TWM350827U - Improved supporting stand for SMD type of light emitting diode - Google Patents
Improved supporting stand for SMD type of light emitting diode Download PDFInfo
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- TWM350827U TWM350827U TW97216261U TW97216261U TWM350827U TW M350827 U TWM350827 U TW M350827U TW 97216261 U TW97216261 U TW 97216261U TW 97216261 U TW97216261 U TW 97216261U TW M350827 U TWM350827 U TW M350827U
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M350827 八、新型說明： 【新型所屬之技術領域】 一種SMD發光二極體支架改良結構，尤其係指一種 於SMD發光二極體支架設置彎折槽以防止彎折造成結構 損壞並防止水氣滲入的SMD發光二極體支架改良結構。 【先前技術】M350827 VIII. New description: [New technical field] A modified structure of SMD LED bracket, especially refers to a bending groove provided in SMD LED bracket to prevent structural damage caused by bending and prevent moisture infiltration SMD light-emitting diode support improved structure. [Prior Art]
近年來，由於發光二極體（Light Emitting Diode，LED) 具有耗電量低、元件壽命長、錢暖燈咖及反應速度快 等優點，加上其體積小、耐震動、適合量產，因此發光二 極體已普遍·於資訊、軌及消費性電子產品的指示燈 與顯示展置上，如行動電話及個人數位助理（p_ai D_ Assistant ’ PDA)營幕背光源、各種戶外顯示器、 交通號誌燈及車燈等。 通常發光二極體晶片係透過表面黏貼技術（Surface Mount Device ’ SMD)固接於SM〇發光二極體支架内， 二1Γ發光二極體支架的内部結構對於發光二極體晶片 果係具有直接性的影響，以下將綱—種習知的 SMD發光二極體支架結構。In recent years, Light Emitting Diode (LED) has the advantages of low power consumption, long component life, fast heating and fast response, and its small size, vibration resistance and mass production. Light-emitting diodes are commonly used in the display and display of information, rail and consumer electronics, such as mobile phones and personal digital assistants (p_ai D_ Assistant 'PDA) camping backlights, various outdoor displays, traffic numbers Zhi lights and lights, etc. Usually, the LED chip is fixed in the SM〇 light-emitting diode bracket through Surface Mount Device (SMD). The internal structure of the LED emitter diode has direct structure for the LED chip. Sexual effects, the following is a well-known SMD light-emitting diode support structure.
請參考「第1A圖」所矛，「锋1A 饮， 」汁不第1A圖」係為習知SMD 發光二極體支架結構支牟去綠 未3折剖面圖。習知SMD發光 二極體支架結構，其包合·货,^ 弟一支架91、第二支架92、 電性連接部93。 第一支架91之上表面 體晶片94,發光二極體晶片 911的一端用以固接發光二極 94可以透過第一支架91產生 5 M350827 電性連接，第一支架91以提供發光二極體晶片94所需的 一種電性極性’或是可以與其他電子裝置（未繪示）進行 電性連接。 第一支架92之上表面921的一端用以與第一支架91 所固接的發光二極體晶片94透過打線接合(wke b〇nding) 技術^成電性連接，第二支架92以提供發光二極體晶片Please refer to the spear of "Picture 1A". "Front 1A drink," juice not 1A" is a conventional SMD light-emitting diode support structure. The conventional SMD light-emitting diode support structure includes a package, a cargo, a bracket 91, a second bracket 92, and an electrical connection portion 93. The first bracket 91 is provided with a surface body wafer 94, and one end of the LED array 911 for fixing the LEDs 94 can be electrically connected through the first bracket 91 to form a 5 M350827, and the first bracket 91 is provided with a light emitting diode. An electrical polarity required for the wafer 94 may be electrically connected to other electronic devices (not shown). One end of the upper surface 921 of the first bracket 92 is electrically connected to the LED chip 94 fixed to the first bracket 91 through a wire bonding technique, and the second bracket 92 provides illumination. Diode wafer
94所需的另外一種電性極性，或是可以與其他電子裝置進 行電性連接。 <電性連接部93自第-支架91以及第二支架92延伸 設置’用以與外部電源電性連接，第-支架91所延伸的 電性連接部93電性連接其巾—㈣雜性，並且以提供 發光二極體晶片94其巾-種電性極性；第二支㈣所延 伸=電性連接部93電性連接至另外—種電性極性，並且 、提供么光—極體晶片94另外—種電性極性。Another electrical polarity required for 94, or it can be electrically connected to other electronic devices. <Electrical connection portion 93 extends from the first bracket 91 and the second bracket 92 to electrically connect with an external power source, and the electrical connection portion 93 extended by the first bracket 91 is electrically connected to the towel-(4) And providing the light-emitting diode wafer 94 with its electrical polarity; the second branch (four) extending = electrical connection portion 93 is electrically connected to another electrical polarity, and providing a light-polar body wafer 94 another - kind of electrical polarity.
