•M338458 八、新型說明： 【新型所屬之技術領域】 本創作係有關-種電連接器，尤指_種安裝於電路板上之電連接器。 【先前技術】 電連接器廣泛應用於電子領域，例如可移轉數據資料之手機或其他設 備上之串舰流排（Universal Serial BUS，簡稱USB)用電連接器，固定於 電路板上，以形成訊號傳輸之路徑。 、 -種電連接α ’可安裝至電路板上’其包括絕緣本體、收容於絕緣本 . 翻之概導魏子，錢包覆魏緣本體之雜顏；所述導電端子設 • 有焊接端，所述導電端子由一健地端子和複數信號端子組成，所述電連 接器還包括=電性連接導電端子焊接端之集成ESD防護元件之ic元件，信 號端子中之靜f流經1C元件經接地端子導丨。所述遮體包括一安裝 部，所述1C元件包括一内表面’其緊貼遮蔽殼體之安裝部放置且通過粘合 劑將二者連結起來。 -、然而，上述電連接器組裝過程中，1C元件和遮蔽殼體二者之固持是通 過膠結之方式實現的，膠接固持之方式不僅使製造工序變得繁瑣，而且容 易在自動化之效率上出現瓶頸。 鑒於此，實有必要提供一種電連接器以解決上述問題。 【新型内容】 本創作之目的在於提供一種電連接器，其可簡化電連接器之製造工序。 本創作是這樣解決上述技術問題的：一種電連接器，可安裝至電路板 上，其包括絕緣本體、收容於絕緣本體内之複數導電端子，以及包覆於絕 緣本體之遮蔽殼體，所述導電端子由一個接地端子和複數信號端子組成， 所述電連接器還包括一電性連接導電端子之防護靜電之IC元件，信號端子 中之靜電流經1C元件經接地端子導出，每一導電端子設有露出電連接器後 端底部之焊接端，所述絕緣本體包括一位於電連接器後端之尾部，其中所 述導電端子自尾部向上彎折延伸彎折部，所述導電端子焊接端、彎折部及 絕緣本體之尾部共同構成收容IC元件之收容部。 5 • M338458 與習知技術相比’本創作電連接器利用導電端子之焊接端、·彎折部和 絶緣本體之尾部組成之收容部收容1C元件，不但簡化了製造工序，且能有 效提南大批量製造之效率。 【實施方式】 下面，將結合附圖對本創作電連接器作進一步詳細描述。 請參閱第一圖至第四圖所示，為本創作電連接器100之第一實施例， 包括絕緣本體1、裝於絕緣本體1中之複數導電端子2、包覆於絕緣本體^ 上之遮蔽殼體3及安裝於絕緣本體1賴之錢電路(Integrated circui 稱1C)元件4。• M338458 VIII. New description: [New technical field] This is a kind of electrical connector, especially an electrical connector mounted on a circuit board. [Prior Art] Electrical connectors are widely used in the field of electronics, such as mobile terminals for transferring data data on mobile phones or other devices, and are connected to the circuit board by the electrical connectors of the Universal Serial BUS (USB). Form the path of signal transmission. - The electrical connection α ' can be mounted on the circuit board'. It includes the insulating body and is housed in the insulation. The general guide Wei Zi, the money covering the Wei edge body; the conductive terminal set • welded end The conductive terminal is composed of a grounding terminal and a plurality of signal terminals, and the electrical connector further comprises an ic component that is electrically connected to the integrated ESD protection component of the soldering terminal of the conductive terminal, and the static f in the signal terminal flows through the 1C component. Guided by the grounding terminal. The cover includes a mounting portion, and the 1C member includes an inner surface that is placed against the mounting portion of the shield housing and joins the two by an adhesive. - However, in the assembly process of the above electrical connector, the holding of both the 1C component and the shielding casing is achieved by cementing, and the manner of bonding and fixing not only makes the manufacturing process cumbersome, but also facilitates the efficiency of automation. A bottleneck has occurred. In view of this, it is necessary to provide an electrical connector to solve the above problems. [New Content] The purpose of this creation is to provide an electrical connector that simplifies the manufacturing process of the electrical connector. The present invention solves the above technical problems in that the electrical connector is mounted on a circuit board, and includes an insulative housing, a plurality of conductive terminals received in the insulative housing, and a shielding housing covering the insulative housing. The conductive terminal is composed of a grounding terminal and a plurality of signal terminals, and the electrical connector further comprises an IC component for