M405140 五、新型說明： 【新型所屬之技術領域】 本創作係㈣-種餘，屬電子元件散触術領域， 特別係指糊金屬固定棒結合數片非金屬散熱片之散熱模組 嶄新設計，具有提高散熱能力之功效者。 【先前技術】 按，隨著資訊半導體業的發展，半導體晶片不斷朝向高頻 化發展，近年來例如中央處理器（cpi])等電子裝置之處理速 度-日千里，LED也朝向高功率照明的應用，然:而伴隨而來的 是產生之高溫，如何有效的將電子裝置熱源(如會發熱的電子 主、被動元件’例如：中央處理器、LED、IC、整流器、電阻、 電容、電感…等)產生之高溫排出’使電子裝置能於適當的工 作溫度下運轉，實為各家業者爭相開發的重點。 以 LE1D 為例，LE：D 是發光二極體(Light- emitting Diode) 的縮寫，是半導體材料製成的固態發光元件，材料使用ΠΙ_ν 族化學70素（如：磷化鎵(GaP)、砷化鎵（GaAs)等），發光原 理是將電能轉換為光，也就是對化合物半導體施加電流，透過 電子與電洞的結合，過剩的能量會以光的形式釋出，達成發光 的效果’屬於冷性發光’壽命長達十萬小時以上。LED最大的 特點在於：無須暖燈時間（idling time)、反應速度快、體積 3 M405140 小、用電省、对震、污染低、適合量產’具高可靠度，容易配 合應用上的需要製成極小或陣列式的元件。惟因為led是固態 照明’即是利用晶片通電，量子激態回復發出能量（光），但在 發光的過程，晶片内的光能量並不能完全傳至外界，不能出光 的能量’在晶片内部及封裝體内便會被吸收，形成熱。LED — 般的轉換效率約只有10%〜30%，所以1W的電，只有不到0.2W 變成你可以看見的光，其它都是熱，若不散熱，這些熱量累積 會對晶片效率及壽命造成損傷。故要以高效率LED運用於照明 設備首先要解決散熱的問題。再以led散熱專利為例，新型 M314505號「高功率LED燈泡散熱結構」專利（2007年〇6月 21日專利公告資料參照），主要係於一燈頭上固定有一底基 板’該底基板的頂面支撲固定有至少一支熱導管，熱導管套設 固定有複數散熱片及一頂基板，頂基板的頂面設有對應熱導管 數量的高功率LED，該高功率LED的底面係黏結支撐於熱導 管的頂端。新型第M314433號「發光二極體封裝之散熱模組」 專利(2007年06月21日專利公告資料參照）’該散熱模組包 含：一 LED電路板；一散熱塊，包括複數個散熱片；以及一 散熱膠材，藉以直接固定該LED電路板於該散熱塊上；其中在 該LE：D電路板與該散熱塊之間，不具有一金屬基板。發明第 1260798號「高散熱發光二極體」專利（2006年〇8月21曰專 利公告資料參照），至少包括：一多孔隙材料層；一熱傳導層， 設於該多孔隙材料層表面；以及一晶片，設於該熱傳導層，由 4 M405140 該熱傳導層將該晶片所發出之熱量傳導至該多孔隙材料層，並 由該多孔隙材料層將該熱量對流至外部。 由以上諸前案可知習用led散熱大都採用金屬散熱片，或 結合熱導管、致冷晶片、均熱板、散熱風扇等方式為之，普遍 具有散熱效果不佳、散熱速度不夠迅速、散熱模組結構複雜、 成本向等缺失。此即為現行習用技術存有最大之缺失，此缺失 乃成業界亟待克服之難題。M405140 V. New description: 【New technology field】 This creation department (4)-species is a field of electronic components in the field of astigmatism. It refers specifically to the new design of the heat dissipation module of the paste metal fixing rod combined with several non-metal heat sinks. It has the effect of improving heat dissipation. [Prior Art] According to the development of the information semiconductor industry, semiconductor wafers are constantly moving toward high frequency. In recent years, the processing speed of electronic devices such as a central processing unit (CPI) has been increasing, and LEDs are also oriented toward high-power illumination. Application, of course: is accompanied by the high temperature generated, how to effectively heat the electronic device (such as electronic main and passive components that can generate heat) such as: central processing unit, LED, IC, rectifier, resistor, capacitor, inductor... The high-temperature discharge generated by the 'enablement of the electronic device to operate at an appropriate operating temperature is the focus of the development of various industries. Taking LE1D as an example, LE:D is an abbreviation of Light-emitting Diode. It is a solid-state light-emitting component made of semiconductor materials. The material is made of ΠΙ ν chemistry 70 (such as gallium phosphide (GaP), arsenic. Gallium (GaAs), etc., the principle of luminescence is to convert electrical energy into light, that is, to apply current to the compound semiconductor, through the combination of electrons and holes, excess energy will be released in the form of light, achieving the effect of luminescence. Cold lighting has a lifetime of more than 100,000 hours. The biggest feature of LED is that it does not need idling time, fast response speed, small volume 3 M405140, power saving, vibration, low pollution, suitable for mass production, high reliability, easy to match the needs of the application. A very small or array of components. But because LED is solid-state lighting, that is, using the wafer to energize, the quantum exciplex returns to emit energy (light), but in the process of illuminating, the light energy in the wafer cannot be completely transmitted to the outside world, and the energy that cannot be emitted is 'inside the wafer and The inside of the package will be absorbed to form heat. LED - the conversion efficiency is only about 10% ~ 30%, so 1W of electricity, less