裝於 * "及“核92透過射出成麵程被封 #於1座95内’而使得第-支架91以及第二支架％ 別的電性連接部93外露於勝座％之外。 〃 μ參考「第1B圖」以及「第1C圖」所示 1為，SMD發光二極體支架結構支架彎折 紐娜構支架 在將電性連接部93進行蠻批B A ^ η* , ,+Ana3 仃3折且貼合於膠座95外側 、由於膠座95得、為熱塑性樹 ，含 擠壓時，將益、Λ枕颅士 乂成，虽文到外力所 將無法承文擠壓時的外力，因此會造成膠座95 M350827 受外力擠壓的部分造成形變，使得第—支架91或第二支 架92於彎折部分的内側彎折半徑r將小於第一支架9ι / 第二支架92的厚度T，並且第一支架91或第二支架^ 的厚度T小於第一支架91或第二支架％於彎折部分的 側彎折半徑R。 由於第-支架91或第二支架92於彎折部分的外侧彎 折半徑R大於第-支架91或第二支架92的厚度T，則合 導致彎折部分的外側與顧95產生分離㈣況（如4 ic圖」所示）’導致形成第—支架91或第二支架92於彎 折部分外職縣95之_挪96，會使得水氣自· 隙％滲入，影響到發光二極體晶片％的發光功效，甚至 導致發光二極體晶片94失去效用。 對於上述第一支架91或第二支架92於彎折部分外側 與膠座95之間所產生的空隙96使得水氣滲入的問題，更 有人進:步提出了-種改善方式，如「第2A圖」所示，「第 2A圖」係為習知SM〇發光二極體支架改良結構支架未彎 折剖面圖。 义以下將針對改良結構所改良的部份加以說明，其餘與 先前技術相同部份將不再進行贅述·，此-習知SMD發光 二極體支架改良結構所改㈣部分在於第-支架91之上 表面911及第二支架92之上表面921分別設置凹槽97， 並且凹槽97被域於膠座％内。 明參考「第2B圖」以及「第2C圖」所示，「第邡 圖」係為白知SMD發光二極體支架改良結構支架彎折剖 7 M350827 面圖；「第2C圖」係為習知細發光二極體支架改良結 構支架彎折局部放大剖面圖。 透過所D又置的凹槽97’可以有效的增加水氣的行進路 徑，使得發光二極體晶片94可以延長水氣渗人的時間， 藉此增加發光二極體晶片94的壽命。 仁疋在將呢性連接部93進行彎折且貼合於膠座％ 外侧時，所產生的彎折部分的外侧與膠座％產生分離的 情況(如「第2C圖」所示），於第一支架91或第二支架 92於彎折部分外側與膠座％之間所產生的空隙％，依然 會使得水氣滲入，仍會影響發光二極體晶片94的發光功 效甚至^致發光一極體晶片94失去效用。故此習知8胤) 發光-極體支架改良結構僅為延長水氣渗人的時間，並不 月b將水氣渗入問題加以解決。 因此’習知SMD發光二極體支架改良結構仍然未能 解決第-支架91或第二支架92於彎折部分外側與谬座％ 之間所產生的空隙96，而使得水氣滲入的問題。 綜上所述，可知先前技術中長期以來一直存在s_ 發光二極社架結齡料連料時，由於膠座結構 受損而造成水氣渗人關題，因此有必要提岐進的麟 手段’來解決此一問題。 【新型内容】 有鑒於先前技術存在SMD發光二極體支架結構在彎 折電性連接部時，由於勝座結構受損而造成水氣渗入的問 題，本創作遂揭露一種SMD發光二極體支架改良結構j 8 M350827 其中： 發光二極體支架改良結構，其 、膠座、電性連接部以及主要 本創作所揭露之SMD 包含：第一支架、第二支架 彎折部。 第一支架用以固接發光二極體晶片於第—支架之上 表面-端’第二支架之上表面—端與發光二極體The electrical connection portion 93 of the first bracket 91 and the second bracket is exposed to the outside of the singularity of the singularity of the first bracket 91 and the second bracket. μ refers to "1B" and "1C" as shown in Fig. 1, and the SMD light-emitting diode support structure is bent and the Nina structure supports the electrical connection portion 93. BA ^ η* , +Ana3仃3 fold and fit on the outside of the rubber seat 95, because the rubber seat 95 is a thermoplastic tree, when it is squeezed, it will be smashed into the shackles of the scorpion, although the external force will not be able to compress the paper. The external force, therefore, causes deformation of the portion of the rubber seat 95 M350827 that is pressed by the external force, so that the bending radius r of the first bracket 91 or the second bracket 92 on the inner side of the bent portion will be smaller than the first bracket 9 / second bracket 92 The thickness T of the first bracket 91 or the second bracket ^ is smaller than the side bending radius R of the first bracket 91 or the second bracket % at the bent portion. Since the outer bending radius R of the first bracket 91 or the second bracket 92 on the outer side of the bent portion is larger than the thickness T of the first bracket 91 or the second bracket 92, the outer side of the bent portion is separated from the bay 95 (four). As shown in Fig. 4), the formation of the first bracket 91 or the second bracket 92 in the bent portion of the external county 95 is to cause the water vapor to penetrate into the gap, affecting the light emitting diode chip. The luminous efficacy of % even causes the light-emitting diode wafer 94 to lose its effectiveness. For the problem that the first bracket 91 or the second bracket 92 is formed between the outer side of the bent portion and the rubber seat 95 to cause water and gas to infiltrate, more people have stepped forward to propose an improvement method such as "2A". As shown in the figure, "Fig. 2A" is an unbent sectional view of a modified structural bracket of a conventional SM 〇 light-emitting diode support. The following is a description of the improved part of the improved structure, and the rest of the same parts as the prior art will not be described again. The modified structure of the conventional SMD light-emitting diode support is modified in part by the first-frame 91. The upper surface 911 and the upper surface 921 of the second bracket 92 are respectively provided with grooves 97, and the grooves 97 are located in the rubber seat %. Referring to "2B" and "2C", the "Dimensional Map" is a modified view of the modified structure of the SMD LEDs. The M350827 is a cross-section; the "2C" is a habit. A partially enlarged cross-sectional view of the bent structure of the modified structure of the improved light-emitting diode support. The groove 97' disposed through the D can effectively increase the traveling path of the water vapor, so that the LED wafer 94 can prolong the time of water vapor infiltration, thereby increasing the life of the LED wafer 94. When the elastic