•M336673 八、新型說明： 【新型所屬之技術領域】 本創作係有關於一種支撐結構，尤指一種用於均溫板 的支撐結構及均溫板。 '【先前技術】 、 隨著電腦之中央處理器（CPU)的運算速度不斷提昇，其所產生 • 的發熱量亦越來越高，以往由鋁擠型散熱器及風扇所組成的散熱裝 置，已不能滿足目前之中央處理器的使用需求，於是有業者陸續開 發出具有更高導熱效能的熱管(heat pipe)及均溫板(vapor chamber) ’並將其與散熱器作組合，以有效地解決現階段的散熱問 喊’其中’又以均溫板具有與發熱電子元件作大面積直接貼附接 觸，而吸引更多的相關業者投入此均溫板的研究。 習知之均溫板及其支撐結構，如第一圖所示，該均邋 _板主要包括一殼體1〇a、一工作流體2〇a、一毛細組織 30a及支樓體40a，其中工作流體20a、毛細組織3〇a 及支撐體40a係容置於殼體10a内部，且支撐體40a係由 板體連縯幫、折而成型的波浪板，且其上下兩端分別抵屢 於毛細組織30a之内側，並令毛細組織30a與殼體l〇a之 内壁面相互貼接。 然而’習知之均溫板及其支撐結構，該支撐結構雖具 有抵壓於毛細組織30a，並與殼體l〇a之内壁面相互貼 接；但其工作流體20a受熱後，將由液相轉變為汽相，此 以相氣體的行走路徑係沿著支撐體40a之波浪形槽道向兩 5 M3 3 6673 側移動後，再傳遞至上方的毛細組織30a來達成其熱傳導 機制，由於此汽相氣體的行走路徑相當漫長，因而導致其 熱傳導效能不彰；另，由於其支撐體4〇a係呈一長條狀對 毛細組織30a進行抵壓，在未被支撐體4〇a所抵壓的毛細 組織30a ，因為距離長而容易產生垂落或蹋陷$見象；而有 • 待加以改善者。 【新型内容】 本創作之目的，在於提供一種均温板及其支撐結構， 錯由該等槽道的間隔設置及該等波浪片的配置，不僅可將 毛細組織均勻的壓抵貼接於殼體之内壁面，而增加其密合 :::二；並可增加均溫板的汽相變化量，以加快熱量的 傳遞速度，進而提昇其導熱效能者。 括一：Π?目#，本創作係提供-種均溫板，包 體具：一二流體、一毛細組織及-支撐結構，該殼 而; m該卫作流體填注於該巾^容腔内部； 佈設於該中空容腔内；該支撐結構係容置於 口茨毛細組織内部，該古 設有對應排列且間卩5配= 板體’於該板體上開 別成型有-波、、纟槽道，於該料道内部分 毛細組ί，：;ί二浪片之上下兩端面分別抵綱 為了 織與該殼體之㈣面相互貼接。 樓結構，該均溫板包括一趣糸“、種均溫板之支 細组織及—支撐結構，兮：二=於該殼體内部的-毛 /支撐、、、口構包括一板體，於該板體 M336673 ^開設有對應排列且間隔配置的複數槽道，於該等槽道内 邛刀別成型有一波浪片，該波浪片之上下兩端面分別抵壓 於所述毛細組織，並使所述毛細組織與所述殼體之内壁面 相互貼接。 【實施方式】 有關本創作之詳細說明及技術内容，配合圖式說明如 下，然而所附圖式僅提供參考與說明用，並非用來對本創 作加以限制者。 睛苓閱第二及三圖所示，係分別為本創作之支撐結構 立脰外觀圖及苐一圖之A區域局部放大圖，本創作係提供 種句/m板及其支撐結構，该均溫板Chamber)包括 一殼體10、一工作流體20(參閱第六圖）、一毛細組織 3〇(參閱第四圖）及一支撐結構4〇。 支撐結構40包括一矩形板體41，此板體41係可為結構 強度尚的金屬材料所製成，於板體41上開設有互相對應排 列的複數槽道42，各個槽道42係為間隔配置，並在相鄰槽 道42之間形成有一間隔板43 ;另在該等槽道42内部分別成 孓有第波浪片44及第二波浪片45，此第一波浪片44係由 一南出板體41頂面的波峯段441及二分別連接於波峯段 441的波谷段442所構設而成，且波谷段442係低於板體 41之底面，另，位於第一波浪片44後方的第二波浪片45係 由二高出板體41頂面的波峯段451及一連接於各波峯段 451的波谷段452所構設而成，且波谷段奶2係低於板體 M336673 41之底面；此外，任二相鄰波浪片乜、奶之波峯段銘1 如係為錯位設置，而本實施例之第一波浪片私的 : 441恰對應於第二波浪片45的波谷段脱，而第一波浪又 ^ 波奋& 442恰對應於第二波浪片45的二波峯段> ”第四、五及六圖所示，係分別為本創作均溫板 之口，，且成元件立體分解圖、組合剖視圖及另一方向 :見圖’本創作之均溫板包括一殼體1〇、一工作流體心 示）、一毛細組織3〇及一支撐結構4〇 ’其中該殼 -10係由-上殼板η及一下殼板12所組合而成，並在上殼 下殼板12之間形成有一中空容腔13，此毛細組_ 糸可為金屬編織網’其係佈設於中空容腔13内部， ，構40係容置於毛細組織3G内部，並利用其各波浪片从、牙 45分料毛細組織3G壓抵於上、下殼板u、&内壁面 猎由剛述之各元件的組合，再將工作流體難下殼板 i對内部的中空容腔13進行除氣 抽真工，即可完成均溫板之製作。 藉由本創作之支撐結構4〇之各槽道犯的間隔設置及該 卜/良片Μ 45的配置’不僅可將毛細組織别均句的壓抵 =接^mio,内壁面’而增加毛細組織3〇與殼體ι〇之内 =面在口貼接效果’亚可增加均溫板的汽相變化量，以加 快熱量的傳遞速度，進而提昇其導熱效能者。 綜上所述，當知本創作之均溫板及其支樓結構已具有 產業利用性、新穎性與進步性，又本創作之構造亦未曾見 M336673 於同類產品及公開使用，完全符合新型專利申請要件 依專利法提出申請。 【圖式簡單說明】 第圖係習知均溫板組合剖示圖。 f 一圖係本創作之支撐結構立體外觀圖。 第一圖係、第二圖之A區域局部放大圖。 係'本創作均溫板之各組成元件立體分解圖。 ^ Θ係本創作均溫板之組合剖視圖。 弟八圖係、本創作均溫板之另一方向組合剖視圖。 【主要元件符號說明】 <習知> 殼體10a 工作流體20a 毛細組織30a ‘ 支撐體40a • <本創作> 殼體10 上殼板11 ^ 下殼板12 中空容腔13 工作流體20 毛細組織30 支撐結構40 M336673 板體41 分隔板43 波峯段441、451 第二波浪片45 槽道42 第一波浪片44 波谷段442、452• M336673 VIII. New Description: [New Technical Field] This creation is about a support structure, especially a support structure for a uniform temperature plate and a temperature equalization plate. '[Prior Art] As the computing speed of the computer's central processing unit (CPU) continues to increase, the amount of heat generated by it is also increasing. In the past, heat sinks consisting of aluminum extruded radiators and fans, It is no longer able to meet the current needs of the central processing unit, so some manufacturers have developed a heat pipe and a vapor chamber with higher thermal conductivity and combined it with the radiator to effectively Solve the current stage of heat dissipation and ask 'where' and the uniform temperature plate has a large area of direct contact with the heating electronic components, and attract more relevant industry players to invest in this temperature plate research. The conventional uniform temperature plate and its supporting structure, as shown in the first figure, the uniform plate mainly comprises a casing 1〇a, a working fluid 2〇a, a capillary structure 30a and a branch body 40a, wherein the work The fluid 20a, the capillary structure 3〇a and the support body 40a are housed inside the casing 10a, and the support body 40a is a wave plate formed by the plate body, which is formed by folding and folding, and the upper and