M39395.3 五、新型說明： ' 【新型所屬之技術領域】 結構之軟 本創作係有關於—種軟性雷 θ + 性電路板。 人14電路板，尤指具有散熱 【先前技術】 印刷電路板（Printed circuit board) « 產品不可或缺的主要 疋現今電子 做出電路的線路及圖面，因而被稱為印刷電路J vt 子產品不斷微小化跟精細化，目前大多數n电 用貼附姓刻阻劑，經過曝光顯影後，再都是採 路板。 丹以蝕刻做出印刷電 傳：印刷電路板的軟性電路板係 =一!熱層以提升散熱效率。又或者在軟性電 =數個m使基板直接與外界接觸以 然而利用上述方式達成的散熱效果仍舊有限。政'、，、Α果 本案創作人有鐘於上述習用的結構装置於實際施用時的 缺失，且積累個人從事相業·實務上多年之經驗，精心 =究，終於提出-種設計合理且#效改善上述問題之結構。 【新型内容】 ^創作之主要目的：在於利用散熱材料本身之傳熱能力， 以提高具有散熱結構之軟性電路板的散熱效率。 為了達成上述之目的：本創作係提供一種具 熱結構之 軟性電路板’其包含：—基板，其為—呂绪； Z設於該 基板之上表面的導熱層；一設於該導熱層之上表面的導體層以 及數個由S亥導體層之表面向下延伸到該基板的孔位，其中，每 3/9 一該些孔位中填有一散熱材料，哕 本創作具有以下的效果^放…、材科係接觸於該基板。 熱材料，料散熱_切傳1 =生賴量可傳導至該散 本創作的具體職可提升二力以提高散熱效率，根據 為使能更進-步瞭解▲熟w個百分點的散熱效率。 下有關本創作之詳細說明與附圖，技術内容’請參閱以 說明用，並_來對本創作加以限^者。_式僅提供參考與 [實施方式】 =-_示’ f知技術之軟㈣路板h 基板10…設於該基板10 ^ 及〆設於該導熱層! ] a々“主 ㈣们导热厚1 1 a以 立山μ也Γ 1之上表面的導體層12a。該基拓1 0 a產生係藉由該導熱層1 1 a導熱。 & 所\本創作揭露—種具有散熱結構之軟性電路 1 η ϊ I二板1〇 ; 一設於該基板1 0之上表面的導 熱W，°又於該導熱層1 1之上表面的導體層12以及數 個由：：2之表面向下延伸到該基板1 0的孔位i 3 if4#二^些孔位13中填有—散熱材料1 4 ’該散熱材 料1 \ f觸於該基板1〇。其中’該基板1〇產生的熱量可 傳，至為政熱材料工4 ,藉由散熱材料工4本身之傳熱能力以 权的政’、、、效率，根據本創作的具體測試可提升二十至五十個百 分點的散熱效率。 本創作具有多種實施態樣，在第一種實施態樣中，該基板 1 0為一層狀結構，其可為-銅箱或㈣，該導熱層1 1係固 設於β基板1Q的上表面，例如’可利用黏著方法貼附於該基 板10^上表面’該導熱層1 1同樣為一層狀結構，而該導熱 層1 1可為散熱片’例如：聚亞醯胺（ΡΙ)或熱可塑性聚亞 4/9 M393953 ， 酿胺（Tf1)等，該導熱層1 1經由化學方法改變内部性質， 以使層1 1具妹南的黏著性’進而提供該具有散熱結 構之軟十電路板i較佳的機械強度；該導體層工2係固設於該 導熱層1 1的上表面，例如，可利用黏著方法貼附於該導熱層 1 1白=表面，該導體層]_ 2可為—銅件，其用以作為電子裝 置訊號傳輪的媒介。 另外，本創作更可利用模具將該具有散熱結構之軟性電路 板=裁切’使該基板10的左側面、該導熱層1 1的左側 =1 2社側面_—垂直面上；該基板1 0的右 貝_+古"V熱層1 1的右側面和該導體層1 2的右側面位於另 产Γι而Γ上’換s之’該基板1 ◦的左側面、該導熱層1 1的 Γ二T體層12的左側面相互切齊;該基板1 〇的右側 目;I層11的右側面和該導體層12的右側面相互切齊 ° ，職妓熱結構之軟性魏板1形成—左右切齊 之多層狀電路板結構。 每一該些孔位13係由該導體層12向下延伸 至該基板1 0，例如每—該些孔位1 3可垂 邛。每基f 1 〇的上表面，或延伸至該基板1 0的内 旨或其他高傳熱效率的材料，換言之，該 材料1 板1㈣上表面接咖進行散熱，該散私 f2 更可接觸於該導熱層11和該導體層1 Μ 熱效果’例如：該散熱材料！ 4可填滿每—該些孔 3或邊政熱材料丄4由該基板丄〇 — 1 該導熱層11和該導體層12的側壁。、*上方延伸覆盘 每—該些孔位13可利用多種製程製作，例如：上述 5/9 M393953 之孔位1 3可利用卷料 0〇 ^ , TMr 對卷連續水平式UV雷射鑽孔方式或 單張非連續式UV雷射你^ 二 , 祖灿 ...τ十讚孔方式成型’具體的製程如下：首 先，提供一軟性電路杈.+ _ 板，產生一 UV雷射光束，將該UV雷 射光束導引至该軟性電败 、…，、Wh 电路板上，使該軟性電路板之預設區 域化以形成本創作之^· ,/ ί q β艾母—該些孔位1 3，其中每一該些 孔位1 3由邊導體層1 0 + ^ ^ ^ ^ 2之表面向下延伸到該軟性電路板之 基板1 0 ’並使母一訪, * ^^ ^ ^ α Α >孔位1 3的底面位於該基板的上 表面或位於該基板1 η ^ 丄υ的内部。 上U ηϋ纟t構之軟性 利用機械鑽孔方式成甩 # ^ i ’具體的製程如下：首先，提供一 軟性電路板，接下來u re播;^丨u拟士士△ 切削刀具在該軟性電路板之預設 區域鑽孔以形成本創作— u 1 Q ^ ^ 之母—該些孔位1 3，其中每一該 些孔位1 3由该導體層Ί ^ . η Λ 、, Μ 丄2之表面向下延伸到該軟性電路板 之基板1 0，亚使每〜分1 ,^ ^ -V* ^ 二孔位1 3的底面位於該基板1 〇的上表面或位於該某 取板1 0的内部。 具體=呈3之ΪJ材料1 4則可利用電鍍方式成型， 軟性電路板；提供1,提供—具有每—該些孔位1 3的 -絕緣層而裸露出I」；接下來在該軟性電路板上設置 連接於電源之陰極；该些孔位13，並將該軟性電路板 該些孔位1 3中形成電鍍金屬，例如：銅等，沉積在每一 程，以形成本創作/目1熱材料1 4，經由上述電鍵金屬之製 η卜之具有散熱結構之軟性電路板1。 本⑷2亦可結合具有散熱效果之材料使其更具有散熱之 =果’在第三_示之第二種實施態樣_，該具有散熱結構之 車電板1 更包括一第一導熱膠廣1 5，該第一導熱膠層 1 5係為一層狀結構，該第一導熱膠層1 5設置於該導熱層工 M393953 1與該基板10之間，其中，每一該些孔位1 3係由該導體層 1 2向下延伸貫穿該導熱層1 1和該第一導熱膠層1 5 ’並延 伸至該基板1〇，例如每一該些孔位1 3吁垂直向下延伸至該 ， 基板10的上表面，或延伸至該基板1〇的内部。 ‘ 如第四圖所示，在第三種實施態樣中，該具有散熱結構之 軟性電路板1"更包括一第一導熱膠層15與一第二導熱膠層 1 6，該第一導熱膠層1 5設置於該導熱層1 1與該基板10 之間’該第二導熱膠層16設置於該導熱層11與該導體層1 # 2之間’其中’每一該些孔位1 3係由該導體層12向下延伸 貫穿該第二導熱膠層1 6、該導熱層1 1和該第一導熱膠層1 5 ’並延伸至該基板1〇，例如每一該些孔位玉3可垂直向下 k伸至该基板1〇的上表面，或延伸至該基板1〇的内部。 