M361724 五、新型說明： 【新型所屬之技術領域】 本創作關於發光元件，尤其涉及—種LED封裴結構。 【先前技術】 LED (Light Emitting Diode)，即發光二極體，是 一種半導體固體發光元件。它是利用固體半導體晶片作 為發光材料。當兩端加上正向電壓，半導體中的少數截 流子和多數截流子發生複合，放出過剩的能量而引起光 子發射，直接發出紅、橙、黃、綠、青、藍、紫、白色 的光。LED光源由於具有高節能 '壽命長、利於環保等 優點，而得到廣泛的應用。實際上，自LED問世以來， LED的應用面越來越廣泛，其環保節能之優點使得LED 被視為21世紀之主要照明光源之一。 、為了在照明市場上占得一席之地，不同封裝類型的 白光LED在市場上不斷出現。隨著led的大量應用， LED的需求量越來越大，其中LED顯示幕更是隨著應用 的需要而將會受到越來越多的關注。然而，如何提高led 防潮性能以及如何解決成為一個重要的課題。 傳統的LED發光結構包括支架及發光晶片，該支架 具有反射杯，發光晶片設置於支架的反射杯中。通常， 這種結構的發光二極體做成顯示幕或照明光源後，由於 頒示幕或照明光源的使用環境有時會比較潮濕，比如戶 外顯示幕或照明光源，尤其在雨天等惡劣環境下。這時， 濕氣就會沿著反射杯的曲面侵入到led内部，影響led 的使用壽命’甚至造成LED失效。 3 M361724 【新型内容】 發光:=，封:=供-種能有效防止濕氣侵入到 其包===載c=:::led封裝結構’ 環繞於發光晶片的2杯上具有凹凸結構，凹凸結構 =作具有之效益：與現有技術相比，led 構，凹凸結構環繞於發光晶片的周 圍，從而此有效地防止濕氣入侵到發 :凸結構增加了濕氣進入LED内部的路徑，也增強了膠 力，使得所述裝結構L二内部的阻 【實施方式】 m異的防潮功能。 為了使本創作的目的、技術方案及優點更加清楚明 Ί、ϊ合附圖及實施例，對本創作進行進一步詳細 此處所描述的具體實施㈣僅用以解 樟本創作，並不用於限定本創作。 請參、圖2和圖3,為本創作第—實施例提供 =ED封裳結構10。該LED封裝結構1〇包括載體U、 發先晶片12以及設置於載體^上的 和反射杯u綱的結構，例如:^14。載體11 接。發光晶片12設置於載體〗膠水相連 杯Η環繞該發光晶片12。反射杯反射 該凹凸結構環繞於發光晶片12的周圍，：凹凸結構’ J周固，即該凹凸結構為 4 M361724 環狀結構。 體^有料層料與發光w12電連接，載 選自金屬、金屬合金或陶細等。反射 材料等、。貝可選自金屬、金屬合金、高熱塑材料或陶瓷 括兩：的凹凸結構設置於反射杯14的内側面，包 =:;!16’兩級的臺階16環繞於發光晶片㈣ #上面的臺階16上架設有透鏡18，透鏡18 圖1所Λ的4以及載體11 一起封裝發光晶片12於其内。 二且：赭透鏡18為凸透鏡形狀’以具有較好的發光角 :同的要求調整角度。透鏡18可作為發光晶 ❹、/1 ’透鏡18可先單獨製作，然後再將已成 辟 =18置於臺階16上。兩級的臺㉟16之間的連接 二為斜壁，其具有斜面，該斜面可以是經過亮化處 其成為亮面，以提高^效率。當發光晶 面反射出’叫效地將發光晶片12所發出：光導出= =14 ’棱向出光效率，以及改變出光角度。下面提到的 人面j可以採用類似的亮面處理並具有相同的功效。 总一製作白光時，發光晶片12上覆蓋有螢光膠17,該 立光膝17至少覆蓋整個發光晶片I〕。在榮光膠I?與透 鏡18之間還填充有透明膠層182，謂兩者黏合。。 、如圖2所示，反射杯14的週邊尺寸小於載體u的 週邊尺寸，即載體11至少兩側端部突出於反射杯14外 而未被反射杯14所覆蓋，在該兩側端部分別設置有正負 極引腳13。如圖3所示，在載體j j的底面⑽對應正 5 M361724 負極引腳13設置有正負極引出焊盤15，正負極引腳i3 分別與正負極引出焊盤15對應電性連接，例如通過貫穿 載體11的過孔（未圖示）電氣連接。另外，在載體n的 底面110上還設置有散熱焊# 19，用於與散熱裝置（未圖 不）烊接，以將發光晶片12產生的熱量及時導出。 a在LED封裝結構10使用時，當其處於潮濕或雨水 兄日守，凹凸結構，如圖i中的兩級的臺階“能增加透 鏡18及透明膠層182與反射杯14的結合力，且能加長M361724 V. New description: [New technical field] This creation relates to light-emitting components, especially to LED-sealing structures. [Prior Art] LED (Light Emitting Diode), which is a light-emitting diode, is a semiconductor solid-state light-emitting element. It utilizes a solid semiconductor wafer as a luminescent material. When a forward voltage is applied to both ends, a small number of interceptors in the semiconductor are combined with most of the interceptors, releasing excess energy to cause photon emission, directly emitting red, orange, yellow, green, cyan, blue, purple, white light. . LED light sources are widely used due to their high energy efficiency, long life and environmental benefits. In fact, since the advent of LEDs, LEDs have become more and more widely used. The advantages of environmental protection and energy saving make LEDs one of the main lighting sources in the 21st century. In order to gain a foothold in the lighting market, white LEDs of different package types are constantly appearing on the market. With the large number of applications of LEDs, the demand for LEDs is increasing, and LED display screens will receive more and more attention as applications meet. However, how to improve the moisture resistance of the LED and how to solve it becomes an important issue. A conventional LED lighting structure includes a bracket and a light emitting chip, the bracket having a reflective cup, and the light emitting chip is disposed in the reflective cup of the bracket. Usually, after the light-emitting diode of this structure is used as a display screen or an illumination source, the environment of the presentation screen or the illumination source may be relatively humid, such as an outdoor display screen or an illumination source, especially in a harsh environment such as rain. . At this time, moisture will invade the inside of the led along the curved surface of the reflector cup, affecting the service life of the LED' or even causing the LED to fail. 3 M361724 [New content] Luminescence: =, seal: = supply - can effectively prevent moisture from invading into its package ===c=:::led package structure 'The 2 cups surrounding the illuminating wafer have a concave-convex structure, Concavo-convex structure = has the advantage: compared with the prior art, the led structure, the concave-convex structure surrounds the periphery of the light-emitting chip, thereby effectively preventing moisture from invading to the hair: the convex