment mechanism 312 angle fine adjustment mechanism 314 shooting camera group 316 shooting camera group 318 perforation 320 Partial Curing Equipment 402 Preliminary Positioning Fixture Form No. A0101 Page 13 of 27 'ldo Year. December h Corrected Ridge Change Page M422750 ______ 100 Years. December 02 Correction Replacement Page
404 第一定位機構 406 第二定位機構 408 孔道 410 治具靶標 504 X軸微調機構 502 Y軸微調機構 506 角度微調機構 508 拍攝相機組 510 機械手臂 512 固化設備 602-61 6 多層板貼合方法 702-714 多層板貼合方法 表單编號A0101 第14頁/共27頁404 first positioning mechanism 406 second positioning mechanism 408 hole 410 fixture target 504 X-axis fine adjustment mechanism 502 Y-axis fine adjustment mechanism 506 angle fine adjustment mechanism 508 shooting camera group 510 robot arm 512 curing device 602-61 6 multi-layer board bonding method 702 -714 Multilayer Plate Fitting Method Form No. A0101 Page 14 of 27
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| JP5139736B2 (en) * | 2007-06-27 | 2013-02-06 | 東レエンジニアリング株式会社 | Liquid crystal component manufacturing method and manufacturing apparatus |
| JP5155826B2 (en) * | 2007-12-27 | 2013-03-06 | セイコーインスツル株式会社 | Manufacturing method of display device |
| CN201211974Y (en) * | 2008-04-25 | 2009-03-25 | 深圳市大族激光科技股份有限公司 | Workpiece clamp system |
| JP2010072598A (en) * | 2008-09-22 | 2010-04-02 | Hitachi Displays Ltd | Liquid crystal display and method of manufacturing liquid crystal display |
| CN201569829U (en) * | 2009-09-11 | 2010-09-01 | 叶长火 | Roller type patching device capable of adjusting and aligning position |
| TWI416207B (en) * | 2010-01-07 | 2013-11-21 | Discovery High Technology Co Ltd | A method for attaching substrates |
| CN102794970B (en) * | 2011-05-28 | 2015-04-29 | 宸鸿科技(厦门)有限公司 | Method and device for bonding multilayer plates |
-
2011
- 2011-05-28 CN CN201110152528.7A patent/CN102794970B/en not_active Expired - Fee Related
- 2011-08-08 TW TW100214699U patent/TWM422750U/en not_active IP Right Cessation
- 2011-08-08 TW TW100128242A patent/TWI503064B/en not_active IP Right Cessation
-
2012
- 2012-02-06 KR KR1020120012006A patent/KR101681660B1/en active IP Right Grant
- 2012-04-11 JP JP2012090074A patent/JP5591277B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI503064B (en) * | 2011-05-28 | 2015-10-01 | Tpk Touch Solutions Xiamen Inc | Laminating method and apparatus of multi-layers plate |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20120132616A (en) | 2012-12-06 |
| CN102794970B (en) | 2015-04-29 |
| JP5591277B2 (en) | 2014-09-17 |
| TWI503064B (en) | 2015-10-01 |
| TW201309133A (en) | 2013-02-16 |
| JP2012246475A (en) | 2012-12-13 |
| CN102794970A (en) | 2012-11-28 |
| KR101681660B1 (en) | 2016-12-01 |
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