综上所述，本創作之優點··由於該散熱材料丄4接觸該基 板10，該基板1〇產生的熱量傳導至每一該些散熱材料14 辜曰由政熱材料14本身之傳熱能力，以提高散熱效率，根據 本創作的具體贼可提升二十至五十㈣分點的散熱效率。 鲁作上所述僅為本創作之較佳可行實施例，非因此侷·限本創 利範圍，故舉凡運用本創作說明書及圖示内所為之等效 支術交化，均包含於本創作之範圍内。 【圖式簡單說明】 ^ 一圖係為習知技術之示意圖 例的 =圖為本創作之具有散熱結構之軟性電路板之第一實施 創作之具有散熱結構之軟性電路板之第二實施 7/9 M393953 第四圖係為本創作之具有散熱結構之軟性電路板之第三實施 例的示意圖。 【主要元件符號說明】 la 軟性電路板 1 0 a 基板 11a 導熱層 12a 導體層 1、1/、1〃 具有散熱結構之軟性電路板 10 基板 11 導熱層 12 導體層 1 3 孔位M39395.3 V. New description: ' 【New technology field】 Soft structure This creation department has a kind of soft thunder θ + circuit board. People's 14 circuit boards, especially with heat dissipation [Prior Art] Printed circuit board « The indispensable part of the product is the circuit and the drawing of the circuit made by today's electronics. It is called the printed circuit J vt sub-product. Constantly miniaturization and refinement, most of the current n-electric stickers are attached with a resistive agent, and after exposure and development, they are all mining boards. Dan made a printed telegraphy with etching: the flexible circuit board of the printed circuit board = one! The thermal layer to improve the heat dissipation efficiency. Or, in soft electric = several m, the substrate is directly in contact with the outside, but the heat dissipation effect achieved by the above method is still limited. The creators of the case, the creators of this case have the lack of the above-mentioned structural devices used in the actual application, and accumulated the experience of individuals engaged in the industry and practice for many years, carefully = research, finally proposed - a reasonable design and # Effectively improve the structure of the above problems. [New content] ^ The main purpose of the creation is to use the heat transfer capability of the heat dissipation material itself to improve the heat dissipation efficiency of the flexible circuit board with the heat dissipation structure. In order to achieve the above object, the present invention provides a flexible circuit board having a thermal structure, which comprises: a substrate, which is a Lu Xun; a heat conducting layer disposed on the upper surface of the substrate; and a heat conducting layer disposed on the substrate a conductor layer on the upper surface and a plurality of holes extending from the surface of the S-conductor layer to the hole of the substrate, wherein each of the holes is filled with a heat dissipating material, and the creation has the following effects^ The substrate is in contact with the substrate. Thermal material, heat dissipation _ cut pass 1 = the amount of raw can be transmitted to the dispersion. The specific job of this creation can improve the heat to improve the heat dissipation efficiency, according to the ability to enable more step-by-step understanding of ▲ cooked w percentage points of heat dissipation efficiency. For a detailed description of the creation and the drawings, the technical content 'please refer to the description, and _ to limit the creation of this