TWM323068U - Heat-sink bottom board capable of adjusting fan position - Google Patents

Heat-sink bottom board capable of adjusting fan position Download PDF

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Publication number
TWM323068U
TWM323068U TW096209267U TW96209267U TWM323068U TW M323068 U TWM323068 U TW M323068U TW 096209267 U TW096209267 U TW 096209267U TW 96209267 U TW96209267 U TW 96209267U TW M323068 U TWM323068 U TW M323068U
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TW
Taiwan
Prior art keywords
heat
dissipating
fan
plate
bottom plate
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TW096209267U
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Chinese (zh)
Inventor
Bo-Ren Shr
Jing-Chuan Li
Huei-Ting Ye
Chih-Hsien Lin
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Gigazone Int Co Ltd
Giga Byte Tech Co Ltd
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Application filed by Gigazone Int Co Ltd, Giga Byte Tech Co Ltd filed Critical Gigazone Int Co Ltd
Priority to TW096209267U priority Critical patent/TWM323068U/en
Publication of TWM323068U publication Critical patent/TWM323068U/en

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Description

M323068 八、新型說明: 【新型所屬之技術領域】 方〜二:係舁’重散熱構件有關,尤指-種於散熱板下 ::二羽’風扇係能調整其於散熱板下方之位 L先W技術】 α 按Ik著科技的進步與發展,電腦早已成為五 生活t所不可或缺的工且, …、σ 吊 /、 凡,、疋具有重I輕、i崔恶士 乂击 的筆記型電腦,更是杆動芮狄& π ^ “π方便 " 更疋仃動商矛力的敢佳助手。然@,筆記切 面,…電子元件或構件在散熱方 H 又桌上型電腦遜色,因此常需借助一 t結構來提供散熱。再加上筆記型 ; ,係將其底部盥卓笠 力又便用狀况下 …" 4置放處相貼平,故熱量容易囤積而 口此有一種用以置放於筆記型電腦下古 熱底板因應而生。 方之放 一般此種散熱底板,除τ 成外,亦㈣牛/Γ 或散熱性佳之材質製 匕:有進一步加裝風扇來提供較佳之散熱效果者,铁 -而,在貫際使用上仍存在以下的問題點: …、 】·散熱底板與風扇間之連接為不可任 因此僅能適用於少數的幾種筆而:夕, 適用與使用。 纖上,…限制其 ,,2.散熱底板與風扇所組合成的散熱結構,整體 當的魔大’在攜帶方面相去的 且如·貝相 較大的空間。 相印的不方便’於收藏時亦將佔據 S ) 3·風扇在長時間的使用下’不免損壞或堆積大量灰塵 5 M323068 ,故維修上相當不易,更換風扇更為麻煩。 此外,如我國公告第號M272361號「'底板散熱機構」 新型專利-案,其係包括—框架及_安裝於該框架上之風 扇所構成,且該風扇雖可透過框架而調整位置或仰角等, 但卻因該框架並無提供散熱面積而不具有散熱作用,以致 整體散熱效能全仰賴該風扇,終無法達到良好的散熱效果 有鑑於此’本創作人係為改善並解決上述之缺失,乃 特潛心研究並配合學理之利,終於提出―種設計合理且 有效改善上述缺失之本創作。 【新型内容】 丑本創作之主要㈣,在力可提供一種可調整風扇定位 之散熱底板,其不僅可使風扇配合熱源位置而調整移位, 以適用於各式筆記型電腦上,且仍可維持散熱底板應有的 散熱面積,同時在攜帶及收藏上也較為方便,在維修盘更 換上更為簡便。 —為了達成上述之目的,本創作係提供一種可調整風扇 定位之散熱底板’包括一散熱板、以及一可安裝於散熱板 底部之風扇’’其中,散熱板頂面為一承置面、底面則突設 複數彼此延伸走向相一致的散熱鰭片,且各散熱鰭片間呈 平行間隔排列,而風扇係具有一殼體,於殼體上設有一定 位=構,定位結構係用以將風扇固定於散熱板下方處,必 要時風扇亦可拆卸。藉以達到上述之目的。 【實施方式】 M323068 為了使t審查委員能更進一步瞭解本創作之特徵及 技術内容,請參閱以下有關本創作之詳細說明與附圖,然 而所附圖式僅提供爹考與說明用,並非用來對本 限制者。 請參閱第-圖及第二圖,係分別為本創作第一實施例 之立體分解示意圖及立體組合示意圖。本創作係提供一種 可0風扇定位之散熱底板,包括一散熱板!、以及至少 一可安裝於該散熱板1底部之風扇2 ; 1中. ,:熱板!可為單一基板1〇,亦可為多個基板ι〇的組 二二本創作所舉之實施例中,散熱板“系由所述二基板 彎折後層疊,夢此^ ^ 式而使各基板10能經 交曰且糟此此鈿小所佔空間並便於收合;該-美族 10並列相鄰的一側上係#古巧一基扳 惻上係叹有彼此相對應而配合的樞軸部 ,以二基板10之樞軸部100共同為-樞軸11所穿入 ^使一基板1〇能樞接連結。 ^該二ί板10皆由良好的散熱或熱傳導體所製成,如銘 頂二:熱板1成為良好的散熱或熱傳導體,二基 供一筆記:二:承置面二水平並列後所構成的表面積恰可 二1 (如第四圖所示)平置於該散熱板1上 ,Μ 一併茶閱弟三圖所示,- # ^M^ i , —基板10底面則皆凸設有複數 彼此門#心/致的放熱鰭片1G1,且各散熱鰭片101 門开心“:隔排列,以於任二相鄰的散熱鰭片ΙΟΙ 間形成一流道102 ,日士认办u 7 ^ &於各放熱縛片101高度皆相同,M323068 Eight, new description: [New technical field] Fang ~ two: Department of 're-heating components related, especially - under the heat sink:: two feathers fan can adjust its position below the heat sink L First W technology] α According to Ik's progress and development of science and technology, computers have long been an indispensable part of the five life, and ..., σ 吊 /, 凡, 疋 疋 has a heavy I light, i Cui sniper sniper The notebook computer is even more powerful. π ^ "πconvenient" is a more daring assistant. However, @, note cutting surface, ... electronic components or components in the heat sink H and desktop The computer is inferior, so it is often necessary to use a t structure to provide heat dissipation. Plus the notebook type; the bottom of the system is sturdy and easy to use... " 4 placement is flat, so the heat is easy to hoard There is a kind of mouthpiece for placing on the ancient hot floor of the notebook computer. Fang Fang puts this kind of heat-dissipating bottom plate, in addition to τ, it also (4) cow / Γ or heat-dissipating material 匕: further Install a fan to provide better heat dissipation, iron - and, in a continuous There are still the following problems: ..., 】 · The connection between the heat sink and the fan is not allowed, so it can only be applied to a few kinds of pens: eve, apply and use. Fiber, ... limit it, 2. The