structure increases the path of moisture entering the inside of the LED, The glue force is enhanced, so that the internal structure of the mounting structure L has a moisture-proof function. The present invention will be further described in detail in order to clarify the purpose, technical solutions, and advantages of the present invention. The detailed description of the present invention is only used to solve the present invention and is not intended to limit the present invention. Referring to Figures 2 and 3, a =ED closure structure 10 is provided for the first embodiment of the present invention. The LED package structure 1 includes a carrier U, a precursor wafer 12, and a structure disposed on the carrier and a reflective cup, for example, ^14. The carrier 11 is connected. The illuminating wafer 12 is disposed on the carrier and is connected to the illuminating wafer 12 by a cup. Reflecting cup reflection The concave-convex structure surrounds the periphery of the light-emitting wafer 12, and the concave-convex structure 'J is solid, that is, the concave-convex structure is a 4 M361724 annular structure. The material layer is electrically connected to the light-emitting layer w12, and is selected from the group consisting of metal, metal alloy or ceramic. Reflective materials, etc. The bebe is selected from the group consisting of metal, metal alloy, high thermoplastic material or ceramic: the concave and convex structure is disposed on the inner side of the reflector cup 14, and the step 16 of the two stages is surrounded by the light emitting chip (4) 16 is provided with a lens 18, and the lens 18 and the carrier 11 of Fig. 1 together encapsulate the luminescent wafer 12 therein. Second, the 赭 lens 18 is in the shape of a convex lens to have a good illuminating angle: the same angle is adjusted. The lens 18 can be used as a light-emitting crystal, and the /1' lens 18 can be fabricated separately, and then the resultant = 18 is placed on the step 16. The connection between the two stages 3516 is an inclined wall having a slope, which may be a bright surface to improve the efficiency. When the illuminating crystal is reflected, it is said that the illuminating wafer 12 emits light: the light is led ==14 ′ directional light outgoing efficiency, and the light exiting angle is changed. The human face j mentioned below can be treated with a similar glossy surface and has the same effect. When the white light is always produced, the luminescent wafer 12 is covered with a fluorescent glue 17, which covers at least the entire luminescent wafer I]. A transparent adhesive layer 182 is also filled between the glazing adhesive I and the lens 18, that is, the two are bonded. . As shown in FIG. 2, the peripheral dimension of the reflector cup 14 is smaller than the perimeter dimension of the carrier u, that is, at least two end portions of the carrier 11 protrude outside the reflector cup 14 and are not covered by the reflector cup 14, respectively, at the ends of the two sides. Positive and negative pins 13 are provided. As shown in FIG. 3, the bottom surface (10) of the carrier jj corresponds to the positive 5 M361724. The negative electrode lead 13 is provided with a positive and negative electrode lead-out pad 15, and the positive and negative electrode pins i3 are electrically connected to the positive and negative electrode lead-out pads 15, respectively. The vias (not shown) of the carrier 11 are electrically connected. In addition, a heat-dissipating solder #19 is further disposed on the bottom surface 110 of the carrier n for splicing with a heat sink (not shown) to derive heat generated by the light-emitting chip 12 in time. a when the LED package structure 10 is used, when it is in a damp or rainy, the concave-convex structure, the two-stage step in FIG. i can increase the bonding force between the lens 18 and the transparent adhesive layer 182 and the reflective cup 14, and Can lengthen
濕氣由外部沿膠體和反射杯14結合面入侵到發光晶片~ 12附近的路徑，由此能有效防止濕 附近，提高發光二極體的使料命。 12 明參閱圖4，為本創作第二實施例提供的封裝 結構20。該LED封裝結構2〇具有與第一實施例led封 裝結構ίο基本相同的結構組成，不同之處在於，led封 裝結構20的凹凸結構包括至少一臺階26和至少一個凹 槽28。圖4與圖i至圖3中相同的結構採用相同的標號， 在此不再贅述。圖4所示的凹凸結構包括—個臺階％; 一個凹槽28，當然，實際應用中可採用兩個或多個臺階 26和/或兩個或多個凹槽28。臺階26位於凹槽28的上 方，臺階26上支撐有透鏡18。 曰 如圖4所示，凹槽28可以看作是一個梯形槽，凹槽 28面向反射杯14中心轴的内側面281為斜面，可反射 光線’提高出光效率，以及改變出光角度。靠近發光晶 片12的槽壁282是一個直壁’該直立的槽壁282也可看 作疋個沿者反射杯14轴向延伸的凸環，槽壁2 8 2限定 一個用於填充螢光膠或透明膠體的空間。在製作白光 6 M361724 時，凸環的槽壁282限定的空間内填充的是螢光膠I?， 通過槽壁282使螢光膠17可以有效覆蓋發光晶片12, 使螢光粉得到有效的激發’出光光斑均勻。而且，在製 作白光時，由於只在槽壁282内覆蓋螢光膠17，避免^ ^射杯14㈣空間裏全部覆蓋榮光膠17，從而減少了 赏光叙的用i，可以節約成本。當然，也可以製作成其 他$衫如單色光源，此時，槽壁282限定的空間内填充 的疋透明膠體，而且透明膠體可以進一步延伸填充整個 反射杯14的内部空間。 凹槽28除截面形狀為梯形之外，還可以為方形或v 形γ圖5顯示的是方形槽28a，即方形槽28a的兩側槽壁 句為直J，其中，罪近發光晶片12的直壁可看作 是一個凸環。該凸環具有第二實施例的槽壁282同樣的 功能。圖6顯示的是V形槽28b，即V形槽28b的槽内 侧面均為斜s ’而且，v形槽28b朝向反射杯14中心軸 或者發光晶片12的槽外側面282b為斜面，這些斜面都 可以反射光線，提高出光效率，以及改變出光角度。 請參閱圖7’為本創作第三實_提供的led封裝 結構3 0。該LED封裳結構3 〇具有與第二實施例LED封 裝結構20基本相同的結構組成，不同之處在於，led封 裝結構30的凹凸結構包括臺階％、第一凹槽％和第二 凹槽39。圖7與圖4中相同的結構採用相同的標號，在 此不再贅述。 堂階36、第一凹槽38和第二凹槽39由外至内順序， 或按照圖示由上至下的順序，依讀於反射杯14的内側 面。臺階36上支撐有封裝發光晶片12的透鏡18。兩個 7 M361724 凹槽38和39相互銜接，圖7所示的第—凹槽％和第二 凹槽39都是梯形槽，第一凹槽％和第二凹槽^面向反 $杯14中心軸的槽内側面均為斜面，可適當反射光線， 提南出光效率，以及改變出光角度。第二凹槽^靠近發 .光晶片12的槽壁392是一個直壁，該直立的槽壁392 ^ 可看作是一個沿著反射杯14軸向延伸的凸環。該凸環具 有第二實施例的槽壁282同樣的功能。 、/、 凹槽38和39除截面形狀為梯形之外，還可以為方 > 7或V形。圖8顯示的是方形槽38&和，即方形样 H 39a的兩側槽壁均為直壁，其中，如‘ 9a罪近發光晶片12的錢可分別看作是—個凸環，因 ，圖8中共有兩個凸環382a和3仏。每個凸環具有第二 貫施例的槽壁282同樣的功能。圖9顯示的是 - = 39b，即v形槽通和m的槽内側面均為斜面，而 ’ V形槽39b朝向反射杯14中心軸 的槽外側面獅為斜面，由此可以反射光線Hk ,效率，以及改變出光角度。此兩個v_3d先 銜接，形成鋸齒形槽結構，也可目 成夕回的鋸齒形槽結構，具有更好的防潮效果。 凊參閱圖10 ’為本創作篦四杳7 处槿Γ 例提供的LED封裝 =:。§亥1^封裝結構40包括發光晶片12 體=的載體41和反射杯44。载體41和反射杯成^是 肢成型的。發光晶片12設置於載體4ι的 】射杯44環繞該發光晶片12,反射杯44 :: ::圖」0中的凹凸結構為凹槽48,例如方形二凸： 胃8罪近發光晶片12的槽壁術是—個直壁，該直立 8 M3 61724 =槽壁48 =也可看作是—個沿著反射杯44軸向延伸的凸 裱。该凸環具有第二實施例的槽壁282同樣的功能。 在載體41上具有兩個開槽43，分別位於發光晶片 12的兩側並延伸到載體41的側面’每個開槽衫内=容 有引腳45，該引腳45 一端與發光晶片12電性連接，另 一端延伸到載體41的底面，如圖丨丨和圖The moisture invades from the outer surface of the colloid and the reflecting cup 14 to the path near the light-emitting wafer ~12, thereby effectively preventing the vicinity of the wet and improving the life of the light-emitting diode. Referring to Figure 4, there is shown a package structure 20 provided by a second embodiment of the present invention. The LED package structure 2 has substantially the same structural composition as the first embodiment of the LED package structure, except that the uneven structure of the LED package structure 20 includes at least one step 26 and at least one recess 28. The same structures as those in FIG. 4 and FIG. 3 to FIG. 3 are denoted by the same reference numerals and will not be described again. The relief structure shown in Fig. 4 includes a step %; a groove 28, of course, two or more steps 26 and/or two or more grooves 28 may be employed in practical applications. The step 26 is located above the recess 28 on which the lens 18 is supported.凹槽 As shown in Fig. 4, the groove 28 can be regarded as a trapezoidal groove, and the inner side surface 281 of the groove 28 facing the central axis of the reflecting cup 14 is a sloped surface, which can reflect light to increase the light-emitting efficiency and change the light-emitting angle. The groove wall 282 near the illuminating wafer 12 is a straight wall. The upright groove wall 282 can also be regarded as a convex ring extending axially along the reflector cup 14. The groove wall 282 defines a filler for filling the fluorescent glue. Or a space for transparent colloids. When the white light 6 M361724 is made, the space defined by the groove wall 282 of the convex ring is filled with the fluorescent glue I, and the fluorescent glue 17 can effectively cover the light-emitting chip 12 through the groove wall 282, so that the fluorescent powder is effectively excited. 'The light spot is even. Moreover, in the case of producing white light, since only the fluorescent glue 17 is covered in the groove wall 282, it is possible to avoid covering all of the glory 17 in the space of the cup 14 (4), thereby reducing the use of the light, and saving cost. Of course, it is also possible to make other $shirts such as a monochromatic light source. At this time, the space defined by the groove wall 282 is filled with a transparent transparent gel, and the transparent colloid can further extend to fill the inner space of the entire reflective cup 14. The groove 28 may be square or v-shaped in addition to the trapezoidal shape of the trapezoid. FIG. 5 shows a square groove 28a, that is, the groove walls on both sides of the square groove 28a are straight J, wherein the sin is adjacent to the light-emitting chip 12 A straight wall can be