M319519 八、新型說明： 【新型所屬之技術領域】 本創作係一種發光二極體之多層導熱板散熱裝置，其係一種透過導熱柱將 熱傳導至不同層之導熱板上，而使發光二極體及配合驅動電路所產生之熱，可 以分層、立體、分散散熱方式迅速散發至外界者。 • 【先前技術】 按，在日常生活上最常接觸之燈光光源有舊式燈泡、石英燈泡、日光燈泡 及水銀燈等，不同於前述之燈源，發光二極體係屬於冷發光，具有耗電量低、 Φ元件哥命長、不需暖燈時間、反應速度快等優點，再加上其體積小、耐震動、 適合量產、容易配合應用上之需求製作成極小及陣列式元件，所以發光二極體 在寊sfl、通訊及消費性產品之指示、顯示裝置上，已成為日常生活上不可或缺 之重要7G件，同樣地，以高亮度發光二極體為背光或照明之光源亦將愈來愈受 到重視。 但以高亮度發光二極體作為背光或照明用之光源，因轉換效率問題，使用 時會產生高熱，而持續之高熱對於電子元件會造成損害，且需作為高亮度背光 或照明器具時，則需集中多個發光二極體，因此所產生之熱將會更高，為解決 肇背光或照明燈具之散熱問題，請參閲帛j圖所示，其設有一散熱座1〇〇，該散熱 座100—面上設有複數個排列整齊之散熱鰭片1〇1，該等散熱鰭片1〇1與散熱座 100係呈垂直狀，且該散熱座100上並與散熱鰭片 101相對之一面則貼設有一光 源基板102 ’該光源基板1〇2上設有多個發光二極體1〇3，該等發光二極體1〇3 分別與光源1^板102作電性連接，如此一來，雖可藉由光源基板1〇2與散熱座 100將發光-極體103所產生之熱加以排除 ，惟因發光二極體103皆安裝在同一 光源基板102上’因此所產生之熱亦先集中在光源基板1〇2，雖透過與光源基板 102緊接觸之散熱座⑽將熱傳導至外界，但往往於光源基板⑽上之發光二極 體103分佈密度高的因素，無法僅藉由單一平面快速將熱散發出去，會發生熱 滞留現象’無法迅速將熱導散出去，而使背光或照明光源之發光光源過烫，同 M319519 時’藉由散熱座1GG與散熱鰭片1G1之設計方式，將使讎具之體積及製作成 本增加，使用上非常不理想。 【新型内容】 創作綱要： 本創作之創作人有鑑於上述之缺點，因此乃針對其癥結所在，開始著手加 •以謀求改善，雛所缺，以解求—項合理解決之道，經過無數次之研析、設 計，終於完成本創作之發光二極體之多層導熱板散熱裝置。 、本創作之-目的，在提供-種發光二極體之多層導熱板散熱裝置，該裝置 係為-種供作為背光或照明用之發光二極體之散熱裝置，該裝置上設有一個以 籲上具散熱效果之m定散熱框架，該等固定散熱框架間分別夾置有光源基板或導 熱板；其中，該外層之固定散熱框架間設有一光源基板，該光源基板上分別設 有複數個-定排列之發光二極體，該光源基板上設有與發光二極體電性連接之 電流引線，且在該光源基板内側分別設有相接觸之導熱柱，該等導熱柱之另一 端則分別與不同層之導熱板相接觸，如此一來，可藉由該等導熱柱之熱傳導而 將發光二極體所產生之熱，分散配置至相疊置且不同層之導熱板上，使其所產 生之熱，除可藉由光源基板及固定散熱框架導熱及散熱外，且可藉由分層、立 體、分散之導熱板以增加散熱面積，進而能達到迅速散熱之目的者。 • 本_之次—目的，在提供-種發光二極體之多層導熱板散難置，其外 層之固定散熱框架周邊上設有光學增光均光板，以均勾增加光源之亮度。 本創作之再-目的，在提供—種發光二極體之多層導熱板散熱裝置，其導 熱柱可與任-層之導熱板-體成型，該等導熱柱分別穿過疊置之其他層導熱板 上之開孔，並與光源基板之内側相接觸，如此一來，可將該等發光二極體所產 生之熱，透過導熱柱之熱傳導至各層之導熱板上。 【實施方式】 請參閱第2、3、4圖所示，其為本創作之第一實施方式，本創作係一種發 光二極體之多層導熱板散熱裝置，主要係將背光或照明用之發光二極體所產生 M319519 之熱藉由分散、分層之導熱板以增加賴面積進行散熱，·該裝置上設有一個以 上具散熱效果之固定散熱框架10,該等固定散熱框架1〇中分別設有一開口 ^， 且該等m定散熱姉10之端邊分職有撕之航12，該等航12中分別可 穿套有-鎖合件13 ’於本實施例為一鎖桿，以令該等固定散熱框架1〇可藉由穿 套在鎖孔12中之鎖合件13之鎖合，而疊置在一起。 另’於該外層之固定散熱框架10 設有一光源基板2〇，該光源基板2〇 係由導熱材料製成’使該等光源基板20具有快速導熱效果’且該光源基板2〇 上設有複數個-定排列之發光二極體4〇，該等發光二極體4〇並透過電流引線與 驅動電路(® t未示)作電性連接，且縣縣板2G之_分觀有與鎖孔12 相對之穿孔21 ’以使該等發光二極體4〇所產生之熱，可透過光源基板2〇及固 疋散熱框架10向外傳導。 再者，在該光職板20下設有至少一層導熱板3〇 (於本實施例為二個，且 其材質為具有特定熱傳導方向之石墨所組成），該等導熱板3〇係由導熱材料製 成’且該等導熱板30上設有複數個開孔31，該等開孔31中分別插設有導熱柱 5〇，該等導熱柱50之另-端分別與光源基板2〇接觸，且不同層導熱板3〇^之 導熱柱50係呈互相錯位狀，如此一來，可將在光源基板2〇巾之發光二極體仙 所產生之熱，透過該等導熱柱5〇分別穿套過蚊散熱框架1()上之開口及上層 導熱板30之開孔31，而分散傳導至不同層之導熱板3〇上，更增加快速導敎效 果。 …、 又’於叠置在最外層之固定散熱框架1〇周邊上設有絲增光均光板6〇，以 使在該絲基板2G上之發光二鋪4G可藉由光學增光均光板⑼之侧，均句 增加光源的亮度。 凊參照第5 ®所示，其為補作之第二實施方式，本實施方式與上述實施 方式之不同為：於各層導熱板30上於面對光源基板2〇之一面上分別設有複數 個=體成型之導熱柱5G，該不騎導熱板3請之導熱柱5()係呈互相錯位狀， 且該導熱柱50之另一端則分別穿套過上層之導熱板3〇之開孔31，而與光源基 板20接觸，如此一來，可將在光源基板2〇中之發光二極體4〇所產生之熱透 M319519 過導熱柱50穿套過固定散熱框架1〇及内層導熱板3〇之開孔3ι，而將熱以分層、 立體、分散方式傳導至不同之導熱板3〇，再經由不同之固定散熱框架1〇快速向 外散熱。 請參照第6及6a圖所示，其為本創作之第三實施方式，其主要係於任一層 導熱板30上設有複數個與之一體成型之導熱柱5〇，該等導熱柱5〇之一端接觸 於光源基板20之内側，另一端則穿套過固定散熱框架1〇及導熱板3〇上之開孔 31 ’分別與不同層之導熱板30接觸，而將熱以分層、立體、分散方式傳導至各 固定散熱框架ίο上，再經由該等gj定散熱_ 10快速向外散熱。 請參照第7及7a圖所示，其為本創作之第四實施方式，其主要係於最外層 φ之導熱板3〇上設有複數個與之一體成型之導熱柱％，該等導熱柱so另一端則 穿套過固定散熱框架10及不同内層導熱板3〇上之開孔31，而與光源基板2〇之 内側接觸，而將熱藉由導熱柱50以分層、立體、分散方式料至各導熱板洲， 該等導熱板30再傳導至各固定散熱框架1〇上，並經由該等固定散熱框架μ快 速向外散熱。 Ν 此外，本創作之導熱板30端邊上設有穿孔32，使用時，可藉固定散熱框架 10之夾置，而與光源基板2(Μ呆持一定間距，同時，該導熱板3〇、光源基板2〇、 及固定散熱框架10可藉由穿套在鎖孔12、穿孔21、32 _之鎖合件13之鎖合， •而疊置在一起(如第2圖與第4圖所示）。 σ 綜上所述，本創作在物品、形狀、構造、裝置上屬首先創作，且可改良習 用技術之各種缺點，在使用上能增進功效，合於實用，充份符合新型專利要件， 實為一理想之創作。 【圖式簡單說明】 第1圖：為習知技術之立體示意圖。 第2圖：為本創作之第一實施方式之立體示意圖。 第3圖··為本創作之第一實施方式立體分解示意圖。 第4圖：為本創作之第一實施方式斷面組合示意圖。。 M319519 第5圖：為本創作第二實施方式之立體分解示意圖。 第6圖··為本創作第三實施方式之立體分解示意圖。 第6a圖：為本創作第三實施方式之a-a放大斷面示意圖。 第7圖：為本創作第四實施方式之立體分解示意圖。 第7a圖：為本創作第四實施方式之b-B放大斷面示意圖。 