heat-dissipating structure combined with the heat-dissipating bottom plate and the fan, the overall magical large 'in the carrying aspect and the larger space like the shell. The inconvenient printing will also occupy the S in the collection. Under the long-term use, it will not damage or accumulate a large amount of dust 5 M323068, so it is quite difficult to repair. It is more troublesome to replace the fan. In addition, as for the new patent of the "floor heat sink mechanism" in the announcement No. M272361 of China, it includes - the frame and the fan mounted on the frame, and the fan can adjust the position or elevation through the frame, but the frame does not provide a heat dissipation area and does not have a heat dissipation effect, so that the overall heat dissipation performance depends on The fan, in the end, can not achieve a good heat dissipation effect. In view of this, the creator has made great efforts to improve and solve the above-mentioned shortcomings. Reasonable kinds of design and effective foregoing issues of this creation. [New content] The main part of the ugly creation (4) is that it can provide a heat-dissipating bottom plate with adjustable fan positioning, which can not only adjust the displacement of the fan with the heat source position, but also can be applied to various notebook computers, and still Maintaining the heat dissipation area of the heat sink base plate is also convenient in carrying and storing, and it is more convenient to replace the repair disk. In order to achieve the above objectives, the present invention provides a heat dissipating bottom plate that can adjust the fan positioning, including a heat dissipating plate and a fan that can be mounted on the bottom of the heat dissipating plate. The top surface of the heat dissipating plate is a bearing surface and a bottom surface. The heat dissipating fins are arranged to extend in parallel with each other, and the heat dissipating fins are arranged in parallel intervals, and the fan has a casing, and a positioning structure is arranged on the casing, and the positioning structure is used for the fan. It is fixed under the heat sink and the fan can be removed if necessary. In order to achieve the above purposes. [Embodiment] M323068 In order to enable the t-reviewers to further understand the features and technical contents of this creation, please refer to the following detailed description and drawings of the creation. However, the drawings are only for reference and explanation, not for use. Come to this limiter. Please refer to the first and second figures, which are respectively a perspective exploded view and a three-dimensional combination diagram of the first embodiment of the present invention. This creation provides a heat sink base that can be positioned by a fan, including a heat sink! And at least one fan 2 that can be mounted on the bottom of the heat sink 1; 1 in . , : hot plate! In the embodiment which can be a single substrate or a plurality of substrates, the heat dissipation plate is formed by bending and stacking the two substrates, and each of them is designed to be The substrate 10 can be cross-cutted and the space occupied by the small one is small and easy to be folded; the side of the adjacent side of the American-American 10 is on the side of the adjacent one. The pivot portion is pivotally connected to the pivot portion 11 of the two substrates 10 to enable pivotal connection of a substrate 1. The two plates 10 are made of a good heat dissipation or heat conduction body. For example, Mingding 2: hot plate 1 becomes a good heat dissipation or heat conduction body, and the second base is for one note: 2: the surface area formed by the two horizontal planes is just two (as shown in the fourth figure). On the heat dissipating plate 1, Μ 茶 tea reading the three figures shown in the figure, - # ^M^ i , — the bottom surface of the substrate 10 is convexly provided with a plurality of door #心/induced exothermic fins 1G1, and each heat dissipation The fins 101 are happy ": arranged in a row to form a first-class track 102 between any two adjacent heat-dissipating fins, and the height of the heat-dissipating die 101 is the same.