seen as a convex ring. This convex ring has the same function as the groove wall 282 of the second embodiment. Fig. 6 shows a V-shaped groove 28b, i.e., the inner side surface of the V-shaped groove 28b is inclined s', and the v-shaped groove 28b is inclined toward the central axis of the reflecting cup 14 or the groove outer side surface 282b of the luminescent wafer 12, and these inclined surfaces Both can reflect light, improve light extraction efficiency, and change the angle of light. Please refer to FIG. 7' for the LED package structure 30 provided by the third embodiment of the present invention. The LED package structure 3 has substantially the same structural composition as the LED package structure 20 of the second embodiment, except that the uneven structure of the LED package structure 30 includes a step %, a first groove %, and a second groove 39. . The same components in Fig. 7 and Fig. 4 are denoted by the same reference numerals and will not be described again. The step 36, the first recess 38 and the second recess 39 are read from the outside to the inside, or in the order from top to bottom, as illustrated, on the inside of the reflector cup 14. A lens 18 enclosing the luminescent wafer 12 is supported on the step 36. The two 7 M361724 grooves 38 and 39 are coupled to each other, and the first groove % and the second groove 39 shown in FIG. 7 are trapezoidal grooves, and the first groove % and the second groove ^ face the center of the inverted cup 14 The inner side of the groove of the shaft is a beveled surface, which can appropriately reflect the light, improve the light extraction efficiency, and change the light exit angle. The second groove ^ is close to the hair. The groove wall 392 of the optical wafer 12 is a straight wall, and the upright groove wall 392 ^ can be regarded as a convex ring extending along the axial direction of the reflective cup 14. This collar has the same function as the groove wall 282 of the second embodiment. The grooves / 38 and 39 may have a square shape > 7 or a V shape in addition to the trapezoidal shape of the trapezoid. Figure 8 shows a square groove 38 & and, that is, the groove walls on both sides of the square-shaped H 39a are straight walls, wherein, for example, the money of the near-lighting chip 12 can be regarded as a convex ring, respectively, There are two convex rings 382a and 3仏 in FIG. Each of the collars has the same function as the slot wall 282 of the second embodiment. Figure 9 shows - = 39b, that is, the v-groove and the inner side of the groove of m are both inclined, and the 'V-shaped groove 39b is inclined toward the outer side of the groove of the center axis of the reflector cup 14, thereby reflecting the light Hk , efficiency, and changing the angle of light. The two v_3d are first connected to form a zigzag groove structure, and can also be seen as a zigzag groove structure with a better moisture-proof effect.凊 Refer to Figure 10 for the LED package provided by the 篦 杳 杳 杳 = =. The package structure 40 includes a carrier 41 and a reflector cup 44 of the light-emitting chip 12 body. The carrier 41 and the reflector cup are formed into limbs. The illuminating wafer 12 is disposed on the carrier 4 ー surrounding the illuminating wafer 12, and the concave-convex structure in the reflecting cup 44:::: 0 is a groove 48, for example, a square bulge: the stomach 8 is near the illuminating wafer 12 The slot wall is a straight wall, and the upright 8 M3 61724 = slot wall 48 = can also be seen as a tenon extending axially along the reflector cup 44. This convex ring has the same function as the groove wall 282 of the second embodiment. There are two slots 43 on the carrier 41, which are respectively located on both sides of the light-emitting chip 12 and extend to the side of the carrier 41. Each of the slotted shirts has a pin 45, and one end of the pin 45 is electrically connected to the light-emitting chip 12. Sexual connection, the other end extends to the bottom of the carrier 41, as shown in Figure 丨丨 and
