TWM393131U - Improved structure of circuit board cutter - Google Patents

Improved structure of circuit board cutter Download PDF

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Publication number
TWM393131U
TWM393131U TW99205936U TW99205936U TWM393131U TW M393131 U TWM393131 U TW M393131U TW 99205936 U TW99205936 U TW 99205936U TW 99205936 U TW99205936 U TW 99205936U TW M393131 U TWM393131 U TW M393131U
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TW
Taiwan
Prior art keywords
circuit board
cutting
machine
control unit
template
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TW99205936U
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Chinese (zh)
Inventor
Chih-Yung Liu
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Techmech Technologies Corp
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Priority to TW99205936U priority Critical patent/TWM393131U/en
Publication of TWM393131U publication Critical patent/TWM393131U/en

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Description

M393131 五 新型說明: 【新型所屬之技術領域】 本創作係提供-種電路板 於伽懈台到位以進行裁J機之結構改良,尤指可易 不同型式的預設電路板裁切裁二:板娜 ,即可進行各種锻魏_作;雜«平㈣升降路徑 【先前技術】 按在傳統手動製造力σ 長、製造成品效果不佳、成。紐序,因作業時間 t 成°°不良率亦高,則在諸多的不便 與麻煩中,透過加工機具的自 、半自動化的作業流程, 不僅可㈣_業的製造程序、加工步驟、減少人工 ,也可以省時、省工、接古 '、 ^乍率、增加產品的良率而降 2=二 加工製造業之加工過程,大都改以加 .% 加工機具進行製造,必須透過模具的 獅曰提阿加工的品質與速度、加速作業流程的進行,以達 到大里Hie生產的經濟效益。而在各種加工製造的作業令 ,關於^_❿製造,較透式題賴具以各種 尺寸的4 ’進仃多種尺寸、形狀、規格等不同限制的條件 進行加工作業’其中如電路板的裁切加工製造,因適用範圍 不同配5的機型、礙牌等,會有大小不-、長寬不等、構 心不同等史化’則為了配合各種電路板尺寸不同,必須設置 多種切割刀具來因應加工作業的使用需求,則切割電路板用 3 之機具在進行切割作業前,必須配合不_式的電路板而更 換切割刀具、調整工作平台的升降路徑,並改難測工作平 台侧的路徑位置,以進行加工_作業,在實際使用時, 仍存在諸多的缺失與不便,如: (1 )切割機具的工作平台承載不關式的電路板時,亦必 須更換不同的切割刀具、調整工作平台的上、下升降 之储,並調整偵測工作平台升降的偵測器,而使工 作平台供切割刀具對位進行電路板切割,但因偵測器 的調正易產生5吳差、或造成债測誤失的情況,導致切 割電路板時發生切割錯誤的現象,且切割作業的不良 率提升,影響工作效率。 (2 )切賴具之_刀具係配合裁切電路板之型式,而調 正更換切割刀具的大、小尺寸,則切割刀具往下切割 工作平台上的電路板時,下降的距離也會不同,必須 配合工作平台的路徑、電路板的尺寸等進行調整,造 成事前的準備作業繁瑣、不便之困擾。 疋以,如何解決目前電路板切割機在切割作業中必須調 整偵測器對位工作平台之問題,且配合各種型式電路板而更 、°】刀具,並重新檢測對位、造成事先準備工作須瑣等缺 失,即為從事此行業之相關廠商所亟欲研究改善之方向所在 者。 【新型内容】 M3931.31 故’創作人有鑑於上述之問題與缺失,乃搜集相關資料 ,經由多方評估及考量,並以從事於此行㈣積之多年經驗 ,經由不斷f猶及修改,始設計出此種可自_整切割機台 對位,方便快速進行電路板裁切之電路板切割機之結構改良 的創設專利誕生者。 本創作之主要目的乃在於該切割機之機台利用基座供作 業平台滑行位移 側之加I區設有鶴單元帶動壓板升降 位移’健板底部切割模具對位作業平台並進行切割預設電 路板,且機台外_裝設控解元,職由奴儀表預設之 工作屋力值’再以罐絲細_聽下轉之勤值,而 透過控制雜純動料連動顧娜,進行作業平台上預 又電路板之蝴加工’舰合不簡設電路板蝴並更換塵 板及切割模組時’達到不需調整感測器的位置,即可偵測作 業平台上、下升降的路徑’即可順利進行預設電路板切割作 業之目的。 本創作之次要目的乃在於該切割模組係具有相對之上模 板下拉板’並於上模板設有切割刀具組、下模板則設有承 載座且上換板、下模板的周邊角落即分設有定位部,各定 位部係於上模板_邊,分顺树蚊鱗,而各定部並 於下模板的周邊,分別設有複數定位槽。 【實施方式】 為達成上述目的及功效,本創作所採用之技術手段及其 5 構造,茲繪圖就本創作之較佳實施例烊加說明其特徵與功能 如下’俾利完全瞭解。 請參閱第一、二、三圖所示,係為本創作之立體外觀圖 、立體分解圖、加工前側視圖,由圖中所示可以清楚看出, 本創作電路板切割機之結構,係包括機台1、切割模具2、 控制單元3,其中: 該機台1係設有基座1 1,並於基座1 1表面二側分別 設有滑軌1 1 1,二側滑軌1 1 1間則設有推移單元1 i 2 ,以利用基座1 2之各滑軌i2,供作業平台丄2底部二 側所設之執槽121,相對滑動嵌合,且透過推移單元工工 2固設於作業平台12底部,即可透過推移單元112驅動 作業平台12於基座1 1上活動滑移,而基座11的一側係 設有加工區13 ’則於加工區13的基座1 1周邊,設有複 數立柱131 ’且各立柱131脑動套設有壓板13 2, 並於壓板13 2—側設有驅動單元13 3,並將驅動單元i 3 3固設於機台1上。 該切割模具2係設有相對之上模板21、下模板2 2, 而上核板21底部為設有切割刀具組2 i丄,且相對切割刀 具組211於下模板22上則設有承載座221,並於上模 板21下模板2 2的各周邊角落,分別設有定位部2 3, 則各定位部2 3係於上模板21周邊,分別設有複數定位桿 才對各久位桿2 31於下模板2 2的周邊,分別設 常調整感·的位置,可以減少_誤差的程度。 且控制早70 3之設定儀表3 1、測壓儀表3 2,係可為 β•力十或電子式儀表,而控制部3 3,即可為供氣筒、液遷 筒或馬達等’各_之動力機具。 β、以上所述僅為本創作之較佳實施例而已,非因此 侷限本創叙翻顧,本_電路㈣賴之結構,係藉 峨。1上裝⑨控制單元3,並透過聰儀表3 2感測加工 區13中,驅動單元13 3帶動壓板13 2向下位移之壓力 值而與叹疋儀表31所預設之壓力值做比對,以確認基座 的作業平。