lower ends thereof respectively abut the capillary. The inside of the tissue 30a is placed such that the capillary tissue 30a and the inner wall surface of the casing 10a abut each other. However, the conventional temperature equalizing plate and its supporting structure have abutment against the capillary structure 30a and adhere to the inner wall surface of the casing 10a; however, after the working fluid 20a is heated, it will be transformed from the liquid phase. For the vapor phase, the traveling path of the phase gas moves along the undulating channel of the support body 40a toward the two 5 M3 3 6673 sides, and then passes to the upper capillary structure 30a to achieve its heat conduction mechanism due to the vapor phase. The traveling path of the gas is quite long, which results in poor heat transfer performance. In addition, since the support body 4〇a is pressed against the capillary structure 30a in a long strip, it is not pressed by the support body 4〇a. Capillary tissue 30a, because of the long distance, is prone to drooping or falling into the view; and there are • those to be improved. [New content] The purpose of the present invention is to provide a temperature equalizing plate and a supporting structure thereof, which are arranged by the spacing of the channels and the arrangement of the wave plates, so that the capillary structure can be uniformly pressed against the shell. The inner wall of the body increases its tightness:::2; and can increase the vapor phase change of the uniform temperature plate to accelerate the heat transfer rate, thereby improving the heat conduction performance. Included: Π?目#, the creation department provides a kind of uniform temperature plate, the package body has: a fluid, a capillary structure and a support structure, the shell; m the fluid is filled in the towel The inside of the cavity is disposed in the hollow cavity; the support structure is placed inside the mouthpiece capillary structure, and the ancient arrangement is correspondingly arranged and the interlayer 配5=plate body is opened on the plate body-wave And the grooved channel, the upper and lower end faces of the capillary group in the channel are respectively abutted for the weaving and the (four) faces of the casing. The structure of the floor, the temperature-average plate includes a fun ", a fine structure of the uniform temperature plate and a support structure, 兮: two = inside the shell - hair / support,, and the mouth structure includes a plate a plurality of channels arranged correspondingly and spaced apart are disposed in the plate M336673, and a wave plate is formed in the channel, and the upper and lower end faces of the wave plate respectively press against the capillary structure, and The capillary structure and the inner wall surface of the casing are in contact with each other. [Embodiment] The detailed description and technical contents of the present invention are as follows with reference to the drawings, but the drawings are only for reference and explanation, and are not used. To limit the creation of this creation. The second and third figures are shown in the second and third figures, which are respectively the supporting structure of the creation and the partial enlargement of the A area of the first picture. The creation department provides the sentence/m board. And its supporting structure, the temperature equalizing plate comprises a casing 10, a working fluid 20 (refer to the sixth figure), a capillary structure 3 (see the fourth figure) and a supporting structure 4〇. The supporting structure 40 comprises a rectangular plate body 41, the plate body 41 is The structural strength is made of a metal material, and a plurality of channels 42 are arranged on the plate body 41, and the channels 42 are spaced apart, and a partition plate 43 is formed between the adjacent channels 42; Further, in the interior of the channels 42, a wave plate 44 and a