【主要元件符號說明】 固定散熱框架 10 開口 11 鎖孔 12 鎖合件 13 光源基板 20 穿孔 21、32 導熱板 30 開孔 31 發光二極體 40 導熱柱 50 光學增光均光板 60M319519 VIII. New Description: 【New Technical Fields】 This is a multi-layer heat-dissipating heat sink for light-emitting diodes, which is a kind of light-transmitting diode that transmits heat to different layers through a heat-conducting column. And with the heat generated by the drive circuit, it can be quickly distributed to the outside world in a layered, three-dimensional, and distributed heat dissipation manner. • [Prior Art] Press, the most commonly used light sources in daily life are old bulbs, quartz bulbs, daylight bulbs, and mercury lamps. Unlike the aforementioned sources, the light-emitting diode system is cold-emitting and has low power consumption. Φ components, long life, no need for warming time, fast response, etc., plus its small size, vibration resistance, suitable for mass production, easy to match the needs of the application to make very small and array components, so the light two The polar body has become an indispensable 7G piece in daily life on the indications and display devices of 寊sfl, communication and consumer products. Similarly, the light source with high-brightness light-emitting diodes as backlight or illumination will also become more and more More and more attention has been paid. However, high-brightness light-emitting diodes are used as backlights or light sources for illumination. Due to conversion efficiency problems, high heat is generated during use, and continuous high heat causes damage to electronic components, and when used as a high-brightness backlight or lighting fixture, It is necessary to concentrate a plurality of light-emitting diodes, so the heat generated will be higher. To solve the heat dissipation problem of the backlight or the lighting fixture, please refer to the figure 帛j, which has a heat sink 1〇〇, the heat dissipation A plurality of heat-dissipating fins 1〇1 are arranged on the surface of the base 100, and the heat-dissipating fins 1〇1 are perpendicular to the heat-dissipating base 100, and the heat-dissipating base 100 is opposite to the heat-dissipating fins 101. a light source substrate 102 is disposed on one side. The light source substrate 1 is provided with a plurality of light emitting diodes 1 and 3, and the light emitting diodes 1 and 3 are respectively electrically connected to the light source 1102. In the meantime, although the heat generated by the light-emitting body 103 can be removed by the light source substrate 1〇2 and the heat sink 100, the light-emitting diodes 103 are all mounted on the same light source substrate 102. Also concentrated on the light source substrate 1〇2, although through the light source The heat sink (10) in close contact with the substrate 102 conducts heat to the outside, but the distribution density of the light-emitting diode 103 on the light source substrate (10) is often high, and heat cannot be quickly dissipated only by a single plane, and heat retention occurs. The heat conduction can not be quickly dissipated, and the illumination source of the backlight or illumination source is too hot. When the M319519 is used, the design of the heat sink 1GG and the heat sink fin 1G1 will increase the volume and production cost of the cooker. Very unsatisfactory. [New Content] Creation Outline: The creators of this creation, in view of the