TWM401870U - Heat-dissipating semiconductor package - Google Patents

Heat-dissipating semiconductor package

Info

Publication number
TWM401870U
TWM401870U TW099220400U TW99220400U TWM401870U TW M401870 U TWM401870 U TW M401870U TW 099220400 U TW099220400 U TW 099220400U TW 99220400 U TW99220400 U TW 99220400U TW M401870 U TWM401870 U TW M401870U
Authority
TW
Taiwan
Prior art keywords
heat
semiconductor package
dissipating semiconductor
dissipating
package
Prior art date
Application number
TW099220400U
Other languages
Chinese (zh)
Inventor
Hung-Hsin Hsu
Chang-Chih Lin
Yi-Chia Chen
Original Assignee
Powertech Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Powertech Technology Inc filed Critical Powertech Technology Inc
Priority to TW099220400U priority Critical patent/TWM401870U/en
Publication of TWM401870U publication Critical patent/TWM401870U/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
TW099220400U 2010-10-21 2010-10-21 Heat-dissipating semiconductor package TWM401870U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW099220400U TWM401870U (en) 2010-10-21 2010-10-21 Heat-dissipating semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW099220400U TWM401870U (en) 2010-10-21 2010-10-21 Heat-dissipating semiconductor package

Publications (1)

Publication Number Publication Date
TWM401870U true TWM401870U (en) 2011-04-11

Family

ID=60592618

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099220400U TWM401870U (en) 2010-10-21 2010-10-21 Heat-dissipating semiconductor package

Country Status (1)

Country Link
TW (1) TWM401870U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI488029B (en) * 2012-06-15 2015-06-11 Uunup Technology Co Ltd Non-symmetric heat sink
US9565793B2 (en) 2012-10-31 2017-02-07 Industrial Technology Research Institute Environmental sensitive electronic device package

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI488029B (en) * 2012-06-15 2015-06-11 Uunup Technology Co Ltd Non-symmetric heat sink
US9565793B2 (en) 2012-10-31 2017-02-07 Industrial Technology Research Institute Environmental sensitive electronic device package

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Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees