TWM384303U - Thermal drivce with a turbulent structure to increase heat dissipating efficiency - Google Patents

Thermal drivce with a turbulent structure to increase heat dissipating efficiency Download PDF

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Publication number
TWM384303U
TWM384303U TW99203227U TW99203227U TWM384303U TW M384303 U TWM384303 U TW M384303U TW 99203227 U TW99203227 U TW 99203227U TW 99203227 U TW99203227 U TW 99203227U TW M384303 U TWM384303 U TW M384303U
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TW
Taiwan
Prior art keywords
heat dissipation
heat
spoiler structure
dissipation fins
protrusions
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Application number
TW99203227U
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Chinese (zh)
Inventor
Ming-Chih Chen
Wei-Cheng Chou
Original Assignee
Wistron Corp
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Publication date
Application filed by Wistron Corp filed Critical Wistron Corp
Priority to TW99203227U priority Critical patent/TWM384303U/en
Publication of TWM384303U publication Critical patent/TWM384303U/en

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Abstract

A thermal device includes a plurality of thermal fins, a fan disposed on a side of the plurality of thermal fins for driving air flow from the side of the plurality of thermal fins to gaps between the plurality of thermal fins, and a turbulent structure disposed between the plurality of thermal fins and the fan. The turbulent structure includes a plurality of protruding portions disposed on the side of the plurality of thermal fins for disturbing the air flow entering the gap between the plurality of thermal fins.

Description

M384303 五、新型說明: 【新型所屬之技術領域】 本創作係提供一種散熱裝置,尤指一種利用擾流結構擾 流進入複數個散熱鰭片之間隙之氣流,藉以提昇散熱效率之 散熱裝置。 【先前技術】 隨著科技的進步,消費性電子產品的功能越來越豐富, 因此對效能的要求也越來越高。然而高效能意味著高耗能, 甚至可能引起共振、噪音、散熱等問題。舉例來說,效能提 高連帶使得各元件在執行各種功能時所伴隨產生的熱能也 相對地增加,若電子產品之内部元件所產生的熱能無法有效 率的排除,則會影響到電子產品之運作穩定性和運作效率, 甚至可能導致機械故障,造成使用者的損失。傳統.電子裝置 的散熱模組大多藉由散熱器來吸收熱源所產生之熱量,且另 於散熱器之一側設置風扇,藉以用來對散熱器施以強制對流 以散逸自熱源傳導至散熱器之熱量。而散熱器係可由複數個 散熱鰭片所組成,故當熱源所產生之熱量經由導熱元件傳遞 至複數個散熱鰭片後,風扇即開始運轉以強制對流之方式將 氣流吹入相鄰散熱鰭片之間,藉以散逸自熱源所傳遞至複數 個散熱鰭片之熱量。然而現今電子元件所產生之熱量越來越 高,傳統電子裝置的散熱技術已逐漸不敷使甩需求。故在不 M384303 額外新增散熱元件以避免增加製造成本的前提下,如何設計 出可有效改善風扇所產生強制對流的熱傳效果以提高氣冷 方式之散熱效率的散熱裝置,即為現今電子產業所需努力的 重要課題。 【新型内容】 本創作係提供一種利用擾流結構擾流進入複數個散熱 $鰭片之間隙之氣流,藉以提昇散熱效率之散熱裝置,以解決 上述之問題。 本創作之申請專利範圍係揭露一種利用擾流結構提昇 散熱效率的散熱裝置,其包含有複數個散熱鰭片,一風扇, 其係設置於該複數個散熱鰭片之一側,該風扇係用來驅動氣 流自該複數個散熱鰭片之該側進入該複數個散熱鰭片間之 . 間隙,以及一擾流結構件,其係設置於該複數個散熱鰭片與 • 該風扇之間,該擾流結構件包含有複數個突出部,其係設置 於該複數個散熱鰭片之該側,該複數個突出部係用來擾流進 入該複數個散熱鰭片之間隙之該氣流。 本創作之申請專利範圍另揭露該擾流結構件係設置於 該散熱鰭片上,且該擾流結構件之該複數個突出部之軸向與 該散熱鰭片間係形成一角度。 M384303 本創作之申請專利範圍另揭露該角度實質上係為90度。 本創作之申請專利範圍另揭露該風扇之一殼體上係形 成有兩凹槽,該擾流結構件之兩端係以可轉動之方式分別設 置於該殼體之該兩凹槽内。 本創作之申請專利範圍另揭露該擾流結構件另包含有 一桿件,其係連接於該複數個突出部之一端,以及一旋鈕, 其係連接於該桿件之一端且設置於該凹槽内,該旋鈕係用來 驅動該桿件相對於該複數個散熱鰭片轉動。 本創作之申請專利範圍另揭露該散熱裝置另包含有一 定位銷,其係安裝於該凹槽之一端,該定位銷係用來***該 桿件,藉以限制該桿件之旋轉運動。 本創作之申請專利範圍另揭露該散熱裝置另包含有一 卡勾,其係設置於該凹槽之一側,該卡勾係用來止抵該桿 件,藉以限制該桿件之位移運動。 本創作之申請專利範圍另揭露該擾流結構件之該複數 個突出部係分別延伸至相鄰散熱鰭片之各間隔内,且該複數 個突出部延伸至相鄰散熱鰭片之各間隔内之長度係小於該 散熱鰭片之該側寬度之一半。 M384303 本創作之申請專利範圍另揭露該擾流結構件之該、 個突出部之軸向係實質上水平於該複數個散熱鰭片°。"複數 本創作之申請專利範圍另揭露該複數個散熱鰭片之一 殼體上係形成有兩凹槽,該擾流結構件之兩端係以可^動 方式分別設置於該殼體之該兩凹槽内。 【實施方式】 請參閱第1圖以及第2圖,第i圖為本創作第—實施例 一電子系統10之元件***示意圖,第2圖為本創 一^ 施例電子线1G之組立圖。電子系統1()包含有—散熱裝置 12; -發熱元件14’其可為—硬碟、—中央處理器、^ — 光碟機等電子科;以及—熱導件16,其係連接於散熱裝置 U與發熱tl件14,熱導件16係用來將發熱元件14所產生 …、I傳遞至放熱裝置12,藉以降低發熱元件14之工作溫 度…其中熱導件16係可為一熱管。此外,散熱裝置12包含 有複數個散_片18 ’以及—風扇2(),其係設置於複數個 =熱韓片18之-側。風扇2G係用來驅動氣流自複數個散熱 鰭片18之該側進入複數個散熱鰭片“間之間隙,藉以由氣 冷方式散逸自熱導件16傳遞至散熱裝置12之熱量。散熱裝 另匕3有一擾流結構件22,其係設置於複數個散熱鰭 ”風扇20之間。擾流結構件22包含有複數個突出部 7 M384303 221,其係設置於複數個散熱鰭片18之該側。當風扇20驅 動氣流自複數個散熱鰭片18之該側進入複數個散熱鰭片18 之間隙時’複數個突出部221係用來擾動進入複數個散熱鰭 片18之間隙之氣流。舉例來說,複數個突出部221之表面 可形成有螺旋狀紋路,當風扇2〇驅動氣流自複數個散熱鰭 片18之該側流經擾流結構件22之複數個突出部221以進入 複數個散熱鰭片18之間隙時,氣流會環繞突出部221之軸 心而產生螺旋狀擾動,進而可打散原來已經發展完成的邊界 層流場而增加相鄰散熱鰭片18間氣流之紊流強度,藉以提 昇散熱裝置12的散熱效率。其中本創作突出部221之形狀、 數目、以及表面紋路並不侷限於上述實施例’端視實際需求 而定。 請參閱第1圖、第2圖、以及第3圖,第3圖為本創作 第一實施例擾流結構件22結合於風扇2〇之示意圖。風扇20 包含有一殼體201,其係用來容置風扇之内部零組件,例 .如葉片等。殼體201上係可形成有雨凹槽203,以使擾流結 構件22之兩端係以可轉動之方式分別設置於殼體201之兩 凹槽203内。擾流結構件22另玎包含有一桿件223,其係連 接於複數個突出部221之一端,以及/旋鈕225,其係連接 於桿件223之一端且設置於風扇2〇之凹槽203内。