above shortcomings, are aiming at the crux of the problem, and have begun to work on the basis of seeking to improve, the lack of the young, to solve the problem - the reasonable solution, after numerous times The research and design and design finally completed the heat dissipation device of the multi-layer heat conduction plate of the light-emitting diode of the present invention. The purpose of the present invention is to provide a heat dissipating device for a multi-layer heat-conducting plate of a light-emitting diode, which is a heat-dissipating device for a light-emitting diode for backlighting or illumination, and a device for a light-fixing frame having a heat-dissipating effect is disposed, and a light source substrate or a heat-conducting plate is interposed between the fixed heat-dissipating frames; wherein a light source substrate is disposed between the fixed heat-dissipating frames of the outer layer, and the light source substrate is respectively provided with a plurality of light-emitting substrates a light-emitting diode arranged in a row, wherein the light source substrate is provided with a current lead electrically connected to the light-emitting diode, and a heat-conducting column is formed on the inner side of the light source substrate, and the other end of the heat-conducting column is The heat conduction plates of the different layers are respectively contacted by the heat conduction plates of the different layers, so that the heat generated by the light-emitting diodes can be dispersedly disposed on the heat-dissipating plates of the stacked and different layers, so that The generated heat can be heat-dissipated and dissipated by the light source substrate and the fixed heat-dissipating frame, and the heat-dissipating surface can be increased by the layered, three-dimensional, and dispersed heat-conducting plates, thereby achieving rapid heat dissipation. By. • The purpose of this _ is to provide a multi-layer heat-conducting plate with a light-emitting diode, and an optically-enhanced light-homogenizing plate is arranged on the periphery of the fixed heat-dissipating frame of the outer layer to increase the brightness of the light source. The purpose of the present invention is to provide a multi-layer heat-dissipating heat sink of a light-emitting diode, wherein the heat-conducting column can be formed with any one-layer heat-conducting plate, and the heat-conducting columns respectively pass through the other layers of the stacked heat conduction. The opening of the plate is in contact with the inner side of the light source substrate, so that the heat generated by the light emitting diodes can be transmitted to the heat conducting plate of each layer through the heat of the heat conducting column. [Embodiment] Please refer to Figures 2, 3 and 4, which is the first embodiment of the creation. The present invention is a multi-layer heat conduction plate heat-dissipating device for a light-emitting diode, mainly for backlighting or illumination. The heat of M319519 generated by the diode is dissipated by the dispersed and layered heat conducting plate to increase the heat dissipation. The device is provided with more than one fixed heat dissipating frame 10 with heat dissipation effect. An opening ^ is provided, and the end of the m-shaped heat-dissipating cymbal 10 is divided into a tearing voyage 12, and the