M318894 八、新型說明： 【新型所屬之技術領域】 本新型是有關於一種相變散熱裝置，特別是指一種可 發熱體接觸並散發熱能的具有相變散熱裝置的機殼。 【先前技術】 參閱圖1，以公告第M295424號「具致冷晶片的水冷 式散熱系統」新型專利案為例，主要包含有一散熱器u、 -致冷晶片12—增壓裝置13、—水冷頭14、串連該散熱 器U、該致冷晶片12、該增壓裝置13與該水冷頭14的三 輸送管15、串連該散熱器n與該水冷頭14的一迴送管16 及風扇17° *亥散熱器11是可與外界冷空氣進行熱交換 。該增壓裝置13是-種加壓馬達或壓縮機，可以使流體循 環流動於該等輸送管15與該迴送管16。該水冷頭14是與 一發熱體2(如電腦的中央處理器，cpu)接觸。該風扇17是 可產生冷風吹向該散熱器U。 藉此，當該增壓裝置13加壓流體時，該水冷頭14内 的教體會吸收該發熱體2的熱能，並循環至該散熱器u與 外界冷空氣進行熱父換，達到降溫的效果，如此周而復始 ，使β亥發熱體2達到散熱的目的。惟，前述散熱系統雖然 可以達到散熱的目的，然，其卻於實際使用時，乃存有以 下缺失而亟待解決： 1·由於前述水冷式的散熱系統必須仰賴該增壓裝置13 加壓流體，才能使流體循環流動，不但元件較多、成本較 Ν、噪音值咼，且在增壓同時也會產生熱能，造成流體溫 5 M318894 度不斷提高，而增加冷卻負荷。 2·重要的是，流體雖然可以益山& _ 埶俨9 λα ^ ,r 糟由熱此的傳導，吸收該發 熱體2的熱能，達到降溫的 不；m , 的’惟’奴體的散熱效率遠 不及虱體分子，因此，在埶僂 ,ϋ …、傳面積有限，且長時間使用後 忒發熱體2與流體的溫度會隨 響散熱效果。 4間增長而提高，嚴重影 、3·再者，若前述流體是水，則在寒帶地區氣溫達到〇tM318894 VIII. New description: [New technical field] The present invention relates to a phase change heat dissipating device, in particular to a casing with a phase change heat dissipating device which can contact and dissipate heat energy. [Prior Art] Referring to Figure 1, a new patent case of "Water-cooled heat-dissipating system with cryogenic wafers" is disclosed in the publication No. M295424, which mainly includes a radiator u, a refrigerant chip 12, a supercharging device 13, and water cooling. The head 14 is connected in series with the heat sink U, the refrigerating chip 12, the three-pipe 15 of the pressurizing device 13 and the water-cooling head 14, a return pipe 16 connecting the radiator n and the water-cooling head 14 and The fan 17° *Hai radiator 11 is capable of heat exchange with outside cold air. The supercharging device 13 is a pressurized motor or a compressor that allows fluid to flow through the delivery pipe 15 and the return pipe 16. The water-cooling head 14 is in contact with a heat generating body 2 such as a central processing unit (cpu of a computer). The fan 17 is capable of generating cold air to be blown toward the radiator U. Thereby, when the supercharging device 13 pressurizes the fluid, the teaching body in the water-cooling head 14 absorbs the thermal energy of the heating element 2, and circulates to the radiator u to exchange heat with the outside cold air to achieve the effect of cooling. In this way, the β-Hai heating element 2 achieves the purpose of heat dissipation. However, although the above-mentioned heat dissipating system can achieve the purpose of dissipating heat, it has the following shortcomings in actual use and needs to be solved: 1. Since the water-cooling heat dissipating system must rely on the pressurizing device 13 to pressurize the fluid, In order to make the fluid circulate, not only the components are more, the cost is heavier, the noise value is 咼, and the heat energy is also generated at the same time of pressurization, which causes the fluid temperature to increase 5 M318894 and increase the cooling load. 2. It is important that although the fluid can be Yishan & _ 埶俨9 λα ^ , r is transferred by heat, absorbs the heat energy of the heating element 2, and does not cool down; m, the heat of the 'sole' slave body The efficiency is far less than that of the corpus callosum. Therefore, in the 埶偻, ϋ ..., the transmission area is limited, and after a long time of use, the temperature of the heating element 2 and the fluid will follow the heat dissipation effect. 4 increases and increase, serious impact, 3 · Again, if the above fluid is water, the temperature in the cold zone reaches 〇t