12移送預設電路板4至定位,即可供壓板 13 2底部切割模具2之上模板2 χ,以所設切割刀具組2 11進行預設電路板4的切割,俾可達到不必調整感測器的 位置’即可侧作業平台:2的升降、到位,而透過壓力感 測方式自動感測預設電路板4運送之目的,不必調整感測器 進行俄測作業平台12、壓板13 2之升降距離,即可達到 快速進行預設電路板4的切割作業之效用,且配合預設電路 板4的1式不同’更賴板丨3 2與切觀具2之割刀具組 2 1 1 ’亦不必重新調整侧位置,故舉凡可達成前述效果 之-構、裝置皆應受本創作所涵蓋,此種簡易修飾及等效結 構查化均應同理包含於本創作之專利範圍内 ,合予陳明。 上述本創作之f路板蝴機之結構改良於實際使用時, 為可具有下列各項優點,如: M393131 (一)機台1之基座1 1,利用作業平台i 2上切割模具2 之下模板22的承载座221,供承置預設電路板4 ,並配合預設電路板4的型式、尺寸,更換壓板工3 2底部上模板21之切割刀具i i,即可利用控 制單元3之《儀表3 2,感測壓板i 3 2向下婦 之壓力值’而不必調整感测器债測的位置,方便預設 電路板4加工的對位、切割快速進行。 (二)機台i於基座工工上的作業平台玉2、加工區^之 壓板13 2,所固設之切割模具2的下模板2 2、上 杈板21 ’配合預設電路板4的尺寸、型式做更換, 重新組裝、定位後,不必重新調整基座丄工之作業平 台12、壓板13 2升降的行徑、距離、位置,可透 過控制單元3的_儀表3 2感測作業平台! 2、壓 板1 3 2的料行徑,進行職電路板的裁切,事先M393131 Five new descriptions: [New technical field] This creation provides a kind of circuit board to improve the structure of the J machine in the position of the grading machine, especially the preset circuit board that can be easily cut into two types: Ban Na, you can carry out a variety of forging Wei _ made; miscellaneous « flat (four) lifting path [previous technology] According to the traditional manual manufacturing force σ long, the finished product is not effective, into. New order, because the working time t is ° ° ° high rate, in many inconveniences and troubles, through the processing machine's self-semi-automatic operation process, not only (4) _ industry manufacturing procedures, processing steps, reduce labor It can also save time, save labor, pick up the ancient ', 乍 rate, increase the yield of the product and drop 2 = two processing manufacturing process, most of which are modified by adding .% processing tools, must pass the mold lion The quality and speed of the processing, and the acceleration of the operation process, in order to achieve the economic benefits of Dali production. In the various manufacturing and manufacturing operations, regarding the manufacturing of the ^_❿, the transparent type of the tool is processed in various sizes, such as various sizes, shapes, specifications, etc. Processing and manufacturing, due to the different scope of application of the 5 models, stagnation, etc., there will be different sizes, lengths and widths, different structure and other history. In order to match the various circuit board sizes, a variety of cutting tools must be set. In order to meet the needs of the processing operation, the machine for cutting the circuit board must replace the cutting tool with the non-type circuit board, adjust the lifting path of the working platform, and change the path of the working platform side before the cutting operation. Position, for processing_work, in actual use, there are still many defects and inconveniences, such as: (1) When the working platform of the cutting tool carries the circuit board that is not closed, it is also necessary to replace different cutting tools and adjust the work. The upper and lower lifting of the platform is stored, and the detector for detecting the lifting of the working platform is adjusted, and the working platform is used for cutting the cutting tool for the cutting tool. However, due to the correction of the detector, it is easy to cause a difference of 5 or a loss of the debt measurement, which causes a cutting error when cutting the circuit board, and the defective rate of the cutting operation is increased, which affects the work efficiency. (2) The cutting tool is matched