electrically protecting the static electricity of the conductive terminal, wherein the static electricity flowing in the signal terminal is led out through the grounding terminal of the 1C component, and each conductive terminal a soldering end is disposed at a bottom end of the rear end of the electrical connector, the insulating body includes a tail portion at a rear end of the electrical connector, wherein the conductive terminal is bent upwardly from the tail portion to extend the bent portion, and the conductive terminal is soldered, The bent portion and the tail portion of the insulative housing together constitute a housing portion for housing the IC component. 5 • M338458 Compared with the prior art, the M338458 uses the soldering end of the conductive terminal, the bent portion and the housing of the end of the insulating body to accommodate the 1C component, which not only simplifies the manufacturing process, but also effectively promotes the Nanda The efficiency of mass production. [Embodiment] Hereinafter, the present invention will be further described in detail with reference to the accompanying drawings. Referring to the first embodiment to the fourth embodiment, the first embodiment of the present invention includes an insulative housing 1 and a plurality of conductive terminals 2 mounted on the insulative housing 1 and coated on the insulative housing ^ The shielding case 3 and the component circuit 4 mounted on the insulative housing 1 (Integrated Circui 1C) are mounted.
請參第二圖至第四圖，絕緣本體i包括基部！ ！和自基部i i向前延伸而 成之舌板12。複數收容導電端子之收容通道14沿對接方向延伸貫穿基部“ 下^面13及舌板12底部15，基部n之下表面13向下凸伸一組平行設置 ^士部⑽，相鄰兩擔止部13G之間之間隙與收容通道14相通。為組裝 =緣本體i至遮蔽殼體3上，自基部„上表面16兩端部分別向上凸設凸台 鱼下矣17/部及下表面13兩端部分別凸伸突部170，以及側面17 Z m 162 ° 11 ^ 18 翼4 180，兩翼部18〇之間之距離不小於胁 且兩翼部180及它們之間之尾部18之 兀件之見度汉置 導引部⑻，以導引IC元件4裝入收容= 向中他們圍成之收容部182設置 個接:端二2:，_邑緣本體1内對應之收容通道14内，由- =内之^ΤΓίίΓ26 _，每-導《例包括收容於舌 极u内之ν通部21、自基部η之下表 ^ =21和_ 23且固定靖本 和遮蔽殼體3之安裝部32，即焊接端t緣本體1之尾部18 每-導電端子2還包括自焊接端23 = 之後端底部； I6方向延伸之彎折部24及 由&朝絶緣本體1基部11上表面Please refer to the second to fourth figures, the insulating body i includes the base! ! And a tongue 12 extending forward from the base i i . The plurality of receiving passages 14 for accommodating the conductive terminals extend through the base portion "the lower surface 13 and the bottom portion 15 of the tongue plate 12 in the mating direction, and the lower surface 13 of the base portion n protrudes downwardly to form a set of parallel portions (10), adjacent to the two supporting portions. The gap between the 13G and the receiving passage 14 communicates with each other. For assembly = edge body i to the shielding shell 3, two ends of the upper portion 16 of the upper surface 16 are respectively protruded from the bottom of the upper portion of the upper portion of the upper portion of the upper portion The ends respectively protrude from the protrusion 170, and the side surface 17 Z m 162 ° 11 ^ 18 wing 4 180, the distance between the two wings 18 不 is not less than the flank and the two wings 180 and the tail portion 18 between them The guiding portion (8) is arranged to guide the IC component 4 into the receiving body. The connecting portion 182 is arranged in the middle of the receiving portion 182. The end 2:, the corresponding receiving channel 14 in the body portion 1 is -= Within ^ΤΓίίΓ26 _, each-guided example includes the ν-portion 21 housed in the tongue u, the table below the base η ^ 21 and _ 23 and the mounting portion of the fixed Jing and the shielding shell 3 32, that is, the tail portion 18 of the welding end t-edge body 1 each of the conductive terminals 2 further includes a self-welding end 23 = a rear end bottom portion; a bent portion 24 extending in the I6 direction and &Amp; toward the upper surface of the insulating body 11 of the base 1