以下時，水會結冰，使裝詈 、 戒置失效，另一嚴重問題是，水如 果有/¾漏的情形’會使電子竑 电卞綠路兀全毀損，造成嚴重的損 失0 值得-提的是，雖然氣體的散熱效率較好，惟，目前 主要是利用空氣對流達到降溫的目的，因此，散熱的效果 /、疋局限在該發熱體2的表面，❿無法帶走該發熱體2 内部的熱能’所以’整體而論，氣體的散熱效果反而不及 水冷式散熱H而大量的水流，使該致冷晶片不堪負荷 如何達到有效降溫，成為目前業者極思克服的問題。 【新型内容】 口此本新型之目的，即在提供一種能降低嗓音，並 大幅提昇散熱效果與散熱效率的具有相變散熱裝置的機殼 於疋本新型具有相變散熱裝置的機殼，包含一殼體 單兀、一腔體單元及一管系。該殼體單元具有一殼蓋，及 形成在該殼蓋一内表面的一工作室，該殼蓋是與外界冷空 氣進行熱交換’使進行入該工作室内的工作流體冷凝成液 6 M318894 態工作流體。該腔體單元是與一發熱體接觸且内部流通有 工作流體，使工作流體吸收熱能後氣化成氣態工作流體。 該管系是連通該工作室與該腔體單元形成密閉迴路，可導 引該工作室内的液態工作流體由該低點向低處進入該腔體 單元，及導引該腔體單元内的氣態工作流體擴散至該工作 室。 本新型的功效是能藉由氣-液兩相變化的工作流體，產 生自體循j哀的流動效果，並直接以該大面積的殼蓋辅助散 熱’而能簡化元件、降低成本與噪音，並大幅提昇散熱效 果與散熱效率。 【實施方式】 有關本新型之前述及其他技術内容、特點與功效，在 以下配合參考圖式之數個較佳實施例的詳細說明中，將可 清楚的呈現。 參閱圖2、圖3,本新型具有相變散熱裝置的機殼的一 第一較佳實施例包含一殼體單元3、一腔體單元4及一管系 5 〇 該殼體單元3在本實施例是一般電腦的主機，並具有 一殼蓋31、界定在該殼蓋31 —内表面311的一工作室32， 及设置在該工作室32内且區分該工作室32為多數流道33 的一波浪型散熱鰭片34。該工作室32是沿水平方向延伸， 並具有形成在二端的一高點321與一低點322，而形成有一 斜度。 該腔體單元4在本實施例具有分別與一發熱體6接觸 7 M318894 的三腔體41、42、43。該等腔體41、42、43是分別與溫度 低、中、高的一發熱體6接觸。 3亥管系5具有串連該等腔體41、42、43的二串接管51 、連通該腔體41與該工作室32高點321的一氣管段52， 及連通該腔體43與該工作室32低點322的一液管段53， 使該等串接管51與該工作室32、該等腔體41〜43形成一密 閉迴路。藉此，在該等串接管51、該等腔體41〜43與該工 作至3 2抽取真空後，注入工作流體，使工作流體循環於一 真空環境，工作流體在本實施例是一種在常溫下為液態的 冷媒，也可以是一種溫度超傳導液體。 當該等發熱體6產生高溫，該腔體41内的液態工作流 體會藉由熱傳導吸收該發熱體6(最低溫）產生的熱能，使部 份液態工作流體氣化成氣態，此時，該腔體41内的壓力會 因為氣體膨脹而提昇，使氣態工作流體隨同液態工作流體 經該串接管51進入該腔體42。而該腔體42内的液態工作 流體同樣會藉由熱傳導吸收該發熱體6(次低溫）產生的熱能 ’使部份液態工作流體氣化成氣態，此時，該腔體42内的 壓力同樣會愈提昇，使氣態工作流體隨同液態工作流體經 該串接管51進入該腔體43。且該腔體43内的液態工作流 體也會藉由熱傳導吸收該發熱體6(最高溫）產生的熱能，使 餘下的液態工作流體氣化成高溫的氣態工作流體。 此時，高溫的氣態工作流體會依循該氣管段52瞬間向 低濃度擴散至該工作室32内，由於該殼蓋31具有相當大 的面積與外界冷空氣接觸，且該散熱鰭片34也能提昇散熱 M318894 面積，因此，該工作室32内的氣態工作流體會與該等大面 積的设蓋31、散熱鰭片34進行熱交換，使高溫的氣態工作 流體沿該等流道33流動的過程中，迅速地擴散且遇冷開始 降溫，並凝結為水滴形成液態工作流體。藉此，該液態工 作流體會順沿該工作室32的斜度，依循該液管段53由上 向下再次流入該腔體41内。如此週而復始，使前述工作流 體在該工作室32、該等腔體41〜43與該管系5間自體循環 ’達到散熱效果。 參閱圖4，是本新型一第二較佳實施例，其與第一較佳 實施例大致相同，不同處在於： 該殼體單元3在本實施例是一種可攜式電腦的上蓋。 並具有呈波浪狀的一殼蓋36，使該殼蓋36可直接區分該工 作室32形成數流道37。 藉此，當高溫的氣態工作流體擴散至該工作室32上半 部時，由於該波浪狀的殼蓋36具有相當大的面積與外界冷 空氣接觸，因此，該工作室32内的氣態工作流體會與該殼 蓋36進行熱交換，使高溫的氣態工作流體沿該等流道37 向下流動的過程中，遇冷開始降溫並凝結為水滴形成液態 工作流體’達到散熱效果。 參閱圖5 ’是本新型一第三較佳實施例，其與第一較佳 實施例大致相同，不同處在於： 該殼蓋31的内表面311是形成有一斜度。 該殼體單元3更具有界定出一工作室38的一熱交換器 39。該熱交換器39是依循該殼蓋31内表面311的斜度固設 9 M318894 在該设蓋31内表面311，使該工作室38形成一高點381與 一低點382，並具有區分該工作室38形成數流道383的一 波浪形散熱鰭片391、形成在一端且與該氣管段52連通的 一氣室392，及形成在另一端且與該液管段53連通的一液 室 393。 藉此，當高溫的氣態工作流體依循該氣管段52向低濃 度擴散至該工作室38内，由於該熱交換器39是與大面積 的殼蓋31接觸，因此，該工作室38内的氣態工作流體會 與該熱交換器39及該散熱鰭片391進行熱交換，再將熱能 傳導至該殼蓋31與外界冷空氣進行熱交換，使高溫的氣態 工作流體沿該等流道383流動的過程中，遇冷開始降溫並 凝結為水滴形成液態工作流體。藉此，該液態工作流體會 順沿該熱交換器39的斜度，依循該液管段53由上向下再 次流入該腔體單元4(圖未示）内，達到散熱效果。 據上所述可知，本新型之具有相變散熱裝置的機殼具 有下列優點及功效： 1 ·本新型是藉由前述液態-氣態工作流體在二相變化的 過程中’以液態工作流體由高處向低處流動，及氣態工作 流體由濃度高向濃度低流動且有氣體壓力推送的物理特性 ，產生自體循環的流動效果，不但可以有效降低噪音，且 不會有額外的熱源產生。 2·重要的是，本新型可以藉由液態工作流體以熱傳導的 方式，有效吸收該等發熱體的熱能，再變態為氣態工作流 體與該殼體單元3進行熱交換，藉此，不但能大幅提昇散 10 M318894 :、放果與散熱效率外，且該殼體單元3是-般主機必要的In the following, the water will freeze, causing the decoration and the ring to fail. Another serious problem is that if the water has a /3⁄4 leak, the electronic circuit will be completely destroyed, causing serious damage. 