M317079 八、新型說明： 【新型所屬之技術領域】 _本創作係有關於—種可用以安裝發光二極體晶片之 極體支u冓’尤其係指一種smd二極體固晶支架結 構改良者。 【先前技術】 近幾年來’由於發光二極體（Light Emitting Diode， LED)的發光效率不斷進步提升，使得發光二極體在應用 領，愈趨廣泛，已漸漸取代曰光燈與白熱燈泡，和液晶顯 液日日笔視之月光源或侧光源、交通號諸燈，以及一 般照明裝置等之趨勢。 ：!又而σ，杳光一極體晶片通常是固接於二極體支架 (或可稱引線架）内，藉以構成一發光二極體，如公告於 中華民國94(西元20〇5)年08月u日，證書號數：Ι2379ΐ2 之發光二極體引線架之製造方法及其構造，其揭露出有一 ^發光二極體引線架之構造，請參閱第一圖所示，該引線 架係由基板1 〇 a上射出有碗狀基材2 〇 a所構成，且該 碗狀基材2 0 a係將基板1 〇 a區隔有複數塊導電片工 1 a，並延伸至碗狀基材2 〇 a外部形成接腳丄2 a，且 該基板1 0 a上沖壓並延伸至碗狀基材2 〇 a底部，形成 一散熱底板1 3 a，該散熱底板i 3 a係凸設曝露於碗狀M317079 VIII. New description: [New technical field] _ This creation is about a kind of polar body support that can be used to mount a light-emitting diode wafer. In particular, it refers to a smd diode solid crystal support structure. . [Prior Art] In recent years, due to the continuous improvement of the luminous efficiency of the Light Emitting Diode (LED), the LED has become more and more widely used, and has gradually replaced the Xenon lamp and the white heat bulb. And the trend of liquid crystal or side light source, traffic light, and general lighting devices. :! And σ, Twilight's one-pole wafer is usually fixed in a diode bracket (or can be called a lead frame) to form a light-emitting diode, as announced in the Republic of China 94 (20〇5) On August 08th, the manufacturing method and structure of the LED diode lead frame of the certificate number: ΐ2379ΐ2, revealing the structure of a light-emitting diode lead frame, as shown in the first figure, the lead frame system A bowl-shaped substrate 2 〇a is formed on the substrate 1 〇a, and the bowl-shaped substrate 20 a is separated from the substrate 1 〇a by a plurality of conductive sheets 1 a and extended to a bowl-shaped base. The outer surface of the material 2 〇a is formed with a pin 2 a, and the substrate 10 a is stamped and extended to the bottom of the bowl substrate 2 〇a to form a heat dissipation substrate 13 a, which is exposed and exposed. Bowl
基材2 0 a底部，藉以構成一具有散熱底板1 3 a I 架者。 Ή琛 如第二圖所示，該碗狀基材2 〇 a内部中可提供發光 二極體晶片（半導體芯片）3 〇 a之附著’係將其固著^散 M317079 熱底板1 9。 1 1 上’之後將發光二極體晶片3 0 a與導電片 0 a +之=利用導線3 1 a相互接設，最後於碗狀基材2 ' _ =制封裝—層環氧樹脂4 0 a等材料，即完成發光二極 體之製作程序。 ’ @ 而，§發光二極體所產生之光線，若依實際之需求 - =:白光4，此時，該發光二極體晶片3 〇 a即可係為藍 - 並且於碗狀基材2 0 a中需充填黃色之螢光粉 鲁 、，以使發光二極體晶片3 0 a所釋放出之藍光穿射 化赏光粉時，能經由螢光粉之效用而轉變為白色光之效 果，即可達到白光的目的。 惟，通常發光二極體晶片3 〇 a係為四方型體，但散 1 3 a於冲壓時係呈現碗狀（圓形），四方型體與碗 =之間的配合，易使得螢光粉於充填時有充填不均之現 ，將於發光二極體晶片3 0 a四周有偏多及偏少之情 =，尤其是發光二極體晶片3 〇 a的四邊端與散熱底板工 a之間，當螢光粉偏多及偏少時，使得 •及偏藍，從而造成光學輝度有不均之現象。九色偏。 • *、，緣疋，本創作人有感上述缺失之可改善，乃特潛心研 九並配〇學理之運用，終於提出一種設計合理且有效改善 上述缺失之本創作。 【新型内容】 本創作之目的，係提供一種SMD二極體固晶支架結 構，以提供後續製程之發光二極體晶片固接使用，且提^ 充填螢光粉時，可使其均勻地分佈於發光二極體晶片四 周，以避免發生螢光粉充填不均，造成光學輝度有不均之 6 M317079 情形。 加為達上述之目的，本創作提供一種smd二極體固晶 支杀：構I括·膠體’其一端面形成一内凹的功能區; -固曰日基座’係與該膠體固接，且位於該功能區·，複數個 至屬接腳/係刀別與该膠體固接，以分別位於該固晶基座 側，且係由該功能區中分別向外延伸至該膠體外部；以 及-：杯，係形成於該膠體的功能區中，且該内杯固接於 該固晶基座之71端面，該内杯開設有固晶空間，將該固晶 基座之頂端面顯露於該固晶空間中。 本創作具有之效益：本創作於膠體中加以形成内杯及 固晶空間，以提供後續製程之發光二極體晶片安裝於内杯 之固晶空間内，且外形乃係依發光二極體晶片而設計，以 供充填螢絲時，可使其㈣地分佈於發光二極體晶片四 周以避免發生螢光粉充填不均，產生偏多及偏少之現 象，枚而使得白光之光色偏黃及偏藍，造成光學輝 均之情形。