折部24是構成收容部182之一料，八4 =申之接觸部25。焊接端23和彎 元件4垂直和水平方向上位移之作用。刀別起到限制裝入收容部182中之IC ic元件4為大體上為扁平狀，内部集合複數個咖保護元件{元件 6 M338458 4由内壁40、與内壁40相對設置之外壁41、連接内壁40和外壁41之一對 侧壁44及頂壁43和底壁42組成，其中外壁41上設置有複數分別與導電 ^子2之接觸部25電性導通之導電區410 ;所述底壁42和内壁40、外壁 41相交接之位置處分別設置有楔形之引導部420以方便1C元件***收容部 182中。1C元件4裝入收容部182中後，導電端子2焊接端23承接1C元 件之底壁41，接觸部25分別對應彈性抵接1C元件4外壁41之導電區410。 遮蔽殼體3遮覆於絕緣本體1之外，其設有與舌板12對應設置之對接 介面31和與對接介面31相對設置之安裝部32。遮蔽殼體3由頂面33、底 面34及連接它們之兩側面35組成，絕緣本體1之突部no分別和遮蔽殼 體3對應之之側面35及底面34干涉配合。自遮蔽殼體3靠近側面％之底 • 面34上設有衝壓部37，該衝壓部37貫通至侧面35且朝外彎折形成與底面 34平齊之焊接部38，焊接部38與導電端子2之焊接端23共面設置了安裝 部32自兩側面35延伸且相向彎折組成，且形成複數分別與絕緣本體1之 凸台160、擋臂162、擋止部13〇對應之卡持槽39把絕緣本體丨和遮蔽殼 體3牢固固持；導電端子2之焊接端23從遮蔽殼體3安裝部％之底端^ 後凸伸。自遮蔽殼體3頂面33之後端中央向後水平延伸一舌板33㈧舌板 330位於1C元件4之頂部之上，防止IC元件4從收容部182中脫落出來。 請參照第五圖至第六圖所示為本創作電連接器1〇〇之第二實施例，其 與第一實施例相似，由絕緣本體1、裝於絕緣本體丨中之複數導電端子2、 包覆於絕緣本體1上之遮蔽殼體3及安裝於絕緣本體丨背後之IC元件4組 •成。 與第一實施例不同，本實施例中之1C元件4收容部（未標示）由導電 端子2之焊接端23、彎折部24和絕緣本體1上對應之尾部18組成；其中 焊接端23用來承接IC元件4之底壁，彎折部24分別和IC元件*外壁仙 對應之導電區410對應電性接觸。為更牢固地組接忙元件4，可在元件 4之底壁（未標示）上鍍可焊性鍍層，在導電端子2之焊接端23上铲 條件下可溶化之焊材，當組接電連接器刚至電路板上過表面安事:: (SurfaceM_tTechn〇1〇gy ’簡稱SMT)焊接時，上述焊材即可溶化並將導兩 端子2焊接端23和IC元件之底壁機械組接起來。第二實施例 : 例相同部分之技術特徵在此不做贅述。 、貝也 7 M3 3 845 8 ^裝電連接ϋ 1GG至電路_，將導電端子2之焊接端23、遮蔽殼體 3之焊接部％分別與電路板上對應之電路過smt焊接。組配後，各信號端 子26中之靜電自焊接端23直接流經1C元件4後從接地端子20導出。 %與習知技術相比，本創作電連接器1〇〇利用導電端子2之桿接端^、 弓折口P 24#絕緣本體1之尾部18組成之收容部收容IC元件*，不 了製造工序，且能有效提高大批量製造之效率。 ，士述僅為本創作電連接器100《兩個具體實施$式，本領域之普通技 術人員在不?文變本發明精神之原理下所做出之任何改進均視為本創作之保 護範圍，例《遮蔽殼體3之焊接部38為***電路才反後進行之焊接等。” 紅所述，本創作符合新型專利要件，妥依法提出專利申請。惟，以 • i所述者僅為本創作之較佳實施例，本創作之範圍並不以上述實施例為 限，舉凡熟習本案技藝之人士援依本創作之精神所作之等效修飾 ， 皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 弟一圖係本創作電連接器第一實施例之立體組合圖。 苐一圖係弟一圖所示電連接器之立體分解圖。 第三圖係第一圖所示電連接器之另一角度之立體分解圖。 第四圖係第_圖所示電連接H遮蔽殼體和其他元件分離之立 弟五圖係本創作電連接器第二實施例之立體組合圖。 β • 第六圖係第五圖所示電連接器遮蔽殼體和其他元件分離之立體組合圖。 【主要元件符號說明】 電連接器 100 絕緣本體 1 基部 11 舌板 12 下表面 13 撞止部 130 收容通道 14 底部 15 上表面 16 凸台 160 擋臂 162 側面 17 突部 170 尾部 18 翼部 180 導引部 181 8 M3 3 845 8 收容部 182 導電端子 2 接地端子 20 導通部 21 焊接端 23 彎折部 24 接觸部 25 信號端子 26 遮蔽殼體 3 對接介面 31 安裝部 32 頂面 33 舌板 330 底面 34 側面 35 衝壓部 37 焊接部 38 卡持槽 39 1C元件 4 内壁 40 外壁 41 導電區 410 底壁 42 引導部 420 頂壁 43 側壁 44The folded portion 24 is formed as one of the receiving portions 182, and the fourth portion is the contact portion 25. The action of the welding end 23 and the bending element 4 in the vertical and horizontal directions. The IC ic element 4 in the accommodating portion 182 is substantially flat, and a plurality of coffee protection elements are assembled inside. The element 6 M338458 4 is provided with an inner wall 40, an outer wall 41 opposite to the inner wall 40, and an inner wall. 40 and one of the outer wall 41 are formed by the side wall 44 and the top wall 43 and the bottom wall 42. The outer wall 41 is provided with a plurality of conductive regions 410 electrically connected to the contact portions 25 of the conductive members 2; the bottom wall 42 A wedge-shaped