M282241 四、創作說明（1) '【新型所屬之技術領域】 i 本創作係有關一種無風扇工業機箱，尤指以鰭片狀散 熱外殼取代系統内部之風扇裝置，以利系統散熱，且具有 可擴充性架構，得於機體内部增設如介面卡、硬碟、光碟 機者。 【先前技術】 請參閱第一和第二圖，係本案創作人先前向鈞局提 出新型專利申請之「鋁製鰭片散熱外殼之無風扇工業電 腦」（申請案號第9 3 2 2 0 7 5 8號），係包含一散熱外殼 (A )、一導熱塊（B )，及一主機板（C )，其中，該散 熱外殼（A )為鋁材料預熱後，以擠型模具製成，外表向 外延伸成複數個鰭片（A 1 )，鰭片（A 1 )的方向可以是縱 向排列，也可以是橫向排列，其目的在增加散熱外殼 (A )與外界空氣接觸的面@，散熱外殼的前後切面 (A 2 )上，設有複數個螺孔（A 3 )，可供前蓋板（D )及 後蓋板（E )以螺絲螺合固定，前蓋板（D )及後蓋板 (E )上設有開關（D 1 )及連接埠（D2 )、記憶卡抽祓區 (D3 )等，散熱外殼（A )的内部則與導熱塊（B )相接 觸，導熱塊（B )的另一端則與主機板（C )上發熱的電子 _元件相接觸，如微處理器（C 1 )及北橋晶片（C 2 )等，導 熱塊（B )的形狀可以是數個需要傳導熱量的電子元件的 形狀的結合。 當微處理器（C 1 )及北橋晶片（C 2 )等電子元件運作 後產生的熱，隨即透過導熱塊（B )將熱傳導至散熱外殼M282241 IV. Creation Instructions (1) '[New Technology Field] i This creation is about a fanless industrial case, especially a fin-shaped heat dissipation shell to replace the fan device inside the system, in order to facilitate system heat dissipation, and Expandable architecture, such as interface cards, hard disks, and optical disk drives can be added inside the machine body. [Prior art] Please refer to the first and second figures, which is the "fanless industrial computer with aluminum fin heat dissipation case" previously filed a new patent application by the creator of this case (Application No. 9 3 2 2 0 7 No. 5 8), which includes a heat dissipation shell (A), a thermally conductive block (B), and a motherboard (C), wherein the heat dissipation shell (A) is made of aluminum material and pre-heated, and is made of an extrusion mold. The appearance extends outward into a plurality of fins (A 1). The direction of the fins (A 1) can be longitudinally or horizontally. The purpose is to increase the surface of the heat dissipation casing (A) that is in contact with the outside air. A plurality of screw holes (A 3) are provided on the front and rear cut surfaces (A 2) of the heat dissipation casing, and the front cover (D) and the rear cover (E) can be screwed and fixed. The front cover (D) The rear cover (E) is provided with a switch (D1), a connection port (D2), a memory card drawing area (D3), and the like, and the inside of the heat dissipation casing (A) is in contact with the heat conduction block (B) to conduct heat The other end of the block (B) is in contact with the electronic components on the motherboard (C), such as the microprocessor (C1) and the Northbridge chip (C2). Shaped block (B) may be required in conjunction with a number of electronic components heat conduction shape. When the electronic components such as the microprocessor (C1) and the Northbridge chip (C2) operate, the heat generated by the electronic components is then conducted to the heat sink through the thermal block (B).