4電路電性連接。載體41對應發光晶片12處具有開孔 =其内收容有熱沉47,發光晶片12設置於熱沉〇的 、上。熱沉47的底面設有散熱焊盤49，用於盥二 散熱裝置連接，以將熱量散發出。 、/、 射杯44的中間孔洞内填充有膠體，當製作曰 膠體為螢光膠；當製作彩色或單色光源時，膠體 為透明谬，體可通過點膠方式填充於反射杯44的中間 孔洞内，也可以制模注或模塑成型方法形成。 圖10中顯示的凹槽48為方形，槽壁 也可採用梯形槽或V形槽，槽壁可以是 二：土斜壁。例如，目13顯示槽壁是帶斜壁 48a， 10相同。具體地，圖13的凹槽術朝 斜軸或者發光晶片12的槽外側面4仏為 光角度。*可以反射光線’提高出光效率’以及改變出 圖14的結構又基本類似於圖13的結構，不同之處 在於’凹凸結構採用的是V带揭“κ χ 兩個相對的槽内側面都是斜：槽:：了形槽-的 反射杯財心軸或者Γ光日片形槽48b朝向 九日日片12的槽外側面482b也為 9 M361724 斜面’由此可以一同反射井续，挺 變出光角度。Π反射先線“出光效率’以及改 ，15至圖17顯示的是凹凸結構採用兩個凹槽的方 工，，、他結構都基本類似於圖1〇的結 的結構採用相同的標號，在此不再賛述如圖 =:槽分別是方形槽57a和梯形槽m ，這 發光晶片12,且朝向反射杯44中心軸或者發 =曰曰片U的槽内側面㈣和槽外側面572b也為斜面， 角二可以—同反射光線，提高出光效率，以及改變出光 二圖16所示，兩個凹槽都是方形槽58a和58b，方 = ΓΛ58ί3的槽壁都是直壁，可看作是—個沿著反 二伸的凸環。該凸環具有第二實施例的槽壁 同樣的功能。 ,如圖17所示，兩個凹槽都是V形槽59a和59b，v 形心59a和59b的每個槽内側面都是斜面，而且，v形 = 59a和59b朝向反射杯44中心軸或者發光 =卜側面都為斜面，由此可以—同反射光線，提高出 先效率，以及改變出光角度。 月 >，圖18 ’為本創作第五實施例提供的lED封裝 、、'口構60。該LED封#社错（η诗丄， τ πη ^ .4- ^ 衣、、，口構60基本類似於第四實施例的 、'^口冓4〇，不同之處在於，LED封裝結構60的 凹凸結構設置於反射杯44的外側面上，反射杯44覆蓋 f封裝膠體62，封裝膠體62材質可以是透明膠。圖18 舁圖10中相同的結構採用相同的標號，在此不再贅述。 圖18中的凹凸結構為一個臺階68，當然也可以是兩級 10 M3 61724 的臺階或者更多級的臺階’視實際需要而定。而且，嘹 置於反射杯44外側壁上的凹凸結構也可以是凹槽，如= 形槽、梯形槽、V形槽，還可以是兩個凹槽或更多的凹 槽。封裝膠體62不僅覆蓋整個反射杯44，還填充到反 射杯44的中間孔洞内。如果需要製作白光光源，'則需要 先在發光aa片1 2上復蓋螢光膠，例如通過點膠方式形 成。其中，設於外側壁的凹凸結構即能增加封裝膠體Μ 與反射杯44的結合力，且能加長由外部到發光晶片u 的路徑，由此能有效防止濕氣進入到發光晶片12附近。 ，且，通過該封裝膠體62的外部覆蓋，可進一步將發光 晶片12以及反射杯44均隔離於潮濕或濕氣環境之外。 請參閱圖19,為本創作第六實施例提供的LED封裝 結構7 〇。該L E D封裝結構7 〇基本類似於第五實施例^ led封裝結構60，不同之處在於，led封装結構％的 凹，結構包括分別設置於反射杯44的外側面和内側面 的J階75和兩個凹槽78a和78b，反射杯44中間孔洞内 收t有螢光膠％。圖19與圖18中相同的結構採用相同 =軚唬，在此不再贅述。圖19中的兩個凹槽和78b ^似於圖15中的方形槽57a和梯形槽57b。螢光膠76 ^ ^到與反射杯44的頂面相齊，螢光膠76上覆蓋有封 、膠體72，該封裝膠體72將反射杯44封裝於其二，類 了/固18中的封裳膠體62。通過内外的臺階和凹槽， ^知長濕氣到發光晶片12附近的路徑，增強led 的防湖功能。 之外^ 2凹凸結構除可以設置於反射杯44的内外側面 C 了以5又置於反射杯44的頂面，例如直接在頂面 11 M361724 上開設凹槽。 圖20甲的LED封裝結構類似於 之處在於，圖20中的LED_0士播=/的、、“冓’不同 m 封裝結構的凹凸結構包括分 二Η : 的内側面和外側面的臺階86和凹样 圖不凹槽88為方形槽，當然也可 二 Τ凹槽88朝向反射杯44中心軸或者發光晶== 外側面882為斜面，由此可以反射光線，提高發光效t 圖21中的led封裝結構類似於 不、 之處在於，同U山， 、、、口稱’不同 臺階之外，D職結構的凹凸結構除外側 卜遇包括兩個凹槽88a和88b，圖示均 片曰也可為V形或梯形槽等。凹槽娜靠近發光^ 片12的槽壁為直壁，該直壁也可看π 曰曰 44軸向延伸的凸環。該且 —者反射杯 同樣的功能。 〇、有弟一貫施例的槽壁282 構，本創作第七實施例提供# LED封裝結 光曰^ 12 ^/袭結構具有與圖9類似的結構，其中，發 九曰日片12的封裝體為透 8，不回夕老+ ^ 螢光膠17相接觸。闻^ 不冋之處在於透鏡18與 ^ ^ ' 與圖9中相同的結構採用相同4 circuit electrical connection. The carrier 41 has an opening corresponding to the light-emitting chip 12 = a heat sink 47 is accommodated therein, and the light-emitting chip 12 is disposed on the heat sink. The bottom surface of the heat sink 47 is provided with a heat dissipating pad 49 for connecting the heat sink to dissipate heat. , /, the middle hole of the shot cup 44 is filled with colloid, when the gel is made of fluorescent glue; when making a color or monochromatic light source, the colloid is transparent, and the body can be filled in the middle of the reflective cup 44 by dispensing The holes may also be formed by molding or molding. The groove 48 shown in Fig. 10 is square, and the groove wall can also adopt a trapezoidal groove or a V-shaped groove, and the groove wall can be a two-soil inclined wall. For example, item 13 shows that the groove walls are the same with the inclined walls 48a, 10. Specifically, the groove of Fig. 13 is toward the oblique axis or the groove outer side surface 4 of the light-emitting chip 12 is a light angle. * can reflect light 'improve light extraction efficiency' and change the structure of Figure 14 and is basically similar to the structure of Figure 13, except that 'the concave-convex structure uses V-belt to reveal "κ χ two opposite groove inner sides are Oblique: Slot:: The shape of the groove-shaped reflector cup or the calender-shaped groove 48b toward the outer side surface 482b of the nine-day piece 12 is also 9 M361724 bevel', which can be reflected together and become quite The angle of light exiting. The reflection of the first line "lighting efficiency" and the change, 15 to 17 shows the work of the concave and convex structure using two grooves, and the structure of the structure is basically the same as the structure of the knot of Figure 1 The reference numerals are not mentioned here as shown in Fig. =: the slots are square slots 57a and trapezoidal slots m, respectively, which illuminate the wafer 12 and face the central axis of the reflector cup 44 or the inner side (four) of the slot U and the slot. The side surface 572b is also a beveled surface, and the second corner can be used to reflect light, improve light extraction efficiency, and change the light output. As shown in Fig. 16, both grooves are square grooves 58a and 58b, and the square walls of the square = ί58ί3 are straight walls. Can be seen as a convex