M338439 八、新型說明： 【新型所屬之技術領域】 本創作係關於-種出光之結構，尤其係指—種LED均勻出光之結構 應用於使LH)均勻出光之結構出光均勻之領域。 、系 【先前技術】 -習知的-種LED均勻出光之結構1(可為一均勻出光之燈具） 所不\包括.设體11 ’該设體u具有一出光面U1 :複數個發光二極體結 構12設於該殼體11之底部’該發光二極體結構12之一發光二極體⑵設於^ 反射杯122之底部’且該發光二極體結構12係將螢光粉123混合光學' 後’倒在魏二滅121上成，這綠軸簡單，但無法鋪混合含 膠材之螢光粉層125於發光二極體121上之厚度沿，故會造成發光二極體社構 12出光時色溫稍自，且會有_林產生，且發_轴自外黃及亮度也不 均勻’如此會造成整個燈具結構！的出光面發出不均句之白光。 習知的另-種LED均勻出光之結構2(如第二圖所示），包括：一殼體21， 且該殼體21具有-出光面211 ;複數個白光光源22設於該殼體21之底部由 於相鄰光源所發出之白光重疊區域A1之光線較明亮，而白光未重疊區域於則 光線較暗，故此燈具結構的出光面也會有發出不均句白光之現象。 ^創作人有鐘於上述習知技術之缺點，故提供一種咖均句出光之結構， 其食b使燈具結構的出光面發出均勻之白光。 【新型内容】 〇 ίΐ作之主要目的在於提供一種LED均句出光之結構，其能使led均勻出 光之結構能發出均勻之白光。 本創作之次要目的在於提供一種LED均勻出光之結構及其 減少發光二極體結構發出之光源的色溫不均勻及黃圈光暈之現、象。 、 M338439 本創作提供-種LED均勻岐之結構，包括：m光面位於該殼 體之獅；-光擴絲設於該出絲之下方；至少，光二極體結構設於該殼 : 狀底部’且該發光—極聽構包括：—反射杯；-發光三極體係設於該反射 杯之底部；及-螢光基板係設於該發光二極體之上方，並設於該反射杯之頂部； 其中該螢絲板厚度之誤差。該LED均Μ光之結構之製造綠，其步驟包括： 將-發光二極體設於-反射杯之底部；將一螢光基板設於該發光二極體之上 S，並設於該反射杯之頂部，形成—發光二極體結構；職發光二鋪結構設 /於該殼體之底部；及將一光擴散板設於一殼體之一出光面之下方。 本創作另—種LED均勻出光之結構，包括··-殼體；-出光面位於 馨該殼體之頂端；-增亮膜設於該出光面之下方；—光擴散板設於該增亮膜之下 方，至少-發光二極體結構設於該殼體之底部，且該發光二極體結構包括：一 反射杯，-發光-極體係設於該反射杯之底冑；及一勞光膜係覆於該發光二極 體上’其中該螢光基板厚度之誤差小於1%。該LED均句出光之結構之製造方法， 其步驟包括·將-發光二鋪設於該反射杯之底部；將—螢光膜覆於該發光二 極體t，形成一發光二極體結構；將該發光二極體結構設於該殼體之底部；將 -增免膜⑨於殼體之-出絲之下方；及將_光擴散板設於該增細之下方。 本創作又_ LED均句出光之結構，包括：—殼體；—出光面位於 該殼體之頂端；一增亮膜設於該出光面之下方；-光擴散板設於該增亮膜之下 方，-螢光層銳該光擴散板之下方；及至少一白紐管設於該殼體之底部。 ‘該LED均勻出光之結構之製造方法，包括：將至少一白光燈管設於一殼體之底 -部，將一增受膜設於該殼體之一出光面之下方；將-光擴散板設於該增亮膜之 下方；及將一螢光層設於該光擴散板之下方。 【實施方式】 茲為使貴審查委員對本創作之特徵及方法步驟有更進一步之瞭解與認 識，現將詳細設計之原理及本創作之較佳實施例說明如後。 本創作第-實施例之LED均勻出光之結構3(可為_均勻出光之LED燈具) 6 M338439 (如第三圖所示）’包括：一殼體31 ; —出光面311位於該殼體&之頂端；一光 擴散板32沒於該出光面311之下方；至少一發光二極體結構33設於該殼體31 之底部’且該發光一極體結構33包括：一反射杯331 ; —發光二極體332係設 於該反射杯331之底部；及一螢光基板333係設於該發光二極體332之上方， 並設於該反射杯331之頂部；其中該螢光基板厚度之誤差小於1%，該螢光基板 333包括一基板3331及一学光粉層3332，該螢光粉層3332係設於該基板3331 之下表面，基板厚度及螢光粉層厚度之誤差分別小於1%，且該螢光粉層3332中 包括複數個光擴散粉33321及螢光粉33322。其中該出光面311和該光擴散板 32中間更設有一增亮膜34，且該增亮膜34上具有一鋸齒狀表面341。 本創作第一實施例之LED均勻出光之結構之製造方法(如第四圖所示），其 步驟包括： S31將一發光二極體設於一反射杯之底部； S32將一螢光基板設於該發光二極體之上方，並設於該反射杯之頂部，形成 一發光二極體結構； S33將該發光二極體結構設於一殼體之底部； S34將一增亮膜設於該殼體之一出光面之下方；及 S35將一光擴散板設於該增亮膜之下方。 S32步驟中包括將複數個螢光粉及擴散粉混合後分佈於一基板之下表面，形 成該螢光基板之一步驟。將該複數個螢光粉及擴散粉混合後分佈於該基板之該 下表面之步驟中之該分佈方式包括旋轉塗佈、含浸塗佈、刮刀塗佈、濺錄錢膜、 蒸鍵鑛膜或離子鍍膜。S34步驟中，包括使該增亮膜上形成複數鋸齒狀之一表面 之一步驟。 本創作第二實施例之LE：D均勻出光之結構3(如第五圖所示)和第一實施例不 同之處，其中該出光面311和該光擴散板32中間不具有該增亮膜34，且增加另 一增亮膜334設於該基板3331之上表面。 本創作第二實施例之LE1D均勻出光之結構之製造方法(如第六圖所示），其 步驟包括： " S41將一發光二極體設於一反射杯之底部； 7 M338439 S42將一螢光基板(該螢光基板包括一基板及一螢光粉層，該螢光粉層係 設於該基板之下表面）設於該發光二極體之上方，並設於該反射杯之 頂部； S43將一增亮膜設於該基板之上表面，形成一發光二極體結構； S44將該發光二極體結構設於一殼體之底部；及 S45將一光擴散板設於該殼體之一出光面之下方。 本創作第三實施例之LEID均勻出光之結構3 (如第七圖所示)和第一實施例不 同之處在於該螢光基板也可為一螢光片335,該螢光片335中包括複數個光擴散 粉3351及螢光粉3352，且該螢光片厚度之誤差小於1%。 本創作第三實施例之LED均勻出光之結構之製造方法(如第八圖所示），其 步驟包括： ' S51將一發光二極體設於一反射杯之底部； S52將複數個螢光粉及擴散粉混合後壓製成一螢光基板(該螢光基板為一 光片）； S53將該榮光片設於該發光二極體之上方，並設於該反射杯之頂部，形成 一發光二極體結構； S54將該發光二極體結構設於一殼體之底部；M338439 VIII. New description: [New technical field] This creation is about the structure of light-emitting, especially the structure of LED uniform light output. It is applied to the field of uniform light emission of LH). , [Prior Art] - a well-known type of LED uniform light-emitting structure 1 (can be a uniform light-emitting fixture) does not include: set body 11 'the body u has a light-emitting surface U1: a plurality of light-emitting two The polar body structure 12 is disposed at the bottom of the casing 11. The light-emitting diode (12) of the light-emitting diode structure 12 is disposed at the bottom of the reflective cup 122 and the light-emitting diode structure 12 is a fluorescent powder 123. The hybrid optics 'after' is poured on the