M403726 五、新型說明： 【新型所屬之技術領域】 本新型係關於一種測試設備，尤其關於— 模組之直立式測試設備。 s "«體 【先前技術】M403726 V. New Description: [New Technology Field] This new type is about a test equipment, especially about the vertical test equipment of the module. s "«body [prior art]
傳統的記憶體模組的測試方法，都是透過專 試設備’ #用人工的方式執行測試。舉例而t的測 記憶體模組插在主機板上，主機板連接至顯示卡，二將 卡連接至登幕，記憶體模組插在主機板的記憶體插抑.不 再對主機板進行開機測試，由人工的方式觀看測試‘： 再依據測試結果對測試過的記憶體模組進行分類。 雖然可以冑過機器手冑纟肖記憶體模组進行#㈣ 動作，但是主機板必須水平置放，以讓機器手臂可以將 記憶體模組***至主機板上的記憶體插槽。然而，主機 板佔了相當大的水平區域。若要對眾多記憶體模組進行 測試，則㈣利用眾多的主機板，而這些主機板只能水 “置放這樣佔據了相當大的空間，不利測試場所的小 型化，因而增加了測試成本。 【新型内容】 種記憶體模組之 的目的、節省測 因此，本新型之—個目的係提供一 直立式測試設備，藉以達到自動化測試 試空間並減少測試成本。 為達上述目的 本新型提供一 種記憶體模組之直立 M403726 式測試設備，其包含一箱體組件、數個 卞致個第一主機板組件 及-處理機。第-主機板組件設置於箱體組件中。各第 ::機板組件包含一主機板、一第_主插座、一轉接板、 -第-副插座及一中央處理器。主機板直立地設置於箱 體組件中。第一主插座設置於主機板上並電連接至主 機板。轉接板電連接至第一主插座，並實質上垂直於主 機板。第-副插座設置於轉接板上。中央處理器設置於 主機板上，並電連接至主機板。處理機用以將數個記憶 體模組分m一錯直方向***至此等第—副插座申以 進行測試，並於須m完畢後將此等記憶體模組拔出。 藉由上述之直立式測試設備，可以在有限的空間下 創造出更多的測試產能，並有效降低測試成本。 為讓本新型之上述内容能更明顯易懂，下文特舉一 較佳實施例，並配合所附圖式，作詳細說明如下。 圖1顯示依據本新型第一實施例之直立式測試設備 之整體示意圖。圖2顯示圖！之直立式測試設備之局部 示意圖。® 3顯示之之直立式測試設備之局部立體示意 圖。 如圖1至3所示’本實施例之記憶體模組之直立式 測試設備1包含-箱體組件10、數個第一主機板組件 以及一處理機（Hand丨er)3〇e當然，記憶體模組之直立式 測試設備i亦可更包含數個附加箱體組件1〇、附加箱體 組件丨〇’的功能類似於箱體組件1〇，這樣可以增加測試 5 M403726 的產能。以下僅以單一箱體組件〗〇的内部構造來做說 明。 第一主機板組件20係設置於箱體組件1〇中。各第 主機板組件20包含一主機板21、一第一主插座22、 一轉接板24、一第一副插座26及一中央處理器28。主 機板21譬如是從市面上可購得之各廠牌的主機板，其係 直立地5又置於箱體組件1〇中。如此一來可依據客戶的 而要購買特定主機板來進行記憶體模組的測試，當然亦 可使用特製的主機板來進行測試。第一主插座22係設置 於主機板21上，並電連接至主機板21。轉接板以係電 連接至第一主插座22,並實質上垂直於主機板21。第一 田J插座26係δ又置於轉接板24上。令央處理器28係設置 於主機板21上，並電連接至主機板21。 處理機30用以將數個記憶體模組丨〇〇分別沿著一鉛 直方向DV***至此等第—副插座％中以進行測試，並 於測試完畢後將此等記憶體模組刚拔出。記憶體模組The traditional method of testing memory modules is to perform tests through manual equipment. For example, the test memory module is inserted on the motherboard, the motherboard is connected to the display card, the second card is connected to the screen, and the memory module is inserted into the memory of the motherboard. Start the test, watch the test manually]: Then classify the tested memory modules according to the test results. Although it is possible to perform the #(四) action through the robotic memory module, the motherboard must be placed horizontally so that the robot can insert the memory module into the memory slot on the motherboard. However, the motherboard occupies a fairly large horizontal area. To test a large number of memory modules, (4) the use of a large number of motherboards, and these motherboards can only "place" such a large space, which is unfavorable for the miniaturization of the test site, thus increasing the test cost. [New content] The purpose of the memory module is to save the measurement. Therefore, the purpose of the present invention is to provide a vertical test equipment to achieve an automated test space and reduce the test cost. The upright M403726 type test device of the memory module comprises a box component, a plurality of first motherboard components and a processor. The first motherboard component is disposed in the cabinet component. The board assembly comprises a motherboard, a first main socket, an adapter board, a first-sub socket and a central processing unit. The main board is disposed upright in the cabinet assembly. The first main socket is disposed on the main board Electrically connected to the motherboard. The adapter board is electrically connected to the first main socket and is substantially perpendicular to the motherboard. The first-sub socket is disposed on the adapter board. The central processing unit is disposed on the motherboard And electrically connected to the motherboard. The processor is configured to insert a plurality of