The bottom of the substrate 20 a is formed to form a heat sink base plate 1 3 a I frame. Ή琛 As shown in the second figure, the inside of the bowl-shaped substrate 2 〇 a can be provided with a light-emitting diode chip (semiconductor chip) 3 〇 a attached to the M317079 hot substrate 19 . 1 1 After 'after the light-emitting diode wafer 30 a and the conductive sheet 0 a + = with the wire 3 1 a connected to each other, and finally to the bowl substrate 2 ' _ = package - layer epoxy 4 0 a material, that is, the production process of the light-emitting diode. ' @而, § The light generated by the light-emitting diode, if the actual demand - =: white light 4, at this time, the light-emitting diode chip 3 〇a can be blue - and on the bowl substrate 2 In the case of 0 a, it is necessary to fill the yellow fluorescent powder, so that the blue light emitted by the light-emitting diode chip 30 a can be converted into white light by the effect of the fluorescent powder. The purpose of white light can be achieved. However, in general, the light-emitting diode chip 3 〇a is a tetragonal body, but the dispersion 1 3 a is in the shape of a bowl (circular) when punching, and the fit between the square body and the bowl = is easy to make the fluorescent powder. In the case of filling, there is a lack of filling, and there will be more or less of the surrounding of the LED wafer 30. In particular, the four sides of the LED chip 3 〇a and the heat sink. In the meantime, when the phosphor powder is too much and too little, it makes the blue light, which causes the optical brightness to be uneven. Nine-color deviation. • *,, 疋, the creator feels that the above-mentioned deficiencies can be improved, and he is dedicated to the use of 〇 研 , 终于 〇 〇 〇 〇 〇 〇 〇 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 [New content] The purpose of this creation is to provide an SMD diode solid crystal support structure to provide a subsequent process for fixing the LED body, and to uniformly distribute the phosphor powder. Around the LED array, to avoid uneven filling of the phosphor powder, resulting in uneven optical brightness of 6 M317079. For the purpose of the above, the present invention provides a smd diode solid-crystal smashing: a structure comprising a colloidal body whose one end forms a concave functional area; - a solid 曰 pedestal 'system is fixed to the colloid And located in the functional area, a plurality of subordinate pins/knobs are fixed to the colloid to be respectively located on the side of the solid crystal base, and extend outward from the functional area to the outside of the colloid; And a cup is formed in the functional area of the gel, and the inner cup is fixed to the end surface of the solid crystal base 71. The inner cup is provided with a solid crystal space, and the top surface of the solid crystal base is exposed. In the solid crystal space. The benefits of this creation: the creation of the inner cup and the solid crystal space in the colloid to provide a subsequent process of the LED chip mounted in the solid crystal space of the inner cup, and the shape is based on the LED chip When designed to fill the filament, it can be distributed (4) around the LED array to avoid uneven filling of the phosphor powder, resulting in a phenomenon of partiality and partiality, which causes the white light to be colored. Yellow and bluish, causing optical convergence.
