M317745 八、新型說明： 【新型所屬之技術領域】 本創作係一種散熱模組之結構改良，特別是指一種在板式熱 管内設有獨立且不相聯通之複數熱管，可提高散熱效率之新型散 熱模組者。 【先前技術】 ' 習知用於排除發熱元件熱量之散熱結構，例如電冰箱、冷氣 • 機、大型電子看板’献高速運作之電子元件等容§發熱之設備， 通常會設置能幫助排徐内部熱量之散熱模組，以維持裝置運作之 穩定；其中，在一個常見的結構中，會在該容易產生熱量之發熱 元件上’ 0^1:具有良好導熱效能之辅助裝置，如銅片、銘板或以 熱官貼近表面等不同結構型態之散熱模組，配置在該發熱元件之 表面上’將熱量以賊的方式代換散熱模組之結構中，並且 在散熱模組遠離發熱元件之另端將熱量排除。 • 例如在一個散熱模組係為一熱管結構的情形中，所述熱管在 散熱模組之前端，將熱量從發熱元件交換至裝設在熱管内之導熱' -物質，該導熱物質在吸取熱量後開始向散熱模組之一散熱端流 動；如第1圖所顯示之散熱端結構，在該散熱端通常會設置一導 熱組織2 Q，所述導熱組織2 〇係具有—結合端2 i可結合在該 熱管3 0之表面上，並於該導熱組織2 〇之其餘區域，^雜 除熱量之開放端2 2 ;在此—制的散熱結構中，該導熱組織2 0係-沿著該熱管3 〇表面連續平行設置之散熱片結構，其中， 5 M317745 該熱管3 0至導熱組織2 0之間熱量的傳遞型態，就如第2圖所 顯示的情形一樣，由於該熱管3 〇之斷面結構係一圓形輪廓，該 熱里經熱管3 0與V熱組織2 0之結合部21，以輻射之型態朝 導熱組織2 0之開放端2 2放射傳遞。 或在另一如第3圖所顯示之不同結構的散熱端，該導熱元件 • 2 0係為一具有溝槽2 3之金屬塊結構，係設置在一成連續彎曲 - 分佈型態之熱管3 〇上；該導熱組織2 0之結合部21與該熱管 春 3 0之接觸型態，係如第4圖之斷面所顯示的情形，可知的是， 該熱量之傳遞型態一如前述也是成輻射的型態朝該導熱組織2 〇 之開放端2 2區域傳遞，並且因為該熱管3 〇與導熱組織2 〇之 接觸面積僅為雜之結合鶴，若要制紐之散熱效果，則需 在該散熱馳之散難，助卜更大面躺結構型態，而這樣= 散熱模組其散熱效率通常較為低落。 在弟2圖及弟4圖所减示的熱量傳遞情形中，明顯可見 鲁 该導熱組織2 0在傳遞熱量時，並沒有呈現平均散佈的型態，而 ' 疋根據鮮3 Q之輪臟11職射傳遞；崎樣的傳遞方式，熱 • 量在該導熱組織2 Q遠離結合端21之區域，例如散熱片之四個 角洛亚無法有效發揮縣之散熱效率，因為大部分的熱量在輕射 2遞個過程巾’大都集中在距離熱Q較近的區域，而距離較 遠的區域所能獲得進而排除之熱量就變得更少。 有鑑於習知結構中熱量分佈不均之缺失，若能重行設計該習 知放熱她之結構型態，使其具有不同於制結構之組配關係， 6 M317745 而能提高整體之散熱效率，將可增加該散熱模組之使用型態及應 用範轉。 【新型内容】 爰此’本創作散熱摩組織結構改良其主要目的係在改良習知 散熱結構散熱效率不理想的情形；且，經由改良設計之散熱模組 - 之結構及結合型態，將可提高裝置之散熱效率，增進裝置運作之 - 效能者。 鲁所述散熱模組其結構係包括：一板式熱管與一導熱組織之結 S，該板式熱管之部份區域係配置在一發熱元件上，用以排除該 發熱兀件產生之熱量；該導熱組織係具有用以和該板式熱管接觸 或連結之結合端，可將導熱組織結合設置在該板式熱管上一預定 區域並在及^r熱組織之其餘區域形成一開放端；其中，該板式 熱管設有複數個獨立且不相聯通之熱管組織，使該板式熱管可迅 速且均勾地進行熱量傳遞及熱交換，進而提高散熱模組讀熱效 • 率者。 【實施方式】 - 請參閱第5®，係本創作之較佳實細，其結構係包括··一 板式熱管1〇與一導熱組織2〇之結合；該板式熱管^〇之部份 ϋ域係配置在-發熱元件4〇 (請參閱第9圖）上，用以排除在 發熱兀件上所產生之熱量；該導熱域2 Q係具有㈣和該板式 熱管10接觸或連結之結合端2i，用以將導熱組織結合設 置在該板式齡i 〇上-預定區域，並在該導熱組織2 〇之= M317745 區域形成一開放端2 2，而在所採的實施例中，該_組織2 〇 係為沿該板式熱管1〇週邊佈置之複數個導熱片；其中，該板式 熱管1⑽具有複數侧立且不相騎之單元熱管1 !所組織而 成’使該板式熱管i〇可迅速且均勻地進行熱量之傳遞及熱交 換，進而提高散熱模組之散熱效率。 請參閱第㈣，在所採的實施财，所述配置在該板式教管 1 〇内之複數解元熱管！ i，係採取—平行並列的分佈型態， 並且各鮮元熱管11 _齡利目魏地運作；實務上，該不 同單元熱管11内配裝有可相變化之物質，例如··純水或冷媒或 有機，劑或其組合之物質。在一個配置有複數個獨立且不相聯通 之熱管的結構型態中，將可大幅提昇整體排除熱量之效率，較習 知單-熱管之結構型態’散熱效率可高出數倍之多。此外，熱量 在導熱組織2 Q内之傳遞縣，在所採之實施例中，係如圖中所 顯示的平均散佈在該導熱組織2 〇之開放端2 2上，有效利用該 導熱組織2 0所有開放端2 2之散熱區域，進而提高整體散熱之 效能。 請繼續參閱第7及8圖，係本創作散熱模組之改良結構另一 實施態樣’係在該板式鮮i Q上配置—具有溝㈣3之金刺 狀導熱組織2 0。其中鱗熱組織2 〇之結合端2 i，係_ 式熱"（D之表面戦大面積之接合，較f知結射健線财 觸有者更大的熱量傳雜域；此外也_結合部2丨與板式教$ ! 0所賴之大_接合，使得板式絲i q内之歸能如第^ M317745 圖中所顯示的傳遞型態，迅速且均勻的散佈到該導熱組織2 〇之 開放端2 2，達到快速散熱之目的。 除此之外，本創作所具有複數熱管配置之配置結構係如第9 圖所顯示’當該板式鮮！（3之_端崎份表面區域，直接或間 接（中間設有-散熱片或熱電偶等）地平貼在一發熱元件4 .運射之c p u)上時，各單元熱管1 1可如箭棚示的方向， .快速的將熱量往導熱組織2 0傳送；即使在使用上遇到外力使該 • 板式鮮1 Q產生破損，也只有單-或少數之單元熱管1 ；L受到 影響’其餘部份之單元熱管11健㈣_運作排除熱量，維 持裝置之運作正常以及提供維修人員有更長的應變時間，以確保 裝置運作不受影響，係具有較習知結構更佳之可靠度。 綜上所述’本創作散熱模組之結構改良，係提供發熱元件一 4速排除熱1、有效提昇散減組效率之散熱結構，藉由該配 置有複數個獨立且不相聯通之單元熱管工工之板式熱管工0，以 • 錢板式熱管1 0與導熱模組2 0間緊密結合所形成快速傳遞熱 里之、’.口構型悲、’確實改善習知散熱模組散熱效率不佳之缺失，而 - 可進步將*亥散熱模組應用於更廣泛之領域，如小型化之晶片模 組或薄化電子看板之厚度，展現相當大之進步。 惟以上所述者，僅為本創作之較佳實施例而已，並非用來限 定本創作實施之範圍。即凡依本創作申請專利範圍所作之均等變 化與修飾，皆為本創作專利範圍所涵蓋。 9 M317745 【圖式簡單說明】 第1圖：係習知散熱模組之立體結構示意圖（一）。 第2圖：係第1圖之剖面示意圖。 第3圖：係習知散熱模組之立體結構示意圖（二）。 第4圖：係第3圖之剖面示意圖。 . 第5圖··係本創作實施例之立體結構示意圖。 ，第6圖：係第5圖之剖面示意圖。 _ 第7圖：係本創作另一實施例之立體結構示意圖。 第8圖：係第7圖之剖面示意圖。 第9圖：係本創作一實際使用狀態之散熱路徑展示圖。 