connecting portion 93 is bent and attached to the outer side of the rubber seat portion, the outer side of the bent portion is separated from the rubber seat % (as shown in "2C"). The void % generated between the outer side of the bent portion and the second holder 92 of the first bracket 91 or the second bracket 92 still causes moisture to penetrate, and still affects the luminous efficacy of the light-emitting diode wafer 94 or even the light-emitting one. The polar body wafer 94 loses its effectiveness. Therefore, the conventional 8胤) illuminating-polar body support structure is only to prolong the time of water and gas infiltration, and does not solve the problem of water and gas infiltration. Therefore, the conventional SMD light-emitting diode support improved structure still fails to solve the problem that the first bracket 91 or the second bracket 92 generates a gap 96 between the outer side of the bent portion and the sley portion, so that water and gas penetrate. In summary, it can be seen that in the prior art, there has been a long-standing s_ illuminating dipole frame ageing material, because the damage of the rubber seat structure causes the water and gas to infiltrate the problem, so it is necessary to improve the lining means. 'To solve this problem. [New content] In view of the prior art, when the SMD light-emitting diode support structure is bent at the electrical connection portion, the water vapor infiltration occurs due to the damage of the winning seat structure, and the present invention discloses an SMD light-emitting diode support. Improved structure j 8 M350827 wherein: the improved structure of the light-emitting diode support, the rubber seat, the electrical connection part and the SMD disclosed by the main body of the present invention include: a first bracket and a second bracket bent portion. The first bracket is used for fixing the LED chip on the surface of the first bracket - the end surface of the second bracket - the end and the light emitting diode
7連接；職健第—絲及第二妓部分地埋置於膠 座内1性連接部，自第_支架以及第二支架延伸設置: 亚設置於膠座外部，狀與外部電源電性連接；主 部’设置於第-核及第二核之下表面與電性連接部交 界處’並設置有彎折槽。 本創作所揭露之SMD發光二極體支架改良結構如上 所述，與先術之間的差異在於本創作透過配置於第一 支架及第二核之下表面與電性連接部交界處的主要彎 折部所設置之彎折槽，並將第—核及第二支架封裝於谬 座中’再將電性連接部進行彎折貼合於膠座時，由於所設 置之料槽可以避免膠座受_折時的外力擠壓所造成 的變形’不會造成結構較損，並使得第—支架及第 二支能緊密貼合膠座，可以有效的防止水氣進人所造成發 光二極體晶片發光功效的影響。 透過上述的麟手段，本創作可叫成SM〇發光二 極體支架結構有效防止水氣滲入的技術功效。 【實施方式】 以下將配合圖式及實施例來詳細說明本創作之實施 9 M350827 方式，藉此縣_如何顧技術手段來解決肋問題並 達成技術功效的實現触能充分靖並據以實施。 首先介紹本創作所揭露之SMD發光二極體支架改良 、、、°構’亚晴參照「第3A圖」所示，「第3A圖」係為本創 作SMD發光二極體支架改良結構支架未彎折剖面圖。7 connection; the occupational first-wire and the second one are partially embedded in the one-piece connection part of the rubber seat, extending from the first bracket and the second bracket: the outer part is disposed outside the plastic seat, and is electrically connected to the external power source The main portion 'is disposed at the junction of the surface of the first core and the second core and the electrical connection portion' and is provided with a bending groove. The improved structure of the SMD light-emitting diode support disclosed in the present application is as described above, and the difference between the prior art and the prior art is that the original bend is disposed at the boundary between the lower surface of the first support and the second core and the electrical connection portion. The bending groove provided by the folding portion, and the first core and the second bracket are packaged in the sley seat, and when the electrical connecting portion is bent and attached to the rubber seat, the rubber seat can be avoided due to the groove provided The deformation caused by the external force squeezed by the _ folding will not cause the structure to be damaged, and the first bracket and the second branch can closely fit the rubber seat, which can effectively prevent the water vapor from entering the LED. The effect of wafer luminescence efficacy. Through the above-mentioned lining means, this creation can be called the technical effect of the SM 〇 light-emitting diode support structure to effectively prevent moisture from infiltrating. [Embodiment] Hereinafter, the implementation of the present invention will be described in detail with reference to the drawings and the examples. The M350827 mode is used to implement the rib problem and achieve the technical effect. First, the improvement of the SMD LED package disclosed in this work is introduced, and the structure of the SMD is shown in Figure 3A. The figure 3A is the improved structure of the SMD LED package. Bend section view.
