M364912 五、新型說明： 【新型所屬之技術領域】 本創作係有關一種觸控板’特別是一種電容式觸控板。 【先前技術】 現代消費性電子裝置多配備觸控板做為其輸入裝置之一。為符合輕、 • 薄 '短、小，觸控板亦多與面板整合成為觸控式面板，以方便使用者輪 Φ 入。觸控板根據感測原理的不同可分為電阻式、電容式、紅外線式或超 音波式等。電阻式觸控板利用兩導電薄膜作為上下電極，使用者施壓導 致上下電極導通，如此一來，只要測知面板的電壓變化，即可計算接觸 點的位置。一般電容式觸控板是以銦錫氧化物（IT0)導電材料設置於玻 璃基板的結構，在ΙΤΟ玻璃的四角放電時可於表面形成一均勻的電場， 當可導電物體(如使用者的手指)觸碰時會吸取微量的電流，此細微變化傳 送至連接的控制器作進一步分析以檢測出可導電物體的輸入位置。電容 式觸控板具有防塵'防火以及高解析度等優點，故已逐漸被大量採用， 但習知技術大多採用兩層的導電層，所以觸控板結構的厚度較厚，不利 練薄的要求。因此’透過簡化而有效益的生纽絲提高電容式觸控 ^ 板的品質與生產成本的降低是此領域之人士努力的方向之一。 【新型内容】 -種電容式觸控板，具有包含金屬導線連接結構作為橋接結構的一部 分，可提供簡化的製程與較佳的物性與電性。 —-種電容摘純，其彻金屬導__娜輕職置，可增進 電谷感應效能的敏感度與精確度。 3 M364912 -種電容式觸控板，其彻金料線連接結構傳遞_位置，在結 上可減少建構觸控板的厚度，以利觸控板的輕薄所需。 根據上述，本創作之一實施例提供一種電容式觸控板，包含—透明基 層、-透明導電層、複數透明絕緣體與複數金屬連接結構。透二 位於透明基層上，其包含—第—感__與—第二感奪陣列交錯設 置且彼此隔離，其中第一感測區陣列包含複數第一感測墊與複數透曰= 2連接結構將第-感測塾電性連接於K向，第二感測區陣列則包 含複數第二感測墊且彼此隔離。複數透明絕緣體位於透明導電層上，其 中每-透明絕緣體對應並覆蓋於每一透明導電連接結構上。複數金屬連 接結構位於透鴨賴±，其職些第二_魏性雜於—不同 一方向的第二方向。 、 以下藉由具體實施例配合所附的圖式詳加說明，應當更容易瞭解本創 作之目的、技術内容、特點及其所達成之功效。 【實施方式】 圖1A為根據本創作之一實施例說明一電容式觸控板之正視示意 圖。一電容式觸控板的感測區域10包含一透明基層102、一透明導電層 104位於透明基層1〇2上。透明導電層1〇4包含一第一感測區陣列⑽與 一第二感測區陣列105交錯設置且彼此隔離，其中第-感測區陣列103 包含複數第一感測墊1031與複數透明導電連接結構1〇33將第一感測墊 1031電性連接於一第一方向X，帛二感測區陣列105 &含複數第二感測 墊1051且彼此隔離。於一實施例中，第一感測墊1〇31與第二感測墊1〇51 的幾何形狀呈菱形或是錢形，尺寸大小相同或概H測塾1031 以長條形的透明導電連接結構1033將其電性連接以達到緻密排列的目 的，但本創作並不限於此。再者，第一接點1〇6與第二接點1〇8位於感 測區域10外圍之一側邊或多側邊可分別與第一感測墊1〇31與第二感測 墊1051電性連接。 4 M364912 達Λ第二^職麗的電性連_應傳_由__ 2勃’於—實施射，金屬連接結構地的寬度报小，因此對 導ΪίΪ^3的3^/次，本創作所謂的橋接結構單位係由一透明 過沿第—方向x排列，金屬連接結構_跨 大Ϊ透構舰沿第二方向Y排列，透明絕緣體202的寬度則 t構觀以確保其與金屬連接結_接觸。再者， 點=Π?觸控板的感測區域10外的板邊緣上包含複數第-接 ::匕 分別電性連接第一感測區陣列103與-第二感測 —端再連接至訊號輸出排線或導路(圖上未示）。其 二1 2後，會再以另一透明材料覆蓋於上以作結 =:=^:=過_緣體~導 構，作以金屬連接結構302取代傳統全為透明導電連接結 相鄰的疊層、，其優=^:302置於距第一或第二感測塾較遠的疊層而非 性效：===:3言，金屬連接結構的物性與電 爲層，統將金屬連接結構製作於距第-或第二感·較近的 i明導電圖形時，===二，結構而言’當以王水侧形成 下之金屬連齡爐。Λ 有破、造成王水赖在絕緣層 最後:優,接結構中 =ΞΗ====: 雷廢=ΐ〇Ω 、、數彳°，例如一般金屬連接結構為400nm，透明導 nm易化成金屬(厚膜)連接結構上的透明導電層(薄膜)疊接不 6 M364912 良(如不平整或細縫)。相較於傳統，本創作的金錢接結構為橋接結構中 最後製作的優點在於可避免此種情形產生； ⑷對於傳統將金屬連接結難作於距第__或第二感測塾較近的 製作絕緣體與透明導電連接結構而言，由於絕緣體形成於 透月導電連接輯之前’因此形錢明魏連接 絕緣體，如此形成的義導電連接結構 =避免_傷及M364912 V. New Description: [New Technology Field] This creation is about a touch panel, especially a capacitive touch panel. [Prior Art] Modern consumer electronic devices are often equipped with a touch panel as one of their input devices. In order to meet the light, thin and short 'small and small, the touchpad is also integrated with the panel to form a touch panel to facilitate the user's wheel Φ. The touchpad can be classified into a resistive type, a capacitive type, an infrared type, or a supersonic type according to the sensing principle. The resistive touch panel uses two conductive films as the upper and lower electrodes, and the user applies pressure to cause the upper and lower electrodes to be turned on. Thus, as long as the voltage change of the panel is sensed, the position of the contact point can be calculated. Generally, a capacitive touch panel is a structure in which an indium tin oxide (IT0) conductive material is disposed on a glass substrate, and a uniform electric field can be formed on the surface when the four corners of the glass are discharged, such as a user's finger. A small amount of current is drawn when touched, and this slight change is transmitted to the connected controller for further analysis to detect the input position of the conductive object. Capacitive touch panels have the advantages of dustproof 'fireproof and high resolution, so they have been widely used. However, most of the conventional techniques use two layers of conductive layers, so the thickness of the touch panel structure is thick, which is not suitable for thinning. . Therefore, improving the quality and production cost of capacitive touch panels through simplified and effective raw silk is one of the efforts of people in this field. [New content] - A capacitive touch panel with a metal wire connection structure as a part of the bridge structure provides a simplified process and better physical and electrical properties. --- Capacitor extraction pure, its metal guide __ Na light position, can enhance the sensitivity and accuracy of the electric valley induction performance. 