TWM408820U

TWM408820U - Surface-patch type multigband antenna module

Info

Publication number: TWM408820U
Application number: TW100201131U
Authority: TW
Inventors: Tsai-Yi Yang; Chia-Tsung Wu
Original assignee: Cirocomm Technology Corp
Priority date: 2011-01-18
Filing date: 2011-01-18
Publication date: 2011-08-01

Description

100年05月17日修正五、新型說明：【新型所屬之技術領域】 [〇〇〇1]本創作係有關一種天線，尤指一種高增益多頻段的多頻天線模組》【先前技術】 [0002] 隨著無線通訊科技的發展，電子產品例如筆記型電腦、行動電話、個人數位助理（PDA)等可攜式電子裝置均朝向輕薄化進行設計開發《用以收發電波訊號的天線尺寸相對縮小’或是改變天線結構型態，方可内置於電子產品内部使用。 [0003] 目前市面上常見的多頻段的多頻天線為倒ρ形天線 (Planar Inverted-F Antenna，PIFA)。此天線採用了簡單的二維設計，透過印刷電路板（PCB)制造工藝直接將銅工藝印在印刷電路板上，以形成一平板狀多頻段的多頻天線，或者利用沖壓技術將金屬薄片沖壓形成一具有三維設計的多頻天線。 [0004] 由於PIFA天線結構可改變印刷電路板二維或金屬薄片上的天線幾何形狀，以達到雙頻甚至三頻以上的收發效果。但疋為了滿足訊说收發品質’以及避免周圍環境的影響造成其頻率協調失準，因此該印刷電路板或金屬薄片所沖壓成形的天線勢必具有一定大小的體積，為了安裝該PIFA天線結構該而電子裝置内部也必須預留一適當的空間來安置該PIFA天線結構’如此一來勢必違背電子裝置朝輕薄短小的小型化設計的需求。表單编號A0101 第3頁/共22頁 M408820 __ι一 100年G5月17 E修正替換頁【新型内容】 [0005} 因此，本創作之主要目的，在於解決傳統的缺失，所以提供一種將多頻段的多頻天線的金屬圖案載設於該高介電常數之陶瓷材料製作成的陶瓷載體上，以形成一個可直接進行表面黏著工程高效率的多頻段的多頻天線。同時也形成一輕薄短小的小型化的内置式可表面片的多頻天線。Correction 5, May 17, 100, New Description: [New technology field] [〇〇〇1] This creation is related to an antenna, especially a multi-frequency antenna module with high gain and multi-band. [Prior Art] [0002] With the development of wireless communication technology, portable electronic devices such as notebook computers, mobile phones, personal digital assistants (PDAs), etc. are designed and developed toward light and thin, and the size of the antenna for transmitting and receiving signals is relatively Zoom out 'or change the antenna structure type to be built into the electronics. [0003] Multi-band antennas commonly used in the market are Planar Inverted-F Antenna (PIFA). The antenna uses a simple two-dimensional design to print the copper process directly onto the printed circuit board through a printed circuit board (PCB) manufacturing process to form a flat multi-band multi-band antenna, or to stamp the foil using stamping techniques. A multi-frequency antenna with a three-dimensional design is formed. [0004] Since the PIFA antenna structure can change the antenna geometry on the two-dimensional or metal foil of the printed circuit board to achieve dual-frequency or even three-frequency transmission and reception effects. However, in order to satisfy the quality of the transmission and reception, and to avoid the influence of the surrounding environment, the frequency coordination of the antenna is inaccurate. Therefore, the antenna formed by the printed circuit board or the metal foil must have a certain size, in order to install the PIFA antenna structure. Inside the electronic device, an appropriate space must also be reserved to accommodate the PIFA antenna structure. This is inevitably contrary to the demand for the miniaturized design of the electronic device toward light, thin and short. Form No. A0101 Page 3 of 22 M408820 __ι一100年G5月17 E Correction Replacement Page [New Content] [0005} Therefore, the main purpose of this creation is to solve the traditional lack, so provide a multi-band The metal pattern of the multi-frequency antenna is placed on the ceramic carrier made of the high dielectric constant ceramic material to form a multi-band multi-band antenna capable of directly performing surface adhesion engineering with high efficiency. At the same time, a compact, small, built-in surface-mountable multi-frequency antenna is formed.