creation. _ type only provides reference and [embodiment] =-_ shows 'f know the soft technology (four) way board h substrate 10... is set on the substrate 10 ^ and is placed on the heat conduction layer!] a 々 "main (four) heat conduction thick 1 1 a is a conductor layer 12a on the upper surface of the mountain. The base 10 a is generated by the heat conduction layer 11 a. The invention discloses a flexible circuit having a heat dissipation structure. 1 η ϊ I two plates 1 〇; a heat conduction W disposed on the upper surface of the substrate 10, and a conductor layer 12 on the upper surface of the heat conductive layer 1 and a plurality of surfaces extending from ::2 The hole position i 3 if4# of the substrate 10 is filled with a heat dissipating material 1 4 'the heat dissipating material 1 \ f touches the substrate 1 〇. The heat generated by the substrate 1 可According to the heat transfer capability of the heat-dissipating material worker 4, the heat transfer capability of the heat-dissipating material worker 4 can increase the heat-dissipating efficiency by 20 to 50 percent according to the specific test of the creation. There are various implementations in the creation. In the first embodiment, the substrate 10 is a layered structure, which may be a copper box or a (four), and the heat conducting layer 1 1 is solid. The heat conducting layer 11 is also a layered structure, and the heat conducting layer 11 can be a heat sink. For example: Polyimide (ΡΙ) or thermoplastic poly 4/9 M393953, Tf1, etc., the thermal conductive layer 1 chemically changes the internal properties, so that the layer 1 1 has the adhesiveness of the sister' The soft ten circuit board i having a heat dissipating structure has better mechanical strength; the conductor layer 2 is fixed on the upper surface of the heat conducting layer 11 , for example, can be attached to the heat conducting layer by an adhesive method 1 1 white = The surface layer, the conductor layer _ 2 can be a copper piece, which is used as a medium for the signal transmission wheel of the electronic device. In addition, the present invention can further use the mold to cut the flexible circuit board with the heat dissipation structure to the substrate. The left side of 10, the left side of the heat conducting layer 1 1 = 2 side side _ - vertical plane; the right side of the right side of the substrate 10 _ + ancient " V thermal layer 1 1 and the conductor layer 12 The right side is located on the left side of the substrate 1 ◦ on the other side, and the second side of the heat conductive layer 1 1 The left side of the substrate 12 is aligned with each other; the right side of the substrate 1 is ;; the right side of the I layer 11 and the right side of the conductor layer 12 are aligned with each other, and the soft slab 1 of the thermal structure of the job is formed - the right and left are aligned Multi-layered circuit board structure. Each of these hole positions 13 extends downward from the