ring along the opposite extension. This convex ring has the same function as the groove wall of the second embodiment. As shown in Fig. 17, the two grooves are V-shaped grooves 59a and 59b, and the inner side faces of each of the v-shaped cores 59a and 59b are inclined faces, and the v-shapes = 59a and 59b are directed toward the central axis of the reflecting cup 44. Or the illuminating = the side of the bud is a bevel, so that the same light can be reflected, the efficiency of the first is improved, and the angle of the light is changed. Month >, Fig. 18' is the lED package, 'mouth structure 60' provided by the fifth embodiment of the creation. The LED package is in the same manner as the fourth embodiment, and the difference is that the LED package structure 60 is substantially the same as the fourth embodiment. The concave and convex structure is disposed on the outer side surface of the reflective cup 44, the reflective cup 44 covers the f-package colloid 62, and the material of the encapsulant 62 may be a transparent adhesive. The same structures in FIG. 18 are the same reference numerals and will not be described again. The concave-convex structure in Fig. 18 is a step 68, and of course, it may be a step of two stages of 10 M3 61724 or a step of more stages 'depending on actual needs. Moreover, the uneven structure of the crucible placed on the outer side wall of the reflecting cup 44. It may also be a groove, such as a = groove, a trapezoidal groove, a V-shaped groove, or two grooves or more. The encapsulant 62 covers not only the entire reflector cup 44 but also the middle of the reflector cup 44. Inside the hole. If it is necessary to make a white light source, 'you need to cover the luminescent aa piece 1 2 with a fluorescent glue, for example, by dispensing. Among them, the concave-convex structure provided on the outer side wall can increase the encapsulation Μ and reflection. The bonding force of the cup 44, and can be extended from the outside to the hair The path of the wafer u can thereby effectively prevent moisture from entering the vicinity of the light-emitting wafer 12. And, by external covering of the encapsulant 62, the light-emitting wafer 12 and the reflective cup 44 can be further isolated from the wet or humid environment. Referring to Fig. 19, an LED package structure 7 is provided for the sixth embodiment of the present invention. The LED package structure 7 is substantially similar to the fifth embodiment of the package structure 60, except that the LED package structure is %. The recess includes a J-stage 75 and two grooves 78a and 78b respectively disposed on the outer side and the inner side of the reflector cup 44, and the phosphor cup% is received in the middle of the reflector cup 44. In Fig. 19 and Fig. 18 The same structure adopts the same = 軚唬, and will not be described here. The two grooves and 78b in Fig. 19 are similar to the square groove 57a and the trapezoidal groove 57b in Fig. 15. The fluorescent glue 76 ^ ^ to the reflective cup The top surface of the 44 is flush, and the fluorescent glue 76 is covered with a seal and a colloid 72. The encapsulant 72 encapsulates the reflective cup 44 in the second and second type of the sealant 62. The inner and outer steps and grooves are adopted. , ^ know the long moisture to the path near the illuminating wafer 12, enhance the anti-lake of led The outer surface of the reflector cup 44 can be disposed on the top surface of the reflector cup 44, and is placed on the top surface of the reflector cup 44, for example, directly on the top surface 11 M361724. The structure is similar in that the LEDs of FIG. 20=/, the “冓” different m-package structure has a concave-convex structure including the inner side and the outer side of the step 86 and the concave pattern without grooves. 88 is a square groove. Of course, the groove 88 can be oriented toward the central axis of the reflector cup 44 or the illuminating crystal == the outer side 882 is a sloped surface, thereby reflecting light and improving the luminous efficiency. The led package structure in FIG. 21 is similar to The point is that, in addition to the different steps of the U mountain, the, and the mouth, the concave and convex structure of the D job structure includes two grooves 88a and 88b, and the illustrated film can also be V-shaped or trapezoidal. Slots, etc. The groove wall of the groove near the light-emitting sheet 12 is a straight wall, and the straight wall can also be seen as a convex ring extending axially of π 曰曰 44. This is the same function as the reflector cup.槽 有 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The body is transparent, and it does not return to the old + ^ fluorescent glue 17 contact. The smell is that the lens 18 and ^ ^ ' are the same as the same structure in Figure 9.