0 Worth - It is mentioned that although the heat dissipation efficiency of the gas is good, at present, the purpose of cooling by air convection is mainly used. Therefore, the effect of heat dissipation/, 疋 is limited to the surface of the heating element 2, and the heating element 2 cannot be taken away. The internal heat energy 'so' overall, the heat dissipation effect of the gas is not the same as the water-cooled heat dissipation H and a large amount of water flow, so that the cold chip is unbearable and how to achieve effective cooling, which has become a problem that the current industry has overcome. [New content] The purpose of this new type is to provide a casing with a phase change heat dissipation device that can reduce the noise and greatly improve the heat dissipation effect and heat dissipation efficiency. A housing unit, a cavity unit and a tube system. The housing unit has a cover and a working chamber formed on an inner surface of the cover, the cover is in heat exchange with the outside cold air to condense the working fluid entering the working chamber into a liquid 6 M318894 state Working fluid. The cavity unit is in contact with a heating element and has a working fluid circulating therein, so that the working fluid absorbs thermal energy and is vaporized into a gaseous working fluid. The pipe system is connected to the working chamber to form a closed circuit with the cavity unit, and can guide the liquid working fluid in the working chamber to enter the cavity unit from the low point to the low position, and guide the gas state in the cavity unit The working fluid diffuses into the working chamber. The utility model has the advantages that the working fluid which can be changed by the gas-liquid two-phase can generate the flow effect of the self-contained sorrow, and directly assists the heat dissipation by the large-area cover, thereby simplifying components, reducing cost and noise. And greatly improve the heat dissipation effect and heat dissipation efficiency. The above and other technical contents, features and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments. Referring to Figures 2 and 3, a first preferred embodiment of the present invention having a phase change heat sink includes a housing unit 3, a cavity unit 4, and a tube system 5. The housing unit 3 is The embodiment is a mainframe of a general computer and has a cover 31, a working chamber 32 defined on the inner surface 311 of the cover 31, and a set in the working chamber 32 and distinguishing the working chamber 32 as a majority of the flow path 33. A wave type heat sink fin 34. The working chamber 32 extends in the horizontal direction and has a high point 321 and a low point 322 formed at the two ends to form a slope. In the present embodiment, the cavity unit 4 has three cavities 41, 42, 43 which are respectively in contact with a heating element 6 of 7 M318894. The cavities 41, 42, 43 are in contact with a heating element 6 having a low, medium, and high temperature, respectively. The 3H tube system 5 has two series of nozzles 51 connected in series with the