八本創作所揭露之SMD發光三極體支架改良結構，其 包合.第-支架10、第二支架2〇、膠座⑼、雜連接部 3〇以及主要彎折部4〇。 第一支架1G用以固接發光二極體晶片％於第一支架 二之上表面11 一端’發光二極體晶片50可以透過第一支 木1〇產生電性連接，以提供發光二極體晶片50所需的- 種電性極性，或是可以與其他電子裝置（圖中未緣示）進 行電性連接。 第二支架20之上表面21 一端與發光二極體晶片％ 透過打線接合（wire bGnding)技卿趟鍵接，以提 供發光二極體晶片5G所需的另外—種電性極性，或是可 以與其他電子裝置進行電性連接。 綠㈣及第二支㈣係由銅、鐵或其他 二私的金屬或合金材料—體成型所製成，也就是說， 支架10以及第二支架20所延伸的電性連接部％的 材貝可以是銅、贼其他導紐麵麵或合金。 第支架ίο上表面η以及第二支架2〇上表面2】係 ^一層金屬反射層（圖中未綠示），金屬反射層係為 反先性佳的金屬材料’以增加第—支架1G以及第二支架 M350827 20表面的光反射率，使其發光二極體晶片5〇可藉由金屬 反射層提高發光亮度。 上述之第一支架10以及第二支架20係部分地埋置於 膠座60内，膠座6〇係為中空的長多邊形體，膠座之 材質可為聚碳酸酯（Polycarb〇nate，pc)、聚鄰苯二甲醯 胺（Polyphthalamide，PPA)或其他常用來作為SMD發光 二極體支架結構之膠座的熱塑性樹脂。The improved structure of the SMD light-emitting triode bracket disclosed by the eight creations includes the first bracket 10, the second bracket 2, the rubber seat (9), the miscellaneous joint portion 3〇, and the main bent portion 4〇. The first bracket 1G is used for fixing the light emitting diode wafer at one end of the upper surface 11 of the first bracket 2. The light emitting diode wafer 50 can be electrically connected through the first branch to provide a light emitting diode. The electrical polarity required for the wafer 50 can be electrically connected to other electronic devices (not shown). One end of the upper surface 21 of the second bracket 20 is bonded to the LED body by wire bonding (Gb) to provide another electrical polarity required for the LED chip 5G, or Electrically connected to other electronic devices. The green (four) and the second (four) are made of copper, iron or other two private metal or alloy materials, that is, the brackets 10 and the second bracket 20 extend the electrical connection portion of the material It can be copper, thief or other guide surface or alloy. The first bracket η and the upper surface η of the second bracket 2 are provided with a metal reflective layer (not shown in the figure), and the metal reflective layer is a metal material having a good anti-preemptive property to increase the first bracket 1G and The light reflectivity of the surface of the second holder M350827 20 is such that the light-emitting diode wafer 5 can improve the light-emitting brightness by the metal reflective layer. The first bracket 10 and the second bracket 20 are partially embedded in the rubber seat 60. The rubber seat 6 is a hollow long polygonal body, and the material of the rubber seat can be polycarbonate (Polycarb〇nate, pc). Polyphthalamide (PPA) or other thermoplastic resin commonly used as a seat for SMD light-emitting diode support structures.