hoisting 12 can be respectively fitted with a locking member 13' in this embodiment as a locking lever, The fixed heat dissipating frames 1 can be stacked together by the locking of the locking members 13 that are received in the locking holes 12. In addition, the fixed heat dissipation frame 10 of the outer layer is provided with a light source substrate 2, which is made of a heat conductive material to make the light source substrate 20 have a rapid heat conduction effect, and the light source substrate 2 is provided with a plurality of Light-emitting diodes 4 〇, the light-emitting diodes 4 〇 and through the current leads and the drive circuit (® t not shown) for electrical connection, and the county and county board 2G _ view and lock The hole 12 is opposite to the through hole 21' so that the heat generated by the light emitting diodes 4' can be transmitted to the outside through the light source substrate 2 and the heat dissipation frame 10. Furthermore, at least one layer of heat conducting plates 3 (two in this embodiment, and the material is composed of graphite having a specific heat conduction direction) is disposed under the light board 20, and the heat conducting plates 3 are made of heat conduction. The heat conducting plate 30 is provided with a plurality of openings 31, and the heat conducting columns 5 are respectively inserted into the openings 31, and the other ends of the heat conducting columns 50 are respectively in contact with the light source substrate 2 And the heat conducting columns 50 of the different layers of the heat conducting plate 3 are mutually misaligned, so that the heat generated by the light emitting diodes of the light source substrate 2 can be transmitted through the heat conducting columns 5 respectively. The opening on the heat-dissipating frame 1() of the mosquito and the opening 31 of the upper heat-conducting plate 30 are worn, and dispersed and transmitted to the heat-conducting plates 3 of the different layers, thereby increasing the quick guiding effect. ..., and 'on the periphery of the fixed heat dissipation frame 1 叠 stacked on the outermost layer, a silk-enhanced averaging plate 6 设有 is provided, so that the illuminating two-layer 4G on the silk substrate 2G can be side by optically illuminating the averaging plate (9) The average sentence increases the brightness of the light source. Referring to FIG. 5, which is a second embodiment of the supplement, the present embodiment differs from the above-described embodiment in that a plurality of layers are provided on one surface of the heat conducting plate 30 of each layer facing the light source substrate 2; The heat-conducting column 5G of the body is formed, and the heat-conducting column 5 () of the heat-conducting plate 3 is not dislocated, and the other end of the heat-conducting column 50 is respectively passed through the opening 31 of the upper-layer heat-conducting plate 3, In contact with the light source substrate 20, the heat transmitting M319519 generated by the light emitting diodes 4 in the light source substrate 2 can be passed through the heat dissipating frame 50 through the heat dissipating frame 1 and the inner heat conducting plate 3〇. The opening 3119 is used to conduct heat to the different heat conducting plates 3〇 in a layered, three-dimensional, and dispersed manner, and then quickly dissipate heat through the different