為使能更進一步瞭解本創作之特徵及技術内容，請參 閱=下有關本創作之詳細說明與附圖，然而所附圖式僅提 供麥考與說明用，並非用來對本創作加以限制者。 【實施方式】 明麥閱第三圖及第四圖所示，本創作係提供一種 SMD(Surface Mount Device)二極體固晶支架結構，包括有 膠體1 〇、一固晶基座2 〇、複數個金屬接腳3 〇及一 内杯4 0。 7 M317079 該膠體1 〇大致呈圓型體，也可設計為四方型體或多 邊型體等之態樣，本創作不加以限制該膠體i 〇之外型。 膠體1 0 —端面向内凹設形成有一内凹的功能區丄i，其 大致呈圓形狀，當然也可以設計為其它之任何形狀，而該 膠體1 0之材質可係為如聚碳酸酯（Polycarbonate，Pc)、 水鄰本一曱酿胺（Polyphthalamide，PPA )、聚對苯-甲酉分 丁二醇（P〇lybutylene Terephthalte，PBT)、聚甲基丙烯酸 甲酯（Polymethyl Methacrylate ’ PMMA)，或其它任何已知 熱塑性樹脂等之塑料件。 該固晶基座2 0可係由金屬材料件所製成，其固接於 該膠體1 0中央處，且大部份係位於該功能區丄i中，而 相對地兩側緣可進一步突伸至該功能區i i周緣外的膠 體1 0内，以增加固晶基座2 〇與膠體1 〇之間的結合強 度。 、口口 該等金屬接腳3 0係由金屬材料件所製成，如銅、 鐵、鋁或銅合金等任何已知具有導電性之金屬材料。每一 金屬接腳3 ◦分別與膠體;l 〇固接，且分別係與固晶基座 2 0間隔相鄰，而可分別位於固晶基座2 〇 一側，並且每 —金屬接腳3 〇係由功能區丄丄中向外延伸至膠體工 外部。 其中，上述之金屬接腳3 〇係各具有一基部31及一 接腳邛3 2。母一基部3 1係分別位於功能區1 1中，每 -接腳部3 2分別係由基部3工向外延伸至膠體工〇外 :，以做為後續之接點。每一金屬接腳3 〇可依設計而同 ¥位於固晶基座2 〇相同侧，或是分別位於固晶基座2 〇 M317079 相對的二側，於本創作之圖式中，係以位於相對的二側為 實施例。另外，每一基部3 1之間及其與固晶基座2 〇之 間係與膠體1 0形成有間隔絕緣區塊1 2，其係由膠體1 0所形成，藉以可區隔出每一金屬接腳3 〇所需之極性 (陽、陰極）。In order to further understand the characteristics and technical content of this creation, please refer to the detailed description and drawings of this creation. However, the drawings are only for the purpose of illustration and description, and are not intended to limit the creation. [Embodiment] As shown in the third and fourth figures of Mingmai, the present invention provides an SMD (Surface Mount Device) diode solid crystal support structure, which comprises a colloid 1 〇 and a solid crystal pedestal 2 〇, A plurality of metal pins 3 〇 and an inner cup 40. 7 M317079 The colloid 1 〇 is roughly round, and can also be designed as a tetragonal or a polygonal body. This creation does not limit the colloidal shape. The colloid 10 - end is concavely formed with a concave functional area 丄i, which is substantially circular, and may of course be designed in any other shape, and the material of the colloid 10 may be, for example, polycarbonate ( Polycarbonate, Pc), water-based polyphthalamide (PPA), poly(p-butylene terephthalte) (PBT), polymethyl methacrylate (PMMA), Or any other plastic member of a known thermoplastic resin or the like. The die-bonding base 20 can be made of a piece of metal material, which is fixed at the center of the colloid 10, and most of which are located in the functional area 丄i, and the opposite sides can further protrude Extending into the colloid 10 outside the periphery of the functional zone ii to increase the bonding strength between the solid crystal pedestal 2 〇 and the colloid 1 〇. Ports These metal pins 30 are made of a metal material such as copper, iron, aluminum or a copper alloy, and any known metal material having electrical conductivity. Each of the metal pins 3 〇 is respectively fixed to the colloid; l 〇, and is respectively spaced apart from the solid crystal pedestal 