因此, 使用者可藉由操作旋鈕225以帶動優流結構件22以桿件223 為中心轴相對於複數個散熱鰭片18轉動’藉以調整複數個 M384303 突出部221與複數個散熱鰭片18之相對夾角,故可調整由 風扇20驅動而進入複數個散熱鰭片18間隙之氣流之擾流角 度。值得一提的是,如第1圖所示,當擾流結構件22設置 風扇20上且位於散熱鰭片18之該側時,擾流結構件22之 複數個突出部221係可分別延伸至相鄰散熱鰭片18之各間 隔内,且複數個突出部221延伸至相鄰散熱鰭片18之各間 隔内之長度Η係可小於散熱鰭片18之該側寬度W之一半, 以使當擾流結構件22相對複數個散熱鰭片18轉動時,擾流 結構件22之兩端不會與散熱鰭片18撞擊而造成損毁。再 者,請參閱第4圖,第4圖為擾流結構件22之一端設置於 凹槽203内之示意圖,散熱裝置12另可包含有一定位銷24, 其係設置於凹槽203之一端,以及一卡勾26,其係設置於凹 槽203之一側。定位銷24以及卡勾26係分別用來限制桿件 223於凹槽203内之旋轉運動以及位移運動,藉以依使用者 需求固定複數個突出部221與複數個散熱鰭片18之相對夾 角以及相對位置。在此第一實施例中,複數個突出部221與 複數個散熱鰭片18之相對夾角係實質上較佳地可為0度, 意即擾流結構件22之複數個突出部221之軸向係實質上水 平於複數個散熱鰭片18,以使流經擾流結構件22之氣流可 環繞突出部221之軸心以產生螺旋狀擾動,進而有效地提昇 散熱裝置12之散熱效率。 請參閱第5圖,第5圖為本創作第二實施例擾流結構件 产· 5 9 M384303 22結合於散熱鰭片18端之示意圖。此實施例中與前述實施 例相同標號之元件具有相同結構與功能,於此不再詳述。在 第二實施例中,複數個散熱鰭片18可包含有一殼體181,殼 體181上係可形成有兩凹槽183,且擾流結構件22之兩端係 可以可轉動之方式分別設置於殼體181之兩凹槽183内,以 使使用者可藉由操作旋鈕225以帶動擾流結構件22以桿件 223為中心軸相對於複數個散熱鰭片18轉動,藉以調整複數 個突出部221與複數個散熱鰭片18之相對夾角。承上所述, 第一實施例與第二實施例之差異處在於,於第一實施例中擾 流結構件22係結合於風扇20端,而於第二實施例中擾流結 構件22係結合於散熱鰭片18端,然兩實施例之擾流結構件 22皆可調整由風扇20驅動而進入複數個散熱鰭片18間隙之 氣流,且可相對於複數個散熱鰭片18旋轉,藉以調整擾流 角度。再者,擾流結構件22之複數個突出部221係可分別 延伸至相鄰散熱鰭片18之各間隔内,且複數個突出部221 延伸至相鄰散熱鰭片18之各間隔内之長度Η係可小於散熱 鰭片18之該側寬度W之一半,以使當擾流結構件22相對 複數個散熱鰭片18轉動時,擾流結構件22之兩端不會與散 熱鰭片18撞擊而造成損毀。在此第二實施例中,複數個突 出部221與複數個散熱鰭片18之相對夾角係實質上較佳地 可為0度,意即擾流結構件22之複數個突出部221之軸向 係實質上水平於複數個散熱鰭片18,’以使流經擾流結構件 22之氣流可環繞突出部221之轴心以產生螺旋狀擾動,進而 M384303 有效地提昇散熱裝置12之散熱效率。 為了有效地提昇散熱裝置12之散熱效率,本創作係於 風扇20與散熱鰭片18間設置擾流結構件22,以使氣流在進 入相鄰散熱鰭片18間之間隙進行熱交換時,可產生具有三 度空間流動方向性的交互傳遞對流,如此便可增強氣流的紊 流現象,並降低熱邊界層的厚度,藉以提昇散熱裝置12之 熱對流效率。在第一實施例以及第二實施例中,擾流結構件 22係為一獨立元件,其兩端分別設置於風扇20之凹槽203 (或散熱鰭片18之凹槽183)内,使用者可藉由旋鈕225將 擾流結構件22推入凹槽203 (或凹槽183)内,以及驅動擾 流結構件22之桿件223相對於複數個散熱鰭片18轉動。擾 流結構件22之複數個突出部221之軸向與複數個散熱鰭片 18之相對夾角係可依據使用者需求而調整,一般來說,該相 對夾角實質上較佳地係可為〇度,故進入複數個散熱鰭片18 之氣流可藉由擾流結構件22可以打散原來風扇20所驅動之 具有已發展完成之邊界層流场的氣流*且擾流結構件2 2之 表面紋路可引導氣流環繞突出部221之軸心以產生螺旋狀擾 動,進而與主流體流場混合生成具有三度空間流動方向性的 交互傳遞對流,增加相鄰散熱鰭片18間氣流之紊流強度, 藉以大幅提昇散熱裝置12的散熱效率,同時也不致大幅增 加系統流阻而導致風量下降的影響過大。除此之外,當散熱 裝置12因長期使用而堆積塵絮於複數個散熱鰭片18之該側 11 M384303 (入風端)時,散熱裝置12之散熱效率會因散熱鰭片18之流 道堵塞而大幅下降。此時,由於擾流結構件22之複數個突 出部221可分別延伸至相鄰散熱鰭片18之各間隔内,且使 用者可藉由旋鈕225驅動桿件223相對於複數個散熱鰭片18 轉動,而擾流結構件22之複數個突出部221便可旋轉清除 堆積在複數個相對應散熱鰭片18之該侧的塵絮,以暢通相 鄰散熱鰭片18間之流道。 請參閱第6圖,第6圖為本創作第三實施例複數個散熱 鰭片18與一擾流結構件30之示意圖。如第5圖所示,於此 實施例中擾流結構件30係可設置於散熱鰭片18之上,擾流 結構件30包含有複數個突出部301,其係設置於散熱鰭片 18鄰近風扇20之該側上,且複數個突出部301之軸向與散 熱鰭片1·8係可依設計需求形成一角度,舉例來說,該角度 實質上係較佳地可為90度。因此,突出部301係可用來擾 動風扇20所驅動之氣流,進而增加相鄰散熱鰭片18間氣流 的紊流強度以提昇散熱裝置12的散熱效率。其中擾流結構 件30與散熱鰭片18係可為一體成型,且擾流結構件30之 設置位置與數目可不侷限於上述實施例,端視設計需求而 定。 在本創作之第三實施例中,當風扇20驅動氣流自複數 個散熱鰭片18之該侧進入複數個散熱鰭片18間之間隙時, 12 M384303 擾流結構件30之複數個突出部301係可用來破壞風扇20所 驅動之具有發展完成邊界層流場之氣流,以使進入複數個散 熱鰭片18間之間隙之氣流形成具有三度空間流動方向性的 渦流,進而增加相鄰散熱鰭片18間之氣流的紊流強度,以 提昇散熱裝置12的散熱效率。 相較於先前技術,本創作之散熱裝置在不額外增設散熱 元件以節省製造成本的前提下,係於複數個散熱鰭片之入風 端設置有擾流結構件,其係用來破壞風扇所驅動氣流之邊界 層流場,進而增加進入相鄰散熱鰭片間氣流之紊流強度,以 提昇散熱裝置之散熱效率,故本創作實提供一良好且有效率 之散熱解決方案。 以上所述僅為本創作之較佳實施例,凡依本創作申請專 利範圍所做之均等變化與修飾,皆應屬本創作之涵蓋範圍。 【圖式簡單說明】 第1圖為本創作第一實施例電子系統之元件***示意圖。 第2圖為本創作第一實施例電子系統之組立圖。 第3圖為本創作第一實施例擾流結構件結合於風扇之示意 圖。 第4圖為本創作第一實施例擾流結構件之一端設置於凹槽内 之示意圖。 13 M384303 第5圖為本創作第二實施例擾流結構件結合於散熱鰭片端之 示意圖。 第6圖為本創作第三實施例散熱鰭片與擾流結構件之示意 圖。 【主要元件符號說明】 10 電子系統 12 散熱裝置 14 承座 16 熱導件 18 散熱鰭片 181 殼體 183 凹槽 20 風扇 201 殼體 203 凹槽 22 擾流結構件 221 突出部 223 桿件 225 旋鈕 24 定位銷 26 卡勾 30 擾流結構件 301 突出部M384303 V. New Description: [New Technology Field] This creation provides a heat sink, especially a heat sink that uses a spoiler structure to turbulence into the gap between a plurality of fins to improve heat dissipation efficiency. [Prior Art] With the advancement of technology, the functions of consumer electronic products are becoming more and more abundant, so the requirements for performance are getting higher and higher. However, high performance means high energy consumption, and may even cause problems such as resonance, noise, and heat dissipation. For example, the improvement of the performance of the components causes the thermal energy generated by each component to perform various functions to be relatively increased. If the thermal energy generated by the internal components of the electronic product cannot be effectively eliminated, the operation of the electronic product is stabilized. Sexual and operational efficiency, and may even cause mechanical failure, resulting in user losses. Conventionally, the heat dissipation module of the