than 0.2W becomes light you can see, the other is hot, if not heat, these heat accumulation will cause wafer efficiency and life damage. Therefore, the application of high-efficiency LEDs to lighting equipment must first solve the problem of heat dissipation. Taking the LED heat-dissipation patent as an example, the new M314505 "High-power LED bulb heat dissipation structure" patent (refer to the patent publication date of June 21, 2007) mainly attaches a base substrate to the top of a base. The surface support is fixed with at least one heat pipe, the heat pipe sleeve is fixed with a plurality of heat sinks and a top substrate, and the top surface of the top substrate is provided with a high-power LED corresponding to the number of heat pipes, and the bottom surface of the high-power LED is bonded and supported. At the top of the heat pipe. The new type of M314433 "thermal module for light-emitting diode package" patent (refer to the patent publication date of June 21, 2007) 'the heat-dissipating module comprises: an LED circuit board; a heat-dissipating block, comprising a plurality of heat sinks; And a heat dissipating adhesive material for directly fixing the LED circuit board to the heat dissipating block; wherein there is no metal substrate between the LE:D circuit board and the heat dissipating block. Patent No. 1260798 "High heat-dissipating light-emitting diode" (refer to the patent publication of August 21, 2006), comprising at least: a porous material layer; a heat conducting layer disposed on the surface of the porous material layer; A wafer is disposed on the heat conducting layer, and the heat conduction layer transfers the heat generated by the wafer to the porous material layer by 4 M405140, and the heat is convected to the outside by the porous material layer. It can be seen from the above previous cases that conventional LED heat dissipation uses metal heat sinks, or combined with heat pipes, cooling chips, soaking plates, cooling fans, etc., generally has poor heat dissipation effect, heat dissipation speed is not fast enough, and the heat dissipation module The structure is complex and the cost is missing. This is the biggest deficiency in the current use of technology, and this lack is a difficult problem to be overcome in the industry.
【新型内容】 本創作研創人鑒於習用技術之缺失，積其多年實際從事精 密陶瓷科技工業產品之設計製造專業知識，經不斷研究、改良 後，終有本創作之研創成功，公諸於世。[New content] In view of the lack of conventional technology, this creative researcher has accumulated many years of experience in the design and manufacture of precision ceramic technology industrial products. After continuous research and improvement, the creation of this creation has been successful and made known to the world.
緣是，本_之主要目的在提供—種「堆#式散熱模組」， 係由第-散熱片結合至少—片的散刻所堆疊結合而成，其令 各散熱片為散熱性良好之具多孔隙結構非金屬構成各散熱片 並具有數穿孔，以藉金屬固定棒固定各散熱片，第—散熱片表 面結合熱源，熱源產生的财藉金屬固定棒迅賴導熱至各散 熱片而散熱’如此達成快速散熱之功效者。 本創作前述金屬固定棒，在熱源需連結電源時，位於第一 散’’、、=端的金屬固疋棒連結熱源電連結部，另_連結外部電The reason is that the main purpose of this _ is to provide a kind of "heap-type heat-dissipating module", which is formed by stacking the first heat sink and at least the scatter of the film, which makes the heat sinks have good heat dissipation. The multi-porous structure non-metal forms each fin and has a plurality of perforations for fixing the fins by a metal fixing rod. The surface of the first fin is combined with a heat source, and the metal rod fixed by the heat source is fast radiated to each fin to dissipate heat. 'So that achieves the effect of rapid heat dissipation. In the above-mentioned metal fixing rod of the present invention, when the heat source needs to be connected to the power source, the metal solid rod located at the first dispersion '' and the = end is connected to the heat source electric connection portion, and the other is connected to the external electricity.