[0006] 為達上述之目的，本創作提供一種表面貼片式的多頻天線模組，包括有： [0007] —基板，係具有一第一表面及第二表面，該第一表面上具有一第一接地金屬面及一第一微帶線，該第一微帶線一端上具有一穿孔，該具有穿孔的部份段的第一微帶線延伸於該第一接地金屬面中，並與該第一接地金屬面之間形成一間隙，該第一接地金屬面的一側邊連結有一第二微帶線，該第二微帶線與該第一微帶線另一端呈平行關係並列，該第一微帶線與該第二微帶線之間具有一間距；另，於該第一表面上具有一組相對應的二固定接點，以及該第二表面上具有一第二接地金屬面； [0008] 一載體，係以高介電常數的陶瓷材料製成一長方體，其上具有第一輻射金屬部、第二輻射金屬部及第三輻射金屬部，該第一輻射金屬部、第二輻射金屬部及第三輻射金屬部以不相同的矩形金屬圖案及直線條金屬圖案組成，並設於該載體的至少一個或兩個表面以上，該第一輻射金屬部與該第二輻射金屬部呈電性連結，該第一輻射金屬部及第二輻射金屬部不與該第三輻射金屬部電性連表單编號A0101 第4頁/共22頁 M408820 100年05月17日梭正替換頁結；剛其巾，該載體與該基板電性連科射金屬部及該第二輻射金屬部與該基板的第一表面上的二固定接點電性連結，使該載體可以固接於該基板的第一表面上，該第一輻射金屬部及該第二輻射金屬部連結處與該第一微帶線電性連結，該第三輻射金屬部與該第二微帶線電性連結，以組合成一多頻天線模組。【實施方式】 [0010]茲有關本創作之技術内容及詳細說明，現配合圖式說明如下： [0011]請參閱第一、二、三、四圖，係本創作之多頻天線模組分解、另一視角的分解、又一視角的分解及外觀立體示意圖。如圖所示：本創作之一種表面貼片式的多頻天線模組，包括有：一基板1及一載體2。[0006] In order to achieve the above object, the present invention provides a surface-mount multi-frequency antenna module, comprising: [0007] a substrate having a first surface and a second surface, the first surface having a first grounding metal surface and a first microstrip line, the first microstrip line has a through hole at one end thereof, and the first microstrip line having the perforated portion extends in the first grounded metal surface, and Forming a gap with the first grounding metal surface, a second microstrip line is coupled to one side of the first grounding metal surface, and the second microstrip line is parallel to the other end of the first microstrip line. Having a spacing between the first microstrip line and the second microstrip line; further comprising a corresponding set of two fixed contacts on the first surface, and a second ground on the second surface a metal surface; a carrier having a high dielectric constant ceramic material having a first radiating metal portion, a second radiating metal portion, and a third radiating metal portion, the first radiating metal portion , the second radiating metal portion and the third radiating metal portion are not The same rectangular metal pattern and the straight strip metal pattern are formed and disposed on at least one or both surfaces of the carrier, the first radiating metal portion and the second radiating metal portion are electrically connected, the first radiating metal portion And the second radiating metal portion is not electrically connected to the third radiating metal portion. Form No. A0101 Page 4 / Total 22 pages M408820 The shuttle is being replaced by the shuttle; the carrier and the substrate The electrical metallographic portion and the second radiating metal portion are electrically connected to the two fixed contacts on the first surface of the substrate, so that the carrier can be fixed on the first surface of the substrate, the first radiation The metal portion and the second radiating metal portion are electrically connected to the first microstrip line, and the third radiating metal portion and the second microstrip line are electrically connected to form a multi-frequency antenna module. [Embodiment] [0010] The technical content and detailed description of this creation are as follows: [0011] Please refer to the first, second, third and fourth figures, which is the decomposition of the multi-frequency antenna module of the present creation. The decomposition of another perspective, the decomposition of another perspective, and the stereoscopic appearance of the appearance. As shown in the figure, a surface-mount multi-frequency antenna module of the present invention comprises: a substrate 1 and a carrier 2.