memory module components m into the first-second socket for testing, and to perform the memory mode after the m is completed. The group is pulled out. With the above-mentioned vertical test equipment, it is possible to create more test capacity in a limited space and effectively reduce the test cost. To make the above contents of the present invention more obvious, the following is a special DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The following is a detailed description of the vertical test apparatus according to the first embodiment of the present invention. Fig. 2 is a partial schematic view of the vertical test apparatus of Fig. 2; ® 3 shows a partial perspective view of the vertical test equipment. As shown in FIGS. 1 to 3, the vertical test apparatus 1 of the memory module of the present embodiment includes a box assembly 10 and a plurality of first motherboard components. And a processor (Hand丨er) 3〇e, of course, the upright test equipment i of the memory module can also include several additional cabinet components 1 附加, the function of the additional cabinet component 丨〇 ' is similar to the cabinet Component 1〇 This can increase the capacity of the test 5 M403726. The following is only explained by the internal structure of a single box assembly. The first motherboard assembly 20 is disposed in the cabinet assembly 1A. Each of the motherboard components 20 includes a host. The board 21, a first main socket 22, an adapter board 24, a first sub-outlet 26 and a central processing unit 28. The main board 21 is, for example, a motherboard of various brands available on the market. The upright 5 is placed in the box assembly 1 。. In this way, the specific motherboard can be purchased for the memory module test according to the customer, and of course, the special motherboard can be used for testing. The socket 22 is disposed on the motherboard 21 and electrically connected to the motherboard 21. The adapter is electrically connected to the first main socket 22 and substantially perpendicular to the motherboard 21. The first J socket 26 is δ Placed on the adapter plate 24. The central processing unit 28 is disposed on the motherboard 21 and electrically connected to the motherboard 21. The processor 30 is configured to insert a plurality of memory modules 沿着 into the first sub-sockets % along a vertical direction DV for testing, and the memory modules are just pulled out after the test is completed. . Memory module
⑽譬如I DIMM記憶體模組，其上安裝有複數個積體 ，路(IC)2〇0。處理機3〇包含一懸吊支架31及一機器手 # 32，亦可更包含用以進行資料處理及管控分類程序之 相關模組。機器手臂32可以沿著懸吊支架移動（X軸 向移動）’懸吊支架31亦可被移動(Y軸向移動），而處理 機30之機器手臂32可以—次抓取—個或多個記憶體模 組100來進行z軸向移動。 此外’前述測試設備 50、一測試前儲存區51、 1可以更包含一測試前暫存區 一測試後粗分類區55及一測 6 M403726 試後細分類區56。處理機 測試前暫存區5〇取出後憶體模組⑽從此等 Ά M y 至第—田1j插座20中。處理 機30依據數個測試結 Μ - ^ ^ ^ U如疋正常或不正常）分別將測 式凡畢之此等記憶體模組 此等記憶體模組⑽在列^ 後粗分類區〜 區1而在測試後可以先存放在測試前儲存 破存放在測試後細分類區56。 值得注意的是’可以提供 . 等記憶體模組⑽從測試^2一處理機（未顯示）以將此 F ,Λ ,, 從利4别儲存區51移動至測試前暫存 Γ1，二測試後粗分類區55移動至測試後細分類區 。备然’亦可由處理機30來執行前述動作。 此外’各第一主機板組件2〇可以更包含一第二主插 以及一、顯第Γ副插座仏—連接線25、—散熱風扇29Α 並·。第二主插座23設置於主機板21上， 上用、^主機板21。第二副插座27設置於轉接板24 用。、收***之其令一個記憶體模組100以供測試 執思μ ’ 25係電連接第二副插座27及轉接板24。散 :風扇29Α設置於中央處理器28 i。顯示卡綱設置 顧主：板21上。使用者可以將顯示螢幕(未顯示)連接至 29B以讓測試人員觀測測試狀況及結果、然而， ^卡別並非是必要元件，因為所有測試過程的資料 都可以由處理機30監控並處理。 圖4顯示依據本新型第-普 之局部示意圖。如圖4所=式測試設備 似於第—m 備係類 一 处仕於測忒设備更包含數個第 一主機板組件60,其係設置於箱體組件1〇令並堆疊 M403726 於此等第一主機板組件20之上 此等第一主機板植袢 60之結構及功用係相同於此箅笛 ’ 寻第—主機板組件20之社 構及功能。於此實施例中，處理機3〇可行經此 : 機板組件60及此等第-主機板組件2〇之間，並將:等 ,己憶體模組100分別向下***至此等第__主機板 q 中及向上***至此等第二主機板組件6〇中只要機器手 臂32可以繞著懸吊支架31翻 糊得即可。值得注意的是， 對於位於上方的箱體組件1〇而+ 處理機30將記憶體 I·且H)0***至第一副插座26中以進行測試之鉛直方向 DV，係與記憶體模組刚所受的重力方向⑽㈣ 位於下方的箱體組件10而言，處理機3〇將記憶體模组 ! 