放核1支撐於桌面等處並予以墊高,而能藉由各U M323068 流道102以自然對流來增加散熱效果。 此外,一基板1〇上亦可分別設有多數散熱通孔, 且各散熱通孔103由二基板10頂面向下貫通而與流道1〇2 相通,如此有助於各散熱通孔1〇3能透過各流道】〇2而彼 此互通’以增加上述自然對流之效果。前述散熱通孔ι〇3 可呈圓形、方形或溝槽狀等各種形狀,在本創作所舉之實 施例令,各散熱通孔1G3係呈溝槽狀,形成於二基板川頂 面(即承置面)上。 風扇2係能被安置於二基板1〇之各散熱鰭片皿下方 ,並可視各式筆記型電腦3不同的熱源位置而作調整,使 風扇2除了被安置於各散熱籍片1〇1下方外,能更進一步 對準於所欲散熱之筆記型電腦3的熱源下方處,藉以提供 筆記型電腦3最佳化的散熱效果。該風扇2具有一殼體2〇 ’於设體2G上設有位結構,定位結構能將風扇2固定 於_ 1下方’必要時風扇2亦可拆卸,·如第三圖所示 ,,、知例中疋位結構係為二彈性臂21,由殼體2〇 各散_片101延伸突出,且二彈 於殼㈣根部處皆為-彈部210,各彈性臂21於盆彈=接 =ΓΓ延伸一按壓部211,當人手同時對二按壓部 施力4,即可令二彈部210分別向外變形,以 ”散熱鰭片101分離,以便移動風扇2之位置 : 1〇1門…定間距之二散熱鰭片 ::吟’各散熱鰭片101末端二側皆設有倒勾104 #21内側亦突設有相扣持的勾部2!2,可增加彈〈 M323068 性臂2】央持於散熱鰭片⑼上之固定效果, 扇2於散熱鰭片101上滑移而可調整位置。9 疋以藉由上ι4之構造组成,即可得到本創作可 風扇定位之散熱底板。 …主 據此,如第四圖所示,當筆 】卜古桢Η 田聿忑^ Μ 3置放於散熱板 上方使科,即可針對該筆記型電腦3的敎源 於散熱板1下方相對庫虛容壯π戶〇 、 置而 播^班 應處女4風扇2,並透過所述定位社 構作位置之調整,且風扇可透過其電源線200以如 =戶料器(圖略)插設於筆記型電腦3上,俾用以提二 侧2所需電力。再者,散熱板!底 腦3近前緣處,係可丨隹一半七社士…土 萃七尘包 加 ,、 乂樞接有稷數橫向間隔之支撐腳 =古’以便透過各支擇腳架105將散熱板】向上支撐一 疋门度使政熱板1能呈仰角擺置,並可於 105末端矣抓、成士 又访肋P木 型電,而散熱板1底面相對於筆記 m ’則可進—步設有複數橫向間隔之止滑墊 107 ,俾用以防滑者。 另’如弟五圖所示’該風扇2之定位結構亦可為二滑 A ^以π入任二相鄰之散熱鰭片101間,而與流道102 配α L又’如第六圖所示,所述定位結構亦可為二延伸臂 方、〇延伸臂23上設有一呈「门」字型之滑槽23Q,且 鰭片101之倒勾1〇4係呈「L」字型者,俾令倒勾 沭—入/月槽230内而能滑動配合;再,如第七圖所示, 所l定位結構係為插銷24,俾藉由插銷24穿置於散熱通孔 103,使風扇2固定於散熱板}下方;最後,如第八圖所q M323068 不 洋述 不,其中,所述定位結構係為螺拾24,且散熱通孔ι〇3内 ,具有對應於螺栓25之螺紋,以藉由螺柱25穿過風扇2而 散熱通孔K)3上。此外,風扇2之定位結構亦可採用黏貼 、磁鐵:掛勾等方式讓風扇2固定於散熱板i下方,在此 因此’藉由本創作可調整風扇定位之散熱底板,不僅 風扇2配合各式筆記型電腦3之熱源位置而調整移位 :散=1亦能透過各散熱籍片1〇1來提供良好的散熱 二:=於該風扇2為可拆卸者,故在攜帶與收藏上也 性\=1能便於配合維修與更換,實為—極具實用 禮_/:墙,本創作實為不可多得之新型創作產品,1 達到預期之使用目的,而解決習知之缺 新賴性及進步性,完全符合新型專利申請要件,二; 2出申請,敬請詳查並賜准本案專利,以保障創作人之 并惟以上所述僅為本創作之較佳可行實施例,非因此即 内專利範圍’故舉凡運用本創作說明書及圖式 内,合=效結構變化,均同理皆包含於本創作之範圍 M323068 【圖式簡單說明】 弟'一圖 得士 4 ί 第二 y本創作第一實施例之立體分解示意圖。 笛一 2係本創作第一實施例之立體組合示意圖。 第二=:第一實施例之局部剖面示意圖。 使用狀態示:創作第-實施例應用於-筆記型電·The core 1 is supported on a tabletop and the like, and is raised, and the heat dissipation effect can be increased by natural convection by each U M323068 flow channel 102. In addition, a plurality of heat dissipation through holes may be respectively disposed on a substrate 1 , and each of the heat dissipation through holes 103 is penetrated from the top surface of the two substrates 10 to communicate with the flow channel 1〇2, thereby facilitating the heat dissipation through holes 1〇. 3 can communicate with each other through each channel 〇 2 to increase the effect of the above natural convection. The heat dissipation through holes ι 〇 3 may have various shapes such as a circular shape, a square shape, or a groove shape. In the embodiment of the present invention, each of the heat dissipation through holes 1G3 is groove-shaped and formed on the top surface of the two substrates ( That is, the bearing surface). The fan 2 can be placed under the heat sink fins of the two substrates, and can be adjusted according to the different heat source positions of the notebook computers, so that the fan 2 is disposed below the heat sinks 1〇1. In addition, it can be further aligned under the heat source of the notebook computer 3 to be cooled, thereby providing an optimized cooling effect of the notebook computer 3. The fan 2 has a casing 2'' disposed on the body 2G, and the positioning structure can fix the fan 2 under the _1. If necessary, the fan 2 can also be disassembled, as shown in the third figure, In the example, the clamping structure is a two-elastic arm 21, which is extended by the shells 2, and the two bullets are at the root of the shell (four) - the elastic portion 210, and the elastic arms 21 are connected to the pots. = ΓΓ extends a pressing portion 211, when the human hand simultaneously applies a force 4 to the two pressing portions, the two elastic portions 210 are respectively deformed outward, so that the heat dissipating fins 101 are separated to move the position of the fan 2: 1 〇 1 door ...The two fins of the fixed distance::吟' Each of the fins 101 has a barb on both sides of the end of the fins 104. The inner side of the #21 is also provided with a hook portion 2! 