cavities 41, 42, 43; a tracheal section 52 connecting the cavity 41 and the high point 321 of the working chamber 32, and communicating with the cavity 43 and A liquid pipe section 53 of the low point 322 of the working chamber 32 forms a closed circuit between the series connecting pipe 51 and the working chamber 32 and the cavities 41 to 43. Thereby, after the series of pipes 51, the cavities 41 to 43 and the working to vacuum are evacuated, the working fluid is injected to circulate the working fluid in a vacuum environment, and the working fluid is at a normal temperature in this embodiment. The liquid refrigerant is a temperature superconducting liquid. When the heating elements 6 generate a high temperature, the liquid working fluid in the cavity 41 absorbs the heat energy generated by the heating element 6 (the lowest temperature) by heat conduction, and vaporizes part of the liquid working fluid into a gaseous state. At this time, the cavity The pressure within the body 41 is increased by the expansion of the gas, causing the gaseous working fluid to enter the cavity 42 along with the liquid working fluid through the series of nozzles 51. The liquid working fluid in the cavity 42 also absorbs the heat energy generated by the heating element 6 (sub-low temperature) by heat conduction to vaporize part of the liquid working fluid into a gaseous state. At this time, the pressure in the cavity 42 is also the same. The higher the lift, the gaseous working fluid enters the cavity 43 along with the liquid working fluid through the stringer 51. The liquid working fluid in the cavity 43 also absorbs the heat energy generated by the heating element 6 (the highest temperature) by heat conduction, and vaporizes the remaining liquid working fluid into a high temperature gaseous working fluid. At this time, the high temperature gaseous working fluid will instantaneously diffuse into the working chamber 32 according to the gas pipe section 52, since the shell cover 31 has a relatively large area to be in contact with the outside cold air, and the heat radiating fin 34 can also The heat dissipation M318894 area is increased, so that the gaseous working fluid in the working chamber 32 exchanges heat with the large-area cover 31 and the heat dissipation fins 34, so that the high-temperature gaseous working fluid flows along the flow channels 33. Medium, rapidly diffuses and begins to cool down in the cold, and condenses into water droplets to form a liquid working fluid. Thereby, the liquid working fluid flows along the slope of the working chamber 32, and the liquid pipe section 53 flows into the cavity 41 again from the top to the bottom. In this manner, the working fluid is self-circulating in the working chamber 32 and between the chambers 41 to 43 and the pipe system 5 to achieve a heat dissipation effect. Referring to FIG. 4, a second preferred embodiment of the present invention is substantially the same as the first preferred embodiment except that the housing unit 3 is an upper cover of the portable computer in this embodiment. A hull-like cover 36 is provided so that the cover 36 directly distinguishes the working chamber 32 