M3 54176 八、新型說明： 【新型所屬之技術領域】 本創作係關於一種晶圓定位承载裝置，特別指一種在 製程當中用蚊位承載晶圓片，並可進行傳送的^ 承載裝置改良設計。 【先前技術】 -般半導體產業的晶圓片製程，必需倚賴石英材 成的機械手臂（Robot blade〕來抓取、承載及傳送晶圓片: 而半導體產業製程的反應室溫度範圍相當廣泛，高溫製程 可達50(TC或更高，相對的必須重視機械手臂抓取晶^王 時，對於晶圓片散熱效率所造成的影響。如第六圖所示， 習知抓取晶圓片20的機械手臂工〇 (承餘置）係=成 ^形：構，在其一端的基部1 〇 1上設有-道圓弧形 的h接觸面102,在另一端設有與第一接觸面1〇2 :=:二的:二接觸面1 〇 3，藉此可使單-晶圓片2 0置放在相-接觸面i Q 2及第二接觸面丄 械手臂1 〇來承載及傳送。由於該第-接觸面 與第二接觸面103的結構，造成該機械手臂10 ”曰曰囡片20接觸面積過多，影響散熱效率 降低良品率及生產效率’並致使製造成本增加。 半導體產業使用的習知機械手臂之缺撼及 。本㈣!作人有感其未臻於完善，遂蝎其心智悉心研 5 41/b 究克服，憑藉其從事謗項 出一種創新的晶圓定仅表業多年之累積經驗，進而研發 時，達到可提供更佳表栽裝置，以期定位承載晶圓片 、J畋熱環境。 【新型内容】 本創作之主要目的巷 計，係藉由石英材質所製晶圓定位承載裝置設 θ in μ ..成的疋位承载裴置改良，減少其 #i，#ϋ曰si J4 β a 曰曰片車父佳及較均勻的散熱 勻散熱及防止熱破片發生之目的。 〜2 本創作之實施内容係為-連結座端部 製成的一承栽盤，該承载盤係 座的二=分別凸伸—懸臂的u形狀，在基座上設有延; 到二個懸臂的半圓形凹階部，在基座的凹階部及各懸臂1 結合有複數個定位塊，較錢係以石英材絲底，1表 面設有藍寶石㈣，且藍寶石塗層的表面實施喷砂處理， 使喷砂表面的⑽度為Ra=28，，藉此構成—種晶圓定 位承載裝置。藉由該定位塊賴計，可減少其受熱面積， 提供晶DM較佳及均句的散熱環境，防止散熱^均所造成 的熱破片瑕疯特別適用於定位承栽高溫製程的晶圓片。 為充分瞭解本創作之目的、特徵及功效，兹藉由下述 具體之實施例，並配合所附之圖式，對本創作做—詳細說 明，說明如後。 【實施方式】 .M354176 如第-圖及第二圖所示，本創作晶圓定位承載裝置設 计，其較佳的實施例係由一連結座工的端部設有石英材質 所I成的-承載盤2，並在該承載盤2上結合複數個第一 及第一定位塊3、3 ’所組成，其中： 該承载盤2係構成有半圓形的一基座21，該基座^ ，的二側端分別凸伸-懸臂2 2，使該承載盤2構成為u •形狀。而該基座2 1上係設有延伸到二個懸臂2 2的半圓 φ _-凹階部2 3，該赠部23的半徑尺寸係依照晶圓 片尺寸構成，例如6对、8忖或1 2对晶圓片等，並在基 座f 1及各懸臂2 2的凹階部2 3表面結合有複數個第: 及第二定位塊3、3’’如圖所示’係可在該基座2 1的凹 階部2 3表面處設有二個第一定位塊3，而在二懸臂2 2 的凹階部2 3表面處分別設有一個第二定位塊3,。 、該第-及第二定位塊3、3，係以石英材為基底所構 成，其中，該第一定位塊3係構成矩形塊狀，以其頂面3 1支撐晶圓片；而該第二定位塊3 ,係在頂面3工，内側構 成有向下的-斜面3 2, ’該斜面3 2，的最底端構成有一 平面3 3’，藉該平面3 3,支撐晶圓片；再者，該第一定 .=塊3最佳尺寸為長2mm、寬2mm、®lmm’而該第二 ，位塊3,最佳尺寸為長2mm、寬2職、頂面至底面的 ，2xnm、斜面的最底端之平面至底面高111111]£>。另外，該 及第二定位塊3、3 ’的表面均設有藍寶石塗層，該藍 寳石塗層的表面並實施6 0號砂粒的喷砂處理，使其噴砂 表面的粗糙度為Ra=2.8/Zm，藉此組成本創作一種晶圓^ M354176 位承載裝置。 復t第—圖及第二圖所示，所述該複數個第-及第- 定位塊3、3，盥兮否共姐〇 , 乐一 ^ w载盤2 t合的方式，可為一體成$ m 製成，或分別製造再杆細㈣“士、^巧篮成型所 政所組成，即係可在所述該凹階 部2巧底面設有複數個定位孔24,而各該第一及/一白 定位塊3、3，的底端設有一凸柱34、34，弟藉::: 弟一及第—定位塊3、3,平衡的組裝在承載盤2上的定位 :4、: ”整該第二定位塊3,的斜面”，朝向= 的中心〃 P組成本創作晶圓定位承載裝置。 圖至第五圖所示，本創作晶圓定位承載裝置應 在承载早圓片4時由複數個第-及第二定位塊 3、3’承鮮-晶圓片4，由於本創作該第二定位塊y 係内側設有-斜面32，，故使單—晶㈣4可在複數個第 、及第-疋位塊3、3’之間達成平衡校正作用，亦即 成自動平衡及自動校正中心的功能。且該第—及第二定位 :3二:積St高度也高於承載盤2的凹階部；3底 面，其石央材質的熱傳導系數為<=5贾祕，因此在承載 早一晶圓片4時’能縮小其與晶圓片4接觸的面積（如第 四圖所示）’並能保持晶圓片4下方—定空隙（如第五圖所 不）’又該承載盤2係以該基座2 !及二懸臂2 2結構组成 U形狀，也能減少受熱面積，因此本創作承載裝置特別適 用在半導體產業的高溫製程，提供該晶圓片4較佳及較均 勻的散熱環境’能防止發生散熱不均所造成的熱破片瑕 窥’提升晶圓片4的良品率。 M354176 如上所述，足見本創作晶圓定位承載裝置，合理進步 至明，完全符合新穎性、進步性及產業利用性之專利要件。 惟，本創作在上文中係以較佳實施例揭露，熟習本項技術 者應理解的是，該實施例僅用於描繪本創作，而不應解讀 為限制本創作之範圍。應注意的是，舉凡與該實施例等效 之變化與置換，均應設為涵蓋於本創作之範疇内。因此， 本創作之保護範圍當以下文之申請專利範圍所界定者為 準。 【圖式簡單說明】 第一圖為本創作晶圓定位承載裝置之組合立體圖。 第二圖為本創作晶圓定位承載裝置之分解立體圖。 第三圖為本創作晶圓定位承載裝置應用實施示意圖之一。 第四圖為本創作晶圓定位承栽裝置應用實施示意圖之二。 第五圖為本創作第四圖之A—A斷面示意圖。 第六圖為習知承載晶圓片之機械手臂結構示意圖。 【主要元件符號說明】 1 .......連結座 2 .......承載盤 2 1......基座 2 2......懸臂 2 3......凹階部 2 4......