-M285832 八、新型說明： 【新型所屬之技術領域】 本創作係關於一種電連接器設計，尤指一種使用於和 晶片模組相壓縮接觸的電連接器。 【先前技術】 現在在某些電子產品（如電腦）上出現了一種1〇八型 的晶片模組，這種晶片模組的導接端為墊圈形狀，與之連 接的電連接n設有與導電㈣縮接觸的端子。現有技術的 電連接器，包括絕緣本體和導電端子，絕緣本體設有收容 一體成型而成，包括 導電端子的端子收容槽，導電端子是一 固持於本體⑽固持部，_部向下延伸設有與電路板相 丈早才妾的焊接部，向上延柚热古& 3 u ^ t ^ …_-M285832 VIII. New Description: [New Technology Area] This creation is about an electrical connector design, especially an electrical connector used in compression contact with a wafer module. [Prior Art] Now, on some electronic products (such as computers), a type 1-8 chip module has appeared. The terminal end of the chip module has a gasket shape, and the electrical connection n connected thereto is provided with Conductive (four) shrink contact terminals. The electrical connector of the prior art includes an insulative housing and a conductive terminal. The insulative housing is integrally formed and received, and includes a terminal receiving slot of the conductive terminal. The conductive terminal is fixed to the body (10) holding portion, and the _ portion extends downward. The welding part that is close to the board, and the extension of the pomelo hot ancient & 3 u ^ t ^ ..._
陷。 種電連接器改良，以克服上述缺trap. Electrical connectors are modified to overcome the above shortcomings
【新型内容】[New content]
為實現上述目的， 種電連接器的創新設計， 且能實現電子元件與電路板的快速傳輸。 目的，本創作電連接器，包括絕緣本體和 5 -M285832 導電端子，絕緣本體上設有 :其中每-個容心:::子容納孔，其特徵在於 第一導電立山早—、山 導電端子和第二導電端子， •導接^ /㈣可與外來f子元件電性連接的第- 外來電子元件電性連接的第電:子-端形成可與 斜排列。卩料㈣，且至少—部分第—導接部呈傾 與現有技術相比，本_電連接器， 杳且能有效減低電感效應，更能符合高頻線路的== 戶、現電子元件與電路板的快速傳輸。 【實施方式】 之結構特徵及其他之作用 茲依附圖實施例將本創作 目的詳細說明如下： 4閱第-圖至第七圖’本創作電連接器包括絕緣本 體1和導電端子及裝設於絕緣本體卜端用關制晶片模 組的上蓋體7，在絕緣本體的另—端裝設有—用以將上蓋 體7㈣於絕緣本體上的搖桿8，在絕緣本體四周設有將 電連接ϋ連制電路板±的連接結構9。其巾，絕緣本體 1上設有若干端子容納孔10，其中每一個容納孔1〇設有相 互連接的第-導f端子2和第二導電端子3，兩導電端子 可相對私動，该第—導電端子3可固定至容納孔！ 〇内，第 一導電端子2可移動地連接至第二導電端子3，該第一導 電端子2和第二導電端子3均為可衝壓成型的片狀金屬， 其中第一導電端子2的厚度大於第二導電端子3的厚度。 •M285832 - 所述絕緣本體1上設有凹陷空間li，以定位對接電子 元件（本實施例中為晶片模組，當然，也可為別的電子元 件），所述絕緣本體1内的容納孔至少形成側寬較寬的第 一容納空間100和第二容納空間101，其中第一容納空間 100可容納及定位第一導電端子2，第二容納空間1〇1可容 納及定位第二導電端子3，其中第一容納空間1〇〇内設有 第一側壁102及第二側壁103，第一側壁1〇2高度低於第二 側壁103冑度。另外在絕緣本體i底部設有定位部^以定 • 位該絕緣本體到電路板上。 所述第一導電端子2 —端形成可與晶片模組電性連接 的第一導接部20 ’且至少一部分第一導接部2〇呈傾斜排列 ’與絕緣本體側壁110呈45度夾角（當然，也可為其他大 小的夾角，但最好為30度到60度夾角），另一端形成抵麼 部21，且抵壓部21下端兩側設有傾斜面23，其朝向第二導 電端子3且朝外，抵壓部21向第二導電端子3延伸設有插 • 入部22，且***部U設有凹槽24。第二導電端子3 一端形 成可與外來電子元件（本實施例中為電路板，當然，也可 為㈣電子元件）電性連接的第二導接部3卜另-端形成 Hi1生抵持上述抵壓部21的彈性部32。雜部32包括兩大 致^于的彈性臂34，兩彈性臂34末端可抵持於傾斜面23， •兩祕部32末端有一相對的抵止部33，抵止部33可與凹槽 • j配° ’通過凹凸配合形成卡持固定。另，在該第二導 電々而子的第二導接部31搭接有焊料5，可將第二導電端 3焊接至電路板上。 7 M285832 -〃 f參照第八圖和第九圖所示，當安裝晶片模組4時， =一¥電端子2受力向下移動時，會利用導電端子的傾斜 面相互移動造成彈性臂34偏移，當不受力時，彈性臂娜 恢復原狀，且將第-導電端子2向上彈回，使其回到原來 的位置，這樣，就形成了可壓縮接觸的電連接器。 請參照第十圖所示，為本創作的第二實施;，結上 述實施例不同之處在於，該兩導電端子還設有偏移結構6 •、、’當兩導電端子相對㈣時，所述第-導電端子2會在水 _ 帛方向上產生偏移’使其第一導接部2〇與晶片模組4之間 產生刮擦動作，這樣，可去除其氧化膜，使二者之間形成 具有較好的電性連接之壓縮接觸。 明茶第十-圖所示，為本創作電連接器的第三實施 例二其與第一實施例不同之處在於，該第一導電端子2導 接部上形成有兩接觸點25以與晶#模㈣目電性接觸。 請芩照第十二圖所示，為本創作電連接器第四實施例 • 的示意圖，本實施例與第一實施例不同之處在於··在本實 施例中，該電連接器的上蓋體7， +是連接在絕緣本體上 ; 在。玄電連接為中另設有一金屬座體1〇，，絕緣本體1固 、 金屬座體10’中’金屬座體1〇’ 一端設有枢接上蓋體 7的樞接孔1〇1’另一端設有樞接搖桿8,的樞接部102， 其在貫施過程中也能達到上述實施例所述效果。 8 M285832 【圖式簡單說明】 第—圖是本創作電連接器的立體組合圖。 第二圖是本創作電連接器的立體示意圖。 »三圖是本創作電連接器中第—導電端子的立體圖。 第四圖是本創作電連接器中第二導電端子的立體圖。 第五圖是本創作電連接器的俯視圖。 第六圖是本創作電連接器帶上錫球的示意圖。 鲁第七圖是本創作電連接器絕緣本體的示意圖。 第八圖是本創作電連接器安裝晶片模組時的示意圖。 第九圖是本創作電連接器與晶片模組壓縮接觸前的示 意圖。 第十圖是本創作電連接器第二實施例的示意圖。 第十一圖是本創作電連接器第三實施例的剖視圖。 第十二圖是本創作電連接器第四實施例的立體圖。 M285832 【主要元件符號說明】In order to achieve the above object, an innovative design of the electrical connector enables rapid transmission of electronic components and circuit boards. The purpose is to create an electrical connector comprising an insulative body and a 5-M285832 conductive terminal. The insulative body is provided with: each of the densities::: sub-accommodating holes, characterized in that the first conductive mountain is early—the mountain conductive terminal And a second conductive terminal, • a conductive/fourth electrical connection of the first-foreign electronic component electrically connectable to the external f-sub-element: the sub-end is formed to be obliquely arranged. The material (4), and at least the part of the first guide is tilted compared with the prior art, the _ electrical connector can effectively reduce the inductance effect, and can better meet the high frequency line == household, current electronic components and Fast transfer of the board. [Embodiment] Structural Features and Other Functions The purpose of the present invention will be described in detail below with reference to the accompanying drawings: 4 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - The upper body of the insulating body is closed with the upper cover body 7 of the wafer module, and the other end of the insulating body is provided with a rocker 8 for attaching the upper cover body 7 (four) to the insulating body, and electrical connection is provided around the insulating body.连接Connected circuit board ± connection structure 9. a plurality of terminal accommodating holes 10 are provided in the insulative housing 1 , wherein each of the receiving holes 1 〇 is provided with a first-conducting f-terminal 2 and a second conductive terminal 3, and the two conductive terminals are relatively privately movable. - The conductive terminal 3 can be fixed to the receiving hole! The first conductive terminal 2 is movably connected to the second conductive terminal 3, and the first conductive terminal 2 and the second conductive terminal 3 are both stampable metal sheets, wherein the thickness of the first conductive terminal 2 is greater than The thickness of the second conductive terminal 3. • M285832 - The insulating body 1 is provided with a recessed space li for positioning the docking electronic component (the wafer module in the embodiment, and of course, other electronic components), and the receiving hole in the insulating body 1 Forming at least a first accommodating space 100 and a second accommodating space 101 having a wide side width, wherein the first accommodating space 100 can accommodate and position the first conductive terminal 2, and the second accommodating space 1 〇1 can accommodate and position the second conductive terminal 3, wherein the first receiving space 1 is provided with a first side wall 102 and a second side wall 103, and the first side wall 1〇2 is lower in height than the second side wall 103. In addition, a positioning portion is disposed at the bottom of the insulative housing i to position the insulative housing onto the circuit board. The first conductive terminal 2 ends form a first guiding portion 20 ′ electrically connectable to the die module and at least a portion of the first guiding portion 2 〇 is obliquely arranged ′ at an angle of 45 degrees to the insulating body sidewall 110 ( Of course, it may be an angle of other sizes, but preferably an angle of 30 degrees to 60 degrees. The other end is formed with the abutting portion 21, and the lower end of the pressing portion 21 is provided with an inclined surface 23 facing the second conductive terminal. 3 and facing outward, the pressing portion 21 extends to the second conductive terminal 3 with the insertion portion 22, and the insertion portion U is provided with the recess 24. One end of the second conductive terminal 3 is formed to be electrically connected to the external electronic component (the circuit board in the embodiment, and of course, the electronic component), and the other end is formed with Hi1 to resist the above. The elastic portion 32 of the pressing portion 21. The miscellaneous portion 32 includes two substantially elastic arms 34. The ends of the two elastic arms 34 can abut against the inclined surface 23, and the ends of the two secret portions 32 have opposite abutting portions 33. The abutting portion 33 can be coupled with the groove. With ° ' formed by snap fit to form a snap. Further, the second conductive portion 31 of the second conductive layer is overlapped with the solder 5, and the second conductive end 3 can be soldered to the circuit board. 