TWM285801U - Light-emitting diode package structure - Google Patents

Description

•M285801 :四、創作說明（1) .【新型所屬之技術領域】 本創作係有關一種封裝結構，尤指一種適用於複數個 發光二極體晶片之表面黏著型封裝結構。 【先前技術】 按，在發光二極體製程技術不斷改良下，使得發光二 A 極體之製造成本大幅降低，加上發光二極體可直接利用晶 _片光源與螢光材料之波長結合據以呈現既定之光色，而逐 * 漸取代聖誕燈飾、手電筒、交通標誌等原本屬於傳統燈泡 之使用領域，並且以極為快速之速度擴張二極體產業之市 場版圖；而發光二極體在作為液晶顯示器的背光源或燈具 吏用時，因同時使用大量的功率，且同一時間亦有複數個 發光二極體被點亮，在此狀況下，集體點亮的複數發光二 極體將產生較多的廢熱，其熱能雖不及鎢絲燈泡之高熱， 如不能予以有效揮散，可能造成相關電路無法正常工作或 壽命問題，由此可見，即使是以低熱能見長的發光二極體 ，其集體工作產生的廢熱仍不容忽視。 如第一圖所示即為習有發光二極體模組封裝結構，其 主要係以散熱片1 1為基材，並在其上製作具有特定線路 佈局之線路層1 2 ，並相互結合，於該線路層1 2上安裝 晶片2 1 ，並打上金線2 2或鋁線，使其分別與成對接點 21 、122連接，在經由封膠形成膠層23 ，即可令 各成對接點1 2 1 、1 2 2配合其上的晶片2 1分別構成 一發光二極體2 ，其發光二極體2係分別透過線路層1 2 上之線路相互連接，故亦可透過線路層1 2與外部的控制• M285801: IV. Creation Description (1) . [New Technology Area] This creation is about a package structure, especially a surface-adhesive package structure suitable for a plurality of light-emitting diode chips. [Prior Art] According to the continuous improvement of the light-emitting diode process technology, the manufacturing cost of the light-emitting diode A is greatly reduced, and the light-emitting diode can directly use the wavelength of the crystal-light source and the fluorescent material. In order to present the established light color, the Christmas lighting, flashlights, traffic signs, etc., which were originally used in the traditional light bulbs, were gradually replaced, and the market layout of the diode industry was expanded at an extremely fast speed; When the backlight or the lamp of the liquid crystal display is used, a large amount of power is used at the same time, and at the same time, a plurality of light-emitting diodes are lit at the same time. Under this condition, the collectively lit multiple light-emitting diodes will be produced. The waste heat, although its thermal energy is not as high as that of the tungsten filament bulb, if it cannot be effectively dissipated, it may cause the related circuit to fail to work properly or have a long life problem. It can be seen that even the light-emitting diodes, which are known for their low thermal energy, work collectively. The waste heat generated cannot be ignored. As shown in the first figure, the package structure of the light-emitting diode module is mainly based on the heat sink 1 1 , and the circuit layer 1 2 having a specific circuit layout is formed thereon and combined with each other. The wafer 2 1 is mounted on the circuit layer 12, and the gold wire 2 2 or the aluminum wire is respectively connected to the pair of contacts 21 and 122, and the glue layer 23 is formed through the sealant to make the pair of contacts. 1 2 1 and 1 2 2 are respectively combined with the wafers 2 1 to form a light-emitting diode 2, and the light-emitting diodes 2 are respectively connected to each other through a line on the circuit layer 12, so that the circuit layer 12 can also be transmitted through the circuit layer 12 External control