guiding portion 420 is respectively disposed at a position where the inner wall 40 and the outer wall 41 are intersected to facilitate insertion of the 1C element into the receiving portion 182. After the 1C element 4 is inserted into the accommodating portion 182, the soldering end 23 of the conductive terminal 2 receives the bottom wall 41 of the 1C element, and the contact portion 25 correspondingly elastically abuts the conductive region 410 of the outer wall 41 of the 1C element 4. The shielding case 3 is covered outside the insulative housing 1, and is provided with a mating interface 31 corresponding to the tongue plate 12 and a mounting portion 32 disposed opposite the mating interface 31. The shielding case 3 is composed of a top surface 33, a bottom surface 34 and two side surfaces 35 connecting them, and the projections no of the insulating body 1 are respectively interference-fitted with the side surface 35 and the bottom surface 34 corresponding to the shielding shell 3. The bottom portion of the self-shielding casing 3 close to the side surface is provided with a stamping portion 37 which penetrates to the side surface 35 and is bent outward to form a welded portion 38 which is flush with the bottom surface 34, the solder portion 38 and the conductive terminal The welding end 23 of the second surface is provided with the mounting portion 32 extending from the two side faces 35 and bent toward each other, and forming a plurality of holding grooves respectively corresponding to the boss 160, the blocking arm 162 and the stopping portion 13 of the insulating body 1. 39. The insulating body 丨 and the shielding case 3 are firmly held; the soldering end 23 of the conductive terminal 2 protrudes from the bottom end of the mounting portion of the shielding case 3. A tongue plate 33 (eight) tongue plate 330 extends horizontally rearward from the center of the rear end 33 of the top surface 33 of the shield case 3, and the tongue plate 330 is placed on top of the 1C element 4 to prevent the IC component 4 from coming off the receiving portion 182. Referring to FIG. 5 to FIG. 6 , a second embodiment of the present invention is similar to the first embodiment. The insulating body 1 and the plurality of conductive terminals 2 mounted in the insulating body 丨 are similar to the first embodiment. The shielding case 3 covering the insulative housing 1 and the IC component 4 mounted on the back of the insulative housing are formed. Different from the first embodiment, the 1C component 4 receiving portion (not labeled) in the embodiment is composed of the soldering end 23 of the conductive terminal 2, the bent portion 24 and the corresponding tail portion 18 of the insulating body 1; wherein the soldering end 23 is used The bottom wall of the IC component 4 is received, and the bent portion 24 is electrically contacted with the conductive region 410 corresponding to the outer wall of the IC component. In order to more securely assemble the busy component 4, a solderable plating layer may be plated on the bottom wall (not shown) of the component 4, and the solder material may be melted under the shovel condition on the soldering end 23 of the conductive terminal 2, when the group is connected to electricity When the connector is just over the surface of the