[0012]該基板1，係具有一第一表面11及第二表面12 ^該第一表面11上具有一第一接地金屬面丨3及一第一微帶線14，該第一微帶線14具一前段141及一後段142，該前段141上具有一穿孔143，該第一微帶線14的前段141延伸於該第一接地金屬面13中’並與該第一接地金屬面13之間形成一間隙15。該第一接地金屬面13的一側邊連結有一第二微帶線16，該第二微帶線16與該第一微帶線14的後段 142呈平行關係並列，且該第一微帶線14的後段142與該第二微帶線16之間具有一間距17，該第一微帶線14的後段142及第二微帶線16之間所形成的間距17寬度，可以來第5頁/共22頁表單编號A0101 M408820 __ 100年05月17日梭正替換頁調整耦合電容值，使得第一接地金屬面13能形成高頻的諧振點，藉以增加頻寬之用。另，於該第一表面11上具有一組相對應的二固定接點18，該二固定接點18用以固接該載體2。又於該第二表面12上具有一第二接地金屬面 19，該第二接地金屬面19係供與銅軸電纜線的接頭的接地部（圖中未示）電性連結。The substrate 1 has a first surface 11 and a second surface 12. The first surface 11 has a first grounded metal surface 3 and a first microstrip line 14. The first microstrip line 14 has a front section 141 and a rear section 142. The front section 141 has a through hole 143. The front section 141 of the first microstrip line 14 extends in the first grounded metal surface 13 and is opposite to the first grounded metal surface 13. A gap 15 is formed therebetween. A second microstrip line 16 is coupled to one side of the first grounded metal surface 13 , and the second microstrip line 16 is juxtaposed in parallel with the rear section 142 of the first microstrip line 14 , and the first microstrip line The rear section 142 of the 14 has a spacing 17 between the second microstrip line 16, and the width 17 formed between the rear section 142 of the first microstrip line 14 and the second microstrip line 16 is available. / Total 22 pages Form No. A0101 M408820 __ On May 17th, 2014, the shuttle replacement page adjusts the coupling capacitor value so that the first grounded metal surface 13 can form a high-frequency resonance point, thereby increasing the bandwidth. In addition, a plurality of corresponding two fixed contacts 18 are disposed on the first surface 11, and the two fixed contacts 18 are used to fix the carrier 2. Further, the second surface 12 has a second grounded metal surface 19 electrically connected to a ground portion (not shown) of the joint of the copper shaft cable.

