M366101 五、新型說明： 【新型所屬之複術領域】 本新型係有關於一種影像擷取裝置的元件，特別是指一種影像 感測模組。 【先前技術】 如圖1所示，是習知影像感測模組的結構示意圖。一影像感測 模組10〇包括一電路板101、連接於電路板101上的一影像感測元 件102、一承座103，以及設置在承座1〇3上的一濾光片1〇4。 • 該承座103呈底部開口的蓋狀’且設置有四個定位柱1〇6。在 電路板101的四角各設置有一對應配合的缺口 107,使得承座103 扣置於電路板101上，並在兩者之間形成密閉的内部空間。在承 座1〇3的頂面上開設有一窗口丨05,濾光片1〇4即設置在窗口 1〇5 内，使光線可透過濾光片104到達影像感測元件1〇2。 組裝時，需要在承座103與電路板1〇1之間點膠並進行烘烤， 使膠合劑凝固，從而使兩者連接在一起。由於膠合劑在烘烤的過 耘中會產生大量的氣體，使得承座1〇3與電路板1〇1之間的密閉 鲁空’力增大，進而導致承座1〇3與電路板1〇1相對於彼此的位 置發生偏離。因此，預先在承座1〇3頂面上設置有通氣孔1〇8，該 通氣孔貫穿内部空間，以使該影像感測模組1〇〇在遇熱時可 •將氣體排出。將承座103與電路板101連接完畢後需要增加作業 程序，將通氣孔1〇8封住，以避免灰塵從通氣孔1〇8進入而落到 影像感測元件1〇2上而影響成像。 這種結構的缺陷在於：將承座1〇3與電路板1〇1連接後，必 須增加後續的工作程序：將通氣孔1〇8封住，增加了組裝的複雜 私度。且通氣孔1〇8設置在承座1〇3的頂面上，會影響到影像感 M366101 測楔組100的外觀。並且，該 電路板而連接後、通氣㈣鹿在承座， 飄落到影像感測模组應内部。.泪之别’灰塵很容易因重力 【新型内容】 觀的缺陷，雜 針 械測模組組裝複雜、影響外 的、陷M、-種排氣的同時能夠減少 外觀的影響之影像感測模組。 彳減小對 件輪雜撕地-嫩；—影像感測元 Hit路板上；以及一承座，包括一頂板及多個侧板，承 ^扣置於電路板上’從而在兩者之間形成内腔；其中，承座的至 二-個側板底面上設置有翻腔以及外界相通且呈曲折形的 氣槽。 W本新型的影縣職組具有町有益效果：將排氣槽設置 在承座的各側板的底面上’組裝完畢後排氣槽位於承座與電路板 之間’不會影響鄉像制模_外觀。另外，由 折的雜，且深度錢，將承座與板崎在—起後 Φ要將排氣槽封閉’因此減少了後續的工作程序。並且由於這種曲 折的形狀，使灰塵不易進入内腔内。 【實施方式】 如圖2和圖3所示’一影像感測模組200包括一電路板201、 連接於電路板2〇1上的一影像感測元件202、一承座203，以及設 置在承座203上的一平板玻璃204。其中影像感測元件202可以是 例如電荷輕合器件（Charge Coupled Device ’簡稱CCD)或者互 補金屬氧化物半導體（Complementary Metal Oxide Semiconductor，簡稱CMOS)。該平板玻璃2Ό4可以是例如，紅外 4 M366101 濾光片。 承座203呈底部開口的蓋狀，包括一頂板2〇3a及四個侧板 . 203b。在承座203的頂板203a上，設置有窗口 203c。該窗口 2〇3c 呈台階形且帶有一台階面203d (參照圖3 )。平板玻璃204的底面 承靠於台階面203d上，藉此定位並使用膠合劑點膠固定。光線通 過對應影像操取設備的光學系統後，透過平板玻璃Μ#再到達影 ' 像感測元件202。 ’ - 在承座203的四角、兩個側板203b的相鄰處分別設有一定位 • 柱205，定位柱205的延伸方向垂直於承座203的頂板203a。定 位柱205的數量為四個，在電路板2〇1的四角設置有對應的四個 缺口 206各疋位柱205與對應的缺口 206配合，使承座203相對 於電路板201定位，並使得承座2〇3的各侧板騰的底面貼置於 電路板201上’從而在承座2〇3與電路板2〇1之間形成一内腔2〇7 (參k圖3)。影像感測元件202即設置於該内腔2〇7内。在其他 的實施例中，可在電路板2G1上設置定位孔來替代缺口施’，、定 位柱205與定位孔配合，可達到同樣的目的。 • 組裝時，需要在承座203的各側板203b的底面與電路板2〇1 的對應位置之間轉，並進行輯’使谬合舰固。由於在棋烤 過^令I產生大菫的氣體，使得承座2〇3舆電路板之間的空 -間壓力增大，導致兩者的相對位置發生偏離，因此，在承座2〇3 .上預先設置有排氣槽。 如圖4所不，不出了承座203的結構示意圖。在承座2〇3的至 少-個側板2〇3b的底面上設置有曲折的一排氣槽2〇8。在如圖所 示的實施例中，排氣槽施包括三段：與内腔斯相通且彼此分 離的兩個第-段208a、將兩個第一段2〇8a連接起來的一第二段 208b ’以及連接在第二段2〇8b的中部並與外界相通的一第三段 M366101 208c ’這三段共同構成曲折的形狀，其中第二段獅 内腔207相通，也不直接與外界相通。 接〃 如圖所示的形狀外，排氣槽也可以是其他的曲折形 St迷宮形。在垂直於氣流流動的方向上，排氣槽施的各 ==截面的大小都比較狹窄。這種形狀有利於氣流順利排出， 同時可避免灰塵輕易進入。 圖5所不’不出了影像感測模'组200沿排氣槽208的第—段 208a的局部剖視圖。第一段2〇 又 产較深认 的度車誠，弟二段208b的深 t i 的深度可以比第二段聽更深（圖未示）。 =^排氣槽各段的深度在從靠近外界到靠近内腔2〇7的方 =漸變淺’使得整個排氣槽观呈階梯形，排氣槽施的深度 =训〜0.02毫米之間變化。由此看出，整個排氣槽施非常的 ^ ’這樣可有效阻止灰塵進入，其他形狀的排氣槽施也可採 用思種階梯形的設置。 在各侧板鳩的底面上還設置有朝向外界的—倒角段2〇9， =段謝與排氣槽施的第三段職相通，這種結構在承座2〇3 j路板20!之間形成縱截面為三角形的空隙，以便於氣體順利 =一’同咖作封閉口 ’當崎完畢後，可視f求在該倒角· 内填充密珊料‘，以滿足在某-些豫況下的棒殊要求。 <罢相比見有技術而口本新型的影像感測模組200將排氣槽遞 :^承座朋的各側板2㈣的底面上，組裝完畢後排氣槽2〇8 :承座203與電路板2()1之間，不會影響到影像感測模組雇 外觀。又由於排氣槽施為曲折的形狀，且深度很淺，將承座 組裝在—起後’可不需要將排氣槽封閉， 2減少了後續的工作程序，並且由於這種曲折的形狀，灰塵不 易進入内腔207内。 M366101 惟以上該者，僅為本新型之較佳實施例而已，當不能以此限定 本新型實施之範圍，即大凡依本新型申請專利範圍及新型說明内 谷所作之簡單的專效變化與修飾，皆仍屬本新型專利涵蓋之範圍 内。 