7 M285832 - 〃 f Referring to the eighth and ninth diagrams, when the wafer module 4 is mounted, when the electric terminal 2 is forced to move downward, the inclined faces of the conductive terminals are moved relative to each other to cause the elastic arms 34. Offset, when unstressed, the elastic arm is restored to its original shape, and the first conductive terminal 2 is bounced back up to return to its original position, thus forming an electrical connector with compressible contact. Please refer to the tenth figure, which is the second implementation of the present invention; the difference between the above embodiments is that the two conductive terminals are further provided with an offset structure 6 •, “When the two conductive terminals are opposite (four), The first conductive terminal 2 is offset in the water _ ' direction to cause a scratching action between the first guiding portion 2 〇 and the wafer module 4, so that the oxide film can be removed, so that the two A compressive contact with a better electrical connection is formed. The third embodiment of the present invention is different from the first embodiment in that the first conductive terminal 2 is formed with two contact points 25 to Crystal #模(四) Electro-mechanical contact. Please refer to FIG. 12, which is a schematic view of a fourth embodiment of the present invention. The difference between this embodiment and the first embodiment is that in the embodiment, the upper cover of the electrical connector Body 7, + is connected to the insulative body; The sinusoidal electrical connection is provided with a metal seat body 1 〇, the insulating body 1 is solid, and the metal seat body 1 ′′ of the metal seat body 10 ′ is provided with a pivot hole 1 〇 1 ′ which is pivotally connected to the upper cover body 7 One end is provided with a pivoting portion 102 pivoting the rocker 8, which can also achieve the effects described in the above embodiments during the application. 8 M285832 [Simple description of the diagram] The first figure is a three-dimensional combination diagram of the original electrical connector. The second figure is a perspective view of the present electrical connector. »The three figures are perspective views of the first conductive terminal in the present electrical connector. The fourth figure is a perspective view of the second conductive terminal in the present electrical connector. The fifth picture is a top view of the present electrical connector. The sixth picture is a schematic view of the present electric connector with a solder ball. The seventh figure of Lu is a schematic diagram of the insulating body of the present electrical connector. The eighth figure is a schematic diagram of the present invention when the chip connector is mounted. The ninth figure is a schematic view of the prior art electrical connector before it is in compression contact with the wafer module. Figure 11 is a schematic illustration of a second embodiment of the present electrical connector. Figure 11 is a cross-sectional view showing a third embodiment of the present electrical connector. Figure 12 is a perspective view of a fourth embodiment of the present electrical connector. M285832 [Main component symbol description]
1 絕緣本體 10 容納孔 100 第一容納空間 101 第二容納空間 102 第一側壁 103 第二侧壁 10, 金屬座體 101， 極接孔 102, 柩接部 11 凹陷空間 110 侧壁 12 定位部 2 第一導電端子 20 第一導接部 21 抵壓部 22 ***部 23 傾斜面 24 凹槽 25 接觸點 3 第二導電端子 31 第二導接部 32 彈性部 33 抵止部 34 彈性臂 4 晶片核組 5 焊料 6 偏移結構 7、 7’ 上蓋體 8 搖桿 8, 才區接搖桿 9 連接結構1 Insulating body 10 accommodating hole 100 First accommodating space 101 Second accommodating space 102 First side wall 103 Second side wall 10, metal seat body 101, pole connecting hole 102, splicing portion 11 recessed space 110 side wall 12 positioning portion 2 First conductive terminal 20 first guiding portion 21 pressing portion 22 insertion portion 23 inclined surface 24 groove 25 contact point 3 second conductive terminal 31 second guiding portion 32 elastic portion 33 abutting portion 34 elastic arm 4 wafer core Group 5 solder 6 offset structure 7, 7' upper cover 8 rocker 8, only area rocker 9 connection structure