[0013] 該載體2，係以高介電常數的陶瓷材料製成一長方體，其上具有第一輻射金屬部21、第二輻射金屬部22及第三輻射金屬部23。該第一輻射金屬部21、第二輻射金屬部22 及第三輻射金屬部23係以不相同的矩形金屬圖案及直線條金屬圖案設於該載體2的至少一個或兩個各表面以上，使得天線的體積以微型化。該第一輻射金屬部21與該第二輻射金屬部22呈電性連結，該第一輻射金屬部21及第二輻射金屬部22不與該第三輻射金屬部23電性連結。在該載體2與該基板1電性連結時，該第一輻射金屬部21及該第二輻射金屬部22與該基板1的第一表面11上的二固定接點18電性連結，使該載體2可以固接於該基板1的第一表面11上。且，該第一輻射金屬部21及該第二輻射金屬部22的連結處與該第一微帶線14電性連結，該第三輻射金屬部23與該第二微帶線16電性連結，以組合成一多頻天線模組。 [0014] 請參閱第四、五圖，係本創作之多頻天線模組外觀立體及電路的線路示意圖。如圖所示：在該第一輻射金屬部 21及該第二輻射金屬部22與該第一微帶線14電性連結後，以該第一輻射金屬部21形成第一天線，該第二輻射金表單編號A0101 第6頁/共22頁The carrier 2 is made of a rectangular material having a high dielectric constant ceramic material having a first radiating metal portion 21, a second radiating metal portion 22, and a third radiating metal portion 23. The first radiating metal portion 21, the second radiating metal portion 22, and the third radiating metal portion 23 are disposed on at least one or both surfaces of the carrier 2 with different rectangular metal patterns and straight strip metal patterns. The size of the antenna is miniaturized. The first radiating metal portion 21 is electrically connected to the second radiating metal portion 22, and the first radiating metal portion 21 and the second radiating metal portion 22 are not electrically connected to the third radiating metal portion 23. When the carrier 2 is electrically connected to the substrate 1 , the first radiating metal portion 21 and the second radiating metal portion 22 are electrically connected to the two fixed contacts 18 on the first surface 11 of the substrate 1 , so that the The carrier 2 can be fixed to the first surface 11 of the substrate 1. The junction of the first radiating metal portion 21 and the second radiating metal portion 22 is electrically connected to the first microstrip line 14 , and the third radiating metal portion 23 is electrically connected to the second microstrip line 16 . To combine into a multi-frequency antenna module. [0014] Please refer to the fourth and fifth figures, which are schematic diagrams of the appearance of the multi-frequency antenna module and the circuit of the circuit. As shown in the figure, after the first radiating metal portion 21 and the second radiating metal portion 22 are electrically connected to the first microstrip line 14, the first radiating metal portion 21 forms a first antenna. Two radiation gold form number A0101 Page 6 of 22

100年05月17日按正替换頁I 屬部22形成第二天線，該第三輻射金屬部23與該第二微帶線16形成第三天線的多頻段的多頻天線模組。 [0015]當訊號源3由第一微帶線14輸入後，流經該第一辕射金屬部21及第二輻射金屬部22形成高低頻分支諧振之結構。再以該第一微帶線14與該第二微帶線16之間所形成的間距17寬度，可以來調整耦合電容值’使得第一接地金屬面13能形成高頻的諧振點，藉以增加頻寬之用。請參閱第六 '七圖，係本創作之多頻天線模組的使用狀態及第六圖的側剖視示意圖。如圖所示：在本創作運用時’將連結銅軸電纜線5的連接器4的訊號饋入探針41穿過該第一微帶線14的穿孔143，與該第一微帶線14電性連結。該連接器4的殼體42與該第二接地金屬面19電性連結在多頻天線模組使用時，將銅轴電纜線5的接頭51鎖接於該連接器4的殼體42的螺紋43上，並透過第一輻射金屬部 21、第二輻射金屬部22及第三輻射金屬部23來接受不同頻段的訊號，以達到可多頻段使用的多頻天線模組。 [0016] 請參閱第八圖a〜b，係本發明的頻率響應曲線示意圖（一）、（二）及第八圖a與第八圖b的頻率響應表示意圖。如圖所示：當本發明之多頻天線模組在700 1111^時，該天線的反射損耗（Return Loss)為-3. 98，駐波比（SWR)為 4. 20。 [0017] 700 MHz 824 MHz 960 MHz 1710 MHz 2170 MHz 反射損耗(Reture Loss) -3.98 •11.66 -5.57 -10.39 -6.38 駐波比(SWR) 4.20 1.73 3.02 1.76 2.88 表單編號A0101 第7頁/共22頁 M408820 [0018] ΙΟϋ年05月17日修正替換頁當本發明之多頻天線模組在824 μη時，該天線的反射損耗為-11.66 ’駐波比為1. 73。 [0019] [0020] [0021] [0022] 當本發明之多頻天線模組在96〇MH^，該天線的反射損 L· 耗為-5.57，駐波比為3.02。當本發明之多頻天線模組在171(^1!7時，該天線的反射損 Lt 耗為-10.39 ’駐波比為1.76。當本發明之多頻天線模組在21701«117時，該天線的反射損 Lt 耗為-6. 38，駐波比為2. 88 » 長期演進天線的峯值增益參數說明（LTE ANTENNA Peak Gain Parameter Summary)如下所示：On May 17, 100, a second antenna is formed according to the replacement page I. The third radiating metal portion 23 and the second microstrip line 16 form a multi-band multi-band antenna module of the third antenna. When the signal source 3 is input from the first microstrip line 14, the first strobe metal portion 21 and the second radiant metal portion 22 are formed to form a high-low frequency branch resonance structure. Further, by the width of the gap 17 formed between the first microstrip line 14 and the second microstrip line 16, the coupling capacitance value can be adjusted so that the first grounded metal surface 13 can form a high frequency resonance point, thereby increasing Use for bandwidth. Please refer to the sixth 'seventh figure, which is the use state of the multi-frequency antenna module of the present invention and the side cross-sectional view of the sixth figure. As shown in the figure, the signal of the connector 4 connecting the copper shaft cable 5 is fed into the through hole 143 of the first microstrip line 14 and the first microstrip line 14 when the present application is used. Electrical connection. The housing 42 of the connector 4 is electrically connected to the second grounding metal surface 19. When the multi-frequency antenna module is used, the connector 51 of the copper shaft cable 5 is locked to the thread of the housing 42 of the connector 4. 43, and through the first radiating metal portion 21, the second radiating metal portion 22 and the third radiating metal portion 23 to receive signals of different frequency bands, so as to achieve multi-band antenna modules that can be used in multiple frequency bands. [0016] Please refer to the eighth diagrams a to b, which are schematic diagrams of the frequency response curves of the frequency response curves of the present invention (1), (2), and the eighth and eighth diagrams b. As shown in the figure, when the multi-frequency antenna module of the present invention is at 700 1111, the return loss of the antenna is -3.98, and the standing wave ratio (SWR) is 4.20. [0017] 700 MHz 824 MHz 960 MHz 1710 MHz 2170 MHz Reflection Loss -3.98 • 11.66 -5.57 -10.39 -6.38 Standing Wave Ratio (SWR) 4.20 1.73 3.02 1.76 2.88 Form Number A0101 Page 7 of 22 M408820 [0018] Modified replacement page on May 17th of the following year. When the multi-frequency antenna module of the present invention is at 824 μη, the reflection loss of the antenna is -11.66 'the standing wave ratio is 1.73. [0022] [0022] When the multi-frequency antenna module of the present invention is at 96 〇 MH^, the reflection loss L· consumption of the antenna is -5.57, and the standing wave ratio is 3.02. When the multi-frequency antenna module of the present invention is at 171 (^1!7, the reflection loss Lt of the antenna is -10.39' VSWR is 1.76. When the multi-frequency antenna module of the present invention is at 21701 «117, The reflection loss Lt of the antenna is -6. 38, and the standing wave ratio is 2. 88 » The LTE ANTENNA Peak Gain Parameter Summary is as follows:

[0023] [0024] 長期演進天線參數說明财 Band GSM (MHz) DCS (MHz) PCS (MHz) WCDMA(MHz) 700 824 880 890 960 1710 1880 1850 1990 2110 2170 峯值增益Peak Gain (dBi) -4.0 2.21 2.49 2.56 2.32 3.88 4.5 476 5.22 4.28 3.07 效能 Efficiency (%) 40.09 66.97 70.48 66.10 63.76 70.35 70.32 71.97 82.60 67.04 58.29[0024] Long-Term Evolution Antenna Parameter Description Fortune Band GSM (MHz) DCS (MHz) PCS (MHz) WCDMA (MHz) 700 824 880 890 960 1710 1880 1850 1990 2110 2170 Peak Gain Peak Gain (dBi) -4.0 2.21 2.49 2.56 2.32 3.88 4.5 476 5.22 4.28 3.07 Efficency (%) 40.09 66.97 70.48 66.10 63.76 70.35 70.32 71.97 82.60 67.04 58.29

本創作之多頻天線模組可提供目前長期演進天線（LONG TERM EVOLUTION ANTENNA，LTE ANTENNA)技術及第四代通訊系統所需的輕薄短小的小型多頻段高效率内置貼片式（SMT)的天線模組結構。且此多頻段涵蓋了 700〜960MHZ及1710〜2170 MHzf，為LTE、全球移動通訊系統（Global System for Mobile Connnunica-tions ’ GSM)、數位通訊系統（Digital Communications System， DCS)、個人通訊系統（Personai Com-munication System, PCS)、寬頻分碼多重存取表單编號A0101 第8頁/共22頁 M408820 100年05月17日梭正替換頁 (Wideband Code Division Multiple Access ， WCDMA)等系統頻段之所需。 [0025] 上述僅為本創作之較佳實施例而已，並非用來限定本創 .作實施之範圍。即凡依本創作申請專利範圍所做的均等變化與修飾，皆為本創作專利範圍所涵蓋。 [0026] 【圖式簡單說明】第一圖，係本創作之多頻天線模組分解示意圖。 [0027] • 第二圖，係本創作之多頻天線模組另一視角的分解示意圖。 [0028] 第三圖，係本創作之多頻天線模組又一視角的分解示意圖。 [0029] 第四圖，係本創作之多頻天線模組外觀立體示意圖。 [0030] 第五圖，係本創作之多頻天線模組電路的線路示意圖。 [0031] 第六圖，係本創作之多頻天線模組的使用狀態示意圖。鲁[0032] 第七圖，第六圖的側剖視示意圖。 [0033] 第八圖a，係本發明的頻率響應曲線示意圖（一）。 [0034] 第八圖b，係本發明的頻率響應曲線示.意圖（二）。 [0035] 【主要元件符號說明】基板1 [0036] 第一表面11 [0037] 第二表面12 表單編號A0101 第9頁/共22頁 M408820 100年05月17日核正替换頁 [0038] 第一接地金屬面13 [0039] 第一微帶線14 [0040] 前段141 [0041] 後段142 [0042] 穿孔143 [0043] 間隙15 [0044] 第二微帶線16 [0045] 間距17 [0046] 固定接點18 [0047] 第二接地金屬面19 [0048] 載體2 [0049] 第一輻射金屬部21 [0050] 第二輻射金屬部22 [0051] 第三輻射金屬部23 [0052] 訊號源3 [0053] 連接器4 [0054] 訊號饋入探針41 [0055] 殼體42 [0056] 螺紋43The multi-frequency antenna module of the present invention can provide the long-term and long-term evolution antenna (LONG TERM EVOLUTION ANTENNA, LTE ANTENNA) technology and the short, small and small multi-band high efficiency built-in chip (SMT) antenna required for the fourth generation communication system. Module structure. And this multi-band covers 700~960MHZ and 1710~2170 MHzf, for LTE, Global System for Mobile Connunica-tions 'GSM, Digital Communications System (DCS), Personal Communication System (Personai) Com-munication System, PCS), Broadband Code Division Multiple Access Form Number A0101 Page 8 of 22 M408820 100th May 17th (Wideband Code Division Multiple Access, WCDMA) need. [0025] The foregoing is only a preferred embodiment of the present invention and is not intended to limit the scope of the invention. That is, the equal changes and modifications made by the patent application scope of this creation are covered by the scope of the creation patent. [0026] [Simple Description of the Drawings] The first figure is an exploded view of the multi-frequency antenna module of the present invention. [0027] The second figure is an exploded schematic view of another perspective of the multi-frequency antenna module of the present invention. [0028] The third figure is an exploded schematic view of another perspective of the multi-frequency antenna module of the present invention. [0029] The fourth figure is a stereoscopic view of the appearance of the multi-frequency antenna module of the present invention. [0030] The fifth figure is a schematic diagram of the circuit of the multi-frequency antenna module circuit of the present invention. [0031] The sixth figure is a schematic diagram of the use state of the multi-frequency antenna module of the present invention. Lu [0032] Fig. 7 is a side cross-sectional view of the sixth figure. [0033] The eighth diagram a is a schematic diagram (1) of the frequency response curve of the present invention. [0034] Figure 8b is a frequency response curve of the present invention. Intent (2). [Description of Main Component Symbols] Substrate 1 [0036] First Surface 11 [0037] Second Surface 12 Form No. A0101 Page 9 of 22 M408820 100 May, 2005 Nuclear Replacement Page [0038] a grounded metal surface 13 [0040] first microstrip line [0040] front section 141 [0041] rear section 142 [0042] perforation 143 [0043] gap 15 [0044] second microstrip line 16 [0045] pitch 17 [0046 Fixed contact 18 [0047] Second grounded metal surface 19 [0048] First radiating metal portion 21 [0050] Second radiating metal portion 22 [0051] Third radiating metal portion 23 [0052] Signal Source 3 [0053] Connector 4 [0054] Signal Feed Probe 41 [0055] Housing 42 [0056] Thread 43