3 M364912 - A kind of capacitive touch panel, its gold wire connection structure transmits _ position, which can reduce the thickness of the built-in touchpad to make the touchpad thin and light. According to the above, an embodiment of the present invention provides a capacitive touch panel comprising a transparent substrate, a transparent conductive layer, a plurality of transparent insulators and a plurality of metal connection structures. The transparent sensing layer is disposed on the transparent base layer, and the second sensing array is staggered and isolated from each other, wherein the first sensing region array comprises a plurality of first sensing pads and a plurality of transparent structures 2 The first sensing region is electrically connected to the K direction, and the second sensing region array includes a plurality of second sensing pads and is isolated from each other. A plurality of transparent insulators are disposed on the transparent conductive layer, wherein each of the transparent insulators corresponds to and covers each of the transparent conductive connection structures. The complex metal connection structure is located in the second direction of the different directions. The following is a detailed description of the specific embodiments and the accompanying drawings, and it should be easier to understand the purpose, technical content, characteristics and effects achieved by the present invention. [Embodiment] FIG. 1A is a front elevational view showing a capacitive touch panel according to an embodiment of the present invention. The sensing region 10 of a capacitive touch panel includes a transparent substrate 102 and a transparent conductive layer 104 on the transparent substrate 12. The transparent conductive layer 1-4 includes a first sensing region array (10) and a second sensing region array 105 interlaced and isolated from each other, wherein the first sensing region array 103 includes a plurality of first sensing pads 1031 and a plurality of transparent conductive The connection structure 1 〇 33 electrically connects the first sensing pad 1031 to a first direction X, and the second sensing area array 105 & includes a plurality of second sensing pads 1051 and is isolated from each other. In one embodiment, the first sensing pad 1 〇 31 and the second sensing pad 1 〇 51 have a diamond shape or a money shape, the same size or a H-shaped measurement 1031, and a strip-shaped transparent conductive connection. The structure 1033 electrically connects them for the purpose of dense alignment, but the present creation is not limited thereto. Furthermore, the first contact 1 〇 6 and the second contact 1 〇 8 are located on one side or the plurality of sides of the periphery of the sensing region 10, respectively, and the first sensing pad 1 〇 31 and the second sensing pad 1051, respectively. Electrical connection. 4 M364912 The second electric 连 of the second 职 丽 _ _ _ _ _ _ _ 2 Bo 'in the implementation of the shot, the width of the metal connection structure is small, so the guide Ϊ Ϊ 3 ^ 3 3 ^ / times, this The so-called bridging structure units are arranged by a transparent pass along the first direction x, the metal connection structure is arranged along the second direction Y across the large transversal ship, and the width of the transparent insulator 202 is t-structured to ensure that it is connected to the metal. Knot_contact. Moreover, the edge of the board outside the sensing area 10 of the touch panel includes a plurality of first-side:: 电 electrically connected to the first sensing area array 103 and the second sensing end are respectively connected to Signal output cable or guide (not shown). After the second 12, it will be covered with another transparent material to make a junction =:=^:=over_edge body~guide structure, replacing the traditional all-transparent conductive junction with the metal connection structure 302. Lamination, its superior = ^: 302 placed in a stack far from the first or second sensing 而非 instead of the effect: ===: 3 words, the physical properties of