【圖式簡單說明】 圖1是習知影像感測模組的結構示意圖； 圖2是本新型影像感測模組的分解示意圖； 圖3是本新型影像感測模組的剖視圖； 圖4是本新型影像感測模組中承座的結構示意圖；及 圖5是本新型影像感測模組沿排氣槽的第—段的局部剖视 【主要元件符號說明】 200影像感測模組 2〇8排氣槽 201電路板 208a第一段 2〇2影像感測元件 208b第二段 203 承座 208c第三段 2〇3a頂板 209倒角段 203b側板 203c 窗口 203d台階面 204平板玻璃 205 定位柱 206 缺口 207 内腔M366101 V. New description: [New type of reincarnation field] This new type relates to an element of an image capturing device, in particular to an image sensing module. [Prior Art] As shown in FIG. 1, it is a schematic structural diagram of a conventional image sensing module. An image sensing module 10A includes a circuit board 101, an image sensing component 102 connected to the circuit board 101, a socket 103, and a filter 1〇4 disposed on the socket 1〇3. . • The socket 103 has a lid-shaped opening at the bottom and is provided with four positioning posts 1〇6. A correspondingly-fitted notch 107 is provided at each of the four corners of the circuit board 101 such that the socket 103 is fastened to the circuit board 101 and forms a sealed internal space therebetween. A window 丨05 is formed on the top surface of the socket 1〇3, and the filter 1〇4 is disposed in the window 1〇5 to allow light to pass through the filter 104 to reach the image sensing element 1〇2. When assembling, it is necessary to dispense and bake between the socket 103 and the circuit board 1〇1 to solidify the glue, thereby connecting the two together. Since the glue generates a large amount of gas in the baking process, the sealing force between the socket 1〇3 and the circuit board 1〇1 is increased, thereby causing the socket 1〇3 and the circuit board 1 〇1 deviates from the position of each other. Therefore, a vent hole 1〇8 is provided on the top surface of the socket 1〇3 in advance, and the vent hole penetrates the internal space so that the image sensing module 1 can discharge the gas when it is heated. After the socket 103 is connected to the circuit board 101, an operation procedure is required to seal the vent holes 1〇8 to prevent dust from entering the vent holes 1〇8 and falling onto the image sensing element 1〇2 to affect imaging. The disadvantage of this construction is that after the socket 1〇3 is connected to the circuit board 1〇1, the subsequent work procedure must be added: the venting holes 1〇8 are sealed, which increases the complicated privacy of the assembly. And the vent hole 1〇8 is disposed on the top surface of the socket 1〇3, which affects the appearance of the image sensing M366101 wedge group 100. Moreover, after the circuit board is connected, the ventilating (four) deer is seated and falls to the inside of the image sensing module. . "Difficult to tears" dust is easy to be due to gravity [new content] view of the defects, miscellaneous needles test module assembly complex, influential, trap M, - kind of exhaust while reducing the impact of the appearance of the image sensing mode group.彳 reduce the twisting of the piece wheel to the ground--; image sensing element Hit plate; and a socket, including a top plate and a plurality of side plates, the buckle is placed on the circuit board' The inner cavity is formed; wherein the bottom surface of the two side plates of the socket is provided with a turning cavity and a gas groove which is externally connected and has a meander shape. W The new Yingxian team has the beneficial effect of the town: the exhaust groove is placed on the bottom surface of each side plate of the socket. 