with the type of the cutting circuit board, and the large and small size of the cutting tool is adjusted. When the cutting tool cuts the circuit board on the working platform, the falling distance will be different. It must be adjusted in accordance with the path of the working platform, the size of the circuit board, etc., resulting in cumbersome and inconvenient preparation work beforehand. In other words, how to solve the problem that the current circuit board cutting machine must adjust the detector alignment working platform in the cutting operation, and cooperate with various types of circuit boards to further correct the alignment and cause the preparation work in advance. The lack of triviality is the direction that the relevant manufacturers engaged in this industry are eager to study and improve. [New content] M3931.31 Therefore, the creators have collected relevant information in view of the above-mentioned problems and deficiencies, and have been evaluated and considered by many parties, and have been working on this line for many years. The patented birth of the patented circuit board cutting machine that can be easily aligned with the cutting machine is designed. The main purpose of this creation is that the machine of the cutting machine uses the pedestal for the sliding displacement side of the working platform, and the I zone is provided with a crane unit to drive the pressure plate to lift and displace the 'bench bottom cutting die alignment working platform and to cut the preset circuit. The board, and the outside of the machine _ install the control solution element, the job value of the default instrument of the slave instrument is 'there is the value of the tank wire _ listening to the diligent value, and by controlling the hybrid material to drive Gu Na, carry out On the work platform, the circuit board is processed in the same way. When the ship is not equipped with a circuit board and the dust board and the cutting module are replaced, the position of the sensor can be detected without lifting the position of the sensor. The path 'is smooth for the purpose of cutting the preset board. The secondary purpose of the creation is that the cutting module has a relatively lower template lowering plate and a cutting tool set is provided on the upper template, and a lower bearing plate is provided with a bearing seat, and the peripheral corners of the upper and lower templates are divided into points. The positioning part is provided, and each positioning part is attached to the upper template _ side, and the tree arranging is arranged, and each fixed part is respectively provided with a plurality of positioning grooves around the lower template. [Embodiment] In order to achieve the above object and effect, the technical means and the 5 structure of the present invention are described in the preferred embodiment of the present invention as follows. Please refer to the first, second and third figures, which are the three-dimensional appearance drawing, the three-dimensional exploded view and the front view of the processing. It can be clearly seen from the figure that the structure of the circuit board cutting machine of the creation includes The machine 1, the cutting die 2, the control unit 3, wherein: the machine 1 is provided with a base 1 1 and a slide rail 1 1 is