町铋唬，在此不再贅述。 々曰,J 塑的方法形成，例如，在形 ：°採用模注或模 後，= = 發光晶…，然 的方式將透鏡18封裳於入/片具L通過模注或模塑 採用前述先單們士袖/毛先日日片 當然，也可以 於發光晶片12上。1透鏡18，再將已成型的透鏡18置 圖23顯示本創作第七實施例提供的LED封裝結 12 M361724 構，該LED封裝結構具有與圖21類似的結構 處在於，在圖23中，發光晶片12的封裝體為透铲= 的封裝膠體72a，封裝膠體72a覆蓋於發光晶片^〔欠 而==注或模塑的方法形成。該封装膠體％進 曰=反射杯44封裝於其内，可進一步延長濕氣到發光 日日片12附近的路徑，增強LED的防潮功能。 本創作上述各實施例的LED封裝結構在反射杯上执 #_結構’所述凹凸結構環繞于發 π 從而能有效地防止濕氣進人到發光晶片12附近 凹凸結構增加了濕氣進人㈣内部的路徑，也 (即如封裝膠體等）和反射杯的結合力，即增加了 二LED内部的阻力，使得所述LED封裝結構具有優： 的防潮功能。 良/、 所述僅為本創作的較佳實施例而已，並不用以 心文、二IS本創作的精神和原則之内所作的任何 圍之内、。s、°改進等’均應包含在本創作的保護範 【圖式簡單說明】 示意^是本創作第一實施例提供白勺咖封裝結構剖面 圖2，圖i中的LED封裝結構俯視示意圖。 圖3是圖！中的LED封裝結構仰視示意圖。 一立圖4是本創作第二實施例提供的led封裝結構剖 不思圖〇 圖5是具有圖4類似結構的LED封裝結構剖面示意 13 M361724 圖，顯示有方形槽。 似結構的LED封裝結構剖面示意 實施例提供的LED封裝結構剖面 圖6是具有圖4類 圖，顯斤古v以 、 片尔有V形槽0 圖7是本創作第三 示意圖。 — 圖，&有圖7類似結構的LED封裝結構剖面示意 巧不有兩個方形槽。Machi, no longer repeat here. 々曰, J plastic method is formed, for example, in the form: ° after molding or mold, = = illuminating crystal..., then the lens 18 is sealed in the in/out piece L by molding or molding using the aforementioned The first sergeant sleeve/hair first day ray may of course be also on the illuminating wafer 12. 1 lens 18, and then the formed lens 18 is shown in FIG. 23, which shows the LED package junction 12 M361724 structure provided by the seventh embodiment of the present invention. The LED package structure has a structure similar to that of FIG. 21, in FIG. The package of the wafer 12 is a squeegee-type encapsulant 72a, and the encapsulant 72a is formed by a method of covering the luminescent wafer. The encapsulant %% 曰=reflector cup 44 is encapsulated therein to further extend the path of moisture to the vicinity of the illuminating day piece 12, enhancing the moisture barrier function of the LED. The LED package structure of the above embodiments of the present invention implements the #_structure' on the reflective cup, and the concave-convex structure surrounds the π to effectively prevent moisture from entering the vicinity of the luminescent wafer 12. The embossed structure increases moisture entering (4) The internal path, also (ie, encapsulation colloid, etc.) and the combination of the reflective cups increase the resistance inside the two LEDs, so that the LED package structure has an excellent moisture-proof function. Good/, the description is only a preferred embodiment of the present invention, and is not used in any of the spirits and principles of the original and the two IS creations. s, ° improvement, etc. should be included in the protection of this creation. [Simplified illustration of the drawing] The schematic is a cross-sectional view of the first embodiment of the present invention. FIG. 2 is a top view of the LED package structure in FIG. Figure 3 is a picture! The LED package structure in the bottom view. Figure 4 is a cross-sectional view of the LED package structure provided by the second embodiment of the present invention. Figure 5 is a cross-sectional view of the LED package structure having the similar structure of Figure 4, 13 M361724, showing a square groove. FIG. 6 is a third schematic view of the present invention. FIG. 6 is a schematic view of the LED package structure provided in the embodiment. FIG. 6 is a diagram showing the class of FIG. — Figure, & Figure 7 shows a similar outline of the LED package structure. There are no two square slots.