Wei Er-Xing 121. The green axis is simple, but the thickness of the phosphor-containing phosphor layer 125 on the light-emitting diode 121 cannot be mixed, so that the light-emitting diode is caused. When the social structure 12 emits light, the color temperature is slightly self-contained, and there will be _ forest production, and the hair shaft is from the outer yellow and the brightness is not uniform. This will cause the whole lamp structure! The illuminating surface emits white light of unevenness. The structure 2 of the conventional LED uniform light emitting device (as shown in the second figure) comprises: a casing 21, and the casing 21 has a light-emitting surface 211; a plurality of white light sources 22 are disposed in the casing 21 At the bottom, the light of the white light overlapping area A1 emitted by the adjacent light source is brighter, and the white light is not overlapped, the light is dark, so that the light emitting surface of the lamp structure may also emit uneven white light. ^The creator has the shortcomings of the above-mentioned conventional techniques, so it provides a structure in which the coffee is evenly emitted, and the food b makes the light-emitting surface of the lamp structure emit uniform white light. [New content] The main purpose of 〇 ΐ ΐ 在于 在于 在于 在于 在于 在于 在于 主要 主要 主要 主要 主要 主要 主要 主要 主要 主要 主要 主要 主要 主要 主要 主要 主要 主要 主要 主要 主要 主要 主要 主要 主要The secondary purpose of this creation is to provide a structure in which the LEDs are uniformly emitted and to reduce the color temperature unevenness and the yellow circle halo of the light source emitted from the LED structure. , M338439 This creation provides a kind of LED uniform structure, including: the lion with the m-gloss surface located in the housing; the optical expansion wire is disposed below the wire; at least, the light diode structure is disposed on the shell: 'and the illuminating-polar listening structure comprises: - a reflective cup; - a light-emitting three-pole system is disposed at the bottom of the reflective cup; and - a fluorescent substrate is disposed above the light-emitting diode and disposed in the reflective cup Top; where the thickness of the screen is in error. The LED is designed to be green, and the steps include: disposing a light-emitting diode at the bottom of the reflective cup; and setting a fluorescent substrate on the light-emitting diode S, and setting the reflection The top of the cup forms a light-emitting diode structure; the second light-emitting structure is disposed at the bottom of the casing; and a light diffusing plate is disposed below a light-emitting surface of one of the casings. The invention further comprises a structure in which the LED is uniformly lighted, comprising: ·--the casing; the light-emitting surface is located at the top of the shell; the brightness-increasing film is disposed below the light-emitting surface; the light diffusing plate is disposed on the light-increasing layer Below the film, at least the light emitting diode structure is disposed at the bottom of the housing, and the light emitting diode structure comprises: a reflective cup, the light emitting pole system is disposed at the bottom of the reflective cup; and a light The film is coated on the light-emitting diode, wherein the error of the thickness of the fluorescent substrate is less than 1%. The method for manufacturing the structure of the LED light-emitting, the step comprising: laying the light-emitting layer on the bottom of the reflective cup; and coating the light-emitting diode on the light-emitting diode t to form a light-emitting diode structure; The light emitting diode structure is disposed at the bottom of the casing; the film is added to the lower portion of the casing; and the light diffusing plate is disposed below the thinning. The present invention is further characterized in that: the structure of the light emitting light of the LED includes: a casing; the light emitting surface is located at the top of the casing; a brightness enhancing film is disposed below the light emitting surface; and the light diffusing plate is disposed on the brightness enhancing film. Below, the phosphor layer is sharply below the light diffusing plate; and at least one white tube is disposed at the bottom of the casing. The manufacturing method of the structure for uniformly emitting light of the LED comprises: disposing at least one white light tube at a bottom portion of a casing, and providing an augmentation film under a light emitting surface of the casing; diffusing the light The plate is disposed under the brightness enhancing film; and a phosphor layer is disposed under the light diffusing plate. [Embodiment] In order to provide a better understanding and understanding of the features and method steps of the present invention, the principles of the detailed design and the preferred embodiments of the present invention are described below. The structure of the LED of the present invention is uniform light-emitting structure 3 (which can be a uniform light-emitting LED lamp) 6 M338439 (as shown in the third figure) 'includes: a casing 31; - the light-emitting surface 311 is located in the casing & a light diffusing plate 32 is not below the light emitting surface 311; at least one light emitting diode structure 33 is disposed at the bottom of the casing 31 and the light emitting body structure 33 comprises: a reflecting cup 331; - a light-emitting diode 332 is disposed at the bottom of the reflective cup 331; and a fluorescent substrate 333 is disposed above the light-emitting diode 332 and disposed at the top of the reflective cup 331; wherein the thickness of the fluorescent substrate The error is less than 1%. The phosphor substrate 333 includes a substrate 3331 and a light powder layer 3332. The phosphor layer 3332 is disposed on the lower surface of the substrate 3331. The thickness of the substrate and the thickness of the phosphor layer are respectively different. It is less than 1%, and the phosphor powder layer 3332 includes a plurality of light diffusion powders 33321 and phosphor powder 33322. A brightness enhancing film 34 is further disposed between the light emitting surface 311 and the light diffusing plate 32, and the brightness enhancing film 34 has a sawtooth surface 341 thereon. The manufacturing method of the structure for uniformly emitting light of the LED of the first embodiment of the present invention (as shown in the fourth figure) comprises the steps of: S31 placing a light emitting diode on the bottom of a reflective cup; S32 setting a fluorescent substrate Above the light emitting diode, disposed on the top of the reflective cup to form a light emitting diode structure; S33 is disposed on the bottom of a housing; S34 is provided with a brightness enhancing film One of the housings is below the light exiting surface; and S35 is provided with a light diffusing plate below the brightness enhancing film. The step S32 includes the steps of mixing a plurality of phosphor powders and diffusion powders and