respectively disposed on two sides of the surface of the base 1 1 , and two side slide rails 1 1 1 is provided with a shifting unit 1 i 2 for utilizing the slide rails i2 of the base 1 2 for the support slots 121 provided on the two sides of the bottom of the work platform 丄 2, and slidingly fitting and moving through the shifting unit 2 The working platform 12 is fixed to the bottom of the working platform 12, so that the working platform 12 can be driven to slide on the base 11 by the pushing unit 112, and one side of the base 11 is provided with a processing area 13' on the base of the processing area 13. 1 1 , a plurality of columns 131 ′ are arranged, and each column 131 is provided with a pressure plate 13 2 , and a driving unit 13 3 is arranged on the side of the pressure plate 13 2 , and the driving unit i 3 3 is fixed on the machine 1 on. The cutting die 2 is provided with a relatively upper template 21 and a lower die plate 2 2, and the bottom of the upper core plate 21 is provided with a cutting tool set 2 i , and the opposite cutting tool set 211 is provided with a bearing seat on the lower die plate 22 . 221, and each of the peripheral corners of the template 2 2 under the upper template 21 is provided with a positioning portion 23, and each positioning portion 23 is attached to the periphery of the upper template 21, and a plurality of positioning rods are respectively provided for each of the permanent rods 2 31 is provided at the periphery of the lower die plate 2 2 with a position of constant adjustment, and the degree of _ error can be reduced. And control the setting instrument 3 1 of the early 70 3, the pressure measuring instrument 3 2, can be β• force ten or electronic instrument, and the control part 3 3 can be a gas supply cylinder, a liquid moving cylinder or a motor, etc. Power equipment. β, the above description is only a preferred embodiment of the present invention, and thus is not limited to this creation, and the structure of the present circuit is based on the structure. 1 The upper control unit 3 is mounted, and the pressure value of the downward displacement of the pressure plate 13 2 is driven by the driving unit 13 3 through the smart meter 32, and is compared with the pressure value preset by the sigh gauge 31. To confirm that the work of the pedestal is flat. 12 Transfer the preset circuit board 4 to the positioning, that is, the template 2 χ above the mold 2 can be cut at the bottom of the pressing plate 13 2 , and the cutting circuit board 4 is cut by the set cutting tool group 2 11 , so that the adjustment is not necessary. The position of the device can be used for the side work platform: 2 lifting and lowering, and the purpose of the pre-determined circuit board 4 is automatically sensed by the pressure sensing method, and the sensor is not required to be adjusted for the Russian working platform 12 and the pressing plate 13 2 Lifting distance can achieve the effect of quickly cutting the preset circuit board 4, and with the difference of the type 1 of the preset circuit board 4, the cutting tool set 2 1 1 ' It is not necessary to re-adjust the side position, so the structure and device that can achieve the above-mentioned effects should be covered by this creation. Such simple modification and equivalent structure check should be included