M322561 八、新型說明： 【新型所屬之技術領域】 本創作係為-種背光模組，特別是—種具有散熱裝置之背光 模組。 【先前技術】 在直下式背光模組中，光源可為冷陰極燈管(c〇ld cathodeM322561 VIII. New description: [New technical field] This creation is a kind of backlight module, especially a backlight module with heat sink. [Prior Art] In the direct type backlight module, the light source can be a cold cathode lamp (c〇ld cathode)
Fluorescent Lamp，CCFL)或發光二極體(Light EmittingDi〇de， LED)，且一者係以朝向體積縮小的方向發展。 但CCFL因為體積幾乎已不能再縮小。而高亮度的LED會產 生局α卩巨大的熱1，則必須要有合適的散熱設計，否則容易造成 LED發光效率降低、壽命縮短等問題。當背賴組受光源加熱影 響，如無冷部裝置將隨時間累積大量熱量，造成背光模組溫度上 升’當溫度上升時，將影響光源的發光效能及擴散板易產生變形。 如第1圖所示，習知背光模組10具有一燈箱1、一殼體12 及一散熱裝置，燈箱1中具有至少一光源1丨，光源Η可為CCFL 燈官或LED，散熱裝置包括散熱鰭片13及散熱風扇15。組裝時， 先將燈箱1裝設固定於殼體12中，再使用導熱膠14將散熱鰭片 13緊密貼合於殼體12之背面，最後將散熱風扇15固定於散熱鰭 片13後方’如此藉由散熱裝置可將背光模組ι〇所產生之熱量向 外排出’以達成降低背光模組高溫之功效。但是，目前對於亮度 等光學顯示品質有極高的要求，使得光源將產生龐大的熱量，經 M322561 由上述之散熱料，無法有效快速的將熱量獅；此外，會因散 熱裝置過厚而影翻背光模組整體厚度，同時影響液晶顯示器之 整體厚度，而這是液晶顯示器所不容所見的。 因此，有關背光模組的散熱問題是目前業界亟需努力克服 的難題。 【新型内容】 本創作係提出一種背光模組，以解決上述問題。 為達到上述目的，本創作一實施例之背光模組具有一殼 體、一設置於殼體内之燈源及一貼附於殼體之底側之散熱裝置， 散熱裝置包括-金屬層、-熱管、—散熱鰭片組及—散熱風扇， 金屬層具有一上表面貼附於殼體之底側，熱管包覆於金屬層内， 散熱鰭片組緊密貼合於金屬層之下表面且具有至少一凹槽，散熱 風扇容置於散熱則之凹槽内，細可產生具有高散熱效能並可 以有效降低背光模組整體厚度，以達到液晶顯示器所需的薄型 化。 【實施方式】 請參照第2圖所示，本創作之第一實施例之背光模組2〇包 括一殼體21、一燈源22、一擴散板23及一光學膜24及一散熱 裝置25。燈源22設置於殼體21内，且包括複數個沿一第一方 向A間隔排列之發光元件221，每一發光元件221可為冷陰極燈 管（Cold Cathode Fluorescent Lamp，CCFL)、發光二極體(LightFluorescent Lamp (CCFL) or Light Emitting Diode (LED), and one developed in a direction toward volume reduction. But the CCFL is almost no longer able to shrink because of its size. The high-brightness LED will produce a huge heat of 1, so it is necessary to have a proper heat dissipation design, otherwise it will easily cause problems such as reduced LED luminous efficiency and shortened life. When the backing group is affected by the heating of the light source, if there is no cold part device, a large amount of heat will accumulate over time, causing the temperature of the backlight module to rise. When the temperature rises, the light emitting efficiency of the light source and the diffusing plate are easily deformed. As shown in FIG. 1 , the conventional backlight module 10 has a light box 1 , a casing 12 and a heat sink. The light box 1 has at least one light source 1 , and the light source Η can be a CCFL light official or an LED. The heat sink includes The heat dissipation fins 13 and the heat dissipation fan 15 are provided. When assembling, the light box 1 is firstly fixed in the casing 12, and then the heat-dissipating fins 14 are closely attached to the back surface of the casing 12, and finally the heat-dissipating fan 15 is fixed behind the heat-dissipating fins 13 The heat generated by the backlight module can be discharged outward by the heat dissipating device to achieve the effect of reducing the high temperature of the backlight module. However, at present, there is an extremely high requirement for optical display quality such as brightness, so that the light source will generate a huge amount of heat, and the heat radiation material can not be effectively and quickly turned on by M322561; The overall thickness of the backlight module affects the overall thickness of the liquid crystal display, which is unacceptable for liquid crystal displays. Therefore, the heat dissipation problem of the backlight module is an urgent problem that the industry needs to overcome. [New content] This creation proposes a backlight module to solve the above problems. In order to achieve the above object, the backlight module of the present embodiment has a housing, a light source disposed in the housing, and a heat sink attached to the bottom side of the housing. The heat dissipation device includes a metal layer, The heat pipe, the heat dissipation fin group and the heat dissipation fan, the metal layer has an upper surface attached to the bottom side of the casing, the heat pipe is wrapped in the metal layer, and the heat dissipation fin group is closely attached to the lower surface of the metal layer and has At least one groove, the heat dissipating fan is accommodated in the groove of the heat dissipation, and the fine heat dissipation performance can be reduced, and the overall thickness of the backlight module can be effectively reduced to achieve the thinning required for the liquid crystal display. [Embodiment] Referring to FIG. 2, the backlight module 2 of the first embodiment of the present invention includes a housing 21, a light source 22, a diffusion plate 23, an optical film 24, and a heat sink 25. . The light source 22 is disposed in the housing 21 and includes a plurality of light-emitting elements 221 arranged along a first direction A. Each of the light-emitting elements 221 can be a Cold Cathode Fluorescent Lamp (CCFL) or a light-emitting diode. Body
Emitting Diode ’ LEDMf射二極體等。擴散板23及光學膜24 M322561 依序設置於殼體21之開口處，以均勻並聚集燈源22提供之光線。 散熱裝置25貼附於殼體21之底側，散熱裝置25包括一金 屬層25卜一熱管（Heat Pipe)252、一散熱鰭片組253及一散熱 風扇255。金屬層251具有一上表面及一相對於上表面之一下表 面，上表面貼附於殼體21之底側，金屬層251為如銅、鋁或鋁 合金等具導熱係數高的金屬製成。熱管252包覆於金屬層251 内，熱管252之長度方向垂直於燈源22之第一方向A。 政熱鰭片組253利用散熱膠緊密貼合金屬層251之下表 面，政熱鰭片組253之長度方向平行於燈源22之第一方向a。 放熱鰭片組253具有一基板2531及垂設於基板2531上之複數個 鰭片2532，鰭片2532之間形成一空氣通道卿，散熱風扇挪 之排出口與空氣通道2533相連通。散熱鰭版253之鰭片微 上可利用鑄模、蝴等機械成形方式形成至少-凹槽254。 鼓風機，且具有— 散熱風扇255容置於凹槽254内，散熱風扇255之數量與 t 254數里致。凹槽254可設置於散熱鰭片組Mg之中間位 置(如第3圖）或—端（第4圖）。散熱風扇255可為-軸流風扇或 —吸入口（圖未示）及一排出口（圖未示）。 凊參照第2 @及第3圖所示， ，燈源22强你由袁4 ΑΛ為I .Emitting Diode ’ LEDMf is a diode and so on. The diffuser plate 23 and the optical film 24 M322561 are sequentially disposed at the opening of the casing 21 to uniformly and condense the light provided by the light source 22. The heat sink 25 is attached to the bottom side of the housing 21. The heat sink 25 includes a metal layer 25, a heat pipe 252, a heat sink fin set 253, and a heat sink fan 255. The metal layer 251 has an upper surface and a lower surface opposite to the upper surface, the upper surface is attached to the bottom side of the casing 21, and the metal layer 251 is made of a metal having a high thermal conductivity such as copper, aluminum or an aluminum alloy. The heat pipe 252 is wrapped in the metal layer 251, and the longitudinal direction of the heat pipe 252 is perpendicular to the first direction A of the light source 22. The heat fin group 253 is closely adhered to the lower surface of the metal layer 251 by using a heat dissipating glue, and the length direction of the political fin group 253 is parallel to the first direction a of the light source 22. The heat-dissipating fin set 253 has a substrate 2531 and a plurality of fins 2532 extending from the substrate 2531. An air passage is formed between the fins 2532. The heat-dissipating fan is connected to the air passage 2533. The fins of the heat sink fins 253 may be formed by at least a groove 254 by mechanical molding such as molding or butterfly. The blower has a cooling fan 255 housed in the recess 254, and the number of the cooling fan 255 is equal to that of the t 254. The groove 254 may be disposed at an intermediate position (as in Fig. 3) or at the end (Fig. 4) of the heat dissipation fin group Mg. The cooling fan 255 can be an axial fan or a suction port (not shown) and a row of outlets (not shown).凊 Refer to the second @ and the third figure, the light source 22 is strong by Yuan 4 ΑΛ for I.