定位孔 M354176M3 54176 VIII. New Description: [New Technical Field] This creation is about a wafer positioning carrier, especially an improved design of a carrier device that uses a mosquito bit to carry a wafer during the process and can be transported. [Prior Art] In the semiconductor industry, the wafer process must rely on a quartz blade to capture, carry, and transport the wafer: The temperature range of the reaction chamber in the semiconductor industry is quite wide. The process can reach 50 (TC or higher, the relative importance must be paid to the effect of the heat dissipation efficiency of the wafer when the robot arm grabs the crystal. As shown in the sixth figure, the wafer 20 is conventionally grasped. The mechanical arm work (bearing) system is formed into a shape: a h-shaped contact surface 102 having a circular arc shape is provided on the base 1 〇 1 at one end thereof, and a first contact surface 1 is provided at the other end. 〇 2 :=: two: two contact faces 1 〇 3, whereby the single-wafer 20 can be placed on the phase-contact surface i Q 2 and the second contact surface arm 1 承载 to carry and transmit Due to the structure of the first contact surface and the second contact surface 103, the contact area of the mechanical arm 10" cymbal 20 is too large, which affects the heat dissipation efficiency, reduces the yield and the production efficiency, and increases the manufacturing cost. The shortcomings of the conventional mechanical arm. (4)! Good, 遂蝎 心 心 心 41 41 41 41 41 41 41 41 41 41 41 41 41 41 41 41 41 41 41 41 41 41 41 41 41 41 41 41 41 41 41 41 41 41 41 41 41 41 41 41 41 41 41 41 41 41 41 41 Carrying the wafer and J畋 thermal environment. [New content] The main purpose of this creation is to improve the position of the θ in μ by using the wafer positioning bearing device made of quartz material. Its #i, #ϋ曰si J4 β a 曰曰片车佳佳 and a more uniform heat dissipation to prevent heat generation and prevent the occurrence of thermal fragments. ~2 The implementation of this creation is - a joint made of the end The bearing tray, the two of the carrying tray bases are respectively convex-extension-shaped u-shapes, and are provided with extensions on the base; semi-circular concave portions to the two cantilever arms, and concave portions of the bases and The cantilever 1 is combined with a plurality of positioning blocks, the quartz is made of quartz wire, the surface of the sapphire is coated with sapphire (4), and the surface of the sapphire coating is sandblasted so that the (10) degree of the blasting surface is Ra=28, This constitutes a wafer positioning carrier device, which can be reduced by the positioning block The heat-receiving area provides the heat dissipation environment of the crystal DM and the uniform sentence, and prevents the thermal fragmentation caused by the heat dissipation. It is especially suitable for positioning the wafers for the high-temperature process. To fully understand the purpose, characteristics and efficacy of the creation. The present invention will be described in detail with reference to the following specific embodiments and with the accompanying drawings, and the description will be followed by the following. [Embodiment] . M354176 As shown in the first and second figures, the present crystal A preferred embodiment of the