Hi述金屬棒可設為中^，以穿設導線連結熱源電連結 部與外部電源。 & 本創作前述第-散熱片與熱源接觸部設有金屬導熱層，以 5 M405140 快速將熱源產生的熱迅速導熱至各散熱片而散熱。 本創作前述各散熱片相對處另設有導熱孔，並設導熱棒連 結各散熱片，以快逮將熱源產生的熱，藉導熱棒迅速導熱至各 散熱片而散熱。前述導熱棒可為導熱效果佳之金眉或非金屬構 成。前述導熱棒可為中空結構或熱管構成。 本創作前述各散熱片間具有介面層，藉介面層結合上、下 散熱片。該介面層為高導熱金屬材料，如低溫焊錫構成。 本創作金屬固定棒及金屬導熱棒係利用金屬具有高結構密 度以及高比容熱之槪，所以具有較高之導熱能力（如：銅金 屬之熱傳導料382w/nfc)，㈣金屬散熱#係彻不同粒徑 的面熱導率非金屬粉粒(如：碳化梦Sic熱傳導率為270W/H1 C)非金屬具有較低的比容熱，是一種相當好的散熱材料， 本創作以金屬導熱棒穿設各非金屬散熱片，更能提高其散熱能 力。 【實施方式】 為達成本創作前述目的之技術手段，兹列舉—實施例，並 配合圖式說明如後’貴審查委員可由之對本創作之結構、特徵 及所達成之功效，獲致更佳之瞭解。 百先，請參閲第-圖所示，由圖可知本創作係由第一散熱 «至夕片的散熱片（2)所堆疊結合而成【在本實施例 中第-散熱片⑴結合有二片散熱片⑵】，其中第—散熱片⑴ 及純熱片⑵為散熱性良好之非金屬構成，亦可為散熱性良 好之具多孔隙結構非金屬構成【第—散熱片⑴及各散熱片⑵ 6 M405140 可由熱導率高的非金屬粉難成，解率高_金屬粉體諸 如：氧化紹Al2〇3、氧化錯Zr2〇、氮化銘AiN、氣化石夕㈣、 氮化销N、碳化鶴WC、碳化石夕Sic、石墨c、結晶碳化石夕、再 結晶碳化梦ReSiC等，㈣氮化财碳化㈣佳】，第一散熱 片⑴及各散熱片⑵並具有數穿孔⑽⑽，穿孔(1〇)(2〇)内 結合有金屬固定棒(3)，以藉金屬固定棒⑶固定第一散熱片⑴ 及各散熱片⑵【金屬固雜⑶可為—般導熱良好的金屬製 螺栓、鉚釘、銷件等】，第-散熱片⑴表面結合熱源⑴，熱 源(A)產生的熱可藉金屬固定棒⑶迅速的導熱至第—散熱片 ⑴及各散熱片⑵而散熱，如此達成快速散熱之功效者。 請參閱第二圊所示’本創作前述金屬固定棒⑶，在熱源需 連結電源時(如LED模組）’位於第一散熱片⑴端的金屬固定 棒(3)連結熱源(A)電連結部⑻，另端則連結外部電源。請參 閱第三圖所示’前述金屬固定棒⑶為中空金屬管⑽，以穿 設導線(G)連結舰電連結部⑻與外部電源，使金屬固定棒⑶ 除具有導熱功能外，兼具電極功能。 請參閱第四圖所示’本創作前述第一散熱片⑴與敎源⑴ 接觸部設有金科熱層⑷【金科熱層⑷由導熱良好之金 屬製成，導熱良好之金屬如金、銀、銅、鐵、銘、姑、錄、辞、 鈦、錳等】’以快速將熱源(A)產生的熱迅速導熱至第」散熱片 ⑴及各散熱片⑵而散熱’本創作金屬導熱層⑷可直接成形 於第-散熱片（1)上，如以印刷或塗佈等方式直接於第一散熱 片⑴與熱源(A)之結合部上，形成金屬導熱層⑷，以減少部 7 M405140 件、降低成本。 請參閱第五圖所示，本創作前述第一散熱片（1)及各散熱片 (2)相對處另設有導熱孔（11)(21)，導熱孔（11)(21)設導熱棒 (5)連結第一散熱片（1)及各散熱片（2)，以快速將熱源(A)產生 的熱’藉導熱棒(5)迅速導熱至第一散熱片（1)及各散熱片（2) 而散熱。前述導熱棒(5)可為導熱效果佳之金屬【導熱效果佳 之金屬如金、銀、銅、鐵、鋁、鈷、鎳、鋅、鈦、錳等】或導 熱效果較第-散熱片⑴及各散熱》(2)佳之非金屬構成。前述 導熱棒(5)可為中空結構或熱管構成。 請參閱第六圖所示’本創作前述第_散熱片⑴及各散熱片 ⑵間具有介面層⑹，藉介面層⑹結合上、下第一散熱片⑴ 各散·、.、片（2)。該介面層（6)為高導熱金屬材料，如以低溫焊 錫為主材料，亦可添加稀土元素、鹼金族及過度元素等，以降 低熔點。 如此而達本創作設計目的，堪稱一實用之創作者。 充伤符合新型專利之「 依法提出申請，謹請貴 實感德便。 综上所述’本創作所揭露之一種「堆疊式散熱模組」為昔所 無，亦未曾見於_外公開之刊物上，理已具新穎性之專利要 件’又本創作確可摒除習用技術缺失，並達成設計目的，亦已 刊之可供產業上利用之新型」專利要件，爰 謹請貴審查委貞惠料查，並鮮本案專利，The Hi metal bar can be set to a middle to connect the heat source electrical connection to the external power supply. & The first heat sink and the heat source contact portion of the present invention are provided with a metal heat conductive layer, and the heat generated by the heat source is quickly transferred to the heat sinks to quickly dissipate heat by the 5 M405140. In the present invention, the heat sinks are separately provided with heat-conducting holes, and heat-dissipating bars are connected to the heat-dissipating fins to quickly catch the heat generated by the heat source, and the heat-conducting rods quickly conduct heat to the heat sinks to dissipate heat. The aforementioned heat conducting rod can be made of a gold eyebrow or a non-metal which has a good heat conduction effect. The aforementioned heat conducting rod may be composed of a hollow structure or a heat pipe. In the creation, each of the heat sinks has an interface layer, and the upper and lower heat sinks are combined by the interface layer. The interface layer is made of a highly thermally conductive metal material such as low temperature solder. The metal fixing rod and the metal heat conducting rod of the present invention utilize a metal having a high structural density and a high specific heat, so that it has a high thermal conductivity (for example, a copper metal thermal conductive material 382w/nfc), and (4) a metal heat dissipation. Non-metallic particles with different particle sizes (such as carbonization