2, which can be attached to the arm. 2] The central fixed holding effect on the heat sink fins (9), the fan 2 slides on the heat sink fins 101 to adjust the position. 9 疋 by the structure of the upper ι4, the heat dissipation of the fan position can be obtained. The bottom plate. ... According to the main figure, as shown in the fourth figure, when the pen] Bu Gu桢Η Tian Hao ^ Μ 3 is placed on the top of the heat sink, the The notebook computer 3 originates from the lower side of the heat dissipation board 1 relative to the library, and the squad is set to be circulated by the positioning mechanism, and the fan can be powered through the power supply. The line 200 is inserted into the notebook computer 3 such as a household device (not shown), and is used to raise the required power on the two sides. Furthermore, the heat sink plate is near the front edge of the bottom 3 and can be half Seven sergeants... The earth's seven dust packs are added, and the 乂 pivot is connected with a number of horizontally spaced support feet = ancient 'to make the heat sink through each of the legs 105 to support the door to the extent that the political hot plate 1 can be presented The elevation angle is placed, and it can be grasped at the end of 105, and the squad is connected to the rib P wood type, and the bottom surface of the heat dissipation plate 1 can be advanced with a plurality of laterally spaced sliding pads 107. The anti-slipper is also used. As shown in the figure of the fifth figure, the positioning structure of the fan 2 can also be two sliding A ^ with π into the two adjacent cooling fins 101, and with the flow channel 102 with α L and ' As shown in the sixth figure, the positioning structure may also be a second extension arm side, and the extension arm 23 is provided with a "door" type chute 23Q and fins. The barbs 1〇4 of the piece 101 are in the shape of an "L", and the barbed hooks are inserted into the in/or the trough 230 to be slidably fitted; and, as shown in the seventh figure, the positioning structure is a pin. 24, the pin 24 is placed in the heat dissipation through hole 103 to fix the fan 2 under the heat dissipation plate}; finally, as shown in the eighth figure, the M323068 is not described, wherein the positioning structure is a screw pickup 24 And the heat dissipation through hole ι3 has a thread corresponding to the bolt 25 to pass through the fan 2 through the stud 25 to dissipate the through hole K)3. In addition, the positioning structure of the fan 2 can also be fixed by the adhesive, magnet: hook, etc., so that the fan 2 is fixed under the heat sink i, so that the fan can be adjusted by the creation of the heat sink base plate, not only the fan 2 cooperates with various notes The position of the heat source of the computer 3 is adjusted and shifted: the scatter=1 can also provide good heat dissipation through the heat sinks 1〇1: = the fan 2 is detachable, so it is also portable and collectible\ =1 can be easily repaired and replaced, it is very practical _/: wall, this creation is a rare new creative product, 1 to achieve the intended use, and to solve the lack of new knowledge and progress Sexuality, in full compliance with the requirements of the new patent application, 2; 2 application, please check and grant the patent in this case to protect the creator and only the above described is only a better feasible embodiment of the creation, not within The patent scope's use of this creation manual and the schema, the combination of the effect and the structure change, are all included in the scope of this creation M323068 [Simple diagram description] Brother '一图得士4 ί Second y this creation The first embodiment Schematic diagram of the body decomposition.笛一 2 is a three-dimensional combination diagram of the first embodiment of the present creation. Second =: a partial cross-sectional view of the first embodiment. Usage status: Creation - The embodiment is applied to - notebook type