第5頁 M285801 、四、創作說明（2) • /驅動電路連接並受其控制。 ^ 惟，線路層之其中一種成形方式，係先在散熱片表面 形成氧化層後建立銅線路以構成線路層，遂線路層即透過 該氧化層與散熱片直接接觸；另種方式係在散熱片底面塗 佈一層導熱膠，其上層再置一高導金屬材料（如銅材），隨 ' 後利用圖案轉移、曝光顯影、蝕刻等已知的線路製作步驟 ， 在高導金屬材料上形成複數的成對接點，隨即構成一線路 •層，以上兩種成形方式之加工製程較為繁雜，容易使不良 率提高，且其線路佈局需因應晶片設置位置而有特定之線 路。 Ιι【新型内容】 有鑑於此，本創作即由簡單之結構即可構成發光二極 體與支架之連結，並可藉定置於散熱基座上達到有效散熱 之功用。 ， 本創作之封裝結構係包括有：一個用以供複數個發光 二極體定置之散熱基座、二個支架，其沿著散熱基座之邊 -側而延伸有導電區段，以及一構成散熱基座與支架連結之 膠體，使複數個發光二極體晶片利用金線與導電區段形成 連結，使各發光二極體晶片不會因支架而限制金線連接位 置，令各發光二極體晶片之位置可靈活配置。 【實施方式】 為能使 貴審查委員清楚本創作之結構組成，以及整 體運作方式，茲配合圖式說明如下： 本創作「發光二極體之封裝結構」，其基本結構組成Page 5 M285801, IV. Creation Instructions (2) • The /drive circuit is connected and controlled. ^ However, one of the circuit layers is formed by forming a copper line on the surface of the heat sink to form a circuit layer, and the circuit layer is in direct contact with the heat sink through the oxide layer; the other way is on the heat sink. The bottom surface is coated with a layer of thermal conductive glue, and the upper layer is further provided with a high-conductivity metal material (such as copper), and a plurality of conventional conductive circuit steps such as pattern transfer, exposure development, etching, etc. are formed on the high-conductive metal material. The pair of contacts form a line and layer. The processing methods of the above two forming methods are complicated, and the defect rate is easy to be improved, and the circuit layout needs to have a specific line depending on the position of the wafer. Ιι [New Content] In view of this, the creation of the present invention can form a connection between the light-emitting diode and the bracket by a simple structure, and can be placed on the heat-dissipating base to achieve effective heat dissipation. The package structure of the present invention comprises: a heat dissipation base for a plurality of light-emitting diodes, two brackets, and a conductive section extending along the side-side of the heat dissipation base, and a composition The colloid of the heat-dissipating base and the bracket is configured to connect the plurality of light-emitting diode chips with the gold wire and the conductive segments, so that the light-emitting diode chips do not limit the gold wire connection position by the bracket, so that the light-emitting diodes are The position of the body wafer can be flexibly configured. [Embodiment] In order to enable your review committee to understand the structure of the creation and the overall operation mode, the following is a description of the following: The "package structure of the light-emitting diode" of this creation, its basic structure

第6頁 ⑧ M285801 J、創作說明（3) 如第二圖及第三圖所示，係包括有： 一個散熱基座3 ，其可以為鋁基板或銅基板材質，並 個表面黏著型發光二極體4定置，各表面黏著 體4係選擇性的在其内部設置一個或者複數個 用以 型發 發光 供複數 光二極 晶片。 二個支 區段 6連 熱基 電區段5 1 一膠體 結於散 座3中 架5 ，其沿著散熱基座3之邊側而延伸有導電 如本圖實施例所示，二支架5係利用絕緣膠體 熱基座3之兩個短邊邊側，而二支架5並由散 各發光二極體4排列方向之兩側分別延伸有導 6圍 散熱 之導 體7 第四 數個 搭配 粉7 你之 ，可 圖所 繞於散 整體組 基座3 電區段 ，其封 圖所示 表面黏 不同發 1 ，以 波長結 當然， 改變發 示，其 6 ，構成散熱 熱基座3邊側 裝時，複數個 上，並打上金 5 1連接，再 裝膠體7並容 ，已構成一完 著型發光二極 光晶片，並可 由發光二極體 合，而形成特 封裝膠體7上 光二極體4之 導光材8於發 基座 ，並 表面 線4 於散 置於 整之 體4 進一 透過 定之 方亦 光線 光二 3與 形成 黏者 1或 熱基 膠體 發光 可視 步於 螢光 光色 可進 行進 極體 支架5之連結 一框體之形式 型發光二極體 鋁線，使其分 座3上覆蓋有 6所形成之框 二極體封裝結 所欲產生之光 封裝膠體7混 粉射出之光線 一步設置有一 路徑，如第五 光線行進路徑 其膠體 4定 別與 一封 體中 構， 源效 合有 即與 置於 兩側 裝膠 ，如 其複 果而 螢光 螢光 導光材8 圖及第六 形成有一Page 6 8 M285801 J. Creation Instructions (3) As shown in the second and third figures, there are included: a heat sink base 3, which can be made of aluminum or copper substrate, and has a surface-mounted light-emitting type II. The polar body 4 is fixed, and each surface adhesive body 4 selectively has one or a plurality of light-emitting diodes for forming a plurality of photodiodes. The two branch sections 6 are connected to the thermal base electric section 5 1 . The colloid is connected to the rack 3 of the loose seat 3 , and the conductive body extends along the side of the heat dissipation base 3 to be electrically conductive as shown in the embodiment of the present invention. The two short sides of the insulating colloidal thermal base 3 are used, and the two brackets 5 are respectively extended by the two sides of the light emitting diodes 4 in the direction of the arrangement of the conductors 7 and the fourth plurality of matching powders 7 You can, as shown in the figure, the entire section of the pedestal 3 electrical section, the surface of the seal shown in the seal is different from the hair 1 , with the wavelength of the course of change, the change, the 6 , the side of the heat sink 3 When installed, a plurality of upper and gold 5 1 connections, and then the colloid 7 is accommodated, which has formed a finished light-emitting diode film, and can be combined by a light-emitting diode to form a special encapsulant 7 light-emitting diode. 4, the light guide material 8 is on the base of the hair, and the surface line 4 is scattered on the whole body 4, and the light is transmitted through the square, and the light beam 2 and the heat-forming colloidal light are visible in the fluorescent light color. Form-type light-emitting diode aluminum with a body frame 5 connected to a frame The light-packing colloid 7 which is formed by the 6-piece frame diode package formed by the partition 3 is covered with a light path, such as the fifth light travel path, the colloid 4 is fixed and one In the structure of the enclosure, the source effect is combined with the glue placed on both sides, such as the complex fruit, and the fluorescent fluorescent light guide material 8 and the sixth form one