in the scope of the patent of this creation. To Chen Ming. The structure of the above-mentioned f-plate butterfly machine is improved in practical use, and has the following advantages, such as: M393131 (1) The base 1 of the machine 1 is cut by the working platform i 2 The carrier 221 of the lower template 22 is used to receive the preset circuit board 4, and the cutting tool ii of the template 21 on the bottom of the platen 3 2 is replaced with the type and size of the preset circuit board 4, and the control unit 3 can be utilized. "Instrument 3 2, sensing the pressure value of the pressure plate i 3 2 down the woman" without having to adjust the position of the sensor debt measurement, facilitates the alignment of the predetermined circuit board 4, and the cutting is fast. (2) The working platform of the machine i on the pedestal worker jade 2, the pressing plate 13 of the processing area ^ 2, the lower template 2 of the cutting die 2 fixed 2, the upper sill plate 21' with the preset circuit board 4 After the size and type are replaced, reassembled and positioned, it is not necessary to re-adjust the path, distance and position of the work platform 12 and the press plate 13 which are completed by the base, and the working platform can be transmitted through the control unit 3 ! 2. Pressing the material of the plate 1 3 2 to cut the job board, in advance

的準備工作簡單、快速、省時、省工,亦符合經濟效 益。 故本創作為主要針對電路板切割機之結構的設計,為 利用機台外側設置_元,並配合基座與加工區之壓板所 裝設切割難之下模板、上池,可_各_式、尺寸之 預設電路板,喊解元以_儀表_基座、壓板的 升降行徑,以進行快速切割作業為主要保護重點,且不需調 整基座或壓板的升降、路徑距離,並可在更換割模具之切割 10 刀具組後,直接進行切_設電路板之加工作f,乃僅使切 割機之機台有自動感測基座、壓板的升降之優勢,且事先準 備作業相當财、省時、省工,惟,以上所述僅為本創作之 較佳實施躺已’ _騎舰本創作之翻麵,故舉凡 運用本創作朗書及圖式内容所為之簡祕叙雜 化,均應同理包含於本創作之專利範圍内,合予陳明 時,==本創作上述電路板切割機之結構改良_ 里之創作二:其功效及目的,故本創作誠為-實用性優 二2广付,新型專利之申請要件,細 有Γ准本案’以保障創作人之辛苦創作,倘若 :::::何稽疑’請不一 ^ M393131 【圖式簡單說明 第一圖係為本創作之立體外觀圖。 第二圖係為本創作之立體分解圖。 第三圖係為本創作加工前之側視圖。 第四圖係為本創作加工時之側視圖。 第五圖係為本創作加工後之側視圖。 【主要元件符號說 1、機台 1 1、基座 13 1 11、滑執 13 1 1 12、推移單元 13 2 1 2、作業平台 13 3 1 21、轨槽 2、切割模具 21、上模板 2 3 2 1 1、切割刀具組 2 3 1 2 2、下模板 2 3 2 2 21、承載座 、定位部 、定位桿 、定位槽 明】 、加工區 、立柱 、壓板 、驅動單元 3、控制單元 12The preparation is simple, fast, time-saving, and labor-saving, and it is also economically beneficial. Therefore, this creation is mainly for the design of the structure of the circuit board cutting machine. In order to use the outside of the machine to set the _ yuan, and to match the pedestal and the pressing plate of the processing area, the template is difficult to cut and the upper pool can be used. The size of the preset circuit board, shouting the _ instrument_base, the lifting path of the pressure plate, for the rapid cutting operation as the main protection focus, and without adjusting the lifting or path distance of the base or the pressure plate, and After changing the cutting tool of the cutting die 10, the cutting operation of the cutting board is directly performed, so that only the machine of the cutting machine has the advantage of automatically sensing the lifting and lowering of the base and the pressure plate, and the preparation work is quite expensive in advance. It saves time and labor, but the above is only a better implementation of this creation. It has been turned over by _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ All should be included in the scope of the patent of this creation, and combined with Chen