係'本創作第二實施例之局部剖面示意圖。 "係本創作第三實施例之局部剖而—。"0 f七圖係、本創作第四實施例之局部剖T忍圖。 第八圖係本創作第五實施例之局部剖:恳圖。 D圖。 【主要元件符號說明】 <本創作>A partial cross-sectional view of a second embodiment of the present invention. " is a partial cutaway of the third embodiment of the present creation. "0 f seven-picture system, partial section T-bearing diagram of the fourth embodiment of the present creation. The eighth figure is a partial section of the fifth embodiment of the present creation: a drawing. D picture. [Main component symbol description] <This creation>

散熱板 i 基板 10 散熱鰭片1〇1 散熱通孔1〇3 支撐腳架105 止滑墊 1〇7 樞轴部 流道 倒勾 止滑套 枢轴 100 1〇2 1〇4 1〇6 11 風扇 2 殼體 20 彈性臂 21 按壓部 211 €源、、線2〇〇 彈部 21〇 勾部 212Heat sink i Substrate 10 Heat sink fins 1〇1 Heat sink hole 1〇3 Support foot frame 105 Stop pad 1〇7 Pivot part flow path barbs stop slide pivot 100 1〇2 1〇4 1〇6 11 Fan 2 housing 20 elastic arm 21 pressing portion 211 € source, line 2 〇〇 spring portion 21 〇 hook portion 212