【主要元件符號說明】 10板式熱管 11 單元熱管 2 0 導熱組織 ^ 21 結合端 2 2 開放端 2 3溝槽M317745 VIII. New Description: [New Technology Field] This creation is a structural improvement of a heat dissipation module, especially a new type of heat pipe with independent heat pipes that are independent and not connected in a plate heat pipe, which can improve heat dissipation efficiency. Module. [Prior Art] 'The heat dissipation structure used to eliminate the heat of the heating element, such as refrigerators, air conditioners, large electronic billboards, high-speed electronic components, etc., is usually equipped to help the interior. Thermal heat dissipation module to maintain the stability of the operation of the device; wherein, in a common structure, it will be on the heat-generating component that is easy to generate heat. 0^1: auxiliary device with good thermal conductivity, such as copper plate and nameplate Or a heat-dissipating module of a different structure type, such as a hot official, is disposed on the surface of the heating element, and the heat is replaced by a thief in the structure of the heat-dissipating module, and the heat-dissipating module is away from the heating element. The end removes heat. For example, in the case where a heat dissipating module is a heat pipe structure, the heat pipe exchanges heat from the heat generating component to the heat conducting material contained in the heat pipe at the front end of the heat dissipating module, and the heat conducting material absorbs heat. Afterwards, the heat dissipation end of the heat dissipation module is flowed; as shown in FIG. 1 , the heat dissipation end structure is generally provided with a heat conducting structure 2 Q, and the heat conduction structure 2 has a bonding end 2 i Bonded on the surface of the heat pipe 30, and in the remaining area of the heat-conducting structure 2, the open end 2 2 of the heat-dissipating heat; in the heat-dissipating structure, the heat-conducting structure 20- along the The fin structure of the heat pipe 3 is continuously arranged in parallel, wherein 5 M317745 the heat transfer pattern between the heat pipe 30 and the heat transfer structure 20 is the same as that shown in Fig. 2, because the heat pipe 3 is The cross-sectional structure is a circular profile, and the heat is transmitted through the junction 21 of the heat pipe 30 and the V heat structure 20 to the open end 2 2 of the heat transfer structure 20 in a radiation pattern. Or in another heat-dissipating end of different structures as shown in FIG. 3, the heat-conducting element 20 is a metal block structure having a groove 23, which is disposed in a continuous bending-distribution type heat pipe 3 The contact state between the joint portion 21 of the heat transfer structure 20 and the heat pipe spring is as shown in the section of Fig. 4, and it is known that the heat transfer pattern is as described above. The radiation pattern is transmitted to the open end 2 2 region of the heat conducting structure 2, and because the contact area between the heat pipe 3 and the heat conducting structure 2 is only a mixed crane, if the heat dissipation effect of the button is required, In the heat dissipation, it is difficult to help the larger surface structure, and the heat dissipation efficiency of the heat dissipation module is usually low. In the case of the heat transfer indicated by the brothers 2 and 4, it is obvious that the heat transfer structure 20 does not exhibit an average spread when transferring heat, and '疋 according to the fresh 3 Q wheel 11 The transmission of the job; the transmission method of the sample, the amount of heat in the area of the heat transfer structure 2 Q away from the joint end 21, for example, the four corners of the heat sink Luo Ya can not effectively play the heat dissipation efficiency of the county, because most of the heat is light The shots of the 2 process wipes are mostly concentrated in the area closer to the hot Q, and the heat that can be obtained and removed from the farther area becomes less. In view of the lack of uneven heat distribution in the conventional structure, if it is possible to redesign the structure of the conventional heat release, so that it has a different relationship with the structure, 6 M317745 can improve the overall heat dissipation efficiency, The usage type and application of the heat dissipation module can be increased. [New content] The main purpose of this design is to improve the heat dissipation efficiency of the conventional heat dissipation structure; and the structure and combination type of the heat dissipation module with improved design will be available. Improve the heat dissipation efficiency of the device and improve the performance of the device. The structure of the heat dissipation module includes: a plate-type heat pipe and a heat-conducting structure node S, and a portion of the plate-type heat pipe is disposed on a heating element for removing heat generated by the heat-generating element; The tissue system has a joint end for contacting or joining with the plate heat pipe, and the heat conductive structure is combined and disposed on a predetermined area of the plate heat pipe and forms an open end in the remaining area of the heat pipe; wherein the plate heat pipe There are a plurality of independent and non-connected heat pipe organizations, so that the plate heat pipe can quickly and uniformly carry out heat transfer and heat exchange, thereby improving the thermal efficiency of the heat dissipation module. [Embodiment] - Please refer to Section 5®, which is a better example of the creation. The structure consists of a combination of a plate heat pipe 1〇 and a heat conducting structure 2〇; part of the plate heat pipe It is disposed on the heating element 4〇 (refer to FIG. 9) for excluding heat generated on the heating element; the heat conduction domain 2 Q has (4) the bonding end 2i contacting or connecting the plate heat pipe 10 , in order to combine the thermal conductive tissue on the plate-type i 〇-predetermined area, and form an open end 2 2 in the thermal conductive tissue 2 M = M317745 region, and in the adopted embodiment, the _ tissue 2 The lanthanum is a plurality of thermal conductive sheets arranged along the periphery of the slab heat pipe 1; wherein the slab heat pipe 1 (10) has a plurality of unit heat pipes 1 that are not erected and are organized to make the plate heat pipe quick and Uniform heat transfer and heat exchange, thereby improving the heat dissipation efficiency of the heat dissipation module. Please refer to (4), in the implementation of the implementation of the implementation, the configuration of the complex heat exchanger in the board of teaching 1 〇! i, adopting a parallel-parallel distribution pattern, and each fresh-type heat pipe 11-year-old Lime Wei is operated; in practice, the different unit heat pipes 11 are equipped with a phase-changeable substance, such as pure water or A substance that is a refrigerant or an organic agent, or a combination thereof. In a configuration with a plurality of independent and non-connected heat pipes, the overall heat removal efficiency can be greatly improved, and the heat dissipation efficiency of the single-heat pipe structure can be several times higher than that of the conventional one. In addition, the transfer of heat in the thermally conductive structure 2 Q, in the embodiment taken, is spread on the open end 2 2 of the thermally conductive structure as shown in the figure, and the thermally conductive structure is effectively utilized. All the open end 2 2 heat dissipation area, thereby improving the overall heat dissipation performance. Continuing to refer to Figures 7 and 8, another embodiment of the improved structure of the present heat-dissipating module is disposed on the plate-type fresh Q--a gold-like heat-conductive structure 20 having a groove (4). Among them, the combination of the scaly heat tissue 2 2 2 i, the _ type of heat " (the surface of the surface of the D is a large area of the junction, compared with the f The joint portion 2丨 and the plate type teaching $! 