M307861 八、新型說明： 【新型所屬之技術領域】 本創作係為一種多輸出輸入之晶片型天線，尤指一種可體積縮小、且可達 • 多端輸出輸入之一種晶片型天線。 【先前技術】 按，中華民國專利公報之證書號第M294111號，其主要於一種多重輸出入 # _0)天線結構，其係設有一基座及一置位件，該基座具有-數錐形等腰狀平 台，該數平台係自基座頂面中心處向外緣邊延伸，及形成具有星狀之外觀型態， 且在各平p之、面上自垂设有活節式天線，該活節式天線間係以等具排列設 立，進而達到多重輸出入(MIM0)天線之效能； 准，亥上述’其雖可達到多重輸出入天線之效能，而當須加強收發訊號時， 往往因擴充天線，導致平台基座所佔空_大，因而造成使用上的不便； 是故，如何將上述等缺失加以摒除 •線的同時，進可使天線外觀體積縮小， 之所在。 【新型内容】 本創作之主要目的即在提供一3 一基板，其係設有一接地層與 晶片天線； ’並提供一種可多輸出輸入之晶片型天 即為本案創作人所欲解決之技術困難點 種多輪出輸入之晶片型天線，其包含： ^一第一晶片天線、一第二晶片天線及一第三 第一晶片天線設有-第-輻射層、 一第一饋入端、一第一接地端、一第 M307861 一接地端、一第三接地端及一第一接地層，該第一饋入端接設一第一訊號線， 該第一訊號線一端可接設基地台訊號端； 一苐二晶片天線設有一第二輕射層、一第二饋入端、一第四接地端、一第 - 五接地端、一第六接地端及一第二接地層，該第二饋入端接設一第二訊號線， . 該第二訊號線一端可接設基地台訊號端； 一第三晶片天線設有一第三輻射層、一第三饋入端、一第七接地端、一第 八接地端、一第九接地端及一第三接地層，該第三饋入端接設有一第三訊號線， φ 該第三訊號線一端可接設基地台訊號端； 俾藉由第一晶片天線之第一饋入端、第二晶片天線之第二饋入端及第三晶 片天線之第三饋入端接設於第一訊號線、第二訊號線及第三訊號線一端，該第 一訊號線、第二訊號線及第三訊號線可接設基地台訊號端俾供接收訊號，俾達 多輸出輸入之晶片型天線之目的者。 【實施方式】 m 之其倾徵内容與優點及其所達成之 功效能夠更為顯現，茲將本創作配合附圖，詳細說明如下· 凊參閱圖-所7F ’本創作係提供-種多輸出輸人之晶片型天線，其包含： -基板卜該基板i設有-接地層14，又該基板i —端設有—第一晶片天 線2’又該基板1另-端設有—第三晶片天線4，又該第—晶片天線2與第三晶 片天線4間設有-第二晶片天線3,再該第—晶片天線2、第二晶片天線3及第 二晶片天線4互不相連接； -第-晶片天線2，該第-晶片天線2，其係設有一第一簡層22、一第一 6 M307861 饋入端21、一第一接地端23、一第二接地端24、一第三接地端25及一第一接 地層26，該第一輻射層22 —端接設第一饋入端21，又該第一輻射層22另一端 接苐一接地端23，該第一輻射層22與第一接地層26設有一間距，該第一接地 層26 —端接設第二接地端24，又該第一接地層26另一端接設第三接地端25， 該第一接地端23、第二接地端24及第三接地端25接設於基板1之接地層14， 該第一饋入端21接設一第一訊號線11 一端，該第一訊號線11另一端可接設基 地台訊號端5 ; 丨 一第二晶片天線3，該第二晶片天線3，其係設有一第二輻射層32、一第二 饋入端31、一第四接地端33、一第五接地端34、一第六接地端35及一第二接 地層36，該第二輻射層32 —端接設第二饋入端31，又該第二輻射層32另一端 接第四接地端33，該第二輻射層32與第二接地層36設有一間距，該第二接地 層36 —端接設第五接地端34，又該第二接地層36另^一^接没第六接地端35 ’ 該第四接地端33、第五接地端34及第六接地端35接設於基板1之接地層14， 該第二饋入端31接設一第二訊號線12 —端，該第二訊號線12另一端可接設基 > 地台訊號端5; 一第三晶片天線4，該第三晶片天線4，其係設有一第三輻射層42、一第三 饋入端41、一第七接地端43、一第八接地端44、一第九接地端45及一第三接 地層46，該第三輻射層42 —端接設第三饋入端41，又該第三輻射層42另一端 接第七接地端43，該第三輻射層42與第三接地層46設有一間距，該第三接地 層46 —端接設第八接地端44，又該第三接地層46另一端接設第九接地端45， 该第七接地端43、第八接地端44及第九接地端45接設於基板1之接地層14， 該第三饋入端41接設一第三訊號線13 一端，該第三訊號線13另一端可接設基 7 M307861 地台訊號端5 ; 又該第一晶片天線之反射損耗曲線61，該第二晶片天線之反射損耗曲線 62，該第三晶片天線之反射損耗曲線63，請參閱圖二所示； 該第一晶片天線與第二晶片天線之隔離度64，該第一晶片天線與第三晶片 天線之隔離度65，該第二晶片天線與第三晶片天線之隔離度66，請參閱圖三所 示0 為使本創作更加顯現出其進步性與實用性，茲與習用作一比較分析如下·· φ 習用技術： 1、 體積龐大、佔空間。 2、 組裝過程繁雜。 本創作優點： 1、體積小、組裝方便。 表丁、上所述，本創作在突破先前之技術結構下，確實已達到所欲增進之功效， 且也非熟悉該項技藝者所易於思及，再者，本創作申請前未曾公開，其所具之 •進步性、實用性，顯已符合新型專利之申請要件，爰依法提出申請，懇請貴 局核准本件新型專利申請案，以勵創作，至感德便。 【圖式簡單說明】 第一圖係為本創作之組合示意圖。 第二圖係為本創作之反射損耗圖。 第三圖係為本創作之兩兩天線間隔離度圖。 8 M307861 【主要元件符號說明】 1..基板 2..第一晶片天線 3..第二晶片天線 4.·第三晶片天線 5..基地台訊號端 11..第一訊號線 12..苐一訊號線 13..第三訊號線 14..接地層 21..第一饋入端 22..第一輻射層 23..第一接地端 24..第二接地端 25..第三接地端 26.·第一接地層 31..第二饋入端 32..第二輻射層 33..第四接地端 34..第五接地端 35..第六接地端 36..第二接地層 41..第三饋入端 42..第三輻射層 43..第七接地端 44..第八接地端 45..第九接地端 46.·第三接地層 61.. 第一晶片天線之反射損耗曲線 62.. 第二晶片天線之反射損耗曲線 63.. 第三晶片天線之反射損耗曲線 64.. 第一晶片天線與第二晶片天線之隔離度 65.. 第一晶片天線與第三晶片天線之隔離度 66.. 第二晶片天線與第三晶片天線之隔離度 9M307861 VIII. New Description: [New Technology Field] This creation is a multi-output input chip antenna, especially a chip type antenna that can be reduced in size and can reach multi-terminal output input. [Prior Art] According to the Patent No. M294111 of the Republic of China Patent Gazette, which is mainly used in a multi-input/in #_0) antenna structure, which is provided with a base and a set member, the base has a number-cone The isosceles platform, which extends from the center of the top surface of the base to the outer edge of the base, and forms a star-shaped appearance, and has a living antenna on the surface of each flat p. The articulated antennas are arranged in an equal arrangement to achieve the performance of multiple input/output (MIM0) antennas. The above can achieve the performance of multiple input and output antennas, and when it is necessary to strengthen the transmission and reception signals, Due to the expansion of the antenna, the platform base is occupied by a large space, which causes inconvenience in use; therefore, how to eliminate the above-mentioned missing lines and at the same time, the appearance of the antenna can be reduced. [New content] The main purpose of this creation is to provide a 3-layer substrate with a ground plane and a chip antenna. 