dream Sic thermal conductivity 270W/H1 C) Non-metal has a low specific heat, which is a fairly good heat-dissipating material. Wear non-metallic heat sinks to improve heat dissipation. [Embodiment] In order to achieve the above-mentioned technical means for the purpose of the present invention, the embodiments are listed, and the description of the structure of the present invention can be better understood. For the first time, please refer to the figure - figure. It can be seen from the figure that the creation is made up of the first heat sink «to the heat sink (2) of the mat (the first heat sink (1) is combined in this embodiment) Two heat sinks (2), wherein the first heat sink (1) and the pure heat film (2) are made of non-metal with good heat dissipation, and can also be composed of a porous structure and a non-metal structure with good heat dissipation [first heat sink (1) and heat dissipation) Sheet (2) 6 M405140 It is difficult to form a non-metallic powder with high thermal conductivity, and the solution rate is high_metal powder such as: Al2O3, Oxidation Zr2〇, Nitrogen AiN, Gasification Shi (4), Nitride pin N , carbonized crane WC, carbonized stone Sic, graphite c, crystalline carbonized stone, recrystallized carbonized dream ReSiC, etc., (4) nitriding carbonization (four) good, first heat sink (1) and each heat sink (2) with a number of perforations (10) (10), A metal fixing rod (3) is combined in the perforation (1〇) (2〇) to fix the first heat sink (1) and each heat sink (2) by a metal fixing rod (3). [Metal solid (3) can be made of metal with good heat conductivity. Bolts, rivets, pins, etc.], the surface of the first heat sink (1) is combined with the heat source (1), and the heat generated by the heat source (A) ⑶ rapidly by metal rods fixed to the second thermally conductive - heat sink fins and each ⑴ ⑵ and heat, so the effectiveness of those who achieve rapid cooling. Please refer to the second section, 'The above-mentioned metal fixing rod (3), when the heat source needs to be connected to the power source (such as LED module), the metal fixing rod (3) at the end of the first heat sink (1) is connected to the heat source (A). (8), the other end is connected to the external power supply. Please refer to the figure in the third figure. 'The metal fixing rod (3) is a hollow metal tube (10). The connecting wire (G) is connected to the ship's electric connecting part (8) and the external power source, so that the metal fixing rod (3) has the heat conducting function and the electrode. Features. Please refer to the fourth figure. 'The first heat sink (1) and the source (1) are provided with a Jinke thermal layer (4). [Jinke thermal layer (4) is made of a metal with good heat conductivity, and a metal with good heat conductivity such as gold. Silver, copper, iron, Ming, Gu, record, resignation, titanium, manganese, etc.] 