circular positioning bearing device is provided with a quartz-made material-bearing disk 2 at the end of a connecting work, and a plurality of first and first combinations are combined on the carrier disk 2 The positioning block 3, 3' is composed of: the carrier tray 2 is formed with a semi-circular base 21, and the two side ends of the base ^ are respectively protruded - the cantilever 2 2, so that the carrier tray 2 is formed For u • shape. The base 2 1 is provided with a semicircular φ _- concave portion 23 extending to the two cantilevers 2 2 , and the radius of the donor portion 23 is formed according to the wafer size, for example, 6 pairs, 8 忖 or 1 pair of wafers and the like, and a plurality of the first and second positioning blocks 3, 3'' are coupled to the surface of the base portion f 1 and the concave portion 2 3 of each of the cantilever arms 2 as shown in the figure Two first positioning blocks 3 are disposed on the surface of the concave portion 23 of the base 2, and a second positioning block 3 is disposed on the surface of the concave portion 23 of the second cantilever 2 2, respectively. The first and second positioning blocks 3, 3 are formed by using a quartz material as a base, wherein the first positioning block 3 is formed into a rectangular block shape, and the wafer is supported by the top surface 31; The two positioning blocks 3 are formed on the top surface, and the inner side is formed with a downward-slope surface 3 2, and the bottom end of the inclined surface 3 2 is formed with a plane 3 3 ′, by which the wafer 3 is supported. Furthermore, the first size of the first block = block 3 is 2 mm long, 2 mm wide, and 1 mmmm, and the second, block 3, the optimal size is 2 mm long, 2 wide, top to bottom 2xnm, the bottommost plane of the slope to the bottom height 111111]£>. In addition, the surface of the second positioning block 3, 3' is provided with a sapphire coating, and the surface of the sapphire coating is subjected to sandblasting of the No. 60 sand to make the surface roughness of the sandblasting surface Ra=2.8. /Zm, which constitutes a wafer ^ M354176 bit carrier. In the first and second figures, the plurality of first-and-first positioning blocks 3, 3, 共 共 共 共 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , Made into $ m, or separately made into a thin (four) "scholar, ^ skillful basket molding office, that is, a plurality of positioning holes 24 may be provided on the bottom surface of the concave step portion 2, and each of the first And a white positioning block 3, 3, the bottom end is provided with a stud 34, 34, brother::: brother and the first positioning block 3, 3, balanced positioning on the carrier 2: 4, : "The bevel of the second positioning block 3," the center 朝向 P of the orientation = constitutes the original wafer positioning carrier. As shown in the fifth to fifth figure, the original wafer positioning carrier should carry the early wafer. At 4 o'clock, the plurality of first and