distributing them on a lower surface of a substrate to form the fluorescent substrate. The distribution pattern of the plurality of phosphor powders and the diffusion powder mixed in the lower surface of the substrate includes spin coating, impregnation coating, blade coating, splash film, steamed mineral film or Ion plating. In the step S34, the step of forming one of the plurality of zigzag surfaces on the brightness enhancing film is included. The LE:D uniform light-emitting structure 3 (shown in FIG. 5) of the second embodiment of the present invention is different from the first embodiment in that the light-emitting surface 311 and the light diffusing plate 32 do not have the brightness enhancing film therebetween. 34, and adding another brightness enhancement film 334 is disposed on the upper surface of the substrate 3331. The manufacturing method of the LE1D uniform light-emitting structure of the second embodiment of the present invention (as shown in the sixth figure) includes the steps of: S41 placing a light-emitting diode at the bottom of a reflective cup; 7 M338439 S42 a fluorescent substrate (the fluorescent substrate includes a substrate and a phosphor layer, the phosphor layer is disposed on a lower surface of the substrate) disposed above the LED and disposed on the top of the reflector S43, a brightness enhancing film is disposed on the upper surface of the substrate to form a light emitting diode structure; S44 is disposed on the bottom of the casing; and S45 is provided with a light diffusing plate One of the body is below the light surface. The LEID uniform light-emitting structure 3 of the third embodiment of the present invention (as shown in the seventh figure) is different from the first embodiment in that the fluorescent substrate can also be a fluorescent sheet 335, and the fluorescent sheet 335 includes A plurality of light diffusing powders 3351 and fluorescent powders 3352, and the error of the thickness of the fluorescent sheets is less than 1%. The manufacturing method of the structure for uniformly emitting light of the LED of the third embodiment of the present invention (as shown in the eighth figure) includes the steps of: 'S51 placing a light emitting diode at the bottom of a reflective cup; S52 is a plurality of fluorescent lights The powder and the diffusion powder are mixed and pressed into a fluorescent substrate (the fluorescent substrate is a light sheet); the S53 is disposed above the light emitting diode and disposed on the top of the reflective cup to form a light emitting diode a polar body structure; S54 is provided with the light emitting diode structure at the bottom of a casing;
S55將一增亮膜設於該殼體之一出光面之下方；及 S56將一光擴散板設於該增亮膜之下方。 本創作第四實施例之LED均勻出光之結構3(如第九圖所示），包括：一殼體 31 ; -出光面311位於該殼體31之頂端；一增亮膜％設於該出光面3ιι之下 方’且-光擴散板32設於該增亮膜34之下方；至少—發光二極體結⑽設於 該殼體31之底部，且該發光二極體結構33包括 ㈣ =九圖所示）’包括-反射㈣一發光二極體2設 == 數個複數觀概粉編找絲，該螢細厚度喃差掀ι%，$ 螢光膜336係貼覆於該發光二極體332上。 “ 本創作第四實施例之·均勻出光之結構之製造方法，其步驟包括(如第十 8 M338439 圖所示）： S61將一發光二極體設於該反射杯之底部； S62將複數個螢光粉及擴散粉混合後壓製成一螢光膜；及 S63將該螢光膜覆於該發光二極體上，形成一發光二極體結構； S64將該發光二極體結構設於一殼體之底部； S65將一增亮膜設於該殼體之一出光面之下方；及 S66將一光擴散板設於該增亮膜之下方。 其中S63步驟為將該螢光膜貼覆於該發光二極體上之一步驟。 