Claims (1)

90.j % fl 3g ^ M323068 _ 九、申請專利範圍·· 1、一種可調整風扇定位之散熱底板,包括·· 放熱板,其頂面為一承置面、底面則突設複數彼此 延伸走向相~致的散熱鰭丨,且各該散熱鰭麵系呈平行 間隔排列;及 一風4 ’具有—殼體,於該殼體上設有-定位結構, δΛ定位結構係用以將該風扇固定於該散熱板下方處。 ^ 2、如申請專利範圍第1項所述之可調整風扇定位之 u、、底板’其中該散熱板係由二基板並列枢接而成。 & 3 #申%專利範圍第2項所述之可調整風扇定位之 ;’、、底板’其中該二基板並列相鄰之-側上係設有彼此相 所穿入,以樞接該二基板。 勹榀軸 4、 如申請專利範圍第丄項所述之可 散熱底板,其中該散熱板底面近 ::,位之 間隔之支。 接有魏橫向 5、 如申請專利範圍第4項所述之可 :熱底板,其中各該支撐腳架末端係套設一止滑:二之 放熱板底面近後緣處則設有複數橫向間隔之止滑^而該 6、 如申請專利範圍第丄項所述之可 散熱底板,其中該散熱板係設有多數散熱通^羽定位之 7、 如申請專利範圍第6項所述之可 :熱底板,其中該定位結構係為插銷,以穿二::位之 通孔。 各叆散熱 M323068 8、 如申請專利範圍第6項所述之可調風戶 «底板,其中以位結構料龍,=== 皆具有對應於該螺栓之螺紋 2熱通孔内 通孔上。 Λ使為·螺设於各該散熱 9、 如申請專利範圍第工項所述之 散熱底板’其中該定位結構係為二彈性臂:?原:定位之 該殼體二侧處分別延伸突丨 〃一彈性臂由 =部,以供人手施壓而使該二彈性臂夾固於各該散熱縫 1 0、如申請專利範圍第9項所述之 — 之散熱底板,其中各該散熱鰭片末 广風扇疋位 該二彈性臂内側突設有相扣持的側皆設有倒勾’而 之範圍第1項所述之可調整風扇定位 鄰=上;Γ結構係為二滑塊,以滑人任二相 砷之所述散熱鰭片間作滑動配合。 W 1 2、如申請專利範圍第1項所 之散熱底板’其中該定位結構係為二5周整風扇定位 臂上設有-滑槽,且各該散熱,鰭片末端:f:於該二延伸 該倒勾係能勾入該滑槽内而作滑動配:。貝·]皆设有倒勾,90.j % fl 3g ^ M323068 _ IX. Scope of application for patents·· 1. A heat-dissipating bottom plate with adjustable fan positioning, including · · heat-dissipating plate, the top surface of which is a bearing surface and the bottom surface protrudes from each other The heat dissipation fins are arranged, and the heat dissipation fins are arranged in parallel intervals; and the wind 4' has a casing, and the casing is provided with a positioning structure, and the δΛ positioning structure is used for the fan Fixed below the heat sink. ^ 2. The adjustable fan positioning u, the bottom plate as described in claim 1, wherein the heat dissipation plate is pivotally connected by two substrates in parallel. & 3 #申% patent scope of the second item of the adjustable fan positioning; ', the bottom plate' wherein the two substrates are juxtaposed adjacent to each other on the side is provided with a mutual penetration, to pivot the two Substrate.勹榀 Axle 4. A heat-dissipating base plate as described in the scope of the patent application, wherein the bottom surface of the heat-dissipating plate is near--, spaced apart. In addition to the Wei transverse direction 5, as described in claim 4 of the patent scope: a hot bottom plate, wherein each end of the support stand is sleeved with a slip: the bottom surface of the second heat release plate is provided with a plurality of lateral intervals at the bottom edge 6. The heat-dissipating base plate according to the invention of claim 2, wherein the heat-dissipating plate is provided with a plurality of heat-dissipating and feather-forming positions, as described in claim 6 of the patent scope: The hot bottom plate, wherein the positioning structure is a pin to penetrate the through hole of the second:: position. Each heat dissipation M323068 8. According to the scope of the patent application, the adjustable windshield «the bottom plate, wherein the bit structure of the material dragon, === has the thread corresponding to the thread of the bolt 2 on the through hole in the through hole. The snail is disposed on each of the heat dissipating components. 