second positioning blocks 3, 3' are fresh-wafer 4. Since the second positioning block y is provided with a bevel 32 on the inner side of the second positioning block, the single-crystal (four) 4 can be A balance correction between the plurality of first and third-level blocks 3, 3' is achieved, that is, the function of the automatic balance and automatic correction center, and the first and second positioning: 3: the product St height is also high Carrier disk 2 The concave portion; 3 the bottom surface, the heat transfer coefficient of the stone material is <=5, so that when the wafer 4 is carried, it can reduce the area of contact with the wafer 4 (as shown in the fourth figure). Show) 'and can maintain the bottom of the wafer 4 - a fixed gap (as shown in the fifth figure) 'and the carrier 2 is composed of the base 2 ! and the two cantilever 2 2 structure U shape, can also reduce the heating area Therefore, the present invention is particularly suitable for the high-temperature process of the semiconductor industry, and provides a better and more uniform heat dissipation environment for the wafer 4, which can prevent the thermal fragmentation caused by uneven heat dissipation. Good product rate. M354176 As mentioned above, it can be seen that the wafer positioning device of the present invention is reasonably improved to meet the patent requirements of novelty, advancement and industrial applicability. However, the present invention is based on the preferred embodiment. It should be understood that those skilled in the art should understand that this embodiment is only used to depict the present invention and should not be construed as limiting the scope of the present invention. It should be noted that variations and permutations equivalent to the embodiment are Should be set to cover Therefore, the scope of protection of this creation is subject to the definition of the patent application scope below. [Simplified illustration] The first figure is a combined perspective view of the created wafer positioning carrier. The exploded perspective view of the created wafer positioning carrier device. The third figure is one of the schematic diagrams of the application implementation of the wafer positioning device. The fourth figure is the second schematic diagram of the application implementation of the wafer positioning device. The fourth section of the creation is a schematic view of the A-A section. The sixth figure is a schematic diagram of the structure of the mechanical arm carrying the wafer. [Main component symbol description] 1 ....... ...carrier tray 2 1...base 2 2...cantilever 2 3...concave step 2 4...positioning hole M354176
3 4’ 4 · · 10· 10 1 10 2 10 3 2 0· 第一定位塊 頂面 凸柱 第二定位塊 頂面 斜面 平面 凸柱 晶圓片 機械手臂 基部. 第一接觸面 第二接觸面 晶圓片 103 4' 4 · · 10· 10 1 10 2 10 3 2 0· First positioning block top surface post second positioning block top surface bevel surface convex column wafer robot arm base. First contact surface second contact surface Wafer 10