第7頁 ⑧ M285801 四、創作說明（4) _ 折射面8 1 ，該光線經由折射面8 1會形成擴散效果，以 增加光線擴散面積，而散熱基座3與導光材8之固定方式 ，可如第五圖及第六圖所示於導光材8與膠體6接觸面間 形成有凸體9 1 ，而膠體6相對應於該凸體9 1則形成有 可與其卡合之凹部9 2 ，藉由凸體9 1與凹部9 2相互卡 ‘ 合之作用，使導光材8得以組裝固定於膠體6 3上方。 _ 另外，該散熱基座3内部各表面黏著型發光二極體4 ’ 之排列方式可如第三圖所示為直線形排列，亦可如第七圖 所示為交錯示排列方式；而散熱基座3内亦可供置放高功 率單晶片發光二極體4 ’，如第八圖所示，其僅具有單顆 Hi晶片，但具有複數個接腳4 2 ’ ，同樣利用金線4 1 ’構成 各接腳4 2 ’與導電區段5 1之連接。 值得一提的是，本創作具有下列之優，點： 1 、複數個表面黏著型發光二極體利用金線與導電區 ^ 段形成連結，使各發光二極體不會因支架而限制金線連接 位置，令各發光二極體之位置可靈活配置，而具有多配置 - 性。 2 、各發光二極體係定置於由鋁基板或銅基板材質所 製成之散熱基座上，可達到有效熱之功用，具有高散熱性 〇 d|| 3 、各發光二極體可視所欲產生之光源效果而搭配不 同發光晶片，以混光成欲產生之光源效果，以具有高演色 性，並可進一步於封裝膠體混合有螢光粉，以由發光二極 體透過螢光粉射出之光線即與螢光粉之波長結合，而形成Page 7 8 M285801 IV. Creation Instructions (4) _ Refraction surface 8 1 , the light will form a diffusion effect through the refractive surface 81 to increase the light diffusion area, and the heat dissipation base 3 and the light guide 8 are fixed. A convex body 9 1 may be formed between the light guiding member 8 and the contact surface of the colloid 6 as shown in the fifth and sixth figures, and the colloid 6 corresponding to the convex body 9 1 is formed with a concave portion 9 engageable therewith. 2, the light guide member 8 is assembled and fixed on the colloid 6 3 by the action of the convex portion 9 1 and the concave portion 9 2 . _ In addition, the arrangement of the surface-adhesive light-emitting diodes 4 ′ in the heat-dissipating pedestal 3 can be arranged in a straight line as shown in the third figure, or can be arranged in an interlaced manner as shown in the seventh figure; A high-power single-chip light-emitting diode 4' can also be placed in the pedestal 3, as shown in the eighth figure, which has only a single Hi-chip, but has a plurality of pins 4 2 ', also using a gold wire 4 1 'constructs the connection of each pin 4 2 ' to the conductive section 5 1 . It is worth mentioning that this creation has the following advantages: 1. A plurality of surface-adhesive light-emitting diodes are connected by a gold wire and a conductive region, so that the light-emitting diodes are not limited by the support. The position of the wire connection makes the position of each light-emitting diode flexible, and has multiple configurations. 2. Each light-emitting diode system is placed on a heat-dissipating pedestal made of aluminum substrate or copper substrate material, which can achieve effective heat function, and has high heat dissipation 〇d|| 3 , each light-emitting diode can be visually desired The light source effect is combined with different light-emitting chips to mix light into the desired light source effect, so as to have high color rendering property, and further, the phosphor can be mixed with the package colloid to be emitted by the light-emitting diode through the fluorescent powder. Light is combined with the wavelength of the phosphor to form