fixed heat dissipating frames. Referring to Figures 6 and 6a, which is the third embodiment of the present invention, it is mainly provided on any one of the heat conducting plates 30, which is provided with a plurality of heat conducting columns 5 之一 which are integrally formed, and the heat conducting columns 5〇 One end is in contact with the inner side of the light source substrate 20, and the other end is inserted through the fixed heat dissipating frame 1 and the opening 31' of the heat conducting plate 3'' respectively contact with the heat conducting plate 30 of different layers, and the heat is layered and three-dimensionally The dispersion mode is transmitted to each fixed heat dissipation frame ίο, and then the heat dissipation _ 10 is quickly radiated outward through the gj. Referring to Figures 7 and 7a, which is a fourth embodiment of the present invention, the heat conduction plate 3 of the outermost layer φ is mainly provided with a plurality of heat-conductive columns % formed by one body, and the heat-conducting columns The other end of the soo is sleeved through the fixed heat dissipation frame 10 and the opening 31 of the different inner heat conducting plate 3, and is in contact with the inner side of the light source substrate 2, and the heat is layered, three-dimensionally dispersed by the heat conducting column 50. The heat conducting plates 30 are again conducted to the fixed heat dissipating frames 1 and are quickly radiated outward through the fixed heat dissipating frames μ. Ν In addition, the end face of the heat conducting plate 30 of the present invention is provided with a perforation 32. When used, the fixing heat dissipating frame 10 can be sandwiched, and the light source substrate 2 is held at a certain distance, and at the same time, the heat conducting plate 3〇, The light source substrate 2 and the fixed heat dissipation frame 10 can be stacked together by the locking of the locking hole 12, the through holes 21, 32, and the like (as shown in Figures 2 and 4). In summary, the creation is first created in the article, shape, structure and device, and can improve various shortcomings of the conventional technology. It can enhance the effect in use, be practical, and fully comply with the new patent requirements. It is an ideal creation. [Simplified illustration of the drawing] Fig. 1 is a perspective view of a conventional technique. Fig. 2 is a perspective view of the first embodiment of the creation. The first embodiment is a schematic exploded view of the first embodiment. Fig. 4 is a schematic cross-sectional view of the first embodiment of the present invention. M319519 Fig. 5 is a perspective exploded view of the second embodiment of the present invention. The stereoscopic decomposition of the third embodiment of the present creation Fig. 6a is a schematic exploded view of the aa of the third embodiment of the present invention. Fig. 7 is a perspective exploded view of the fourth embodiment of the present invention. Fig. 7a: enlarged view of the fourth embodiment of the present invention Schematic diagram of the cross section. [Main component symbol description] Fixed heat dissipation frame 10 Opening 11 Keyhole 12 Locking piece 13 Light source substrate 20 Perforation 21, 32 Thermal plate 30 Opening 31 Light-emitting diode 40 Thermally conductive column 50 Optically-enhanced averaging plate 60