conductor layer 12 to the substrate 10, for example, each of the hole positions 13 can be cottered. The upper surface of each of the bases f 1 〇 Or extending to the substrate 10 or other high heat transfer efficiency material, in other words, the upper surface of the material 1 (1) of the material 1 is connected to the coffee for heat dissipation, and the transparent f2 is more in contact with the heat conductive layer 11 and the conductor layer. 1 Μ Thermal effect 'Example: The heat sink material! 4 can fill each of the holes 3 or the side of the thermal material 丄 4 from the substrate 丄〇 1 the thermally conductive layer 11 and the side walls of the conductor layer 12. , *The upper extension of the plate - each of the holes 13 can be made by a variety of processes, for example: the above 5 / 9 M393953 hole position 1 3 can be used to roll continuous horizontal UV laser drilling Way or a single non-continuous UV laser you ^ two, Zucan ... τ ten praise hole form molding 'specific process is as follows: First, provide a soft circuit 杈. + _ board, produce a UV laser beam, Directing the UV laser beam onto the soft electrical circuit, ..., Wh circuit board, and pre-regionalizing the flexible circuit board to form the original ^· , / ί q β Aimu - the holes Bits 1 3, wherein each of the holes 13 extends downward from the surface of the edge conductor layer 1 0 + ^ ^ ^ ^ 2 to the substrate 1 0 ' of the flexible circuit board and enables the mother to access, * ^^ ^ ^ α Α > The bottom surface of the hole 13 is located on the upper surface of the substrate or inside the substrate 1 η ^ 。. The softness of the upper U ηϋ纟t structure is made by mechanical drilling. # ^ i ' The specific process is as follows: First, provide a flexible circuit board, then u re broadcast; ^ 丨 u 士士士 △ cutting tool in the soft The predetermined area of the circuit board is drilled to form the present creation—the mother of u 1 Q ^ ^—the holes 1 3 , wherein each of the holes 13 is composed of the conductor layer . ^ . η 、 , , Μ 丄The surface of 2 extends downward to the substrate 10 of the flexible circuit board, and the subsurface is every 1 minute, ^ ^ - V* ^ The bottom surface of the two holes 13 is located on the upper surface of the substrate 1 or at the certain board. 1 0 internal. Specifically = 3 Ϊ J material 1 4 can be formed by electroplating, a flexible circuit board; provide 1, provide - with each of the holes 13 - insulating layer exposed N"; next in the flexible circuit The board is provided with a cathode connected to the power source; the holes 13 are formed, and the holes of the flexible circuit board are formed in the holes 13 to form a plating metal, such as copper, etc., which are deposited in each process to form the creation/mesh 1 The thermal material 14 is a flexible circuit board 1 having a heat dissipation structure via the above-described electric key metal. The (4) 2 can also be combined with a material having a heat dissipating effect to make it