〇 〇***至第-副插座2 6中以進行測試之錯直方向D V， 係與記憶體模，組刚所受的重力方向反向。上方的箱體 組件10與下方的箱體組件1G可以單獨存在或—起存在。 圖5顯示依據本新型第三實施例之直立式測試設備 之局部示意圖。如圖5所示，本實施例係類似於第—實 =例，不同之處在於箱體組件10及附加箱體組件10，係 置機α 80 _，且箱體組件1 〇及此等附加箱體袓件 10·可被抽出機台80以便進行維修。 、 圖6與7顯示依據本新型第三實施例之直立式測試 設備之局部示意圖。如圖6肖7所示’本實施例之測試 設備之箱體組件丨0包含一底座12、一上蓋14以及一温 控模組1 6。此等第一主機板組件2〇係固定於底座12中。 上盍14係可被移動以覆蓋底座12及此等第一主機板組 件2〇。溫控模組16係設置於上蓋14及底座12所形成 8 M403726 之一空間18中’用以控制空間18之溫度。於—例子中， 溫控模組16包含一加熱器17。於另一例子中，溫护模 組可以包含氣體提供裝置，用以提供氣體至空間Μ :以 控制溫度。在處理機30插置完記憶體模組1〇〇以後，處 理機30移走，然後一油壓虹懸吊支架％上的油壓缸9〇 將上蓋14往下推以與底座12閉合進而可以依據客戶 的需要執行某些特定溫度的測試。 圖8顯示依據本新型之處理機、電源供應器及主機 板之連接關係、。如圖8所示，本新型之測試設備可以更 包含—電源供應器40，電連接至處理機3〇，處理機 電連接至主機板21，處理機30在將記憶體模組ι〇〇 入至第一副插座26中後導通電源供應器4〇及主機板 21以進行測試，並於測試完畢後斷開電源供應器及 、機板21以移除主機板21。因此，所有測試過程都可 以由處理機30來執行或監控，測試人員的需求 幅降低。 以下詳細說明測試流程。首先，處理機3〇從測試前 。子區50抓取記憶體模組1〇〇***至第一副插座^及/ 或第二副插座27 t ’然後將主機板21通電（開機），讀 二主機板21的訊號是否正常’若發現異常則對主機板 斷電（關機），更換新的記憶體模组1〇〇進行測試。若 ^板21的訊號正常’則重複上述程序以繼續對箱體 〇中之其他主機板21***記憶體模組100。主機 機測試的時間通常很長’譬如是15〇〇秒至3_秒 3 所以處理機3 0可以繼續利用其他附加箱體組件 9 M403726 10的主機21纟進行其他記憶體模組100 #測試，同 樣是重複上述步驟。等到所有附加箱體組# 10,都 滿記憶體模組⑽後，判斷測試時間是否已經到達、— 否則繼續等待，若是則讀取各主機板21的訊號，以判： 記憶體模·组1G0的測試結果是否正常，並依據測試結果 將記憶體模組1GG拔出送至測試後粗分類1 55。另外， 可以透過另一處理機來將記憶體模組100從測試後粗分 類區55搬運至測試後細分類區56。(10) For example, an I DIMM memory module has a plurality of integrated bodies mounted thereon, and the circuit (IC) is 2 〇 0. The processor 3 includes a suspension bracket 31 and a robot hand #32, and may further include related modules for data processing and management classification procedures. The robot arm 32 can be moved along the suspension bracket (X axial movement). The suspension bracket 31 can also be moved (Y axial movement), while the robot arm 32 of the processor 30 can be grasped one or more times. The memory module 100 performs z-axis movement. In addition, the foregoing test equipment 50 and a pre-test storage area 51, 1 may further include a pre-test temporary storage area, a post-test rough classification area 55, and a test 6 M403726 post-test sub-classification area 56. The processor pre-test area 5〇 is taken out and the memory module (10) is removed from the ΆM y to the first field 1j socket 20. The processor 30 separates the memory modules (10) of the memory modules according to the test scores - ^ ^ ^ U, such as normal or abnormal, respectively. 1 After the test, it can be stored in the fine classification area 56 after the test. It is worth noting that 'can provide. The memory module (10) from the test ^2 processor (not shown) to move this F, Λ, from the profitable storage area 51 to the pre-test temporary storage Γ 1, two tests The rear coarse classification area 55 is moved to the post-test sub-classification area. The above-described actions can also be performed by the processor 30. In addition, each of the first motherboard components 2 can further include a second main plug and a display sub-socket 仏-connecting line 25, a cooling fan 29 Α and . The second main socket 23 is disposed on the main board 21, and the upper board 21 is used. The second sub-outlet 27 is provided for the interposer board 24. And inserting it into a memory module 100 for testing, and the second sub-outlet 27 and the adapter board 24 are electrically connected. The fan 29 is disposed on the central processing unit 28 i. Display card outline setting: Main board: on board 21. The user can connect a display screen (not shown) to 29B to allow the tester to observe the test conditions and results. However, the card is not a necessary component because all test process data can be monitored and processed by the processor 30. Figure 4 shows a partial schematic view of the first embodiment of the present