the metal connection structure and the electricity layer, When the metal connection structure is formed in the i-conducting conductive pattern which is closer to the first or second sense, ===2, and in terms of structure, the metal continuous furnace which is formed under the aqua regia side. Λ There is a break, causing Wang Shui to lie in the insulating layer. Last: excellent, the connection structure = ΞΗ ====: Thunder waste = ΐ〇 Ω,, 彳 °, for example, the general metal connection structure is 400nm, transparent guide nm is easy to form The transparent conductive layer (film) on the metal (thick film) connection structure is not attached to M M M M M M M M M M M M M M M ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( Compared with the tradition, the coin-joining structure of the present invention has the advantage that the final fabrication in the bridge structure can avoid this situation; (4) It is difficult for the traditional metal connection to be closer to the __ or the second sensing 塾In the case of fabricating an insulator and a transparent conductive connection structure, since the insulator is formed before the through-the-month conductive connection series, the shaped conductive connection structure is formed.
之前，可以以其適當的高溫形成連接結構形成於絕緣體 接結構具有較佳的物性與紐，其特性較結構之透明導電連 (5)本創作的橋接結構製作方法較 測塾與其巾之-導電連接結構可於_道 桃’不同傳遞方向的感 作的成本與時間降低，提高產能。f製財進行’使得本創作製 以上所述之實施例僅係為說明本 目的在使熟習此項技藝之人士能 乍之技術思想及特點，其 施，當不能以之限定本創作之專利範=本創作之内容並據以實 示之精神所作之均等變化或修飾，^圍，即大凡依本創作所揭 圍内。 乃應涵蓋在本創作之專利範 M364912 【圖式簡單說明】 電容式觸控板上感測墊與逯明 電容式觸控板上感測墊、透明 圖1A為根據本創作之一實施例說明一 導電連接結構之正視示意圖。 圖1B為根據本創作之—實施例說明― 導電連接結構與絕緣體之正視示意圖。 圖ic為根據本創作之一實施例說明一電 導電連接結構、絕緣體與金屬導電連接結構:正:示二測墊、透明Previously, the connection structure can be formed at an appropriate high temperature to form a structure in which the insulator structure has better physical properties and a transparent conductive connection with a characteristic of the structure. (5) The fabrication method of the bridge structure is better than that of the towel. The connection structure can reduce the cost and time of the feeling of different directions in the direction of the road, and increase the production capacity. f Production for the 'making the above-mentioned embodiments of the creation system is only for the purpose of illustrating the technical ideas and characteristics that enable those skilled in the art to do so, and can not limit the patent scope of this creation. = The content of this creation and the equivalent changes or modifications made in accordance with the spirit of the actual display, that is, the general content of the creation of the creation. It should be covered in the patent model M364912 of the present invention. [Simple description of the drawing] Sensing pad on the capacitive touch panel and sensing pad on the capacitive touch panel, transparent FIG. 1A is an embodiment according to the present invention. A front view of a conductive connection structure. 1B is a front elevational view of a conductive connection structure and an insulator in accordance with the present invention. Figure ic illustrates an electrically conductive connection structure, an insulator and a metal conductive connection structure according to an embodiment of the present invention: positive: two test pads, transparent
圖1D為根據本創作之一實施例圖lc沿_ 電容式觸控板上感測墊、透明導電連接 、見示’议圖說明- 結構。 销4、絕緣體與金屬導電連接 【主要元件符號說明】 10 感測區域 102 透明基層 103 第一感測區陣列 104 透明導電層 105 第二感測區陣列 106 、 108 接點 202 絕緣體 302 金屬連接結構 1031 第一感測墊 1033 透明導電連接結構 1051 第二感測墊 X、Y 方向 D-D’ 線 8FIG. 1D is a diagram showing a sensing pad, a transparent conductive connection, and a view of a transparent conductive connection on a _ capacitive touch panel according to an embodiment of the present invention. Pin 4, insulator and metal conductive connection [main component symbol description] 10 sensing region 102 transparent base layer 103 first sensing region array 104 transparent conductive layer 105 second sensing region array 106, 108 contact 202 insulator 302 metal connection structure 1031 first sensing pad 1033 transparent conductive connection structure 1051 second sensing pad X, Y direction D-D' line 8