0 depend on the large _ joint, so that the returning energy in the plate wire iq is rapidly and evenly spread to the heat transfer structure as shown in the transfer pattern shown in the figure M317745. The open end 2 2, for the purpose of rapid heat dissipation. In addition, the creation structure of the complex heat pipe configuration is as shown in Figure 9 'When the plate is fresh! (3 of the end surface area, directly or When indirectly (provided in the middle - heat sink or thermocouple, etc.) flat on a heating element 4, the cpu), each unit heat pipe 1 1 can be in the direction indicated by the arrow, quickly transfer heat to the thermal tissue 20 0 transmission; even if the external force is used to make the plate fresh 1 Q break, only a single- or a small number of unit heat pipes 1; L is affected 'the rest of the unit heat pipe 11 health (four) _ operation to remove heat, Maintaining the normal operation of the device and providing maintenance personnel with longer strain time In order to ensure that the operation of the device is not affected, it has better reliability than the conventional structure. In summary, the structural improvement of the heat-dissipating module of the present invention provides a heating element with a 4-speed heat removal, and effectively improves the efficiency of the reduction group. The heat dissipating structure is formed by a plurality of independent and non-connected unit heat pipe workers, the plate type heat piper 0, and the combination of the money plate type heat pipe 10 and the heat conducting module 20 forms a rapid transfer heat. ''The port configuration is sad,' does improve the lack of heat dissipation efficiency of the conventional heat dissipation module, and - can improve the application of the *Hai thermal module to a wider range of fields, such as miniaturized wafer modules or thinned electronics The thickness of the kanban is a considerable improvement. The above is only the preferred embodiment of the present invention and is not intended to limit the scope of the implementation of the present invention. Modifications are covered by the scope of this patent. 9 M317745 [Simple description of the diagram] Figure 1: Schematic diagram of the three-dimensional structure of the conventional heat dissipation module (1). Figure 2: Sectional diagram of Figure 1. Fig. 3 is a schematic view showing the three-dimensional structure of the conventional heat dissipation module (2). Fig. 4 is a schematic cross-sectional view of Fig. 3. Fig. 5 is a perspective view of the three-dimensional structure of the present embodiment. Fig. 6 is a schematic cross-sectional view of Fig. 5. _ Fig. 7 is a schematic view showing a three-dimensional structure of another embodiment of the present invention. Fig. 8 is a schematic cross-sectional view of Fig. 7. Fig. 9: a practical use of the present creation The heat dissipation path of the state is shown. [Main component symbol description] 10 plate heat pipe 11 unit heat pipe 2 0 heat transfer structure ^ 21 joint end 2 2 open end 2 3 groove