board:: (SurfaceM_tTechn〇1〇gy 'SMT for short) welding, the above welding material can be melted and the two ends 2 welded end 23 and the bottom wall of the IC component are mechanically connected. stand up. Second Embodiment: The technical features of the same portions will not be described herein. , Belle 7 M3 3 845 8 ^ Electrical connection ϋ 1GG to circuit _, the welding end 23 of the conductive terminal 2, the soldering portion % of the shielding case 3 and the corresponding circuit on the circuit board are smt soldered. After assembly, the static electricity from each of the signal terminals 26 flows directly from the soldered end 23 through the 1C element 4 and then from the ground terminal 20. % Compared with the conventional technology, the present invention has the use of the rod terminal of the conductive terminal 2 and the accommodating portion of the tail portion 18 of the insulating body 1 to accommodate the IC component*, which is not a manufacturing process. And can effectively improve the efficiency of mass production. The description is only for the purpose of the creation of the electrical connector 100 "two specific implementations, any improvement made by those skilled in the art without the spirit of the invention is regarded as the protection scope of the present invention. For example, the welding portion 38 of the shielding case 3 is welded after the insertion of the circuit. According to Red, this creation complies with the new patent requirements and makes a patent application in accordance with the law. However, the above is only the preferred embodiment of the creation, and the scope of this creation is not limited to the above examples. The equivalent modifications made by those skilled in the art in accordance with the spirit of this creation shall be covered by the following patents. [Simplified illustration] The first figure of the first embodiment of the present invention is a three-dimensional combination diagram of the present invention. An exploded perspective view of the electrical connector shown in Figure 1. The third figure is an exploded perspective view of the other angle of the electrical connector shown in Figure 1. The fourth figure is the electrical connection shown in Figure _ The H-shading housing and other components are separated from each other. The second embodiment of the present invention is a three-dimensional combination diagram of the present invention. β • The sixth diagram is the fifth diagram of the electrical connector shielding housing and other components separated Three-dimensional combination diagram. [Main component symbol description] Electrical connector 100 Insulating body 1 Base 11 tongue 12 Lower surface 13 Impact stop 130 Housing channel 14 Bottom 15 Upper surface 16 Boss 160 Arm 162 Side 17 Tab 170 Portion 18 Wing portion 180 Guide portion 181 8 M3 3 845 8 Housing portion 182 Conductive terminal 2 Ground terminal 20 Conduction portion 21 Soldering end 23 Bending portion 24 Contact portion 25 Signal terminal 26 Shading housing 3 Butt interface 31 Mounting portion 32 Top Face 33 tongue 330 bottom surface 34 side 35 stamping portion 37 weld portion 38 retaining groove 39 1C element 4 inner wall 40 outer wall 41 conductive region 410 bottom wall 42 guide portion 420 top wall 43 side wall 44