膠座60中係設有内凹之功能區61，功能區61係由膠 座60之一端面62向内凹射成型，並以埋入射出（匕记找 molding)的方式使得第—妓1()以及第二核部分 地埋設置於縣60内，並使得第-支架10 -端（即為固 接於發光二極體晶片50之端部）以及第二支架2〇之—端 (即為與發光二極體晶片50形成電性連接之端部）係暴 露於膠座60的内凹之功能區61内，並且紐連接部％ 自第-支架10以及第二支架2〇延伸設置於膠座6〇外。 膠座60功能區可以料將發光二频晶丨％所發射 的光線針，以提高發絲度，並且可自魏區透 過表面黏貼技術（SmfaceMountDevice，SMD)將發光二 極體晶片5G固接於第-支架1G上，以產生電性連接。一 ^電性連接部30,自第-支架1〇以及第二支架2〇 設置，並設置於_ 6G外部，用以與外部電源電性連接， 第-支架10所延伸的電性連接部3G電性連接其中一種恭 性，’並且以提供發光二極體晶月5〇其中一種電性： 性；第二支架20所延伸的電性連接部3〇電性連接至另外 M350827 種包性極性提供n 電性極性。 桮體日日片50另外一種 進行二枝2G赫㈣子裳置 丁电性連接方式，即透過第— 之電性連接部30，換言之 第 -支杀20 極體晶片50即是透過第—支架支^)之發光二 連接部30而與其他電子_性連接’。―* 20之電性 二支^== 於第，1〇之下細及第 有ί；^Γ與電性連接部30交界處，並設置 請參考「第1Α圖」至「第j 於第-支㈣奴第二枝9 ^如’先前技術 粬m ^ 2中，並未設置任何的彎折 田’因此’在將電性連接部％進行 :::严由於膠座95係為熱塑性樹脂所形成:當 力所時，將無法承受擠壓時的外力，因此她 =外力擠_部分造成形變，使得第— =92於料部分的_折半徑r將小於第- 的^Μ 92 T ’並# —支架％或第二支架92 側第一支架91或第二支架92於彎折部分的外 折本^第一支架91或第二支架92於f折部分的外側彎 折+禮R大於第-支架91或第二支架92的厚度T，則會 導致f折部分的外側與勝座95產生分離的情況（如「第 &圖」所示）’導_成第—支架91或第二支架％於彎 M350827 折部分外側娜座95之咖空隙96，會使得水氣自此空 隙96滲入’影響到發光二極體晶月94的發光功效，甚: 導致發光二極體晶片94失去效用。 因此，請參考「第3A圖」以及「第3B圖」所示，「第 3A圖」係為本創作SMD發光二極體支架改良結構支架未 • f折剖面圖；「第3B圖」係為本創作SMD發光二極體支 架改良結構支架彎折剖面圖。 φ 本们作在第一支架10下表面12及第二支架20下表 面12與電性連接部30交界處之主要彎折部4〇，特別設置 有彎折槽41，可以在將電性連接部3〇進行彎折且貼合於 膠座60外侧時，藉由彎· 41賴衝，使得在彎折二所 產生的擠齡力會直接作用於管折槽41中，而使得彎折 槽41之f折槽面42料折後相互貼合，彎折時所產^的 播壓外力不會作用於膠座60上，使得膠座6〇不會受到外 力擠壓而形成形變，並且在擠壓過程中 #支架川或第二支架㈣主要彎折部 為〇’’，並且第-支架10或第二支架20於主要彎折部 40外側彎折半徑R等於第一支架1〇或第二支架2〇 度T。 由於第-支架10或第二支架20於主要彎折部牝外 側的彎折半徑等於第-支架10或第二支架20的厚度τ， 因此，將不會產生主要彎折部40外側鱗座6〇產生分離 的情況（如「第3C圖」所示，「第3C圖」係為本創作咖 發光二極體支架改良結構支架彎折局部放大剖面圖），而 13 M350827 60之㈣， 於主要彎折部4〇外側與膠座 60之間也不會形成空隙，錢輸緣人，發光二 片50的發光功效不受到影響 _曰曰 以正常運作。 使贿先-極體⑼50可 此外，請參考「第3B圖」所示，在電性連接部30中 更可以包含次要騎部31，_電性連接部30超出膠The rubber seat 60 is provided with a concave functional area 61. The functional area 61 is concavely formed inward by one end surface 62 of the rubber seat 60, and is made to be in a manner of being buried (in the case of finding a molding). () and the second core is partially buried in the county 60, and the first end of the first bracket (ie, the end of the photodiode wafer 50 is fixed) and the end of the second bracket 2 (ie, The end portion electrically connected to the LED chip 50 is exposed to the concave functional area 61 of the rubber seat 60, and the new connection portion % is extended from the first bracket 10 and the second bracket 2 The plastic seat is 6 inches away. The function area of the rubber seat 60 can be used to light the light needle emitted by the second-frequency crystal ,% to improve the hair styling degree, and the light-emitting diode chip 5G can be fixed to the surface of the luminescent diode chip 5G through the surface adhesion technology (SmfaceMountDevice, SMD). The first bracket 1G is used to create an electrical connection. An electrical connection portion 30 is disposed from the first bracket 1 and the second bracket 2, and is disposed outside the _6G for electrically connecting to an external power source, and the electrical connection portion 3G extending from the first bracket 10 Electrically connecting one of the following, and providing one of the electrical properties of the light-emitting diodes: the electrical connection of the second support 20 is electrically connected to another M350827. Provide n electrical polarity. The cup body day piece 50 is another type of 2G Hz (four) sub-spot electrical connection, that is, through the first electrical connection portion 30, in other words, the first-killing 20-pole wafer 50 is through the first bracket The light-emitting two connecting portion 30 is connected to other electrons. ―* 20 electric two ^== in the first, below the fine and the first ί; ^ Γ and the electrical connection 30 junction, and please refer to the "1st map" to the "j" - Branch (four) slave second branch 9 ^ As in the 'previous technique 粬 m ^ 2, no bending field is set up 'so 'in the electrical connection part %::: because the rubber seat 95 is a thermoplastic resin Forming: When the force is applied, it will not be able to withstand the external force when squeezing, so she = external force squeezing _ part of the deformation, so that the -=92 of the material part of the _ folding radius r will be less than the first - Μ 92 T ' and #— bracket% or the second bracket 92 side of the first bracket 91 or the second bracket 92 is folded at the outer portion of the bent portion. The first bracket 91 or the second bracket 92 is bent outside the f-fold portion. The thickness T of the first bracket 91 or the second bracket 92 causes the outer side of the f-fold portion to be separated from the spur 95 (as shown in the "Picture & Figure"). The second bracket is in the corner of the M350827, and the outer part of the seat of the 95th coffee cavity 96, which will make the water vapor infiltrate into the gap 96, which affects the luminous effect of the light-emitting diode crystal 94, even: The LED array 94 is rendered useless. For this reason, please refer to "3A" and "3B". "3A" is a cross-sectional view of the modified structure bracket of the SMD LED bracket. The "3B" is The creation of the SMD light-emitting diode support improved structural bracket bending profile. The main bending portion 4 处 at the boundary between the lower surface 12 of the first bracket 10 and the lower surface 12 of the second bracket 20 and the electrical connection portion 30 is provided with a bending groove 41, which can be electrically connected. When the portion 3 is bent and attached to the outer side of the rubber seat 60, the bending force generated by the bending two directly acts on the tube folding groove 41, so that the bending groove is made. The f-groove surface 42 of the 41-fold groove is folded and adhered to each other, and the external force of the weaving pressure generated during the bending does not act on the rubber seat 60, so that the rubber seat 6〇 is not pressed by the external force to form a deformation, and During the extrusion process, the main bending portion of the bracket or the second bracket (four) is 〇'', and the bending radius R of the first bracket 10 or the second bracket 20 outside the main bending portion 40 is equal to the first bracket 1 or The second bracket 2 has a twist T. Since the bending radius of the first bracket 10 or the second bracket 20 outside the main bending portion is equal to the thickness τ of the first bracket 10 or the second bracket 20, the outer flange 6 of the main bending portion 40 will not be generated. In the case of separation (as shown in Figure 3C), "3C" is a partially enlarged cross-sectional view of the modified structural support bracket of the creative coffee light-emitting diode support), and 13 M350827 60 (4), mainly There is no gap between the outer side of the bent portion 4 and the rubber seat 60, and the light-emitting effect of the light-emitting two sheets 50 is not affected. In addition, as shown in the "3B", the secondary connecting portion 31 may be further included in the electrical connecting portion 30, and the electrical connecting portion 30 is beyond the glue.
座6〇的部份再加以、彎折，使電性連接部30可以罝有更多 種的電性連接方式。 、 接著，請參考「第4Α圖」至「第4D圖」所示，「第 4Α圖」至「第4D圖」係為本創作SMD發光二極體支架 改良結構之彎折槽剖面示意圖。 如圖所示’·考折槽41剖面可以為V型槽71、u型槽 72梯形槽73以及凹型才曹74的組合中任選其中一種形 狀，在此僅為舉例，任何可以形成彎折槽41之形狀，都 應包含於本創作之内，並抑此紐本齡的應用。 而彎折槽41之深度D，通常可以設計為第—支架1〇 ^第二支架2G厚度T的三分之—（或者小於三分之一）， ^折槽41之深度D大於厚度Τ的三分之-，甚至超過 i第支架10或第二支架20厚度Τ的一半時，則第一支架 去=及第二支架2〇於主要f折部4〇處的強度會過小， =到任何的外力作用時，容易造成電性連接部30於主 ^折部40處斷裂的情況發生，因此，‘f折槽41之深度 ϋ不可以過深。 值得注意的是，彎折槽41選自V賴71的實施態 14 M350827 樣時，除了可以設計f折槽41之深度D為第一支架1〇 或第二支架20厚度T的三分之—之外，v型槽71所形成 之夾角《可以設計為垂直角度，在電性連接部3〇進行彎 折且貼合於膠座60外侧，由於v型槽71所形成之夹角以 為垂直角度，因此，可以在第一支架1〇或第二支架2〇於 主要-折部4〇内側形成垂直的弯折角度，使得電性連接 部30可以貼合於膠座6〇外側。 综上所述，可知補作與先前技術之f摘差異在於具 有本創作透過配置於第—支架及第二支架之下表面與電 性連接部交界處的主要彎卿所設置之騎槽，並將第一 支架及第二支架封裝於膠座中，再將電性連接部進行彎折 貼合於膠座時，由於所設置之彎折槽可以避練座受到彎 =時的外力賴所造成的變形，不會造成膠座結構的受 損’並使得第一支架及第二支能緊密貼合膠座，可以有效 的防止水氣進人所造成發光二極體晶片發光功效影 技術手段。 曰 I,藉由此—技術手段可以來解決先前技術所存在SMD 發，一極體支雜構在騎雜連接料，由於膠座結構 又知而造成錢渗人關題，触達成8應發光二極 支架結構有效防止水氣滲人的技術功效。 雖然本創作所揭露之實施方式如上，惟所述之内容並 非用以直接限定本創作之專利保護範圍。任何本創作所屬 技術領域巾财财域者，在硝縣創作所揭露 神和乾圍的前提下’可以在實施的形式上及細節上作些許 15 M350827 之更動。本創作之專利保護範圍，仍須以所附之申請專利 範圍所界定者為準。 【圖式簡單說明】 第1A圖為習知SMD發光二極體支架結構支架未彎 折剖面圖。 第1B圖為習知SMD發光二極體支架結構支架彎折 剖面圖。 第1C圖為習知SMD發光二極體支架結構支架彎折 局部放大剖面圖。 第2A圖為習知SMD發光二極體支架改良結構支架 未彎折剖面圖。 第2B圖為習知SMD發光二極體支架改良結構支架 彎折剖面圖。 第2C圖為習知SMD發光二極體支架改良結構支架 彎折局部放大剖面圖。 第3A圖為本創作SMD發光二極體支架改良結構支 架未彎折剖面圖。 第3B圖為本創作SMD發光二極體支架改良結構支 架彎折剖面圖。 