invention. As shown in FIG. 4, the test device is similar to the first-mother device. The test device further includes a plurality of first motherboard components 60, which are disposed in the cabinet assembly 1 and stacked with M403726. The structure and function of the first motherboards 60 on the first motherboard assembly 20 are the same as the structure and function of the squad-the motherboard assembly 20. In this embodiment, the processor 3 is operable between: the board assembly 60 and the first board components 2〇, and the etc., the memory module 100 is inserted down to the first _ The main board q can be inserted into the second main board assembly 6 in the upper and lower boards as long as the robot arm 32 can be rewound around the suspension bracket 31. It is worth noting that for the upper box assembly 1 and the processor 30 inserts the memory I·and H) 0 into the first sub-socket 26 for testing the vertical direction DV, the memory module The direction of gravity just received (10) (4) In the case of the box assembly 10 located below, the processor 3〇 inserts the memory module! 〇〇 into the first-sub-socket 26 for testing in the wrong direction DV, system and memory The phantom, the group just received the direction of gravity reversed. The upper tank assembly 10 and the lower tank assembly 1G may be present alone or together. Figure 5 shows a partial schematic view of a vertical test apparatus in accordance with a third embodiment of the present invention. As shown in FIG. 5, this embodiment is similar to the first embodiment, except that the box assembly 10 and the additional box assembly 10 are attached to the machine α 80 _, and the box assembly 1 and the like are attached. The box member 10· can be withdrawn from the machine 80 for maintenance. Figures 6 and 7 show partial schematic views of a vertical test apparatus in accordance with a third embodiment of the present invention. The housing assembly 丨0 of the test apparatus of the present embodiment includes a base 12, an upper cover 14, and a temperature control module 16. The first motherboard assembly 2 is affixed to the base 12. The upper deck 14 can be moved to cover the base 12 and the first motherboard components 2〇. The temperature control module 16 is disposed in the space 18 formed by the upper cover 14 and the base 12 to control the temperature of the space 18. In the example, the temperature control module 16 includes a heater 17. In another example, the warming mold set can include a gas supply device for providing gas to the space: to control the temperature. After the processor 30 is inserted into the memory module 1 , the processor 30 is removed, and then the hydraulic cylinder 9 on the hydraulic suspension bracket % pushes the upper cover 14 downward to close the base 12 Some specific temperature tests can be performed according to the needs of the customer. Figure 8 shows the connection relationship between the processor, the power supply, and the motherboard in accordance with the present invention. As shown in FIG. 8, the test apparatus of the present invention may further include a power supply 40 electrically connected to the processor 3, and a processing electromechanical connection to the motherboard 21, the processor 30 immersing the memory module into the The first sub-outlet 26 is electrically connected to the power supply unit 4 and the motherboard 21 for testing, and after the test is completed, the power supply and the board 21 are disconnected to remove the motherboard 21. Therefore, all test procedures can be performed or monitored by the processor 30, and the