electronic device mostly absorbs the heat generated by the heat source by the heat sink, and another fan is disposed on one side of the heat sink, so as to apply forced convection to the heat sink to dissipate the heat source to the heat sink. The heat. The heat sink can be composed of a plurality of heat radiating fins. When the heat generated by the heat source is transmitted to the plurality of heat radiating fins through the heat conducting component, the fan starts to operate to force the convection to blow the airflow into the adjacent heat sink fins. Between the heat transferred from the heat source to the plurality of heat sink fins. However, the heat generated by electronic components is getting higher and higher, and the heat dissipation technology of conventional electronic devices has gradually become insufficient. Therefore, under the premise of not adding additional heat dissipation components to M384303 to avoid increasing manufacturing costs, how to design a heat dissipation device that can effectively improve the heat transfer effect of forced convection generated by the fan to improve the heat dissipation efficiency of the air cooling method is the current electronic industry. An important issue for the effort required. [New Content] This creation provides a heat sink that uses a spoiler structure to sneak into a gap between a plurality of heat sinks and fins to improve heat dissipation efficiency to solve the above problems. The patent application scope of the present invention discloses a heat dissipation device that utilizes a spoiler structure to improve heat dissipation efficiency, and includes a plurality of heat dissipation fins, and a fan disposed on one side of the plurality of heat dissipation fins, the fan system Driving the airflow from the side of the plurality of heat dissipation fins into the gap between the plurality of heat dissipation fins, and a spoiler structure disposed between the plurality of heat dissipation fins and the fan, The spoiler structure includes a plurality of protrusions disposed on the side of the plurality of heat dissipation fins, and the plurality of protrusions are used to disturb the airflow entering the gap between the plurality of heat dissipation fins. The scope of the patent application of the present invention further discloses that the spoiler structure is disposed on the heat dissipation fin, and an axial direction of the plurality of protrusions of the spoiler structure forms an angle with the heat dissipation fin. M384303 The scope of the patent application of this creation further discloses that the angle is substantially 90 degrees. The scope of the patent application of the present invention further discloses that the casing of the fan is formed with two grooves, and the two ends of the spoiler structure are rotatably disposed in the two grooves of the casing. The scope of the patent application of the present invention further discloses that the spoiler structure further includes a rod connected to one end of the plurality of protrusions, and a knob connected to one end of the rod and disposed in the groove The knob is used to drive the rod to rotate relative to the plurality of fins. The scope of the patent application of the present invention further discloses that the heat sink further includes a positioning pin mounted on one end of the recess for inserting the lever member to limit the rotational movement of the lever member. The scope of the patent application of the present invention further discloses that the heat dissipating device further comprises a hook disposed on one side of the recess, the hook being used to stop the rod to limit the displacement movement of the rod. The patent application scope of the present invention further discloses that the plurality of protruding portions of the spoiler structure extend into the respective intervals of the adjacent heat dissipation fins, and the plurality of protrusions extend into the intervals of the adjacent heat dissipation fins. The length is less than one-half of the width of the side of the heat sink fin. M384303 The scope of the patent application of the present invention