Mingshi, == The structural improvement of the above-mentioned circuit board cutting machine of this creation _ Li Zhi's creation two: its efficacy and purpose, so this creation is sincerely - practical excellent 2 Guangfu, the application requirements for new patents In order to protect the creators' hard work, if ::::: What are the doubts? Please do not ^ ^ M393131 [Simple diagram of the diagram The first picture is the three-dimensional appearance of the creation. The second picture is a three-dimensional exploded view of the creation. The third picture is a side view of the original creation process. The fourth picture is a side view of the creation process. The fifth picture is a side view of the original processing. [Main component symbol: 1, machine 1 1 , base 13 1 11 , slide 13 1 1 12, push unit 13 2 1 2, work platform 13 3 1 21, rail groove 2, cutting die 21, upper die plate 2 3 2 1 1、Cutting tool set 2 3 1 2 2, lower template 2 3 2 2 21, carrier, positioning part, positioning rod, positioning groove clearly], processing area, column, pressure plate, drive unit 3, control unit 12

Claims (1)

六、申請專利範圍·· P年 1、-種電路板_機之結構邮,係包括機②、控制單元: 該機台係設有供作業平台獅位移尤基H於基座r側設 有具活動式壓板之加工區,s而於加本區設有可帶動壓板呈升 降位移之·鶴單元,且壓滅㈣織謂位作料(台而進 行切割預設電路板之切割;^具;; 。亥控制單7〇係裝設於機台纖座外側,係吳有可預設工作壓 力值之設定儀表:且設有可_壓板向下位移_力值之測丨 壓儀表,;並設有受測壓儀表:的操控而帶動離動單元連動壓板 位移之控制部。 2、如申請專利範圍第!.項所述電路板切割機此結構改良,其中 "亥機σ於基座的上表面設布滑軌,並於作業平舍底部設有可 配合滑軌呈滑動位移之軌檬$而基座上係毁有可帶動作業平 ;台滑移之推移單元。 3:、如申請專.利範圍第1;項所述電路板切割擲之結構改良,其中 :該切割概係於壓板底部設有上模板,細S上模板於基座 :之作業平丨台表面設亦下模板怕上模板係織置有複數切割刀 具組、下模板表面即設有可.承载預設電路族之承_。 4、如申請專利範圍第3項所述電路板切戰之結構改良;,其中 丨該切割模具之上模板與下模板關邊,齡別鰣供針位嵌 i合之複數定位部,:而複數定位部則於上模似補細周邊 ·:分別設有相對之複數定位捍及定位槽。; M3.93131 5、如申請專利範圍第3項所述電路板切割機之結構 該上模板底部相對於下模板的承載座所承載之預設電路板, 係設有可裁切預設電路板之切割刀具組。 1 6、如申請專利範圍第1項所述電路板切割機之結構改良,其中 該機台上所設之絲單元’射為氣驗、液驗或曲柄連 • 桿之類型的動力構件。 • 7、如申請專利範圍第2項所述電路板切割機之結構改良,其中 • 該機台上所設之推移單元,係可為氣壓虹、液壓缸或曲柄連 桿之類型的動力構件。 8、 如申請專利範圍第工項所述電路板切割機之結構改良,其中 該控制單元之設定儀表、測壓儀表,係可為壓力計或電 儀表。 9、 如申請專利範圍第丄項所述電路板切割機之結構改良,盆中 • 該控制單元之控制部,係可為供氣筒、液壓筒或馬達之類型 ™ 的動力機具。 1 0、如申請專利細第:項所述電路板切難之結構改良,立 中該控制單元之設定儀表,其所預設之工作壓力值係可為 4 8kg/cm ’且較佳實施例之工作壓力值則為6 k g/cm2。 15 M393131 七、圖式. 1V?月叫Sixth, the scope of application for patents · P years 1, a kind of circuit board _ machine structure postal, including machine 2, control unit: The machine is equipped with a platform for the lion shift Yuji H on the base r side A processing zone with a movable platen, and a crane unit capable of driving the pressure plate to move up and down in the Jiaben area, and pressing (4) weaving the positional material (cutting the cutting circuit board for cutting; ^; The Hai control unit 7 is installed on the outside of the machine's fiber holder. It is a setting instrument for Wu's preset working pressure value: and it is equipped with a measuring pressure gauge that can be used for the downward displacement of the pressure plate. The control unit is provided with the pressure gauge: the control unit drives the displacement unit to move the platen displacement. 