表單编號A0101 第10頁/共22頁 M408820 100年05月17日核正替換頁 [0057] 銅轴電纜線5 [0058] 接頭51 • 表單編號A0101 第11頁/共22頁Form No. A0101 Page 10 of 22 M408820 May 17th, 100th Nuclear Replacement Page [0057] Copper Shaft Cable 5 [0058] Connector 51 • Form No. A0101 Page 11 of 22

Claims

M408820 __ 100年05月17日核正替換頁六、申請專利範圍： 1 . 一種表面貼片式的多頻天線模組，包括：一基板，其上具有一第一表面及第二表士，該第一表面上具有一第一接地金屬面及一第一微帶線，該第一微帶線與該第一接地金屬面之間形成一間隙，該第一接地金屬面的一側邊連結有一第二微帶線，該第二微帶線與該第一微帶線呈平行關係並列，該第一微帶線與該第二微帶線之間具有一間距；M408820 __ May 17, 2005 Nuclear replacement page VI. Patent application scope: 1. A surface-mount multi-frequency antenna module comprising: a substrate having a first surface and a second watch; The first surface has a first grounded metal surface and a first microstrip line, and a gap is formed between the first microstrip line and the first grounded metal surface, and one side of the first grounded metal surface is connected a second microstrip line, the second microstrip line is juxtaposed in parallel with the first microstrip line, and a gap is formed between the first microstrip line and the second microstrip line;