'The exhaust groove is located between the socket and the circuit board after assembly' does not affect the township model. _Exterior. In addition, due to the folding of the miscellaneous, and the depth of money, the bearing and the board are in the Φ to close the venting groove, thus reducing the subsequent work procedures. And due to this tortuous shape, dust is not easily entered into the inner cavity. [Embodiment] As shown in FIG. 2 and FIG. 3, an image sensing module 200 includes a circuit board 201, an image sensing component 202 connected to the circuit board 201, a socket 203, and A plate glass 204 on the socket 203. The image sensing component 202 can be, for example, a Charge Coupled Device (CCD) or a Complementary Metal Oxide Semiconductor (CMOS). The flat glass 2Ό4 may be, for example, an infrared 4 M366101 filter. The socket 203 has a lid shape with an open bottom, and includes a top plate 2〇3a and four side plates 203b. On the top plate 203a of the socket 203, a window 203c is provided. The window 2〇3c is stepped and has a stepped surface 203d (refer to Fig. 3). The bottom surface of the flat glass 204 bears against the stepped surface 203d, thereby being positioned and fixed by glue. After passing through the optical system of the corresponding image manipulation device, the light passes through the flat glass Μ# to reach the image sensing element 202. ??? - A positioning column 205 is respectively disposed adjacent to the four corners of the socket 203 and the two side plates 203b, and the positioning column 205 extends in a direction perpendicular to the top plate 203a of the socket 203. The number of the positioning posts 205 is four, and four corresponding notches 206 are disposed at the four corners of the circuit board 2〇1. Each of the clamping posts 205 cooperates with the corresponding notch 206 to position the bearing base 203 with respect to the circuit board 201, and The bottom surface of each side plate of the socket 2〇3 is placed on the circuit board 201' to form an inner cavity 2〇7 between the socket 2〇3 and the circuit board 2〇1 (refer to FIG. 3). The image sensing element 202 is disposed in the inner cavity 2〇7. In other embodiments, a positioning hole may be provided on the circuit board 2G1 instead of the notch, and the positioning post 205 is engaged with the positioning hole to achieve the same purpose. • When assembling, it is necessary to rotate between the bottom surface of each side plate 203b of the socket 203 and the corresponding position of the circuit board 2〇1, and perform a combination to make the ballast. Due to the large amount of gas generated during the baking of the chess, the air-to-space pressure between the 2〇3舆 boards of the socket is increased, causing the relative positions of the two to deviate, and therefore, the bearing 2〇3 A venting groove is provided in advance. As shown in Fig. 4, the structure of the socket 203 is not shown. On the bottom surface of at least one of the side plates 2〇3b of the seat 2〇3, a tortuous groove 2〇8 is provided. In the embodiment shown, the venting groove includes three sections: two first segments 208a communicating with the inner cavity and separated from each other, and a second segment connecting the two first segments 2 〇 8a 208b 'and a third segment M366101 208c' connected to the middle of the second segment 2〇8b and communicating with the outside world form a tortuous shape, wherein the second segment of the lion lumen 207 is in communication and is not directly connected to the outside world. . In addition to the shape shown in the figure, the venting groove can also be other zigzag St labyrinth shapes. In the direction perpendicular to the flow of the airflow, the size of each == section of the exhaust duct is relatively narrow. This shape facilitates the smooth discharge of airflow and prevents dust from entering easily. 