further discloses that the axial direction of the protruding portion of the spoiler structure is substantially horizontal to the plurality of heat dissipation fins. "The patent application scope of the plurality of creations further discloses that one of the plurality of heat dissipation fins is formed with two grooves on the housing, and the two ends of the spoiler structure are respectively disposed on the housing in a movable manner Inside the two grooves. [Embodiment] Please refer to FIG. 1 and FIG. 2, which is a schematic diagram of the explosion of components of the electronic system 10 according to the first embodiment of the present invention, and FIG. 2 is a group diagram of the electronic wire 1G of the present embodiment. The electronic system 1() includes a heat sink 12; the heat generating component 14' can be an electronic device such as a hard disk, a central processing unit, a CD player, and the like, and a heat guiding member 16 connected to the heat sink U and heat t1, the heat guide 16 is used to transfer the heat generating component 14 to the heat releasing device 12, thereby reducing the operating temperature of the heat generating component 14. The heat guiding member 16 can be a heat pipe. Further, the heat sink 12 includes a plurality of scatterers 18' and a fan 2() disposed on the side of the plurality of = hot Korean sheets 18. The fan 2G is used to drive the airflow from the side of the plurality of heat dissipation fins 18 into the gap between the plurality of heat dissipation fins, thereby dissipating heat transferred from the heat guide 16 to the heat sink 12 by air cooling. The crucible 3 has a spoiler structure 22 disposed between the plurality of fins "fans 20." The spoiler structure 22 includes a plurality of protrusions 7 M384303 221 disposed on the side of the plurality of heat dissipation fins 18. When the fan 20 drives the airflow from the side of the plurality of heat dissipation fins 18 into the gap of the plurality of heat dissipation fins 18, the plurality of protrusions 221 are used to disturb the airflow entering the gaps of the plurality of heat dissipation fins 18. For example, the surface of the plurality of protrusions 221 may be formed with a spiral pattern, and when the fan 2 〇 drives the airflow from the side of the plurality of heat dissipation fins 18 through the plurality of protrusions 221 of the spoiler structure 22 to enter the plurality When the fins 18 are in the gap, the airflow will spiral around the axis of the protrusion 221, thereby dissipating the boundary layer flow field which has been developed and increasing the turbulence of the airflow between the adjacent fins 18. The strength is used to improve the heat dissipation efficiency of the heat sink 12. The shape, the number, and the surface texture of the present projecting portion 221 are not limited to the above embodiment, depending on actual needs. Referring to FIG. 1 , FIG. 2 , and FIG. 3 , FIG. 3 is a schematic view showing the first embodiment of the spoiler structure 22 coupled to the fan 2 . The fan 20 includes a housing 201 for receiving internal components of the fan, such as blades. The housing 201 may be formed with a rain groove 203 such that both ends of the spoiler member 22 are rotatably disposed in the two recesses 203 of the housing 201, respectively. The spoiler structure 22 further includes a rod member 223 coupled to one end of the plurality of protrusions 221, and a / knob 225 coupled to one end of the rod member 223 and disposed in the recess 203 of the fan 2 . Therefore, the user can adjust the plurality of M384303 protrusions 221 and the plurality of heat dissipation fins 18 by operating the knob 225 to drive the flow control structure 22 to rotate relative to the plurality of heat dissipation fins 18 with the rod 223 as a central axis. The relative angle is opposite, so that the spoiler angle of the airflow driven by the fan 20 and entering the gaps of the plurality of heat dissipation fins 18 can be adjusted. It is worth mentioning that, as shown in FIG. 1 , when the spoiler structure 22 is disposed on the fan 20 and located on the side of the heat dissipation fin 