20 0, and may be respectively located on the side of the solid crystal pedestal 2 ,, and each metal pin 3 The tether is extended from the functional zone to the outside of the colloid. The metal pins 3 have a base portion 31 and a pinch 32. The mother-base 3 1 series are respectively located in the functional area 1 1 , and each of the - foot portions 3 2 extends outward from the base 3 to the outside of the colloidal work: as a subsequent contact. Each metal pin 3 〇 can be located on the same side of the solid crystal pedestal 2 〇 as the design, or on the opposite side of the solid crystal pedestal 2 〇 M317079, respectively. The opposite two sides are examples. In addition, between each of the bases 31 and between the solid crystal pedestal 2 and the colloid 10, a spacer insulating block 12 is formed, which is formed by the colloid 10, thereby separating each Metal pin 3 〇 required polarity (yang, cathode).
该内杯4 0係形成於膠體1 〇的功能區1 1中，且係 固接於该固晶基座2 0之頂端面2 1的表面上，並且内杯 4 0開$又有一固晶空間4 1，其係呈一四方型孔狀，藉以 使固晶基座2 0之頂端面2 1可部份顯露於該固晶‘間 4 1中。該内杯4 〇於該膠體丄〇中的整體高度d !係低 於該膠體1 〇形成該功能區工丄之端面處的高度廿2 低於該膠體1 〇之膠沿1 3處。 々〃中’上述之膠體1 0可使用如射出成型等之技術方 以固接每一金屬接腳3 0及固晶基座2 0，而内杯4 y係與谬體1 〇為同—材質，利用射出 相::;::1:及内杯4〇,可使膠趙10與内杯 鄰。^ 者^\或可使内杯4 〇與膠體1 〇間隔相 其可利用黏著等==由金屬材料所製成之金屬件， 端面… 式，以固接於固晶基座2 0之頂 的間隔相鄰，。且與每—金屬接腳3Q及·基座20絕緣 業。該内杯4 〇之°固曰：’加以說明發光二極體之成型作 椏體晶片5 0¥访 間4 1中可供-如藍光之發光二 1上，因發光 ^其固接於111晶基座2 G之頂端面2 —° _日日片5 0於切割成型製程作業中，通 9 M317079 常是切割成四方型體，因此固晶空間4 i係設計為四方型 孔，以對應至發光二極體晶片5 〇之外型。之後，可於發 光二極體晶片5 0上連接有數條如金線等之導線5工至 每一金屬接腳3 〇之基部3丄，接著，該固晶空間4工中 可提供充填如黃色之螢光粉6 Q，藉其具有粉末沉積之特 性，可均均地填滿該固晶空間4工，而加以覆蓋發光二極 ?晶片5 0。最後，可於膠體丄〇的功能區丄工中充填覆 1層係為了透光性之封膠層7 〇，如環氧樹脂或石夕膠等 之封膠材，以完成後續之封裝製程作業，而構成一 LEd。 乂經由上述之說明，俾以在金屬接腳3 〇之接腳部3 2 分別施以正、負極之電壓，而導通至基部3 1經由導線5 1之功效，即可使發光二極體晶片5 〇釋放其藍色之光 線，再藉由螢光粉6 〇之功效，使藍光可轉變為白色光， 乂幵>/成白光led。當電壓流通時，將使發光二極體晶片 =0產生熱量，固晶基座2 〇之底端面2 2係可顯露出該 膠體1 〇之另一端面外（如第六圖），可藉由固晶基座2 〇 所具有金屬之熱傳導特性，使熱量能經由固晶基座2 〇有 放V出至膠體1〇外部而散熱。藉此，避免因熱量過高損 壞發光二極體晶片5 0，而縮短其使用之壽命；或者，因 熱量有過高之現象，而使發光二極體晶片5 0產生光衰竭 之情形，即釋放之光芒減弱，使亮度變暗。 如弟七圖所示’並请配合參閱弟四圖，在此實施例 中’該内杯4 0可進一步地開設有一開口 4 2，而使固晶 土庄2 〇之頂端面2 1能顯露於該開口 4 2中，可將導線 5 1連結至該:開口 4 2中與固晶基座2 0連接，並連接至: M317079 其中金屬接腳3 0之基部3 1上，而發光二極體晶片5 〇可使用如銀膠等之導電性接著劑（圖略）固接於該固晶 基座2 0上，而可將固晶基座2 〇當成陰極接點，而該金 屬接腳3 0係為陰極接點，另一金屬接腳3 〇則係為陽極 接點，即可使發光二極體晶片5 〇釋放其光線。 綜合上述之說明，本創作於膠體1 〇中進一步加以彤 成内杯4 0及固晶空間4工，以提供後續製程之發光二極 體晶片5 0可安裝於内杯4 〇之固晶空間4工内，且固晶 空間4 1之外形係依發光二極體晶片5 〇而設計，以供 填赏光粉6 0之製程時，可使螢光粉6 Q均勻地分佈於發 5 0四周’及固晶空間4 1巾’以避免發生 螢光粉6 0充填不均，產生偏多及偏少之現象，從而^得 白光之光色偏黃及偏藍，造成光學輝度有不均之情形。 惟以上所述僅為本創作之較佳可行實施例，非因此即 拘限本創作之專難圍，故舉凡利本創作說明書及圖式 内容所為之等效結構變化，均同理皆包含於本創作之範圍 内，合予陳明。 【圖式簡單說明】 第-圖為習知發光二極體引線架之構造的示意圖。 第二圖為第-圖固接發光二極體晶片的示意圖。 第三圖為本創作之立體圖。 第四圖為本創作之平面剖視圖。 f五圖為賴作固接發光二極體晶片之立體示意圖。 第六圖為第五圖之仰視圖。 M317079 第七圖為本創作固接發光二極體晶片之另一立體示意圖。 