r熱篁導向並聚集於散熱鰭片組253 ;此時， 第一方向A由散熱風扇255之吸入口導入冷 口排出至散熱則組253，再經由散熱籍片 M322561 組253上形成的空氣通道2533將集中於散熱鰭片組253的熱量 隨著#放氣流01、〇2向外散出，如此即可將背光模組所產生之 • 錢向外排出，以達成降低背絲組高溫之功效。 由於利用凹槽254之設置提供容置散熱風扇255，可省去 散熱風扇255的厚度，而使散熱裝置25整體厚度縮小，進而縮 小背光模組及液晶顯示器的整體厚度。再者，可迫使由散熱風扇 255之排出口排出的氣流可順著空氣通道2533流動，而提升散 # 熱效率。 請參照第5圖所示，本創作第二實施例之背光模組2〇,， 本實施例與第-實施例相同或相似的元件標示相同之編號，而不 同處在於散熱裝置25，包括一金屬層251，、一熱管252，、二 組散熱鰭片組253’及二散熱風扇255，，散熱鰭片組253，分 別设於燈源22之兩端，熱管252，之長度方向平行於燈源22之 第一方向A，散熱鰭片組253’之長度方向垂直於燈源22之第一 ^ 方向A。而有關本實施例達到的效果與第一實施例相同，故在此 不贅述。 以上所述，僅用以方便說明本創作之較佳實施例，本創作 之範圍不限於該等較佳實施例，凡依本創作所做的任何變更， 於不脫離本創作之精神下，皆屬本創作申請專利範圍。 【圖式簡單說明】 第1圖習知背光模組散熱裝置結構分解圖。 弟2圖本創作第一實施例之背光模組側視圖。 M322561 空氣通道 凹槽 熱風扇 冷卻空氣 排放氣流 第一方向 2533 254 255 、 255’The enthalpy is guided and gathered in the heat dissipation fin group 253; at this time, the first direction A is introduced into the cooling port by the suction port of the heat dissipation fan 255, and is discharged to the heat dissipation group 253, and then the air passage formed on the heat dissipation piece M322561 group 253. 2533 concentrates the heat of the heat dissipation fin group 253 with the air discharge 01 and 〇2, so that the money generated by the backlight module can be discharged outward, so as to reduce the high temperature of the back wire group. . Since the heat dissipating fan 255 is provided by the arrangement of the recess 254, the thickness of the heat dissipating fan 255 can be omitted, and the overall thickness of the heat dissipating device 25 can be reduced, thereby reducing the overall thickness of the backlight module and the liquid crystal display. Further, the airflow discharged from the discharge port of the heat radiating fan 255 can be forced to flow along the air passage 2533 to improve the heat efficiency. Referring to FIG. 5, the backlight module 2A of the second embodiment of the present invention, the same or similar components of the embodiment and the first embodiment are denoted by the same reference numerals, and the difference lies in the heat sink 25, including a a metal layer 251, a heat pipe 252, two sets of heat dissipation fin sets 253' and two heat dissipation fans 255, and heat dissipation fin sets 253 are respectively disposed at two ends of the light source 22, and the heat pipes 252 are parallel to the light length direction. In the first direction A of the source 22, the length direction of the heat dissipation fin group 253' is perpendicular to the first direction A of the light source 22. The effects achieved by the present embodiment are the same as those of the first embodiment, and therefore will not be described herein. The above description is only for convenience of explaining the preferred embodiments of the present invention, and the scope of the present invention is not limited to the preferred embodiments, and any changes made in accordance with the present creation are not deviated from the spirit of the present creation. It belongs to the scope of patent application for this creation. [Simple description of the drawing] Fig. 1 is an exploded view of the structure of the heat sink of the backlight module. 2 shows a side view of the backlight module of the first embodiment. M322561 Air passage Groove Heat fan Cooling air Discharge airflow First direction 2533 254 255 , 255’
01 >02 A01 >02 A