'And provide a chip-type day with multiple output inputs, which is the technical difficulty that the creators of this case want to solve. A plurality of round-output input wafer type antennas, comprising: a first chip antenna, a second chip antenna and a third first chip antenna provided with a -th radiation layer, a first feed end, and a first a first grounding end, a first grounding end, a third grounding end, and a first grounding layer, wherein the first feeding end is connected to a first signal line, and the first signal line can be connected to the base station signal at one end a second light-emitting layer, a second feed end, a fourth ground end, a first-fifth ground end, a sixth ground end, and a second ground layer, the second A second signal line is connected to the feeding end. The second signal line can be connected to the base station signal end. The third chip antenna is provided with a third radiation layer, a third feeding end and a seventh ground end. , an eighth ground terminal, a ninth ground terminal and a third ground layer a third signal line is connected to the third feeding end, φ one end of the third signal line can be connected to the signal terminal of the base station; 俾 by the first feeding end of the first chip antenna and the second of the second chip antenna The third feeding end of the feeding end and the third chip antenna are connected to one ends of the first signal line, the second signal line and the third signal line, and the first signal line, the second signal line and the third signal line are connectable The base station signal terminal is used for receiving signals, and the destination of the chip antenna for outputting and inputting. [Embodiment] The contents and advantages of m and its effects can be more apparent. The following is a detailed description of the creation and the following drawings. 凊 Refer to Figure - 7F 'This creation provides a multi-output The input wafer type antenna comprises: - a substrate, the substrate i is provided with a ground layer 14, and the substrate i is provided with a first chip antenna 2' and the substrate 1 is further provided with a third portion The chip antenna 4 is further provided with a second chip antenna 3 between the first wafer antenna 2 and the third wafer antenna 4, and the first wafer antenna 2, the second wafer antenna 3 and the second wafer antenna 4 are not connected to each other. a first-wafer antenna 2, which is provided with a first simple layer 22, a first 6 M307861 feed end 21, a first ground end 23, a second ground end 24, and a first a third grounding end 25 and a first grounding layer 26, the first radiating layer 22 is terminated with a first feeding end 21, and the other end of the first radiating layer 22 is connected to a grounding end 23, the first radiation The layer 22 is spaced apart from the first ground layer 26, the first ground layer 26 is terminated with a second ground terminal 24, and the first ground layer 26 is further The first grounding terminal 23, the second grounding terminal 24, and the third grounding terminal 25 are connected to the grounding layer 14 of the substrate 1, and the first feeding end 21 is connected with a first signal. One end of the line 11, the other end of the first signal line 11 can be connected to the base station signal end 5; a second chip antenna 3, the second chip antenna 3 is provided with a second radiating layer 32 and a second feed The second radiating layer 32 is terminated with a second feeding end 31, and the second radiating layer 32 is terminated with a second feeding end 31, and a fourth grounding end 33, a sixth grounding end 35, a sixth grounding end 35, and a second grounding layer 36. The other end of the second radiating layer 32 is connected to the fourth grounding end 33. The second radiating layer 32 is provided with a spacing from the second grounding layer 36. The second grounding layer 36 is terminated with a fifth grounding end 34. The second grounding layer 36 is connected to the grounding layer 14 of the substrate 1 , and the second grounding end 35 is connected to the grounding layer 14 of the substrate 1 . The second feeding end is connected to the grounding layer 14 of the substrate 1 . 