【主要元件符號說明】 [習知] 基板 1 0 a 導電片 1 1 a 接腳 12a 散熱底板 13a 碗狀基材 2 0 a 發光二極體晶片 30a 導線 3 1a 環氧樹脂 40a [本創作] 膠體 10 功能區 11 間隔絕緣區塊 12 膠沿 13 固晶基座 2 0 頂端面 2 1 底端面 2 2 金屬接腳 3 0 基部 3 1 接腳部 3 2 内杯 4 0 固晶空 間 4 1 開口 4 2 發光二極 體 晶 片 5 0 導線 5 1 螢光粉 6 0 12 M317079 封膠層The inner cup 40 is formed in the functional area 1 1 of the colloid 1 , and is fixed on the surface of the top end surface 21 of the solid crystal pedestal 20, and the inner cup is opened and has a solid crystal. The space 4 1 is in the shape of a square hole, so that the top surface 2 1 of the solid crystal pedestal 20 can be partially exposed in the solid crystal ' 4 1 . The overall height d of the inner cup 4 in the colloid is lower than the height 廿2 of the colloid 1 〇 forming the end of the functional zone, which is lower than the colloid 1 of the colloid 1 。. In the above-mentioned colloid 10, a technique such as injection molding can be used to fix each of the metal pins 30 and the solid crystal pedestal 20, and the inner cup 4 y is the same as the scorpion 1 — Material, using the injection phase::;::1: and the inner cup 4〇, can make the glue Zhao 10 and the inner cup. ^ ^ ^ or can make the inner cup 4 〇 and the colloid 1 〇 interval can be used to adhere or other = metal material made of metal material, end face ... type, to adhere to the top of the solid crystal pedestal 2 0 The spacing is adjacent. It is insulated from each of the metal pins 3Q and the susceptor 20. The inner cup 4 〇 曰 固 曰 ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光The top surface of the crystal base 2 G 2 - ° _ Japanese film 50 in the cutting process, through 9 M317079 is often cut into a square shape, so the solid crystal space 4 i is designed as a square hole, to correspond It is a type that is 5 发光 to the light-emitting diode wafer. Then, a plurality of wires 5 such as gold wires are connected to the base 3 of each of the metal pins 3 于 on the LED substrate 50. Then, the solid crystal space 4 can be filled with yellow. The phosphor powder 6 Q, by virtue of its powder deposition characteristics, can uniformly fill the solid crystal space to cover the light-emitting diode wafer 50. Finally, the functional layer of the colloidal crucible can be filled with a layer of sealing material for the light-transmissive sealing layer 7, such as epoxy resin or Shishijiao, to complete the subsequent packaging process. And constitute a LEd. According to the above description, the voltage of the positive and negative electrodes is applied to the pin portion 3 2 of the metal pin 3 ,, and the light is applied to the base portion 3 1 via the wire 5 1 to enable the light emitting diode chip. 5 〇Release the blue light, and then use the effect of the phosphor powder 6 ,, so that the blue light can be converted into white light, 乂幵>/ white light led. When the voltage is circulated, the light-emitting diode wafer will be generated to generate heat, and the bottom end surface 2 of the solid crystal pedestal 2 can reveal the other end of the colloid 1 (as shown in the sixth figure). The solid-state susceptor 2 has a heat transfer property of the metal, so that the heat can be dissipated to the outside of the colloid 1 via the die-bonding base 2 to dissipate heat. Thereby, the damage of the light-emitting diode wafer 50 is prevented from being damaged due to excessive heat, and the life of the light-emitting diode wafer is shortened; or, due to the excessive heat, the light-emitting diode wafer 50 is light-depleted, that