18 , the plurality of protrusions 221 of the spoiler structure 22 can respectively extend to The lengths of the plurality of protrusions 221 extending into the respective intervals of the adjacent heat dissipation fins 18 may be less than one half of the side width W of the heat dissipation fins 18 in each interval of the adjacent heat dissipation fins 18, so that When the spoiler structure 22 rotates relative to the plurality of heat dissipation fins 18, the two ends of the spoiler structure 22 do not collide with the heat dissipation fins 18 to cause damage. In addition, referring to FIG. 4, FIG. 4 is a schematic view showing one end of the spoiler structure 22 disposed in the recess 203. The heat sink 12 may further include a positioning pin 24 disposed at one end of the recess 203. And a hook 26 disposed on one side of the recess 203. The positioning pin 24 and the hook 26 are respectively used to limit the rotational movement and the displacement movement of the rod 223 in the groove 203, so as to fix the relative angle between the plurality of protrusions 221 and the plurality of heat dissipation fins 18 and relative to each other according to the user's requirements. position. In this first embodiment, the relative angle between the plurality of protrusions 221 and the plurality of heat dissipation fins 18 is substantially preferably 0 degrees, that is, the axial direction of the plurality of protrusions 221 of the spoiler structure 22. The plurality of heat dissipation fins 18 are substantially horizontal, so that the airflow flowing through the spoiler structure 22 can surround the axis of the protrusion 221 to generate a spiral disturbance, thereby effectively improving the heat dissipation efficiency of the heat sink 12. Please refer to FIG. 5, which is a schematic diagram of the spoiler structure of the second embodiment of the present invention. 5 M 384303 22 is coupled to the end of the heat dissipating fin 18 . Elements in this embodiment that have the same reference numerals as in the previous embodiments have the same structure and function, and will not be described in detail herein. In the second embodiment, the plurality of heat dissipation fins 18 may include a housing 181, and the housing 181 may be formed with two recesses 183, and the two ends of the spoiler structure 22 may be separately rotatably disposed. The two recesses 183 of the housing 181 allow the user to rotate the spoiler structure 22 with the lever 223 as a central axis relative to the plurality of heat dissipation fins 18 by operating the knob 225, thereby adjusting the plurality of protrusions. The opposite angle between the portion 221 and the plurality of heat dissipation fins 18. As described above, the difference between the first embodiment and the second embodiment is that in the first embodiment, the spoiler structure 22 is coupled to the fan 20 end, and in the second embodiment, the spoiler structure 22 is In combination with the heat dissipation fins 18, the spoiler structure 22 of the two embodiments can adjust the airflow driven by the fan 20 into the gaps of the plurality of heat dissipation fins 18, and can be rotated relative to the plurality of heat dissipation fins 18, thereby Adjust the spoiler angle. Furthermore, the plurality of protrusions 221 of the spoiler structure 22 can extend into the respective intervals of the adjacent heat dissipation fins 18, and the plurality of protrusions 221 extend to the lengths of the adjacent heat dissipation fins 18. The lanthanide system may be smaller than one half of the side width W of the heat dissipation fins 18 such that when the turbulence structure member 22 rotates relative to the plurality of heat dissipation fins 18, the two ends of the turbulence structure member 22 do not collide with the heat dissipation fins 18. And caused damage. In this second embodiment, the relative angle between the plurality of protrusions 221 and the plurality of heat dissipation fins 18 is substantially preferably 0 degrees, that is, the axial direction of the plurality of protrusions 221 of the spoiler structure 22. The airflow through the spoiler structure 22 can surround the axis of the protrusion 221 to create a spiral disturbance, and the M384303 effectively enhances the heat dissipation efficiency of the heat sink 12. In order to effectively improve the heat dissipation efficiency of the heat sink 12, the present invention provides a spoiler structure 22 between the fan 20 and the heat dissipation fins 18 to allow airflow to exchange heat between the adjacent heat dissipation fins 18. The interaction convection with three-dimensional spatial flow directivity is generated, thereby enhancing the turbulence of the airflow and reducing the thickness of the thermal boundary layer, thereby improving the heat convection efficiency of the heat sink 12. In the first embodiment and the second embodiment, the spoiler structure 22 is a separate component, and the two ends of the spoiler structure 22 are respectively disposed in the recess 203 of the fan 20 (or the recess 183 of the heat dissipation fin 18). The spoiler structure 22 can be pushed into the recess 203 (or recess 183) by the knob 225, and the rod 223 that drives the spoiler structure 22 rotates relative to the plurality of fins 18. The relative angle between the axial direction of the plurality of protrusions 221 of the spoiler structure 22 and the plurality of heat dissipation fins 18 can be adjusted according to user requirements. Generally, the relative angle is substantially preferably a twist. Therefore, the airflow entering the plurality of heat dissipation fins 18 can disperse the airflow with the developed boundary layer flow field driven by the original fan 20 by the spoiler structure 22 and the surface texture of the spoiler structure 2 2 The airflow can be guided around the axis of the protrusion 221 to generate a spiral disturbance, thereby mixing with the main fluid flow field to generate an interactive transfer convection having a three-dimensional spatial flow directivity, and increasing the turbulence intensity of the airflow between the adjacent heat dissipation fins 18, In order to greatly improve the heat dissipation efficiency of the heat sink 12, and not greatly increase the system flow resistance, the influence of the air volume drop is excessive. In addition, when the heat dissipating device 12 accumulates dust on the side 11 M384303 (inlet end) of the plurality of heat dissipating fins 18 due to long-term use, the heat dissipating efficiency of the heat dissipating device 12 may be due to the flow path of the heat dissipating fins 18. The blockage has dropped dramatically. At this time, since the plurality of protrusions 221 of the spoiler structure 22 can extend into the respective intervals of the adjacent heat dissipation fins 18, the user can drive the rod 223 relative to the plurality of heat dissipation fins 18 by the knob 225. Rotating, the plurality of protrusions 221 of the spoiler structure 22 can rotate and remove the dust accumulated on the side of the plurality of corresponding heat dissipation fins 18 to clear the flow path between the adjacent heat dissipation fins 18. Please refer to FIG. 6. FIG. 6 is a schematic diagram of a plurality of heat dissipation fins 18 and a spoiler structure 30 according to the third embodiment of the present invention. As shown in FIG. 5 , in this embodiment, the spoiler structure 30 can be disposed on the heat dissipation fins 18 , and the spoiler structure 30 includes a plurality of protrusions 301 disposed adjacent to the heat dissipation fins 18 . On the side of the fan 20, the axial direction of the plurality of protrusions 301 and the heat dissipation fins 1·8 can be formed at an angle according to design requirements. For example, the angle is preferably 90 degrees. Therefore, the protrusion 301 can be used to disturb the air flow driven by the fan 20, thereby increasing the turbulence intensity of the airflow between the adjacent heat dissipation fins 18 to improve the heat dissipation efficiency of the heat sink 12. The spoiler structure 30 and the heat dissipating fins 18 may be integrally formed, and the position and number of the spoiler structures 30 may not be limited to the above embodiments, depending on the design requirements. In