31 is connected to a second signal line 12-terminal, the other end of the second signal line 12 can be connected to the base > ground signal terminal 5; a third chip antenna 4, the third chip antenna 4, A third radiating layer 42 , a third feeding end 41 , a seventh grounding end 43 , an eighth grounding end 44 , a ninth grounding end 45 , and a third grounding layer 46 are disposed. The third radiating layer 42 is disposed. The third feeding end 41 is terminated, and the other end of the third radiating layer 42 is connected to the seventh grounding end 43. The third radiating layer 42 is provided with a spacing from the third grounding layer 46. The third grounding layer 46 is provided with a spacing. The eighth grounding end 44 is connected to the end, and the other end of the third grounding layer 46 is connected to the ninth grounding end 45. The seventh grounding end 43, the eighth grounding end 44 and the ninth grounding end 45 are connected to the substrate 1. a grounding layer 14 , the third feeding end 41 is connected to one end of a third signal line 13 , and the other end of the third signal line 13 can be connected to the base 7 M307861 ground signal end 5; and the reflection loss of the first chip antenna a curve 61, a reflection loss curve 62 of the second chip antenna, and a reflection loss curve 63 of the third chip antenna, as shown in FIG. 2; the isolation between the first chip antenna and the second chip antenna 64, the first The isolation between the chip antenna and the third chip antenna is 65, and the isolation between the second chip antenna and the third chip antenna is 66. See Figure three shows that the present writing 0 as its progress more apparent and practical, is hereby used as a comparison with conventional ·· φ follows conventional techniques: 1, bulky, occupy space. 2. The assembly process is complicated. The advantages of this creation: 1. Small size and convenient assembly. In the above, the creation of this creation has indeed achieved the desired effect under the previous technical structure, and it is not easy for people who are familiar with the art to think about it. Moreover, this creation has not been disclosed before the application. The progress and practicality of the company have met the requirements for the application of new patents. If you apply for it according to law, you are requested to approve the application for this new type of patent, so as to encourage creation and to be sensible. [Simple description of the diagram] The first diagram is a combination diagram of the creation. The second picture is the reflection loss map of this creation. The third picture is the isolation diagram between the two antennas of this creation. 8 M307861 [Description of main component symbols] 1. Substrate 2. First chip antenna 3. Second chip antenna 4. Third chip antenna 5. Base station signal terminal 11. First signal line 12.苐一信号线13..third signal line 14..ground layer 21. first feed end 22.. first radiation layer 23. first ground end 24.. second ground end 25.. third Grounding terminal 26.·first grounding layer 31.. second feeding end 32.. second radiating layer 33.. fourth grounding end 34.. fifth grounding end 35.. sixth grounding end 36.. second Grounding layer 41.. third feeding end 42.. third radiating layer 43.. seventh grounding end 44.. eighth grounding end 45.. ninth grounding end 46. · third grounding layer 61.. first Reflection loss curve of the wafer antenna 62. Reflection loss curve of the second wafer antenna 63. Reflection loss curve of the third wafer antenna 64. Isolation of the first wafer antenna and the second wafer antenna 65.. First wafer antenna Isolation from the third wafer antenna 66. Isolation of the second and third wafer antennas 9