2. The structure of the circuit board cutting machine described in the patent application scope is improved, wherein the " The upper surface is provided with a cloth slide rail, and at the bottom of the operation flat, there is a rail for the sliding displacement of the slide rail, and the base is smashed to drive the work flat; the sliding unit of the slippery stage. Applying for the special improvement of the circuit board cutting throwing structure mentioned in item 1 of the scope, wherein: the cutting profile The upper part of the pressure plate is provided with an upper template, and the upper S template is placed on the base: the surface of the working flat platform is also provided with a lower template, and the upper template is woven with a plurality of cutting tool sets, and the lower template surface is provided with a preset circuit family. 4. The structure improvement of the circuit board warfare described in the third paragraph of the patent application scope; wherein the template on the cutting die and the lower template are closed, and the plurality of positions are arranged for the needle position. Part:: and the plurality of positioning parts are in the upper part of the mold-like peripherals: respectively: a plurality of relative positioning points and positioning grooves are respectively provided; M3.93131 5. The structure of the circuit board cutting machine according to the third item of the patent application scope The bottom plate of the upper template is opposite to the preset circuit board carried by the carrier of the lower template, and is provided with a cutting tool set capable of cutting the preset circuit board. 16. The circuit board cutting machine according to the first item of the patent application scope The structure is improved, wherein the wire unit provided on the machine is 'powered as a type of pneumatic test, liquid test or crank joint rod. · 7. The circuit board cutting machine according to the second item of the patent application scope Structural improvement, where • the push on the machine The unit may be a power member of a type of pneumatic rainbow, hydraulic cylinder or crank connecting rod. 8. The structural improvement of the circuit board cutting machine as described in the application of the patent scope, wherein the control unit sets the meter and the pressure measuring instrument The system can be a pressure gauge or an electric meter. 9. The structural improvement of the circuit board cutting machine described in the scope of the patent application is as follows: the control unit of the control unit can be a gas supply cylinder, a hydraulic cylinder or a motor. TypeTM power tool. 1 0. If the structure of the circuit board is difficult to modify, the setting instrument of the control unit of the center can be set to 4 8kg/cm. 'The working pressure value of the preferred embodiment is 6 kg/cm2. 15 M393131 VII. Schema. 1V? 1616
TW99205936U 2010-04-02 2010-04-02 Improved structure of circuit board cutter TWM393131U (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI492685B (en) * 2011-03-24 2015-07-11 Meiko Electronics Co Ltd Substrate cutting method and device
TWI816453B (en) * 2022-06-29 2023-09-21 超能高新材料股份有限公司 Plate cutting machine and plate cutting method that can simultaneously cut off plates and detect their strength

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI492685B (en) * 2011-03-24 2015-07-11 Meiko Electronics Co Ltd Substrate cutting method and device
TWI816453B (en) * 2022-06-29 2023-09-21 超能高新材料股份有限公司 Plate cutting machine and plate cutting method that can simultaneously cut off plates and detect their strength

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