from the plurality of flow passages 37. Thereby, when the high temperature gaseous working fluid diffuses to the upper half of the working chamber 32, the gaseous working flow in the working chamber 32 is due to the wavy shell cover 36 having a relatively large area in contact with the outside cold air. The heat exchange with the cover 36 is performed to cause the high-temperature gaseous working fluid to flow downward along the flow passages 37, and the cooling starts to cool down and condenses into water droplets to form a liquid working fluid to achieve a heat dissipation effect. Referring to Figure 5, a third preferred embodiment of the present invention is substantially the same as the first preferred embodiment except that the inner surface 311 of the cover 31 is formed with a slope. The housing unit 3 further has a heat exchanger 39 defining a working chamber 38. The heat exchanger 39 is fixed to the inner surface 311 of the cover 31 according to the inclination of the inner surface 311 of the cover 31, so that the working chamber 38 forms a high point 381 and a low point 382, and has a distinction The working chamber 38 forms a wave-shaped heat radiating fin 391 of the plurality of flow paths 383, a gas chamber 392 formed at one end and communicating with the gas pipe section 52, and a liquid chamber 393 formed at the other end and communicating with the liquid pipe section 53. Thereby, when the high temperature gaseous working fluid diffuses into the working chamber 38 according to the low temperature concentration of the gas pipe section 52, since the heat exchanger 39 is in contact with the large-area shell cover 31, the gas state in the working chamber 38 is thereby The working fluid exchanges heat with the heat exchanger 39 and the heat dissipation fins 391, and then conducts heat energy to the cover 31 to exchange heat with the outside cold air, so that the high temperature gaseous working fluid flows along the flow channels 383. During the process, the cold begins to cool down and condenses into water droplets to form a liquid working fluid. Thereby, the liquid working fluid will flow along the slope of the heat exchanger 39, and the liquid pipe section 53 flows into the cavity unit 4 (not shown) from the top to the bottom to achieve the heat dissipation effect. According to the above description, the casing with the phase change heat dissipating device of the present invention has the following advantages and effects: 1. The present invention is characterized in that the liquid working fluid is high in the process of two-phase change by the liquid-gas working fluid. The flow to the lower part, and the gaseous working fluid from the high concentration to the low concentration and the physical characteristics of the gas pressure push, the flow effect of the autogenous circulation, not only can effectively reduce the noise, and there is no additional heat source. 2. It is important that the present invention can effectively absorb the thermal energy of the heating elements by means of a liquid working fluid in a heat conduction manner, and then metamorphize into a gaseous working fluid to exchange heat with the housing unit 3, thereby not only greatly Lifting the dispersion of 10 M318894:, putting fruit and cooling efficiency, and the housing unit 3 is necessary for the general host