'Quickly heat the heat generated by the heat source (A) to the first "heat sink (1) and each heat sink (2) to dissipate heat" The layer (4) can be directly formed on the first heat sink (1), such as by printing or coating, directly on the joint portion of the first heat sink (1) and the heat source (A) to form a metal heat conductive layer (4) to reduce the portion 7 M405140 pieces, reducing costs. Referring to the fifth figure, the first heat sink (1) and the heat sink (2) are separately provided with heat conduction holes (11) (21), and the heat conduction holes (11) (21) are provided with heat conduction bars. (5) connecting the first heat sink (1) and each heat sink (2) to quickly heat the heat generated by the heat source (A) to the first heat sink (1) and the heat sink by the heat conductive rod (5) (2) While cooling. The heat conducting rod (5) may be a metal with good heat conduction effect [metals with good thermal conductivity such as gold, silver, copper, iron, aluminum, cobalt, nickel, zinc, titanium, manganese, etc.) or heat conduction effects of the first heat sink (1) and each Heat dissipation (2) is a non-metallic composition. The aforementioned heat conducting rod (5) may be constructed of a hollow structure or a heat pipe. Please refer to the figure in the sixth figure, which has the interface layer (6) between the first heat sink (1) and each heat sink (2). The first heat sink (1) is bonded to the upper and lower heat sinks (1) by the interface layer (6). . The interface layer (6) is a high thermal conductivity metal material, such as low temperature solder as a main material, and may also add rare earth elements, alkali gold groups and excessive elements to lower the melting point. This is the purpose of this creative design, can be called a practical creator. Injury in line with the new patents "Apply in accordance with the law, please be considerate of your feelings. In summary, the "stacked cooling module" disclosed in this creation is unprecedented and has not been seen in the publications published outside the magazine. The patent element that has been novel is 'this creation can indeed eliminate the lack of customary technology and achieve the design purpose. It has also published a new type of patent element that can be used in the industry. I would like to ask your review committee to check the information. And fresh patents in this case,
例而已，並非 ’運用本創作 8 M405140 說明書及申請專利範圍所作之等效結構變化，理應包括於本創 作之專利範圍内。 【圖式簡單說明】 第一圖係本創作第一實施例組立剖面圖。 第二圖係本創作第二實施例組立剖面圖。 第三圖係本創作第三實施例組立剖面圖。 第四圖係本創作第四實施例組立剖面圖。 第五圖係本創作第五實施例組立剖面圖。 第六圖係本創作第六實施例組立剖面圖。 【主要元件符號說明】 (A) 熱源 (B) 電連接部 (C) 導線 (1) 第一散熱片 (10)穿孔 （11)導熱孔 (2) 散熱片 (20)穿孔 （21)導熱孔 (3) 金屬固定棒 (4) 金屬導熱層 (5) 導熱棒 (6) 界面層For example, it is not intended to use the equivalent structural changes made by the 8 M405140 specification and the scope of the patent application, which should be included in the scope of this patent. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a sectional view of the first embodiment of the present creation. The second drawing is a sectional view of the second embodiment of the present creation. The third figure is a sectional view of the third embodiment of the present creation. The fourth figure is a sectional view of the fourth embodiment of the present creation. The fifth figure is a sectional view of the fifth embodiment of the present creation. The sixth drawing is a sectional view of the sixth embodiment of the present creation. [Main component symbol description] (A) Heat source (B) Electrical connection (C) Conductor (1) First heat sink (10) Perforation (11) Thermal hole (2) Heat sink (20) Perforated (21) Thermal hole (3) Metal fixing rod (4) Metal heat conducting layer (5) Thermal conducting rod (6) Interface layer