5 is a partial cross-sectional view of the image sensing die set 200 along the first segment 208a of the vent 208. In the first paragraph, the depth of the second section of the 208b is deeper than that of the second section (not shown). =^The depth of each section of the venting groove is from the vicinity of the outside to the side close to the inner cavity 2〇7=gradient shallow', so that the entire venting groove is stepped, and the depth of the venting groove is changed to 0.02 mm. . It can be seen that the entire venting groove is applied with a very ^' to effectively prevent dust from entering, and other shapes of the venting groove can also be arranged in a stepped shape. On the bottom surface of each side plate rafter, there is also a chamfering section 2〇9 facing the outside, and the segment is connected with the third section of the venting groove, and the structure is on the bearing 2〇3 j board 20 Between the formation of a vertical section of the triangle gap, in order to facilitate the smooth gas = a 'cafe with a closed mouth' after the completion of the Saki, see the chamfer inside the filling of the material to meet in some The special requirements under the conditions of the case. <Compared with the technology, the new image sensing module 200 transmits the exhaust groove to the bottom surface of each side plate 2 (four) of the seat, and after assembly, the exhaust groove 2〇8: the seat 203 Between the board 2 () 1, it does not affect the appearance of the image sensing module. Moreover, since the exhaust groove is in a tortuous shape and the depth is very shallow, the assembly of the socket after the assembly can eliminate the need to close the exhaust groove, 2 reduces the subsequent working procedure, and due to the tortuous shape, dust It is not easy to enter the inner cavity 207. M366101 However, the above is only the preferred embodiment of the present invention, and the scope of the present invention cannot be limited thereto, that is, the simple special effect change and modification made by the new patent application scope and the new description. , are still within the scope of this new patent. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic structural view of a conventional image sensing module; FIG. 2 is an exploded perspective view of the novel image sensing module; FIG. 3 is a cross-sectional view of the novel image sensing module; FIG. 5 is a partial cross-sectional view of the first embodiment of the image sensing module of the present invention; FIG. 5 is a partial cross-sectional view of the first image sensing module of the present invention along the exhaust slot [main component symbol description] 200 image sensing module 2 〇8 venting slot 201 circuit board 208a first section 2 〇 2 image sensing element 208b second section 203 socket 208c third section 2 〇 3a top plate 209 chamfer section 203b side panel 203c window 203d step surface 204 flat glass 205 positioning Column 206 notch 207 lumen