9. The heat dissipating bottom plate as described in the scope of the application of the patent application, wherein the positioning structure is a two elastic arm: Originally: the two sides of the housing are respectively extended with a protruding arm and a resilient arm by a portion for pressing by the hand to clamp the two elastic arms to each of the heat dissipating slits 10, as claimed in claim 9 The heat-dissipating bottom plate, wherein each of the heat-dissipating fins has a wide fan, and the two elastic arms are provided with a hooked side on the inner side of the two elastic arms, and the adjustable fan according to the first item Positioning adjacent = upper; Γ structure is a two-slider, sliding joint between the heat-dissipating fins of the two-phase arsenic. W 1 2. The heat-dissipating base plate according to item 1 of the patent application scope is wherein the positioning structure is provided with a chute on the entire fan positioning arm of the second and fifth weeks, and the heat dissipation, the fin end: f: Extending the barb can be hooked into the chute for sliding fit: Bay·] all have a barb.
TW096209267U 2007-06-05 2007-06-05 Heat-sink bottom board capable of adjusting fan position TWM323068U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW096209267U TWM323068U (en) 2007-06-05 2007-06-05 Heat-sink bottom board capable of adjusting fan position

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW096209267U TWM323068U (en) 2007-06-05 2007-06-05 Heat-sink bottom board capable of adjusting fan position

Publications (1)

Publication Number Publication Date
TWM323068U true TWM323068U (en) 2007-12-01

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107562149A (en) * 2017-08-24 2018-01-09 太仓市众翔精密五金有限公司 A kind of durable thermostabilization notebook computer bottom plate
CN108829221A (en) * 2018-06-22 2018-11-16 河南孚点电子科技有限公司 A kind of heat dissipation base of adjustable fan position

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107562149A (en) * 2017-08-24 2018-01-09 太仓市众翔精密五金有限公司 A kind of durable thermostabilization notebook computer bottom plate
CN108829221A (en) * 2018-06-22 2018-11-16 河南孚点电子科技有限公司 A kind of heat dissipation base of adjustable fan position

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