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M285801 g、創作說明（5) 特定之光色。 4 、利用簡單支架及導電區段之設置，即可完成各發 光二極體有效打線區域，可縮短習有製作特定線路佈局之 線路層之工作程序，有效提高生產良率。 如上所述，本創作提供一較佳可行發光二極體之封裝 結構，爰依法提呈新型專利之申請，以上之實施說明及圖 式所示，係本創作較佳實施例者，並非以此侷限本創作， 是以，舉凡與本創作之構造、裝置、特徵等近似、雷同者 ，均應屬本創作之創設目的及申請專利範圍之内。M285801 g, creation instructions (5) specific light color. 4. With the simple bracket and the setting of the conductive section, the effective wiring area of each light-emitting diode can be completed, and the working procedure of the circuit layer which has the specific circuit layout can be shortened, and the production yield can be effectively improved. As described above, the present invention provides a package structure of a preferred and feasible light-emitting diode, and an application for a new patent is proposed according to the law. The above description and drawings show that the preferred embodiment of the present invention is not Limitation of this creation is that the similarity and similarity to the structure, installation, and features of this creation should be within the creation purpose of the creation and the scope of patent application.

第9頁 ⑧ M285801 圖式簡單說明 【圖式簡單說明】 第一圖係為習用發光二極體封裝結構之結構示意圖。 第二圖係為本創作中散熱基座與支架之結構立體圖。 第三圖係為本創作中散熱基座與支架之結構示意圖。 第四圖係為本創作中發光二極體封裝結構之結構示意圖。 第五圖係為本創作中發光二極體封裝結構之結構分解圖。 第六圖係為本創作中發光二極體封裝結構之光線照射表現 狀態圖。 第七圖係為散熱基座中各發光二極體另一實施例之排列結 構示意圖。 八圖係為本創作中散熱基座與高功率單晶片發光二極體 之結構示意圖。 :主要元件代表符號說明】 1 —散熱片 2 ——線路層 2 1 —接點 2 2 —接點 2 丨2 2 2 3 發光二極體 晶片 2 --金線 3 --膠層 散熱基座Page 9 8 M285801 Simple description of the diagram [Simple description of the diagram] The first diagram is a schematic diagram of the structure of the conventional LED package structure. The second figure is a perspective view of the structure of the heat sink base and the bracket in the present creation. The third figure is a schematic diagram of the structure of the heat dissipation base and the bracket in the creation. The fourth picture is a schematic diagram of the structure of the LED package structure in the present creation. The fifth figure is an exploded view of the structure of the LED package structure in the present creation. The sixth figure is a diagram showing the state of light illumination of the light-emitting diode package structure in this creation. The seventh figure is a schematic view showing the arrangement of another embodiment of the light-emitting diodes in the heat dissipation base. The eight figure is a schematic view of the structure of the heat sink base and the high power single chip light emitting diode in the creation. : Main component representative symbol description 1 - Heat sink 2 - Circuit layer 2 1 - Contact 2 2 - Contact 2 丨 2 2 2 3 Light-emitting diode Chip 2 - Gold wire 3 - Rubber layer Heat sink

