TWM402494U - Led array package structure having si-substrate - Google Patents

Led array package structure having si-substrate

Info

Publication number
TWM402494U
TWM402494U TW099221109U TW99221109U TWM402494U TW M402494 U TWM402494 U TW M402494U TW 099221109 U TW099221109 U TW 099221109U TW 99221109 U TW99221109 U TW 99221109U TW M402494 U TWM402494 U TW M402494U
Authority
TW
Taiwan
Prior art keywords
package structure
array package
substrate
led array
light emitting
Prior art date
Application number
TW099221109U
Other languages
Chinese (zh)
Inventor
Hung-Yi Lin
Hong-Da Chang
Original Assignee
Touch Micro-System Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Touch Micro-System Tech Corp filed Critical Touch Micro-System Tech Corp
Priority to TW099221109U priority Critical patent/TWM402494U/en
Publication of TWM402494U publication Critical patent/TWM402494U/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Led Device Packages (AREA)

Abstract

A light emitting diode array package structure having silicon substrate. The light emitting diode array package structure comprises a silicon substrate having a plurality of concave cups thereon, a reflective layer disposed on the silicon substrate, a transparent insulation layer disposed on the reflective layer, a conductive layer disposed on the transparent insulation layer and a plurality of light emitting diodes disposed individually on the conductive layer in each concave cups.
TW099221109U 2007-02-08 2007-02-08 Led array package structure having si-substrate TWM402494U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW099221109U TWM402494U (en) 2007-02-08 2007-02-08 Led array package structure having si-substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW099221109U TWM402494U (en) 2007-02-08 2007-02-08 Led array package structure having si-substrate

Publications (1)

Publication Number Publication Date
TWM402494U true TWM402494U (en) 2011-04-21

Family

ID=60592981

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099221109U TWM402494U (en) 2007-02-08 2007-02-08 Led array package structure having si-substrate

Country Status (1)

Country Link
TW (1) TWM402494U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9281451B2 (en) 2012-02-17 2016-03-08 Industrial Technology Research Institute Light emitting element and fabricating method thereof
CN110447101A (en) * 2017-03-21 2019-11-12 昕诺飞控股有限公司 Luminescence component, spotlight and lamps and lanterns

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9281451B2 (en) 2012-02-17 2016-03-08 Industrial Technology Research Institute Light emitting element and fabricating method thereof
TWI631697B (en) * 2012-02-17 2018-08-01 財團法人工業技術研究院 Light emitting element and fabricating method thereof
CN110447101A (en) * 2017-03-21 2019-11-12 昕诺飞控股有限公司 Luminescence component, spotlight and lamps and lanterns

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Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees