TWM367027U - Volatile organic compound processing device for coating process - Google Patents

Volatile organic compound processing device for coating process Download PDF

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TWM367027U
TWM367027U TW98206386U TW98206386U TWM367027U TW M367027 U TWM367027 U TW M367027U TW 98206386 U TW98206386 U TW 98206386U TW 98206386 U TW98206386 U TW 98206386U TW M367027 U TWM367027 U TW M367027U
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Taiwan
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volatile organic
waste gas
organic waste
coating process
zone
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TW98206386U
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Chinese (zh)
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feng-tang Zhang
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Jg Environmental Tech Co Ltd
feng-tang Zhang
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Priority to TW98206386U priority Critical patent/TWM367027U/en
Publication of TWM367027U publication Critical patent/TWM367027U/en

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M367027 五、新型說明: 【新型所屬之技術領域】 本創作係有關一種塗佈製程用揮發性有機廢氣處理裝 置,尤指一種將常溫製程區所逸散出之揮發性有機廢氣, 以濃縮器予以集氣淨化排放,並將濃縮後之揮發性有機廢 氣,脫附併入高溫製程區產生之揮發性有機廢氣,再由終 ,, 處理單元淨化排放之設計者。 _ 【先前技術】 按,揮發性有機物(Volati le Organic Compounds,VOCs) 排放源可分為人為排放源與自然排放源,而人為排放源大 多來自於工業製程中所使用之有機溶劑,但由於製程會產 生VOCs的產業相當多且種類複雜,不同產業及製程所使用 的有機溶劑成分及比例差異性相當大,產業之VOCs廢氣特 性也因此有諸多差異,而且VOCs不論於高溫或常溫製程下 皆會揮發產生,但由於許多塗佈製程之常溫製程係為開放 式製程,乃成為逸散性VOCs的主要來源。 # 接著,對於高溫製程會產生高濃度而且常溫製程可能 逸散出低濃度高風量之揮發性有機廢氣之部分行業,進行 簡單之製程說明: ' 一、PU合成皮業:PU(polyurethane,聚氨基甲酸酯) - 合成皮製程分為乾式及濕式兩種,乾式製程又可分轉移法 及塗佈法,而濕式製程則有含浸法及塗佈法,以乾式轉移 法製程為例,PU合成皮之製造係將PU樹脂溶於有機溶劑 後,常溫塗佈於離形紙上,而藉烘乾加熱使PU樹脂於離形 M367027 紙上熟成固化形成表皮層,然後利用接著劑將基布與表皮 層壓合接著後,再經―道烘絲序處理,鑛離形紙後即 為PU合成皮成品。 二、膠帶業:膠帶之製程主要將壓克力樹脂和橡膠以 有機溶劑’於常溫稀釋調配再塗佈於不同之基材(如〇pp、 PVC、PE、布、複合材料和玻璃紙類等)上,經烘箱加熱供 烤,將有機溶劑蒸發,使樹脂乾燥形成表皮層並完全貼合 基布,再經加工處理,剪裁而製成成品。 二、背光板業:背光板之製程係於常溫以有機溶劑調 配黏膠,而塗佈於導光板,再將乡層之機能性光學膜黏貼 於導光板上,並經加熱使黏膠固化而製成成品。 四、 塗裝業:塗裝過程係於常溫將含有有機溶劑之塗 料塗佈於塗裝物,再經由加熱焙烤硬化成型。 五、 印刷業:製程污染源包括常溫下之油墨稀釋調整 與印刷,以及高溫下之烘乾。 然而’塗佈製程一般只對高溫製程進行揮發性有機廢 氣之處理,而因常溫製程(例如調膠、調漆、塗佈、油墨稀 釋及P刷)會產生之揮發性有機廢氣較高溫製程低許多,故 一般未對常溫製程所逸散出來之揮發性有機廢氣予以處 理’但由於許多塗佈製程之常溫製程係為開放式製程,若 未予以有效集氣,乃成為逸散性揮發性有機廢氣的主要來 源’且2溫製程所逸散出來之揮發性有機廢氣為高風量低 濃若要進行集氣後施以焚化之最終處王里,則因高風量 低展度而必須採用較大容量之終處理設備及耗費較多燃料 (能源)才能予以焚化處理。 M367027 【新型内容】 本創作之主要目的,係欲解決先前技術未對塗佈製程 之常溫製程所逸散之揮發性有機廢氣,予以集氣並淨化濃 縮處理之問題,而具有將塗佈製程之常溫製程所逸散之揮 發性有機廢氣予以濃縮後,再與高溫製程所產生之揮發性 有機廢氣一同淨化,並達到降低終處理設備容量之功效。 本創作之另一目的,則具有令淨化處理過程節能之功 效。 為達上述功效,本創作之結構特徵,係包括有: 一濃縮單元,設置於塗佈製程之常溫製程區下游端, 而將常溫製程區所逸散之揮發性有機廢氣,予以集氣淨化 排放並濃縮處理;以及 一終處理單元,設置於塗佈製程之高溫製程區及該濃 縮單元脫附區之下游端,而將高溫製程區所產生及經該濃 縮單元所濃縮之揮發性有機廢氣予以淨化處理者。 此外,該濃縮單元(Concentrator)為轉輪式濃縮器 (Rotor type rotary concentrator)、轉環式濃縮器 (Carousel type rotary concentrator)或流體化床濃縮器 (Fluidized bed concentrator);其中,該轉輪式濃縮器 與轉環式濃縮器之濃縮倍率可達5〜30倍,而以8〜15倍 為較佳;該流體化床濃縮器之濃縮倍率可達50〜10000倍, 而以100〜1000倍為較佳。又,該終處理單元為冷凝器或 焚化爐;當該終處理單元為焚化爐時,以其焚化熱提供該 濃縮單元所需之脫附熱;而該焚化爐為雙槽式蓄熱焚化 爐、多槽式蓄熱焚化爐、迴轉式蓄熱焚化爐、直燃式焚化 M367027 爐或觸媒式焚化爐。另,該常溫製程區為一般室溫5〜45 °c之調膠區、調漆區、塗佈區、油墨稀釋區及印刷區之一 或其組合,高溫製程區為60〜15(rc之烘烤區。 【實施方式】 首先,請參閱第一圖所示,本創作係包括有: -濃縮單元⑽,可為轉輪式濃縮器、轉環式濃縮器 或流體化床濃縮器,乃設置於塗佈製程之常溫(一般為5〜 45°C)製程區(如調膠區、調漆區、塗佈區、油墨稀釋區及 印刷區之一或其組合)下游端,而將常溫製程區所逸散之揮 發性有機廢氣,予以集氣淨化排放並濃縮處理;其中轉 輪式濃縮器與轉環式濃縮器之濃縮倍率可達5〜倍,流 體化床濃縮器之濃縮倍率可達2〇〜i〇〇0〇倍;以及 一終處理單元(20),可為冷凝器或焚化爐,乃設置於 塗:製程之高溫(一般力60〜15rc)製程區(如烘烤區)及 該濃縮單之端,㈣冑溫冑純所產生 及經該濃縮單元(10)所濃縮之揮發性有機魏予以淨化處 理者。 此外,該終處理單元(20)為焚化爐時,以其焚化熱提 供該濃縮單元(1〇)所需之脫附熱’而焚化爐可為雙槽式蓄 熱焚化爐、多槽式蓄熱焚化爐、迴轉式蓄熱焚化爐、直燃 式焚化爐或觸媒式焚化爐。 ‘”' 基於如是之構成,請再參閱第二、三圖所示,茲以背 光板業與膠帶業之應用例,說明本創作所欲達到之功效: 背光板業:其常溫製程區之溫度為25t,而逸散出濃 度為5〜100PPMv且風量為33〇NCMM之揮發性有機廢氣;其 M367027 南溫製程區之溫度為85°C ’而產生出濃度為500〜3000PPMV 且風量為900NCMM之揮發性有機廢氣;其中,揮發性有機 廢氣含有10%之甲苯(TOL)與90%之醋酸乙酯(EAC);然 而’先藉圖示(但不以此為限)之轉環式濃縮器(1〇a),以 其吸附區(11a)將低溫製程區所逸散出之揮發性有機廢 氣’予以集氣淨化成溫度為26.5°C而濃度為〇·5ΡΡΜν之淨 化氣體排放(淨化效率90%以上);再令溫度為25°c且風量 為33NCMM之脫附氣體,先經過脫附熱交換器(13a)加熱至 180C通過其脫附區(12a),將濃縮後之揮發性有機廢氣脫 附出來(濃縮倍率為10倍),乃成為溫度為、濃度為 45〜ΙΟΟΟΡΡΜν且風量為33NCMM之高濃度低風量濃縮廢氣, 而併入高溫製程區產生之揮發性有機廢氣,再由圖示(但不 以此為限)之雙槽式蓄熱焚化爐(2〇a),予以焚化處理並將 淨化氣體排放。 膠帶業:其低溫製程區之溫度為5〜35t:,而逸散出濃 度為5〜50PPMv且風量為250NCMM之揮發性有機廢氣;其 高溫製程區之溫度為75»C,而產生出濃度為1〇〇〇二 2000PPMV且風量為250NCMM之揮發性有機廢氣;其中,揮 發性有機廢氣含有30%之甲苯(T〇L)、2〇%之醋酸乙酯 (EAC)、30% 之二甲苯(XYLENE)與 20% 之丁酮(MEK);然而, 先藉圖示(但不以此為限)之轉輪式濃縮器(1〇b),以其吸 附區(lib)將常溫製程區所逸散出之揮發性有機廢氣,以 集氣後淨化排放;再令風量為16.7NC膽之脫附氣體,先經 過脫附熱交換器(13b)加熱至200。(:通過其脫附區(12b),將 濃縮後之揮發性有機廢氣脫附出來(濃縮倍率為15倍),乃 M367027 成為溫度為5(TC、濃度為75〜900PPMv且風量為16. 7NCMM 之咼濃度低風量濃縮廢氣,而併入高溫製程區產生之揮發 陡有機廢氣,再由圖示(但不以此為限)之迴轉式蓄熱焚化 爐(20b),予以焚化處理並將淨化氣體排放。 然而’在背光板業之應用例中,低溫製程區所逸散出 之揮發性有機廢氣’係以轉環式濃縮器(10a)予以淨化排 放,並將濃縮後之揮發性有機廢氣,脫附併入高溫製程區 產生之揮發性有機廢氣,再由雙槽式蓄熱焚化爐(2〇a)焚化 排放,另在膠帶業之應用例中,低溫製程區所逸散出之揮 發性有機廢氣’係以轉輪式濃縮器(10b)予以淨化排放,並 將濃縮後之揮發性有機廢氣,脫附併入高溫製程區產生之 揮發性有機廢氣,再由迴轉式蓄熱焚化爐(20b)焚化排放; 疋以,本創作具有將塗佈製程之低溫製程所逸散之揮發性 有機廢氣予以濃縮後,再與高溫製程所產生之揮發性有機 廢氣一同淨化之功效。 此外,在背光板業之應用例中,若未將常溫製程區所 逸散出之揮發性有機廢氣予以集氣濃縮,就直接集氣併入 高溫製程區產生之揮發性有機廢氣,則該雙槽式蓄熱焚化 爐(20a)就必須處理i230(330 + 900)NCMM之風量,然若先以 轉環式濃縮器(l〇a)予以濃縮(濃縮倍率為1〇倍),該雙槽 式蓄熱焚化爐(20a)乃僅須處理933(33+900)NCMM之風量; 另在膠帶板業之應用例中,若未將低溫製程區所逸散出之 揮發性有機廢氣予以集氣濃縮,就直接集氣併入高溫製程 區產生之揮發性有機廢氣,500(250+250)NCMM之風量為該 迴轉式蓄熱焚化爐(20b)所必須處理之風量,然若先以轉輪 M367027 式濃縮器⑽)予以濃缩(濃縮倍率$ 15倍),該迴轉式蓄 熱焚化爐⑽)乃僅須處理267(16 7+25G)n圓之風量;是 故’本創作可大幅降低終處理單元(如焚化爐)之負載,並 具有令淨化處理過程節能之功效。 綜上所述,本創作所揭示之構造,為昔所無,且確能 達到功效之增進,並具可供產業利用性,完全符合新型專 利要件,祈請貴審查委員核賜專利,以勵創新,無任德感。 惟,上述所揭露之圖式、說明,僅為本創作之較佳實 施例,大凡熟悉此項技藝人士,依本案精神範疇所作之修 飾或等效變化,仍應包括在本案申請專利範圍内。M367027 V. New description: [New technical field] This is a volatile organic waste gas treatment device for coating process, especially a volatile organic waste gas which is released from the normal temperature process zone. The gas is cleaned and discharged, and the concentrated volatile organic waste gas is desorbed into the volatile organic waste gas generated in the high temperature process zone, and then the final, processing unit purifies the emission designer. _ [Prior Art] According to Volium le Organic Compounds (VOCs), sources can be divided into anthropogenic sources and natural sources, while anthropogenic sources are mostly derived from organic solvents used in industrial processes, but There are quite a lot of industries and complex types of VOCs in the process. The organic solvent components and ratios used in different industries and processes are quite different. The VOCs in the industry also have many differences in exhaust gas characteristics, and VOCs are treated under high temperature or normal temperature processes. It will volatilize, but since many of the coating process's normal temperature process is an open process, it is the main source of fugitive VOCs. # Next, for some industries where high-temperature process will produce high concentration and the normal temperature process may escape low-concentration and high-volume volatile organic waste gas, a simple process description will be given: '1. PU synthetic leather industry: PU (polyurethane) Formate) - Synthetic leather process is divided into dry and wet, dry process can be divided into transfer method and coating method, while wet process has impregnation method and coating method, taking dry transfer process as an example. The PU synthetic skin is prepared by dissolving the PU resin in an organic solvent, applying it to the release paper at room temperature, and drying the PU resin on the release M367027 paper to form a skin layer, and then using the adhesive to laminate the base fabric with the adhesive. After the skin is laminated and then processed by the "way drying process", the mineralized release paper is the finished PU synthetic skin. Second, the tape industry: the tape process mainly uses acrylic resin and rubber in an organic solvent to be diluted at room temperature and then coated on different substrates (such as 〇pp, PVC, PE, cloth, composite materials and cellophane, etc.) Above, it is heated by an oven for baking, and the organic solvent is evaporated, the resin is dried to form a skin layer and completely adhered to the base fabric, and then processed, and cut to obtain a finished product. Second, the backlight board industry: the process of the backlight board is to mix the adhesive with an organic solvent at normal temperature, and is applied to the light guide plate, and then the functional optical film of the rural layer is adhered to the light guide plate, and the adhesive is cured by heating. Made into finished products. 4. Coating industry: The coating process applies a coating containing an organic solvent to the coating at room temperature, and then is baked and baked by heating. V. Printing industry: Process pollution sources include ink dilution adjustment and printing at normal temperature, and drying at high temperatures. However, the coating process generally only processes volatile organic waste gas in a high-temperature process, and the volatile organic waste gas generated by a normal temperature process (such as mixing, painting, coating, ink dilution, and P brush) has a relatively low temperature process. Many, so the volatile organic waste gas that is escaping from the normal temperature process is generally not treated. 'But many of the coating processes are open-process processes, and if they are not effectively collected, they become fugitive volatile organic compounds. The main source of exhaust gas' and the volatile organic waste gas emitted by the 2-temperature process are high air volume and low concentration. If the gas is to be collected and then incinerated, the upper part of the incineration must be adopted because of the high air volume and low spread. The final processing equipment of the capacity and the consumption of more fuel (energy) can be incinerated. M367027 [New Content] The main purpose of this creation is to solve the problem that the prior art does not collect the volatile organic waste gas that has been dispersed in the normal temperature process of the coating process, and collects and purifies the concentrated process. The volatile organic waste gas dispersed in the normal temperature process is concentrated, and then purified together with the volatile organic waste gas generated by the high temperature process, and the effect of reducing the capacity of the final treatment equipment is achieved. Another purpose of this creation is to have the effect of saving energy in the purification process. In order to achieve the above effects, the structural features of the creation include: a concentration unit disposed at the downstream end of the normal temperature process zone of the coating process, and the volatile organic waste gas dispersed in the normal temperature process zone is subjected to gas purification and discharge. And concentrating; and a final processing unit disposed at a high temperature processing zone of the coating process and a downstream end of the desorption zone of the concentration unit, and the volatile organic waste gas generated by the high temperature process zone and concentrated by the concentration unit is Purify the processor. In addition, the concentration unit (Concentrator) is a Rotor type rotary concentrator, a Carousel type rotary concentrator or a fluidized bed concentrator; wherein the rotary wheel type The concentration ratio of the concentrator and the rotary concentrator can be 5 to 30 times, and preferably 8 to 15 times; the concentration ratio of the fluidized bed concentrator can be 50 to 10000 times, and 100 to 1000 times. It is better. Moreover, the final treatment unit is a condenser or an incinerator; when the final treatment unit is an incinerator, the heat of incineration is used to provide the desorption heat required for the concentration unit; and the incinerator is a double tank type thermal storage incinerator, Multi-tank thermal storage incinerator, rotary thermal storage incinerator, direct-fired incineration M367027 furnace or catalytic incinerator. In addition, the normal temperature process area is one of a mixing zone, a paint adjustment zone, a coating zone, an ink dilution zone and a printing zone of a general room temperature of 5 to 45 ° C, or a combination thereof, and the high temperature process zone is 60 to 15 (rc 【Examples】 First, please refer to the first figure. The creation includes: - Concentration unit (10), which can be a rotary concentrator, a rotary concentrator or a fluidized bed concentrator. It is disposed at the normal temperature (usually 5 to 45 ° C) process area of the coating process (such as the mixing zone, the paint adjustment zone, the coating zone, the ink dilution zone and one or a combination of the printing zones), and the normal temperature The volatile organic waste gas dissipated in the process area is collected and purified, and concentrated and concentrated; wherein the concentration ratio of the rotary concentrator and the rotary concentrator can reach 5 times, and the concentration ratio of the fluidized bed concentrator can be Up to 2〇~i〇〇0〇 times; and a final processing unit (20), which can be a condenser or an incinerator, is disposed in a coating process: a high temperature (general force 60~15rc) process area (such as a baking zone) And the end of the concentration sheet, (4) the temperature generated by the 胄 胄 胄 pure and concentrated by the concentration unit (10) In addition, when the final treatment unit (20) is an incinerator, the incineration heat is used to provide the desorption heat required for the concentration unit (1〇), and the incinerator can be a double-tank heat storage. Incinerator, multi-tank thermal storage incinerator, rotary heat storage incinerator, direct-fired incinerator or catalytic incinerator. '"' Based on the structure, please refer to the second and third figures, The application examples of the board industry and the tape industry illustrate the effects of this creation: Backlight board industry: the temperature in the normal temperature process area is 25t, and the concentration of the escaped concentration is 5~100PPMv and the air volume is 33〇NCMM. Exhaust gas; its M367027 temperature in the south temperature process zone is 85 ° C ', and produces volatile organic waste gas with a concentration of 500~3000PPMV and air volume of 900NCMM; among them, volatile organic waste gas contains 10% toluene (TOL) and 90% Ethyl acetate (EAC); however, the rotary ring concentrator (1〇a), which is illustrated by, but not limited to, the lower temperature process zone is dispersed by its adsorption zone (11a). Volatile organic waste gas is collected and purified to a temperature of 26.5 ° C The concentration of the purification gas is 〇·5ΡΡΜν (purification efficiency is more than 90%); the desorption gas with a temperature of 25°c and an air volume of 33NCMM is first dehydrated by the desorption heat exchanger (13a) to 180C. In the zone (12a), the concentrated volatile organic waste gas is desorbed (concentration ratio is 10 times), and is a high concentration low-volume concentrated exhaust gas having a temperature of 45 ΙΟΟΟΡΡΜ ν and an air volume of 33 NCMM, and is incorporated into the high temperature. The volatile organic waste gas produced in the process area is incinerated and discharged by a double-tank thermal storage incinerator (2〇a) as shown (but not limited to this). Tape industry: its low temperature process area The temperature is 5~35t:, and the volatile organic waste gas with the concentration of 5~50PPMv and the air volume is 250NCMM; the temperature in the high temperature process zone is 75»C, and the concentration is 1〇〇〇2000PMV and Volatile organic waste gas with a volume of 250 NCMM; among them, volatile organic waste gas contains 30% toluene (T〇L), 2% by weight ethyl acetate (EAC), 30% xylene (XYLENE) and 20% Ketone (MEK); however, However, the rotary concentrator (1〇b), which is not limited to this, uses the adsorption zone (lib) to dissipate the volatile organic waste gas emitted from the normal temperature process zone to collect and purify the exhaust gas; The desorbed gas of 16.7 NC was first heated to 200 by a desorption heat exchanger (13b). (Now, the concentration of the volatile organic waste gas is desorbed by the desorption zone (12b) (concentration ratio is 15 times), and the temperature is 5 (TC, the concentration is 75 to 900 PPMv and the air volume is 16. 7 NCMM The concentration of low-volume air is concentrated in the exhaust gas, and the volatilized steep organic waste gas generated in the high-temperature process zone is merged, and then the rotary-type thermal storage incinerator (20b) shown in the figure (but not limited thereto) is incinerated and purified. Emissions. However, in the application of the backlight panel industry, the volatile organic waste gas emitted from the low-temperature process zone is purified by a rotary concentrator (10a), and the concentrated volatile organic waste gas is discharged. Desorbed into the high-temperature process zone to produce volatile organic waste gas, which is incinerated by a two-tank regenerative incinerator (2〇a). In the application of the tape industry, volatile organic compounds are emitted from the low-temperature process zone. The exhaust gas is purified by a rotary concentrator (10b), and the concentrated volatile organic waste gas is desorbed into the volatile organic waste gas generated in the high-temperature process zone, and then the rotary heat storage incinerator (20b) Incineration row疋 , 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本In the example, if the volatile organic waste gas escaping from the normal temperature process zone is not collected and concentrated, and the gas is directly collected into the volatile organic waste gas generated in the high temperature process zone, the double tank type heat storage incinerator (20a) It is necessary to process the air volume of i230 (330 + 900) NCMM, but if it is concentrated first by a rotary concentrator (l〇a) (concentration ratio is 1〇), the double-tank type thermal storage incinerator (20a) is only It is necessary to handle the air volume of 933 (33+900) NCMM; in the application example of the tape board industry, if the volatile organic waste gas emitted from the low-temperature process zone is not collected and concentrated, the gas is directly integrated into the high-temperature process. The volatile organic waste gas produced in the area, the air volume of 500 (250+250) NCMM is the air volume that must be processed by the rotary heat storage incinerator (20b), but it is concentrated first by the runner M367027 concentrator (10). The magnification is $15 times), the rotation The type of thermal storage incinerator (10) only needs to handle 267 (16 7+25G) n round air volume; therefore, this creation can greatly reduce the load of the final treatment unit (such as incinerator) and has the effect of saving energy in the purification process. . In summary, the structure revealed by this creation is unprecedented, and it can achieve the improvement of efficacy, and it can be used for industrial utilization. It fully complies with the new patent requirements, and invites your review committee to grant patents. Innovation, no sense of morality. However, the above-mentioned drawings and descriptions are only preferred embodiments of the present invention. Those who are familiar with the art, and the modifications or equivalent changes made in accordance with the spirit of the case should still be included in the scope of the patent application.

-9- M367027 【圖式簡單說明】 第一圖係本創作之結構說明圖 第二圖係本創作應用 第三圖係本創作應用 於背光板業之結構說明圖。 於膠帶業之結構說明圖。 【主要元件符號說明】 (10)濃縮單元-9- M367027 [Simple description of the diagram] The first diagram is the structure description diagram of the creation. The second diagram is the application of the creation. The third diagram is the structural description of the application in the backlight board industry. The structural description of the tape industry. [Main component symbol description] (10) Concentration unit

(10a)轉環式濃縮器 (11a)吸附區 (12a)脫附區 (13a)脫附熱交換器 (l〇b)轉輪式濃縮器 (lib)吸附區 (12b)脫附區 (13b)脫附熱交換器 (20)終處理單元 (20a)雙槽式蓄熱焚化爐 (20b)迴轉式蓄熱焚化爐 10.(10a) Spiral concentrator (11a) adsorption zone (12a) desorption zone (13a) desorption heat exchanger (l〇b) rotary concentrator (lib) adsorption zone (12b) desorption zone (13b) Desorption heat exchanger (20) final treatment unit (20a) double trough type thermal storage incinerator (20b) rotary regenerative incinerator 10.

Claims (1)

M367027 六、申請專利範圍: 1 .一種塗佈製程用揮發性有機廢氣處理裝置,係包 括有: -濃縮單元,設置於塗佈製程之常溫製程區下游端, 而將常溫製程區所逸散之揮發性有機廢氣,^ 排放並濃縮處理;以及 ' —-終處理單元’設置於塗佈製程之高溫製程區及該濃 縮單兀之脫附區下游端,而將高溫製程區所產生及經該濃 縮單元所濃縮之揮發性有機廢氣予以淨化處理者。 2 .如申請專利範圍第工項所述之塗佈製程用揮發性 有機廢氣處縣置,其中,料縮單元為轉輪式濃縮器、 轉環式濃縮器或流體化床濃縮器。 3.如申請專利範圍第2項所述之塗佈製程用揮發性 有機廢氣處理裝置,其中,該轉輪式濃縮器與轉環式濃縮 之濃縮倍率可達5〜30倍,而以8〜15倍為較佳;該流 體化床濃縮器之濃縮倍率可達2〇〜1〇〇〇()倍,而以1〇〇〜 1000倍為較佳。 4·如申請專利範圍第1項所述之塗佈製程用揮發性 有機廢氣處理裝置,其中,該終處理單元為冷凝器或焚化 爐0 -11 - M367027 0•如申請專利範圍第4項所述之塗佈製程用揮發性 有機廢氣處理裝置,其中,該終處理單元為焚化爐時,以 其焚化熱提供該濃縮單元所 需之脫附熱。 6如申請專利範圍第5項所述之塗佈製程用揮發性 有機廢氣處理裝置’其中,該焚化爐為雙槽式蓄熱焚化爐、 多槽式蓄熱焚化爐、迴轉式蓄熱焚化爐、直燃式焚化爐或 觸媒式焚化爐。 7 .如申請專利範圍第丄至6項任一項所述之塗佈製 程用揮發性有機廢氣處理I置,其中,該f溫製程區為5 45 C之調膠區、調漆區、塗佈區、油墨稀釋區及印刷區 之一或其組合,高溫製程區為60〜15(TC之烘烤區。M367027 VI. Scope of Application: 1. A volatile organic waste gas treatment device for coating process, comprising: - a concentration unit disposed at a downstream end of a normal temperature process zone of a coating process, and which is disposed at a normal temperature process zone Volatile organic waste gas, ^ discharge and concentration treatment; and '--final treatment unit' is disposed in the high temperature process zone of the coating process and the downstream end of the desorption zone of the concentration unit, and the high temperature process zone is generated and The volatile organic waste gas concentrated by the concentration unit is purified by a processor. 2. The volatile organic waste gas for coating process as described in the application of the patent scope is in the county, wherein the shrinking unit is a rotary concentrator, a rotary concentrator or a fluidized bed concentrator. 3. The volatile organic waste gas treatment device for coating process according to claim 2, wherein the concentration ratio of the rotary concentrator and the rotary ring concentration is up to 5 to 30 times, and 8 to 8 15 times is preferred; the concentration ratio of the fluidized bed concentrator can be up to 2 〇 to 1 〇〇〇 () times, and preferably from 1 〇〇 to 1000 times. 4. The volatile organic waste gas treatment device for coating process according to claim 1, wherein the final treatment unit is a condenser or an incinerator 0 -11 - M367027 0 • as claimed in item 4 The volatile organic waste gas treatment device for coating process, wherein when the final treatment unit is an incinerator, the heat of incineration is used to provide the desorption heat required for the concentration unit. [6] The volatile organic waste gas treatment device for coating process according to claim 5, wherein the incinerator is a double tank type heat storage incinerator, a multi-tank type heat storage incinerator, a rotary heat storage incinerator, and direct combustion Incinerator or catalytic incinerator. 7. The volatile organic waste gas treatment I for coating process according to any one of claims 6 to 6, wherein the f temperature processing zone is a 5 45 C rubber mixing zone, a paint mixing zone, and a coating process. One or a combination of the cloth area, the ink dilution area and the printing area, and the high temperature processing area is 60 to 15 (the baking area of TC). -12--12-
TW98206386U 2009-04-17 2009-04-17 Volatile organic compound processing device for coating process TWM367027U (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI504429B (en) * 2010-12-31 2015-10-21
TWI604883B (en) * 2016-07-22 2017-11-11 Jg Environmental Technology Co Ltd Organic waste gas pretreatment purification system and organic waste gas purification method of coating operation

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI504429B (en) * 2010-12-31 2015-10-21
TWI604883B (en) * 2016-07-22 2017-11-11 Jg Environmental Technology Co Ltd Organic waste gas pretreatment purification system and organic waste gas purification method of coating operation

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