tester's demand is reduced. The test process is described in detail below. First, the processor 3 is tested from before. The sub-area 50 grabs the memory module 1 and inserts it into the first sub-socket ^ and / or the second sub-socket 27 t ' and then energizes the main board 21 (power on), and reads whether the signal of the second board 21 is normal. If an abnormality is found, the motherboard is powered off (powered off), and a new memory module is replaced. If the signal of the board 21 is normal, the above procedure is repeated to continue to insert the memory module 100 into the other motherboard 21 in the cabinet. The time of the host machine test is usually very long, such as 15 sec to 3 sec 3, so the processor 30 can continue to use other host modules 9 M403726 10 host 21 纟 to perform other memory module 100 # test, Again repeat the above steps. After all the additional box groups #10 are full of the memory module (10), it is judged whether the test time has arrived, otherwise, the process continues to wait, and if so, the signals of the motherboards 21 are read to judge: the memory model group 1G0 Whether the test result is normal, and according to the test result, the memory module 1GG is pulled out and sent to the rough classification 1 55 after the test. Alternatively, the memory module 100 can be transported from the post-test coarse classification area 55 to the post-test sub-classification area 56 via another processor.
圖9顯示依據本新型第四實施例之第一主機板組件 之不意圖。如圖9所示，本實施例之第一主機板組件2〇, 係類似於第一實施例，不同之處在於第一主機板組件2〇i 更包含一第二主插座23、一第二轉接板24A及一第二副 插座27。第二主插座23設置於主機板21上，並電連接 至主機板21。第二轉接板24A電連接至第二主插座23 , 並實質上垂直於主機板21。第二副插座27設置於第二 轉接板24A上’用以接收***之其中一個記憶體模組1 〇〇 以供測試用。第二副插座27及第一副插座26位於同一 水平面上。如此可以使處理機30的定位更加方便。第二 轉接板24A可以具有如圖所示的舉升結構，也就是由一 第一水平延伸板24A1、一第二水平延伸板24 A3及一垂 直延伸板24A2所構成，垂直延伸板24A2連接第一水平 延伸板24A1及第二水平延伸板24A3，而第二副插座27 係設置於第二水平延伸板24 A3。值得注意的是，第一水 平延伸板24A卜第二水平延伸板24A3及垂直延伸板24A2 可以分開形成或一體形成。此外，這種第一主機板組件 M403726Figure 9 shows a schematic view of a first motherboard assembly in accordance with a fourth embodiment of the present invention. As shown in FIG. 9, the first motherboard component 2 of the embodiment is similar to the first embodiment, except that the first motherboard component 2〇i further includes a second main socket 23 and a second. The adapter plate 24A and a second sub-outlet 27 are provided. The second main socket 23 is disposed on the main board 21 and electrically connected to the main board 21. The second riser board 24A is electrically connected to the second main jack 23 and is substantially perpendicular to the main board 21. The second sub-socket 27 is disposed on the second interposer 24A for receiving one of the inserted memory modules 1 测试 for testing. The second sub-outlet 27 and the first sub-socket 26 are located on the same level. This makes the positioning of the processor 30 more convenient. The second adapter plate 24A may have a lifting structure as shown, that is, a first horizontal extension plate 24A1, a second horizontal extension plate 24 A3 and a vertical extension plate 24A2, and the vertical extension plate 24A2 is connected. The first horizontal extension plate 24A1 and the second horizontal extension plate 24A3 are disposed on the second horizontal extension plate 24 A3. It is to be noted that the first horizontal extension plate 24A and the second horizontal extension plate 24A3 and the vertically extending plate 24A2 may be formed separately or integrally. In addition, this first motherboard component M403726