圖，翱〜是八有圖7類似結構的LED封裝結構剖面示意 $有兩個V形槽。 陶 ^ 面示意^疋本創作第四實施例提供的LED封I結構到 _ 1 1 η rsj _ ^圖10中的LED封裝結構俯視示意圖。 鞫12 f圖10中的LED封裝結構仰視示意圖。 意圖，° _疋八有圖10類似結構的LED封裝結構剖面开 熨頌示朝向發光晶片的外壁為斜壁的凹槽。 意圖^ 14是具有圖13類似結構的LED封裝結構剖面禾 顯示凹槽為V形槽。 意圖，_疋^有圖13類似結構的LED封裝結構剖面示 岛"、、員示有兩個梯形槽的凹凸結構。 意圖1 6__是’、有目15類似結構的LED封裝結構剖面禾 商項示有兩個方形槽的凹凸結構。 意圖:y是具有圖15類似結構的LED封裝結構剖面示 旬頌示有兩個v形槽的凹凸結構。 面示i^。是本創作第五實施例提供& LED封裝結構刹 ^ 7 η 3 疋具有圖18類似結構的led封裝結構剖面示 14Figure, 翱 ~ is a schematic diagram of the LED package structure with a similar structure of Figure 7. There are two V-shaped grooves. The schematic diagram of the LED package structure of the fourth embodiment provided by the fourth embodiment of the present invention to _1 1 η rsj _ ^ FIG.鞫12 f FIG. 10 is a bottom view of the LED package structure. Intentionally, the LED package structure of the similar structure of Fig. 10 is opened and the inner wall facing the illuminating wafer is a slanted wall. The intent 14 is an LED package structure having a similar structure as that of Fig. 13 and the display groove is a V-shaped groove. Intention, _疋^ has a similar structure of the LED package structure of the similar structure shown in Fig. 13, and has two concave-convex structures with trapezoidal grooves. The intent 1 6__ is ', the LED package structure section having the similar structure of the object 15 and the concave and convex structure of the two square grooves are shown. Intent: y is an outline of an LED package structure having a similar structure as that of Fig. 15, showing a concave-convex structure having two v-shaped grooves. Show i^. According to the fifth embodiment of the present invention, the LED package structure is provided with a similar structure of the LED package structure.
M361724 意圖，顯示四Λ 侧壁的臺2 凸結構包括分別L位於反射杯外側壁和内 土圖和兩個凹槽，且在發光晶片上覆蓋有螢光膠。 意圖，顯厂疋具有圖18類似結構的LED封裝結構剖面示 壁的臺F不凹凸結構包括分別位於反射杯外侧壁和内侧 土二自和一個凹槽，發光晶片上未覆蓋螢光膠。 圆 21 | a + 音圖，晨-具有圖20類似結構的LED封裝結構剖面示M361724 It is intended that the table 2 convex structure showing the four side walls includes L, which is located on the outer side wall of the reflector cup and the inner soil pattern and the two grooves, respectively, and is covered with a fluorescent glue on the light-emitting chip. It is intended that the stage F non-concave structure of the LED package structure having the similar structure of Fig. 18 includes the outer side wall and the inner side of the reflector cup and a groove respectively, and the luminescent paste is not covered on the luminescent wafer. Circle 21 | a + sound map, morning - LED package structure with similar structure of Figure 20
Si Γα *、員示凹凸結構包括分別位於反射杯外侧壁和内侧 壁的$階和兩個凹槽。 圖 2 9 3 θ / 立同 疋具有圖9類似結構的LED封裝結構剖面示 ”’、員示封裝體為模注或模塑形成的透鏡。 立圖23是具有圖21類似結構的LED封裝結構剖面示 思圖’顯示封裝膠體為模注或模塑形成的透鏡。 【主要元件符號說明】 10 LED封裝結構 11載體 11 〇底面 12發光晶片 13正負極引極 14反射杯 15正負極引出焊盤 16臺階 162連接壁 17螢光膠 18透鏡 15 M3 61724 182透明膠層 19散熱焊盤 20 LED封裝結構 26臺階 28凹槽 281内侧面 282槽壁 28a方形槽 28b V形槽 282b槽外側面 30 LED封裝結構 36臺階 38第一凹槽 38a方形槽 38b V形槽 382a凸環 39第二凹槽 392槽壁 39a方形槽 392a凸環 39b V形槽 392b槽外側面 40 LED封裝結構 16 M3 61724 41載體 42焊盤 43開槽 44反射杯 45引腳 47熱沉 48 ' 48a凹槽 482槽壁 482a槽外侧面 48b V形槽 482B槽外侧面 49散熱焊盤 57a方形槽 571b槽内侧面 57b梯形槽 572b槽外侧面 58a、58b方形槽 59a、59b V 型槽 60 LED封裝結構 62封裝膠體 68臺階 70 LED封裝結構 72封裝膠體 M3 61724 75臺階 76螢光膠 78a、78b 凹槽 86臺階 88凹槽 882槽外側面 88a、88b 凹槽The Si Γα *, the embossed structure includes the $-step and the two grooves respectively located on the outer side wall and the inner side wall of the reflecting cup. Figure 2 9 3 θ / 立 疋 疋 疋 LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED The cross-section illustration shows that the encapsulant is a lens formed by molding or molding. [Main component symbol description] 10 LED package structure 11 carrier 11 〇 bottom surface 12 illuminating wafer 13 positive and negative poles 14 reflection cup 15 positive and negative extraction pads 16 step 162 connecting wall 17 fluorescent glue 18 lens 15 M3 61724 182 transparent adhesive layer 19 heat sink pad 20 LED package structure 26 step 28 groove 281 inner side 282 groove wall 28a square groove 28b V-shaped groove 282b groove outer side 30 LED Package structure 36 step 38 first groove 38a square groove 38b V-shaped groove 382a convex ring 39 second groove 392 groove wall 39a square groove 392a convex ring 39b V-shaped groove 392b groove outer side 40 LED package structure 16 M3 61724 41 carrier 42 pad 43 slot 44 reflector cup 45 pin 47 heat sink 48 '48a groove 482 slot wall 482a slot outer side 48b V-shaped slot 482B slot outer side 49 heat sink pad 57a square slot 571b slot inner side 57b trapezoidal slot 572b Square groove 58a, 58b square groove 59a, 59b V-groove 60 LED package structure 62 package colloid 68 step 70 LED package structure 72 package gel M3 61724 75 step 76 phosphor glue 78a, 78b groove 86 step 88 groove 882 groove outer side 88a, 88b groove