the third embodiment of the present invention, when the fan 20 drives the airflow from the side of the plurality of heat dissipation fins 18 into the gap between the plurality of heat dissipation fins 18, the plurality of protrusions 301 of the 12 M384303 spoiler structure 30 It can be used to destroy the airflow driven by the fan 20 with the developed boundary layer flow field, so that the airflow entering the gap between the plurality of heat dissipation fins 18 forms a vortex with a three-dimensional flow direction directionality, thereby increasing the adjacent heat dissipation fins. The turbulence intensity of the airflow between the pieces 18 increases the heat dissipation efficiency of the heat sink 12. Compared with the prior art, the heat sink of the present invention is provided with a spoiler structure at the air inlet end of a plurality of heat radiating fins without additional heat dissipating components to save manufacturing cost, which is used to destroy the fan. Driving the boundary layer flow field of the airflow, thereby increasing the turbulence intensity of the airflow entering the adjacent heat sink fins, thereby improving the heat dissipation efficiency of the heat sink, so the present invention provides a good and efficient heat dissipation solution. The above descriptions are only preferred embodiments of the present invention, and all changes and modifications made to the scope of the patent application are subject to the scope of this creation. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing the explosion of components of the electronic system of the first embodiment of the present invention. Figure 2 is a block diagram of the electronic system of the first embodiment of the present invention. Fig. 3 is a schematic view showing the spoiler structure of the first embodiment of the present invention incorporated in a fan. Fig. 4 is a schematic view showing that one end of the spoiler structure of the first embodiment of the present invention is disposed in the recess. 13 M384303 Fig. 5 is a schematic view showing the spoiler structure of the second embodiment of the present invention combined with the fin end. Fig. 6 is a schematic view showing the heat dissipating fin and the spoiler structure of the third embodiment of the present invention. [Main component symbol description] 10 Electronic system 12 Heat sink 14 Bearing 16 Thermal guide 18 Heat sink fin 181 Housing 183 Groove 20 Fan 201 Housing 203 Groove 22 Spoiler structure 221 Projection 223 Rod 225 Knob 24 Locating Pin 26 Snap 30 Spoiler 301 Projection

Claims (1)

M384303 六、申請專利範圍: 1. 一種利用擾流結構提昇散熱效率的散熱裝置,其包含有: 複數個散熱鰭片; 一風扇,其係設置於該複數個散熱鰭片之一側,該風扇 係用來驅動氣流自該複數個散熱鰭片之該側進入該 複數個散熱鰭片間之間隙;以及 一擾流結構件,其係設置於該複數個散熱鰭片與該風扇 之間,該擾流結構件包含有複數個突出部,其係設 置於該複數個散熱鰭片之該側,該複數個突出部係 用來擾流進入該複數個散熱鰭片之間隙之該氣流。 2. 如請求項1所述之散熱裝置,其中該擾流結構件係設置 於該散熱鰭片上,且該擾流結構件之該複數個突出部之 軸向與該散熱鰭片間係形成一角度。 3. 如請求項2所述之散熱裝置,其中該角度實質上係為90 度。 4. 如請求項2所述之散熱裝置,其中該擾流結構件與該散 熱鰭片係為一體成型。 5. 如請求項1所述之散熱裝置,其中該風扇之一殼體上係 r 15 M384303 形成有兩凹槽,該擾流結構件之兩端係以可轉動之方式 分別設置於該殼體之該兩凹槽内。 6. 如請求項5所述之散熱裝置,其中該擾流結構件另包含 有: 一桿件,其係連接於該複數個突出部之一端;以及 一旋鈕,其係連接於該桿件之一端且設置於該凹槽内, 該旋鈕係用來驅動該桿件相對於該複數個散熱鰭片 轉動。 7. 如請求項6所述之散熱裝置,其另包含有一定位銷,其 係安裝於該凹槽之一端,該定位銷係用來***該桿件, 藉以限制該桿件之旋轉運動。 8. 如請求項6所述之散熱裝置,其另包含有一卡勾,其係 設置於該凹槽之一側,該卡勾係用來止抵該桿件,藉以 限制該桿件之位移運動。 9. 如請求項5所述之散熱裝置,其中該擾流結構件之該複 數個突出部係分別延伸至相鄰散熱鰭片之各間隔内,且 該複數個突出部延伸至相鄰散熱鰭片之各間隔内之長度 係小於該散熱鰭片之該側寬度之一半。 16 ξ) M384303 10. 如請求項5所述之散熱裝置,其中該擾流結構件之該複 數個突出部之軸向係實質上水平於該複數個散熱鰭片。 11. 如請求項1所述之散熱裝置,其中該複數個散熱鰭片之 一殼體上係形成有兩凹槽,該擾流結構件之兩端係以可 轉動之方式分別設置於該殼體之該兩凹槽内。 12. 如請求項11所述之散熱裝置,其中該擾流結構件另包含 有: 一桿件,其係連接於該複數個突出部之一端;以及 一旋鈕,其係連接於該桿件之一端且設置於該凹槽内, 該旋鈕係用來驅動該桿件相對於該複數個散熱鰭片 轉動。 13. 如請求項12所述之散熱裝置,其另包含有一定位銷, 其係安裝於該凹槽之一端,該定位銷係用來***該桿 件,藉以限制該桿件之旋轉運動。 14. 如請求項12所述之散熱裝置,其另包含有一卡勾,其 係設置於該凹槽之一側,該卡勾係用來止抵該桿件,藉 以限制該桿件之位移運動。 15. 如請求項11所述之散熱裝置,其中該擾流結構件之該複 17 M384303 數個突出部係分別延伸至相鄰散熱鰭片之各間隔内,且 該複數個突出部延伸至相鄰散熱鰭片之各間隔内之長度 係小於該散熱鰭片之該側寬度之一半。 16.如請求項11所述之散熱裝置,其中該擾流結構件之該複 數個突出部之軸向係實質上水平於該複數個散熱鰭片。 