TWM304025U - Improved assembly of fins and base of heat dissipation device - Google Patents

Improved assembly of fins and base of heat dissipation device Download PDF

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Publication number
TWM304025U
TWM304025U TW95213607U TW95213607U TWM304025U TW M304025 U TWM304025 U TW M304025U TW 95213607 U TW95213607 U TW 95213607U TW 95213607 U TW95213607 U TW 95213607U TW M304025 U TWM304025 U TW M304025U
Authority
TW
Taiwan
Prior art keywords
base
fins
heat dissipation
dissipation device
improved assembly
Prior art date
Application number
TW95213607U
Other languages
Chinese (zh)
Inventor
Chung-Shian Huang
Original Assignee
Chung-Shian Huang
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chung-Shian Huang filed Critical Chung-Shian Huang
Priority to TW95213607U priority Critical patent/TWM304025U/en
Publication of TWM304025U publication Critical patent/TWM304025U/en

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  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Description

8、如由μ + , 101年〇3月26日修正替換 組人請專利範圍第i或2項所述散 且δ改良，該底座係一平面狀的矩形實心金屬座體。 、如申請專利範圍第2項所述散熱器韓片與底座的組合 改良，S亥底座係一圓柱形的實心金屬座體。 1〇、如申請專利範圍第9項所述散熱器鰭片與底座的組合 改良’該底座係一體成型而設有一鎖合底座。8. If the replacement is made by μ + , 101, 〇 March 26, the group is requested to modify the δ and the δ according to the patent range i or 2, and the base is a flat rectangular solid metal seat. According to the combination of the radiator Korean piece and the base described in the second application of the patent scope, the S Hai base is a cylindrical solid metal seat. 1. A combination of a heat sink fin and a base as described in claim 9 of the patent application. The base is integrally formed and provided with a lock base.

15 S15 S

TW95213607U 2006-08-02 2006-08-02 Improved assembly of fins and base of heat dissipation device TWM304025U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95213607U TWM304025U (en) 2006-08-02 2006-08-02 Improved assembly of fins and base of heat dissipation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95213607U TWM304025U (en) 2006-08-02 2006-08-02 Improved assembly of fins and base of heat dissipation device

Publications (1)

Publication Number Publication Date
TWM304025U true TWM304025U (en) 2007-01-01

Family

ID=38318214

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95213607U TWM304025U (en) 2006-08-02 2006-08-02 Improved assembly of fins and base of heat dissipation device

Country Status (1)

Country Link
TW (1) TWM304025U (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI400425B (en) * 2010-11-24 2013-07-01 Auras Technology Ltd Method and Structure of Flat Heat Conveying Pipe Fastening Cooling Fin
TWI468636B (en) * 2011-11-09 2015-01-11 Cooler Master Dev Corp Heat dissipating fin, heat dissipating device and method of manufacturing the same
TWI468638B (en) * 2011-09-01 2015-01-11 Kunshan Lemtech Prec Engineering Co Ltd Radiator fin and base stamping combination method
TWI731479B (en) * 2019-08-13 2021-06-21 黃崇賢 Stamping and riveting structure of radiating fin

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI400425B (en) * 2010-11-24 2013-07-01 Auras Technology Ltd Method and Structure of Flat Heat Conveying Pipe Fastening Cooling Fin
TWI468638B (en) * 2011-09-01 2015-01-11 Kunshan Lemtech Prec Engineering Co Ltd Radiator fin and base stamping combination method
TWI468636B (en) * 2011-11-09 2015-01-11 Cooler Master Dev Corp Heat dissipating fin, heat dissipating device and method of manufacturing the same
TWI731479B (en) * 2019-08-13 2021-06-21 黃崇賢 Stamping and riveting structure of radiating fin

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Legal Events

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