is, The light of the release is weakened, making the brightness darker. As shown in the figure of the seventh figure, and please refer to the fourth figure of the brother, in this embodiment, the inner cup 40 can further have an opening 4 2, so that the top surface 2 1 of the solid crystal soil can be exposed to In the opening 4 2 , the wire 5 1 can be connected to the opening 4 2 and connected to the solid crystal base 20 , and connected to: M317079 wherein the metal pin 30 is on the base 3 1 , and the light emitting diode The wafer 5 can be fixed to the die attach base 20 by using a conductive adhesive such as silver paste (not shown), and the die bond base 2 can be used as a cathode contact, and the metal pin 3 can be used as a cathode contact. The 0 series is the cathode contact, and the other metal pin 3 系 is the anode contact, so that the light emitting diode chip 5 〇 releases its light. Based on the above description, the creation is further divided into an inner cup 40 and a solid crystal space in the colloid 1 to provide a subsequent process of the LED wafer 50 which can be mounted on the inner cup 4 固 solid crystal space. 4 working, and the shape of the solid crystal space 4 1 is designed according to the light-emitting diode chip 5 ,, in order to fill the process of the light-powder 60, the fluorescent powder 6 Q can be evenly distributed around the hair 50 'And solid crystal space 4 1 towel' to avoid the uneven filling of the phosphor powder 60, resulting in more and less phenomenon, so that the light color of the white light is yellowish and bluish, resulting in uneven optical brightness. situation. However, the above description is only a preferred and feasible embodiment of the present invention, and thus it is not limited to the specific difficulty of the creation. Therefore, the equivalent structural changes of the creative manual and the graphic content are all included in the same reason. Within the scope of this creation, it is given to Chen Ming. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a schematic view showing the construction of a conventional light-emitting diode lead frame. The second figure is a schematic diagram of the first-figure fixed-emitting diode chip. The third picture is a perspective view of the creation. The fourth picture is a plan sectional view of the creation. f is a three-dimensional diagram of a fixed-emitting diode chip. The sixth picture is a bottom view of the fifth figure. M317079 The seventh figure is another three-dimensional schematic diagram of the fixed light-emitting diode chip. [Main component symbol description] [General] Substrate 1 0 a Conductive sheet 1 1 a Pin 12a Heat sink base plate 13a Bowl substrate 2 0 a Light-emitting diode wafer 30a Wire 3 1a Epoxy resin 40a [This creation] Colloid 10 Function area 11 Space insulation block 12 Glue edge 13 Solid crystal base 2 0 Top end 2 1 Bottom end 2 2 Metal pin 3 0 Base 3 1 Foot 3 2 Inner cup 4 0 Solid crystal space 4 1 Opening 4 2 LED chip 50 wire 5 1 phosphor powder 6 0 12 M317079 sealing layer