第10頁 ⑧ M285801Page 10 8 M285801

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Claims (1)

M285801 _案號94213229 Θ★年11月Lf日 修正_ 五、申請專利範圍 1 、一種發光二極體之封裝結構，係包括有： 一個散熱基座，用以供複數個表面黏著型發光二極體 晶片定置； 二個支架，其沿著散熱基座之邊側而延伸有導電區段 一膠體，構成散熱基座與支架之連結，其膠體圍繞於 散熱基座邊側，並形成一框體之形式。 2 、一種發光二極體之封裝結構，係包括有： 一個散熱基座，用以供高功率單晶片發光二極體定置 y ® 二個支架，其沿著散熱基座之邊側而延伸有導電區段 j 一膠體，構成散熱基座與支架之連結，其膠體圍繞於 散熱基座邊側，並形成一框體之形式。 3 、如請求項1所述發光二極體之封裝結構，其中各 表面黏著型發光二極體係選擇性的在其内部設置一個或者 複數個發光晶片。 4、如請求項1或2所述發光二極體之封裝結構，其 中該整體散熱基座上可覆蓋有一封裝膠體，其封裝膠體並 容置於膠體所形成之框體中。 φ 5 、如請求項4所述發光二極體之封裝結構，其中該 封裝膠體中可混合有螢光粉。 6 、如請求項1或2所述發光二極體之封裝結構，其 中該整體散熱基座中可覆蓋有一封裝膠體，而封裝膠體上M285801 _ Case No. 94213229 Θ ★ November Lf Day Correction _ V. Application Patent Scope 1. A package structure of a light-emitting diode includes: a heat-dissipating pedestal for a plurality of surface-adhesive light-emitting diodes The body is fixed; the two brackets extend along the side of the heat dissipation base with a conductive portion-colloid, which forms a connection between the heat dissipation base and the bracket, and the colloid surrounds the side of the heat dissipation base and forms a frame. Form. 2. A package structure for a light emitting diode, comprising: a heat sink base for locating a high power single chip light emitting diode y ® two brackets extending along a side of the heat sink base The conductive section j is a colloid, which constitutes a connection between the heat dissipation base and the bracket, and the colloid surrounds the side of the heat dissipation base and forms a frame. 3. The package structure of the light-emitting diode according to claim 1, wherein each of the surface-adhesive light-emitting diode systems selectively has one or a plurality of light-emitting chips disposed therein. 4. The package structure of the light-emitting diode of claim 1 or 2, wherein the integral heat-dissipating base is covered with an encapsulant, and the encapsulant is contained in the frame formed by the colloid. Φ 5 , The package structure of the light-emitting diode according to claim 4, wherein the package colloid is mixed with phosphor powder. 6. The package structure of the light-emitting diode according to claim 1 or 2, wherein the integral heat-dissipating base is covered with an encapsulant, and the encapsulant is on the package. 第12頁 M285801 *_案號94213229 叫^年U月4日 修正_ %五、申請專利範圍 方亦可進一步設置有一導光材。 7、 如請求項6所述發光二極體之封裝結構，其中該 導光材於發光二極體光線行進路徑形成有一折射面。 8、 如請求項6所述發光二極體之封裝結構，該導光 材與膠體接觸面間形成有凸體，而膠體相對應於該凸體則 '形成有可與其卡合之凹部。 . 9 、如請求項1或2所述發光二極體之封裝結構，其 中該散熱基座可以為鋁基板材質。 1 0、如請求項1或2所述發光二極體之封裝結構， 其中該散熱基座可以為銅基板材質。Page 12 M285801 *_Case No. 94213229 Called ^Yu Uyue 4th Amendment_%5. Patent application scope There may be further set a light guide material. 7. The package structure of the light-emitting diode according to claim 6, wherein the light guide material forms a refractive surface on the light path of the light-emitting diode. 8. The package structure of the light-emitting diode according to claim 6, wherein a convex body is formed between the light guiding material and the colloidal contact surface, and the colloid corresponds to the convex body to form a concave portion engageable therewith. 9. The package structure of the light-emitting diode according to claim 1 or 2, wherein the heat dissipation base is made of an aluminum substrate material. The package structure of the light-emitting diode according to claim 1 or 2, wherein the heat dissipation base is made of a copper substrate material. 第13頁Page 13