本創作第五實施例之led均勻出光之結構4(如第十一圖所示），包括：一殼The S55 has a brightness enhancing film disposed under the light emitting surface of the housing; and S56 defines a light diffusing plate below the brightness enhancing film. The LED 3 of the fourth embodiment of the present invention has a uniform light-emitting structure 3 (as shown in FIG. 9), comprising: a casing 31; a light-emitting surface 311 is located at the top of the casing 31; and a brightness enhancement film is disposed at the light-emitting portion. The light diffusing plate 32 is disposed under the brightness enhancing film 34; at least the light emitting diode junction (10) is disposed at the bottom of the casing 31, and the light emitting diode structure 33 includes (4) = nine As shown in the figure) 'Including-reflecting (four)-light-emitting diode 2 is set == Several complex views of the powder are found, the thickness of the thickness is 掀ι%, and the fluorescent film 336 is attached to the light-emitting On the body 332. The manufacturing method of the structure for uniformly emitting light according to the fourth embodiment of the present invention, the steps of which include (as shown in FIG. 8 M338439): S61 sets a light emitting diode at the bottom of the reflecting cup; S62 will be plural The phosphor powder and the diffusion powder are mixed and pressed into a fluorescent film; and the S63 is coated on the light emitting diode to form a light emitting diode structure; and the S64 is configured to have the light emitting diode structure in a shell a bottom of the body; S65 is disposed under a light-emitting surface of the housing; and S66 is disposed below the brightness-enhancing film by the S66. The step S63 is to paste the fluorescent film on the film One step on the light-emitting diode. The structure 4 of the led light-emitting device of the fifth embodiment of the present invention (as shown in FIG. 11) includes: a shell
體41 ; -出光面411位於該殼體41之頂端；一增亮膜42設於該出光面411之 下方，且-光擴散板43設於該增亮膜42之下方，又一營光層私設於該光擴散 上 板43之下方；至少一白光燈源45設於該殼體41之底部。其中該增亮膜犯 具有一鋸齒狀表面421。 ，其步驟包括(如第十 本創作第五實施例之led均勻出光之結構之製造方法 二圖所示），包括： S71將至少一白光燈管設於一殼體之底部。 S72將一增亮膜設於該殼體之一出光面之下方； S73將一光擴散板設於該增亮膜之下方；及 S74將一螢光粉層設於該光擴散板之下方。 其中S72之步驟中，包括使增亮膜上形成複數織狀之一表面之 綜上所述，由於上狀摘作LED均”光之輯的蚊町 及螢光粉層，且LED均㈣光之結構㈣\ 嶋小於1%，故本創作咖物光之結構能使出 已，並非用來限定本創作實施 、特徵及精神所為之均等變化 惟以上所述者，僅為本創作之較佳實施例而 之範圍，舉凡依本卿帽專概騎述之構造 與修飾，均應包括於本創作之申請專利範圍内。 M338439 【圖式簡單說明】 第一圖為習知LED均勻出光之結構之側視圖。 第二圖為另一習知LED均勻出光之結構之側視圖。 第二圖為本創作第一實施例之LED均勻出光之結構之側視圖。 第四圖^本創作第一實施例之LED均勻出光之結構之製造方法之步驟流 第五圖為本創作第二實施例之LED均勻出光之結構之侧視圖。 第六圖為本創作第二實施例之LED均勻出光之結構之製造方法 程圖。，娜抓 第七圖為本創作第三實施例之LH)均勻出光之結構之側視圖。 第八圖為本創作第三實施例之LED均勻出光之結構之製造方法之步驟流 程圖。 抓 第九圖為本創作第四實施例之LE：1)均勻出光之結構之側視圖。 第十圖為本創作第四實施例之LH)均勻出光之結構之製造方法之步驟流 程圖。 ' 第十一圖為本創作第五實施例之led均勻出光之結構之側視圖。 第十二圖為本創作第五實施例之LED均勻出光之結構之製造方法之步驟 流程圖。 【主要元件符號說明】 (習知技術） 1LED均勻出光之結構 11殼體 11出光面 12發光二極體結構 121發光二極體 122反射杯 M338439 123螢光粉 124光學膠材 125含光學膠材之螢光粉層 2 LE：D均勻出光之結構 21殼體 211出光面 22白光光源 A1白光重疊區域 A2白光未重疊區域 Η厚度 (本創作） 3 LED均勻出光之結構 31殼體 311出光面 32光擴散板 33發光二極體結構 331反射杯 332發光二極體 B 333螢光基板 3331基板 3332螢光粉層 33321光擴散粉 33322螢光粉 334增亮膜 335螢光片 3351光擴散粉 3352螢光粉 336螢光膜 M338439 3361光擴散粉 3362螢光粉 34增亮膜 341鋸齒狀表面 4LED均勻出光之結構 41殼體 411出光面 胃 42增亮膜 421鋸齒狀表面 • 43光擴散板 44螢光層 45白光燈源The light-emitting surface 411 is located at the top of the housing 41; a brightness enhancement film 42 is disposed below the light-emitting surface 411, and the light diffusion plate 43 is disposed below the brightness enhancement film 42 and another light-emitting layer Privately disposed below the light diffusing upper plate 43; at least one white light source 45 is disposed at the bottom of the housing 41. Wherein the brightness enhancing film has a serrated surface 421. The steps include (as shown in the second figure of the manufacturing method of the structure for uniformly emitting light of the fifth embodiment of the fifth embodiment), comprising: S71, at least one white light tube is disposed at the bottom of a casing. S72 sets a brightness enhancement