七、圖式:M384303 VI. Patent Application Range: 1. A heat dissipation device that utilizes a spoiler structure to improve heat dissipation efficiency, comprising: a plurality of heat dissipation fins; a fan disposed on one side of the plurality of heat dissipation fins, the fan And a spoiler structure is disposed between the plurality of heat dissipation fins and the fan, and is configured to drive the airflow from the side of the plurality of heat dissipation fins into a gap between the plurality of heat dissipation fins; The spoiler structure includes a plurality of protrusions disposed on the side of the plurality of heat dissipation fins, and the plurality of protrusions are used to disturb the airflow entering the gap between the plurality of heat dissipation fins. 2. The heat dissipating device of claim 1, wherein the spoiler structure is disposed on the heat dissipating fin, and an axial direction of the plurality of protrusions of the spoiler structure and the heat dissipating fin form a angle. 3. The heat sink of claim 2, wherein the angle is substantially 90 degrees. 4. The heat sink of claim 2, wherein the spoiler structure is integrally formed with the heat sink fin. 5. The heat dissipating device of claim 1, wherein one of the fan housings r 15 M384303 is formed with two grooves, and the two ends of the spoiler structure are rotatably disposed respectively on the housing Within the two grooves. 6. The heat sink of claim 5, wherein the spoiler structure further comprises: a rod attached to one end of the plurality of protrusions; and a knob coupled to the rod One end is disposed in the groove, and the knob is used to drive the rod to rotate relative to the plurality of heat dissipation fins. 7. The heat sink of claim 6, further comprising a locating pin mounted to one end of the recess for inserting the lever to limit rotational movement of the lever. 8. The heat dissipating device of claim 6, further comprising a hook disposed on one side of the recess, the hook being used to stop the rod to limit the displacement movement of the rod . 9. The heat sink of claim 5, wherein the plurality of protrusions of the spoiler structure extend into respective spaces of adjacent heat dissipation fins, and the plurality of protrusions extend to adjacent heat dissipation fins The length of each interval of the sheet is less than one half of the width of the side of the heat sink fin. The heat sink of claim 5, wherein the plurality of protrusions of the spoiler structure have an axial direction substantially horizontal to the plurality of heat sink fins. 11. The heat dissipating device of claim 1, wherein one of the plurality of heat dissipating fins is formed with two grooves, and the two ends of the spoiler structure are rotatably disposed on the shell The two grooves in the body. 12. The heat sink of claim 11, wherein the spoiler structure further comprises: a rod attached to one end of the plurality of protrusions; and a knob coupled to the rod One end is disposed in the groove, and the knob is used to drive the rod to rotate relative to the plurality of heat dissipation fins. 13. The heat sink of claim 12, further comprising a locating pin mounted to one end of the recess for inserting the rod to limit rotational movement of the member. 14. The heat dissipating device of claim 12, further comprising a hook disposed on one side of the recess, the hook being used to stop the rod to limit displacement movement of the rod . 15. The heat dissipating device of claim 11, wherein the plurality of protruding portions of the spoiler structure extend to each of the adjacent fins, and the plurality of protrusions extend to the phase The length of each of the adjacent fins is less than one half of the width of the side of the fin. 16. The heat sink of claim 11, wherein the plurality of protrusions of the spoiler structure have an axial extent substantially horizontal to the plurality of fins. Seven, the pattern:
TW99203227U 2010-02-12 2010-02-12 Thermal drivce with a turbulent structure to increase heat dissipating efficiency TWM384303U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103687423A (en) * 2012-09-07 2014-03-26 宏碁股份有限公司 Electronic device and radiating module thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103687423A (en) * 2012-09-07 2014-03-26 宏碁股份有限公司 Electronic device and radiating module thereof

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