second wave plate 45 are respectively formed, and the first wave plate 44 is connected to the peak portion by the peak segments 441 and 2 of the top surface of the south plate 41. The trough section 442 of the 441 is constructed, and the trough section 442 is lower than the bottom surface of the plate body 41. Further, the second wave piece 45 located behind the first wave piece 44 is raised from the top surface of the plate body 41 by two. The peak section 451 and a trough section 452 connected to each peak section 451 are constructed, and the trough section milk 2 is lower than the bottom surface of the plate M336673 41; in addition, any two adjacent wave pieces, the peak of the milk peak If the first 1 is set as a misalignment, the first wave piece of the present embodiment is private: 441 corresponds to the trough segment of the second wave plate 45, and the first wave is again ^Pov & 442 corresponds to the second The two peaks of the wave plate 45>, as shown in the fourth, fifth and sixth figures, are respectively the mouths of the creation of the temperature equalizing plate, And the three-dimensional exploded view of the component, the combined sectional view and the other direction: see Fig. 'The temperature equalizing plate of the present invention includes a casing 1 〇, a working fluid core), a capillary structure 3 〇 and a supporting structure 4 〇 ' The shell-10 is composed of an upper shell η and a lower shell 12, and a hollow cavity 13 is formed between the upper shell lower shell 12, and the capillary group _ 糸 can be a metal woven mesh The system is disposed inside the hollow cavity 13, and the structure 40 is accommodated inside the capillary structure 3G, and is pressed against the upper and lower shell plates u, & the inner wall surface by using the respective wave pieces from the teeth 45 to divide the capillary structure 3G. Hunting is carried out by the combination of the various components just described, and then the working fluid is difficult to be used to degas the inner cavity of the hollow cavity 13 to complete the production of the uniform temperature plate. The interval setting of each channel of the support structure of the present invention and the configuration of the cloth/good film 45 can not only increase the capillary structure by the pressure of the capillary structure, but also the inner wall surface. 3〇 and the inside of the shell = = = face in the mouth bonding effect 'Asia can increase the vapor phase change of the temperature plate to accelerate the heat transfer speed, and thus improve its thermal conductivity. In summary, when the Zhiwen board and its branch structure of Zhiben's creation have industrial utilization, novelty and progress, the structure of this creation has not seen M336673 in the same kind of products and public use, fully complying with the new patent. The application requirements are filed in accordance with the patent law. [Simple description of the drawing] The figure is a sectional view of the conventional uniform temperature plate combination. f A picture is a three-dimensional appearance of the support structure of the creation. The first figure is a partial enlarged view of the A area of the second figure. It is a three-dimensional exploded view of the components of the creation of the temperature plate. ^ Θ This is a sectional view of the combination of the creation of the temperature plate. The eight-figure system and the cross-sectional view of the other direction of the creation of the temperature plate. [Description of main component symbols] <General knowledge> Housing 10a Working fluid 20a Capillary structure 30a 'Support 40a • <This creation> Housing 10 Upper shell 11 ^ Lower shell 12 Hollow cavity 13 Working fluid 20 Capillary structure 30 Support structure 40 M336673 Plate body 41 Partition plate 43 Wave crest section 441, 451 Second wave piece 45 Channel 42 First wave piece 44 Trough section 442, 452