film below a light emitting surface of the casing; S73 places a light diffusion plate under the brightness enhancement film; and S74 places a phosphor powder layer under the light diffusion plate. The step of S72 includes the step of forming one surface of the plurality of woven fabrics on the brightness enhancement film, and the upper layer is extracted as the mosquito line and the phosphor powder layer of the LED light series, and the LEDs are all (four) light. The structure (4) \ 嶋 is less than 1%, so the structure of the creation of the coffee material can be used to limit the implementation, characteristics and spirit of the creation, but the above is only the best of the creation. For the scope of the examples, the structure and modification of the specific caps of the Qing Cap should be included in the scope of the patent application of this creation. M338439 [Simple description of the figure] The first picture shows the structure of the uniform LED light. The second figure is a side view of another structure in which the LED is uniformly lighted out. The second figure is a side view of the structure in which the LED of the first embodiment is uniformly lighted. Step 5 of the manufacturing method of the structure in which the LEDs are uniformly light-emitting. The fifth diagram is a side view of the structure in which the LEDs of the second embodiment are uniformly light-emitting. The sixth figure is a structure in which the LEDs of the second embodiment are uniformly light-emitting. Manufacturing method map. The figure is a side view of the structure of the LH) uniform light emission of the third embodiment of the present invention. The eighth figure is a flow chart of the steps of the manufacturing method of the structure for uniformly emitting the LED of the third embodiment. LE of the fourth embodiment: 1) Side view of the structure for uniformly emitting light. The tenth drawing is a flow chart of the steps of the manufacturing method of the LH) uniform light-emitting structure of the fourth embodiment. 'The eleventh picture is the creation A side view of a structure for uniformly emitting light of a LED according to a fifth embodiment. Fig. 12 is a flow chart showing the steps of a method for manufacturing a structure in which the LED is uniformly light-emitting according to the fifth embodiment. [Explanation of main component symbols] (Prior Art) 1LED uniform light structure 11 housing 11 light emitting surface 12 light emitting diode structure 121 light emitting diode 122 reflecting cup M338439 123 fluorescent powder 124 optical adhesive 125 containing optical glue fluorescent powder layer 2 LE: D uniform light Structure 21 housing 211 light-emitting surface 22 white light source A1 white light overlapping area A2 white light non-overlapping area Η thickness (this creation) 3 LED uniform light-emitting structure 31 housing 311 light-emitting surface 32 light diffusing plate 33 light-emitting diode structure 331 Shooting cup 332 light emitting diode B 333 fluorescent substrate 3331 substrate 3332 fluorescent powder layer 33321 light diffusing powder 33322 fluorescent powder 334 brightening film 335 fluorescent sheet 3351 light diffusing powder 3352 fluorescent powder 336 fluorescent film M338439 3361 light Diffusion powder 3362 fluorescent powder 34 brightening film 341 serrated surface 4LED uniform light structure 41 housing 411 light surface stomach 42 brightening film 421 serrated surface • 43 light diffusing plate 44 fluorescent layer 45 white light source