第3C圖為本創作SMD發光二極體支架改良結構支 架彎折局部放大剖面圖。 第4A圖至第4D圖為本創作SMD發光二極體支架改 良結構之彎折槽剖面示意圖。 【主要元件符號說明】 16 M350827The 6-inch portion is further folded and bent so that the electrical connecting portion 30 can have more electrical connections. Next, please refer to the "4th drawing" to "4D drawing". The "4th drawing" to "4D drawing" are schematic views of the bending groove of the improved structure of the SMD light-emitting diode support. As shown in the figure, the section of the test groove 41 may be any one of a combination of a V-shaped groove 71, a u-shaped groove 72, a trapezoidal groove 73, and a concave type 74. Here, for example, any bend may be formed. The shape of the slot 41 should be included in this creation and will be used in this New Age. The depth D of the bending groove 41 can be generally designed as the third of the thickness T of the second bracket 2 〇 ^ (or less than one third), and the depth D of the folding groove 41 is greater than the thickness Τ If the third bracket is even more than half of the thickness i of the first bracket 10 or the second bracket 20, the strength of the first bracket to go and the second bracket 2 to the main f-fold portion 4〇 is too small, = to any When the external force acts, the electrical connection portion 30 is likely to be broken at the main folding portion 40. Therefore, the depth of the 'f-folding groove 41' cannot be too deep. It should be noted that when the bending groove 41 is selected from the embodiment 14 M350827 of the V-Ray 71, except that the depth D of the f-folding groove 41 can be designed to be three-thirds of the thickness T of the first bracket 1 or the second bracket 20 - In addition, the angle formed by the v-shaped groove 71 can be designed as a vertical angle, and is bent at the electrical connection portion 3〇 and attached to the outside of the rubber seat 60. The angle formed by the v-shaped groove 71 is a vertical angle. Therefore, a vertical bending angle can be formed on the inner side of the first bracket 1 or the second bracket 2 on the main-folding portion 4, so that the electrical connecting portion 30 can be fitted to the outside of the rubber seat 6〇. In summary, it can be seen that the difference between the supplement and the prior art is that the original arrangement is provided by the main bend disposed at the boundary between the lower surface of the first bracket and the second bracket and the electrical connection portion, and When the first bracket and the second bracket are encapsulated in the rubber seat, and the electrical connecting portion is bent and attached to the rubber seat, the bending groove provided can avoid the external force caused by the bending of the seat. The deformation does not cause damage to the structure of the rubber seat and enables the first bracket and the second branch to closely fit the rubber seat, which can effectively prevent the light-emitting effect of the light-emitting diode from being caused by the water vapor entering the human body.曰I, by means of this - technical means can solve the SMD hair in the prior art, the one-pole body is mixed in the riding material, because the structure of the rubber seat is known to cause money to infiltrate the problem, the touch should reach 8 The two-pole bracket structure effectively prevents the technical effect of moisture infiltration. Although the embodiments disclosed in the present disclosure are as above, the above description is not intended to directly limit the scope of patent protection of the present invention. Anyone who belongs to the technical field of this creation belongs to the premise of the disclosure of Shenhe and Qianwei in the creation of the Nanning County, and can make some changes in the form and details of the implementation. The scope of patent protection of this creation must be determined by the scope of the attached patent application. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1A is a cross-sectional view of a conventional SMD light-emitting diode support structure without bending. Figure 1B is a cross-sectional view of a conventional SMD light-emitting diode support structure. Figure 1C is a partially enlarged cross-sectional view showing a conventional SMD light-emitting diode support structure. Figure 2A is a cross-sectional view of a conventional SMD light-emitting diode support improved structural support. Figure 2B is a cross-sectional view of a conventional SMD light-emitting diode support improved structural support. Figure 2C is a partially enlarged cross-sectional view of a modified SMD light-emitting diode support structure bracket. Fig. 3A is an unbent sectional view of the improved structural support of the SMD light-emitting diode support. Figure 3B is a cross-sectional view of the modified structural support of the SMD light-emitting diode support. The 3C is a partially enlarged cross-sectional view of the modified structural support of the SMD light-emitting diode support. 4A to 4D are schematic cross-sectional views of the bending groove of the modified structure of the SMD light-emitting diode support. [Main component symbol description] 16 M350827
10 第一支架 11 上表面 12 下表面 20 第二支架 21 上表面 22 下表面 30 電性連接部 31 次要彎折部 40 主要彎折部 41 彎折槽 42 彎折槽面 50 發光二極體晶片 60 膠座 61 功能區 62 端面 71 V型槽 72 U型槽 73 梯形槽 74 凹型槽 91 第一支架 911 上表面 92 第二支架 921 上表面 93 電性連接部 17 M350827 94 發光二極體晶片 95 膠座 96 空隙 97 凹槽 r 内側彎折半徑 T '厚度 R 外側彎折半徑 D 深度 a 夾角 1810 First bracket 11 Upper surface 12 Lower surface 20 Second bracket 21 Upper surface 22 Lower surface 30 Electrical connection part 31 Secondary bending part 40 Main bending part 41 Bending groove 42 Bending groove surface 50 Light-emitting diode Wafer 60 Plastic seat 61 Functional area 62 End surface 71 V-shaped groove 72 U-shaped groove 73 Trapezoidal groove 74 Concave groove 91 First bracket 911 Upper surface 92 Second bracket 921 Upper surface 93 Electrical connection portion 17 M350827 94 Light-emitting diode chip 95 Plastic seat 96 Clearance 97 Groove r Inner bending radius T 'Thickness R Outside bending radius D Depth a Angle 18
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97216261U TWM350827U (en) | 2008-09-09 | 2008-09-09 | Improved supporting stand for SMD type of light emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97216261U TWM350827U (en) | 2008-09-09 | 2008-09-09 | Improved supporting stand for SMD type of light emitting diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM350827U true TWM350827U (en) | 2009-02-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW97216261U TWM350827U (en) | 2008-09-09 | 2008-09-09 | Improved supporting stand for SMD type of light emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWM350827U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102194965A (en) * | 2010-03-18 | 2011-09-21 | 展晶科技(深圳)有限公司 | Compound semiconductor packaging structure and manufacturing method thereof |
| US8524541B2 (en) | 2009-07-16 | 2013-09-03 | Cheng Kung Capital, Llc | Processes for manufacturing an LED package with top and bottom electrodes |
| TWI422070B (en) * | 2010-03-12 | 2014-01-01 | Advanced Optoelectronic Tech | Compound semiconductor package and method for manufacturing thereof |
-
2008
- 2008-09-09 TW TW97216261U patent/TWM350827U/en not_active IP Right Cessation
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8524541B2 (en) | 2009-07-16 | 2013-09-03 | Cheng Kung Capital, Llc | Processes for manufacturing an LED package with top and bottom electrodes |
| TWI411139B (en) * | 2009-07-16 | 2013-10-01 | Cheng Kung Capital Llc | Led package with top-bottom electrodes |
| US8710540B2 (en) | 2009-07-16 | 2014-04-29 | Cheng Kung Capital, Llc | LED package with top and bottom electrodes |
| US8802503B2 (en) | 2009-07-16 | 2014-08-12 | Cheng Kung Capital, Llc | Processes for manufacturing an LED package with top and bottom electrodes |
| TWI422070B (en) * | 2010-03-12 | 2014-01-01 | Advanced Optoelectronic Tech | Compound semiconductor package and method for manufacturing thereof |
| CN102194965A (en) * | 2010-03-18 | 2011-09-21 | 展晶科技(深圳)有限公司 | Compound semiconductor packaging structure and manufacturing method thereof |
| CN102194965B (en) * | 2010-03-18 | 2015-01-07 | 展晶科技(深圳)有限公司 | Compound semiconductor packaging structure and manufacturing method thereof |
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