yAtL ^ ’不但具有較大散熱面積，氣體能自動地大量擴散， 有放提昇政熱效率，且能簡化元件、降低成本。 、 再者本新型所使用的工作流體是冷媒或溫度超傳導 液體’因此，在氣溫低於OM，不會有結冰的現象，可以 保持工作時的順暢性’且即使真空環境、H卫作流體也 會瞬間氣化，不會影響電子線路，能有效提昇使用的實用 性。 惟以上所述者，僅為本新型之較佳實施例而已，當不 能以此限定本新型實施之範圍，即大凡依本新型申請專利 範圍及新型說明内容所作之簡單的等效變化與修飾，皆仍 屬本新型專利涵蓋之範圍内。 M318894 【圖式簡單說明】 圖1是一立體圖，說明專利號數第M295424號案； 圖2是一正視圖，說明本新型一具有相變散熱裝置的 機殼的一第一較佳實施例； 圖3是該第一較佳實施例中一殼體單元的一剖視圖； 圖4是一立體圖，說明本新型一具有相變散熱裝置的 機殼的一第二較佳實施例；及 圖5是一立體分解圖，說明本新型一具有相變散熱裝 置的機殼的一第三較佳實施例。yAtL ^ ′ not only has a large heat dissipation area, but the gas can be automatically diffused in a large amount, which can improve the efficiency of political heating, and can simplify components and reduce costs. Furthermore, the working fluid used in the present invention is a refrigerant or a temperature superconducting liquid. Therefore, in the case where the temperature is lower than OM, there is no freezing phenomenon, and the smoothness at work can be maintained', and even in a vacuum environment, H The fluid will also vaporize instantaneously, without affecting the electronic circuit, and can effectively improve the practicality of use. However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention cannot be limited thereto, that is, the simple equivalent change and modification made by the novel patent application scope and the novel description content, All remain within the scope of this new patent. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing a patent number No. M295424; FIG. 2 is a front view showing a first preferred embodiment of a casing having a phase change heat dissipating device; 3 is a cross-sectional view of a casing unit in the first preferred embodiment; FIG. 4 is a perspective view showing a second preferred embodiment of the casing having a phase change heat dissipating device; and FIG. An exploded perspective view illustrates a third preferred embodiment of the present invention having a phase change heat sink.
12 M318894 【主要元件符號說明】 3…… …·殼體單元 39•…· •…熱交換器 31 •… •…殼蓋 391… •…散熱鰭片 311… •…内表面 392… …·氣室 32 …，· …·工作室 393… •…液室 321… ，…高點 4…… •…腔體單元 322… …·低點 41 ••… …·腔體 33 …·· …·流道 42••… …·腔體 34 •… •…散熱鰭片 43 ·… •…腔體 3 6 "… •…殼蓋 5…… …·管系 、、六：苦 C 1..... •…&後答 3 7..... —流逗 3丄 τ …Τ *r=> < 9 …· · ____盏答 5 〇 *..... …·工fF至 D L 乐L吕十又· 381… '…同點 53••… •…液管段 382… •…低點 6…… •…發熱體 383… •…流道12 M318894 [Description of main component symbols] 3... .... housing unit 39•...·... heat exchanger 31 •... •...shell cover 391... •...heat dissipation fin 311... •... inner surface 392... Room 32 ..., ... ... studio 393... • ... liquid chamber 321..., ... high point 4... •... chamber unit 322... .... low point 41 ••... ... cavity 33 ...·· ...·flow Road 42••... ... cavity 34 •... •...heat fins 43 ·... •...cavity 3 6 "... •...shell cover 5...... ...·管系,,六:苦C 1... .. •...&After 3. 7..... — Streaming 3丄τ ...Τ *r=>< 9 ...· · ____盏5 〇*..... To DL Le Llu 10· 381... '...Same point 53••... •...Liquid pipe section 382... •...lower point 6... •...heating body 383... •...flow path
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