一載體，其上具有第一輻射金屬部、第二輻射金屬部及第三輻射金屬部，該第一輻射金屬部與該第二輻射金屬部呈電性連結，該第一輻射金屬部及第二輻射金屬部與該第三輻射金屬部不電性連結；其中，在該載體與該基板電性連結時，該第一輻射金屬部及該第二輻射金屬部電性連結連結處與該第一微帶線電性連結，該第三輻射金屬部與該第二微帶線電性連結，以形成多頻段的多頻天線模組。 2 .如申請專利範圍第1項所述之表面貼片式的多頻天線模組，其中，該第一微帶線上具有一前段及一後段，該前段上具有一穿孔，該前段延伸於該第一接地金屬面中，並與該第一接地金屬面之間形成一間隙。 3.如申請專利範圍第2項所述之表面貼片式的多頻天線模組，其中，該第一微帶線的後段及該第二微帶線之間所形成的間距寬度來調整耦合電容值，使第一接地金屬面能形成高頻的諧振點。 4 .如申請專利範圍第3項所述之表面貼片式的多頻天線模組 100201131 表單編號A0101 第12頁/共22頁 1003171528-0 M408820 100年05月17日修正替换頁a carrier having a first radiating metal portion, a second radiating metal portion and a third radiating metal portion, the first radiating metal portion and the second radiating metal portion being electrically connected, the first radiating metal portion and the first The second radiating metal portion is electrically connected to the third radiating metal portion; wherein, when the carrier is electrically connected to the substrate, the first radiating metal portion and the second radiating metal portion are electrically connected to each other A microstrip line is electrically connected, and the third radiating metal portion is electrically connected to the second microstrip line to form a multi-band multi-frequency antenna module. The surface-mount multi-frequency antenna module of claim 1, wherein the first microstrip line has a front section and a rear section, the front section has a perforation, and the front section extends A gap is formed in the first grounded metal surface and the first grounded metal surface. 3. The surface-mount multi-frequency antenna module according to claim 2, wherein a pitch width formed between a rear portion of the first microstrip line and the second microstrip line is adjusted to be coupled. The capacitance value enables the first grounded metal surface to form a high frequency resonant point. 4. A surface-mount multi-frequency antenna module as described in claim 3, 100201131 Form No. A0101 Page 12 of 22 1003171528-0 M408820 Correction replacement page on May 17, 100

，其中，該第一表面上具有一組相對應的二固定接點，該二固定接點以固接該載體的第一輻射金屬部及第二輻射金屬部。 5 .如申請專利範圍第4項所述之表面貼片式的多頻天線模組，其中，該第二表面上具有一第二接地金屬面。 6 .如申請專利範圍第5項所述之表面貼片式的多頻天線模組，其中，該載體係以高介電常數的陶瓷材製成一長方體。 7 .如申請專利範圍第6項所述之表面貼片式的多頻天線模組，其中，該第一輻射金屬部、第二輻射金屬部及第三輻射金屬部係以不相同的矩形金屬圖案及直線條金屬圖案組成設於該載體上。 8 .如申請專利範圍第7項所述之表面貼片式的多頻天線模組，其中，該矩形金屬圖案及直線條金屬圖案設於該載體至少一個或兩個表面以上。 9.如申請專利範圍第8項所述之表面貼片式的多頻天線模組，其中，更具有一連接器，該連接器具有一殼體，該殼體内具有一訊號饋入探針，該訊號饋入探針穿過第一微帶線的穿孔，並與該第一微帶線電性連結。 100201131 表單编號A0101 第13頁/共22頁 1003171528-0The first surface has a corresponding set of two fixed contacts, and the two fixed contacts are fixed to the first radiating metal portion and the second radiating metal portion of the carrier. 5. The surface mount multi-frequency antenna module of claim 4, wherein the second surface has a second grounded metal surface. 6. The surface-mount multi-frequency antenna module according to claim 5, wherein the carrier is made of a rectangular parallelepiped with a high dielectric constant ceramic material. The surface-mount multi-frequency antenna module according to claim 6, wherein the first radiating metal portion, the second radiating metal portion and the third radiating metal portion are different rectangular metals. The pattern and the linear strip metal pattern are formed on the carrier. 8. The surface mount multi-frequency antenna module of claim 7, wherein the rectangular metal pattern and the linear strip metal pattern are disposed on at least one or more surfaces of the carrier. 9. The surface-mount multi-frequency antenna module of claim 8, wherein the connector further has a connector having a housing having a signal feed probe therein. The signal feeds the probe through the through hole of the first microstrip line and is electrically connected to the first microstrip line. 100201131 Form No. A0101 Page 13 of 22 1003171528-0