more heat-dissipating. In the third embodiment, the second embodiment has a heat-dissipating structure. The first thermal conductive adhesive layer 15 is a layered structure, and the first thermal conductive adhesive layer 15 is disposed between the thermal conductive layer M393953 1 and the substrate 10, wherein each of the holes 1 3 extends downward from the conductive layer 1 1 and the first thermal conductive layer 15 5 ' and extends to the substrate 1 , for example, each of the holes 13 extends vertically downward to The upper surface of the substrate 10 or the inside of the substrate 1 is extended. As shown in the fourth embodiment, in the third embodiment, the flexible circuit board 1" having a heat dissipation structure further includes a first thermal conductive adhesive layer 15 and a second thermal conductive adhesive layer 16. A glue layer 15 is disposed between the heat conductive layer 11 and the substrate 10. The second heat conductive adhesive layer 16 is disposed between the heat conductive layer 11 and the conductor layer 1 # 2 'where each of the holes 1 3 is extended from the conductor layer 12 through the second thermal adhesive layer 16 , the thermal conductive layer 1 1 and the first thermal adhesive layer 15 5 ' and extends to the substrate 1 , for example, each of the holes The jade 3 may extend vertically downward to the upper surface of the substrate 1 or to the inside of the substrate 1 . In summary, the advantages of the present invention: Since the heat dissipating material 丄4 contacts the substrate 10, the heat generated by the substrate 1〇 is transmitted to each of the heat dissipating materials 14 and the heat transfer capability of the thermal material 14 itself In order to improve the heat dissipation efficiency, according to the specific thief of this creation, the heat dissipation efficiency of 20 to 50 (four) points can be improved. The above description is only a better and feasible embodiment of this creation. It is not limited to the scope of this creation. Therefore, the use of this creation manual and the equivalent of the illustrations in the illustrations are included in this creation. Within the scope. [Simple description of the diagram] ^ A diagram is a schematic example of a conventional technique = a second implementation of a flexible circuit board having a heat dissipation structure created by the first implementation of a flexible circuit board having a heat dissipation structure. 9 M393953 The fourth figure is a schematic diagram of a third embodiment of a flexible circuit board having a heat dissipation structure. [Main component symbol description] la Flexible circuit board 1 0 a Substrate 11a Thermal conductive layer 12a Conductor layer 1, 1/, 1〃 Flexible circuit board with heat dissipation structure 10 Substrate 11 Thermal conductive layer 12 Conductor layer 1 3 Hole position
散熱材料 第一導熱膠層 第二導熱膠層Heat dissipation material, first thermal conductive layer, second thermal adhesive layer