巧所有實施例中以供測試用。 立式測試設備，由於轉接板24的作用， 以將記憶體模組1 00沿著垂直方向插至 二副插座27中，而轉接板24的水平延 、仅、所以直立式主機板21之間的間距可以有效 縮小。因此，可以在有限的空間下創造出更多的測試產 能’並有效降低測試成本。 在較佳實施例之詳細說明中所提出之具體實施例僅 用以方便說明本新型之技術内容，而非將本新型狹義地 限制於上述實施例’在不超出本新型之精神及以下申請 專利範圍之情況，所做之種種變化實施，皆屬於本新型 之範圍。 ^uj/26 【圖式簡單說明】 圖1顯示依據本新型第—杏 之整體示意圖。 $ _施例之直立式剛試設備 顯示圖1之直立式測試設備之局部示意圖。 圖3顯示之之直立式帝丨4 < a 且立式測试設備之局部立體示音 圖4顯示依據本新型 ^圖。 之局部示意圖。心第…例之直立式測試設備 圖5顯示依據本新型All of the examples are for testing. The vertical test equipment, because of the action of the adapter plate 24, inserts the memory module 100 into the second sub-outlet 27 in the vertical direction, and the horizontal extension of the interposer 24, only the upright main board 21 The spacing between them can be effectively reduced. As a result, more test productivity can be created in a limited space' and the cost of testing can be effectively reduced. The specific embodiments set forth in the detailed description of the preferred embodiments are merely used to illustrate the technical content of the present invention, and are not intended to limit the present invention narrowly to the above-described embodiments' without departing from the spirit of the present invention and the following claims. The scope of the scope and the implementation of various changes are within the scope of this new model. ^uj/26 [Simple description of the drawing] Fig. 1 shows an overall schematic view of the first type of apricot according to the present invention. $ _ Example of vertical test equipment showing a partial schematic diagram of the vertical test equipment of Figure 1. Figure 3 shows the upright emperor 4 < a and the partial stereo sound of the vertical test equipment. Figure 4 shows a diagram according to the present invention. Partial schematic diagram. The vertical test equipment of the heart... Figure 5 shows the new type according to the present invention.
之局部示意圖。 帛-實施例之直立式測試設備 圖6與7顯示依據本新型第 設備之局部示意圖。 圖8顯示依據本新型之處理 板之連接關係。 二實施例之直立式測 機、電源供應器及主 試 機 圖9Partial schematic diagram.直-Inverted test equipment of the embodiment Figures 6 and 7 show a partial schematic view of the apparatus according to the present invention. Figure 8 shows the connection relationship of the processing boards according to the present invention. The vertical type measuring machine, the power supply and the main test machine of the second embodiment are shown in Fig. 9.
顯示依據本新型第四奋& ,, ^ 之不意圖。 【主要元件符號說明】 DV :鉛直方向 1 〇 :箱體組件 12 :底座 1 6 :溫控模組 1 8 :空間 21 :主機板 23 :第二主插座 24A :第二轉接板 2 6 .第一副插座 弟四員施例之第-主機板組不 12 1 :測試設備 1()、附加箱體組件 14 :上蓋 17 :加熱器 ' 2〇| :第一主機板組件 22 :第一主插座 24 :轉接板 25 :連接線 27 :第二副插座 M403726Shows the intent of the fourth Fen & , , ^ according to this new type. [Main component symbol description] DV: Vertical direction 1 〇: Box assembly 12: Base 1 6: Temperature control module 18: Space 21: Motherboard 23: Second main socket 24A: Second adapter board 2 6 . The first sub-relay four-member embodiment - the main board group is not 12 1 : test equipment 1 (), additional cabinet assembly 14: upper cover 17: heater ' 2 〇 |: first main board assembly 22: first Main socket 24: adapter plate 25: connecting wire 27: second auxiliary socket M403726
28 ： 中央處理器 29A :散熱風扇 29B :顯示卡 30 ： 處理機 31 ： 懸吊支架 32 ： 機器手臂 40 ： 電源供應器 50 ： 測試前暫存區 51 ： 測試前儲存區 55 ： 測試後粗分類區 56 ： 測試後細分類區 60 ： 第二主機板組件 80 ： 機台 90 ： 油壓缸 95 ： 油壓缸懸吊支架 100 :記憶體模組 200 :積體電路 1328 : Central processing unit 29A : cooling fan 29B : display card 30 : processor 31 : suspension bracket 32 : robot arm 40 : power supply 50 : pre - test buffer area 51 : pre - test storage area 55 : rough classification after test Area 56: Sub-classification area after test 60: Second main board assembly 80: Machine 90: Hydraulic cylinder 95: Hydraulic cylinder suspension bracket 100: Memory module 200: Integrated circuit 13