第5頁 M282241 四、創作說明（2) (A )，透過散熱外殼（A )外表的鰭片（A 1 )將熱散到外 部，因此内部不需要再設置風扇。 由圖中可見悉，該「鋁製鰭片散熱外殼之無風扇工業 電腦」一如習知的工業機箱，因其設計係針對單一用途， 而犧牲了擴充插槽、磁碟容置空間等非系統運作所必須之 裝置；然，今曰的市場情勢瞬息萬變，業者必須經常修改 生產線規格或生產全新的商品以迎合市場需求，若不能跟 上需求的腳步，便將失去產業競爭力，甚至黯然退出市 場。 面對生產線規格的頻繁變更，勢必要具極佳運用彈性 的工業機箱方能承擔重任，不具擴充性反而成了習知工業 機箱於應用層面的嚴重缺陷，產業界急需一種具有如桌上 型電腦般，能夠視情況加以彈性運用的工業機箱，以配合 生產線上的經常性變動。 有鑑於上述之缺失，創作人乃本著求好之精神及理 念，藉其多年從事相關研究所累積之專業知識、技術與經 驗的相互輔佐，而開發出本創作，以期提供產業界一種更 為實用之工業機箱。 【新型内容】 1 本創作的主要目的是提供一種結構簡易、散熱良好的 散熱模組。 本創作的另一目的是提供擴充插槽，增進工業用機箱 之可擴充性，藉以提升效能與操作彈性。 為達上述目的，本創作結合兩者，使電腦機殼本身即Page 5 M282241 4. Creation Instructions (2) (A), the heat is dissipated to the outside through the fins (A 1) on the outside of the heat-dissipating casing (A), so there is no need to install a fan inside. As can be seen from the figure, the "fanless industrial computer with aluminum fin cooling shell" is like a conventional industrial case. Because it is designed for a single use, it sacrifices expansion slots, disk storage space, etc. The device necessary for system operation; however, the market situation today is changing rapidly, and the industry must often modify the production line specifications or produce brand-new products to meet the market demand. If it fails to keep up with the pace of demand, it will lose its industrial competitiveness and even quit market. In the face of frequent changes in the specifications of the production line, it is necessary to have an industrial chassis with excellent flexibility to take on the heavy responsibility. Without expansion, it has become a serious drawback of the conventional industrial chassis at the application level. The industry urgently needs a computer with a desktop Generally, an industrial chassis that can be flexibly used according to the situation to match the frequent changes in the production line. In view of the above-mentioned shortcomings, the creator is based on the spirit and concept of seeking for the better, and leverages the accumulated knowledge, technology and experience accumulated in relevant research institutes for many years to develop this creation, in order to provide a more Practical industrial case. [New content] 1 The main purpose of this creation is to provide a heat dissipation module with simple structure and good heat dissipation. Another purpose of this creation is to provide expansion slots to enhance the expandability of industrial chassis, thereby improving performance and operating flexibility. To achieve the above purpose, this creation combines the two, so that the computer case itself is
第6頁 ^ M282241 四、創作說明（3) 為一散熱器，本創作無風扇可擴充式工業機箱，包含一散 .熱外殼、複數個導熱塊、一主機板、複數個蓋板，及一承 載架；其中，散熱外殼為鋁材料或其它金屬材質預熱後， 以擠型模具製成，外表向外延伸成複數個鰭片，内部則與 導熱塊相接觸，導熱塊的另一端則與主機板上發熱的電子 元件相接觸，如微處理器等。導熱塊的作用為均熱，使電 子元件所產生的熱能迅速傳導至散熱外殼，散熱外殼鰭片 部分的作用則為散熱，將熱能散至外部；該位於主機板上 之插槽係作為承載架組設之用，並藉由獨特承載架具有的 擴充插槽與多點多軸向之裝設彈性，可用以裝置額外的介 面卡、硬碟機、光碟機等設備，且該承載架亦可為配置多 數個擴充插槽的型式，以裝設更多的設備。 為使 鈞局審查委員能確實瞭解本創作欲達前述目 的，而所需具備特殊構造及其操作技術手段，茲舉一實施 例詳細說明如后，謹請參閱’。 【實施方式】 請參閱第三圖及第四圖，本創作係無風扇可擴充式工 業機箱，包含散熱外殼（1 )、主機板（2 )、導熱塊 (3 )、承載架（4 )、前蓋板（5 )、後蓋板（6 )，及底 @蓋板（7 );其中，該散熱外殼（1 )為鋁材料或其它金屬 材質預熱後，以擠型模具製成，外表向外延伸成複數個鰭 片（1 1 )，鰭片（11 )的方向可以是縱向排列，也可以是 橫向排列，其目的在增加散熱外殼（1 )與外界空氣接觸 的面積，散熱外殼的前後切面（1 2 )上，設有複數個螺孔Page 6 ^ M282241 IV. Creation Instructions (3) is a radiator. This creation is a fanless and expandable industrial chassis, including a diffuser. Thermal enclosure, multiple thermally conductive blocks, a motherboard, multiple covers, and a Carrying frame; where the heat-dissipating shell is made of aluminum or other metal material after preheating, it is made of extrusion die, the outer surface extends into a plurality of fins, the inner part is in contact with the heat conduction block, and the other end of the heat conduction block is in contact with Electronic components such as microprocessors are in contact with the motherboard. The function of the heat conduction block is to equalize the heat, so that the thermal energy generated by the electronic components is quickly transferred to the heat dissipation shell, and the fin part of the heat dissipation shell is to dissipate the heat energy to the outside; the slot on the motherboard is used as a carrier It can be used for assembly, and with the unique expansion slot of the unique carrier and multi-point and multi-axis installation flexibility, it can be used to install additional interface cards, hard drives, optical drives and other equipment, and the carrier can also To configure more types of expansion slots to install more equipment. In order to make sure that the jury members of the Bureau can truly understand the purpose of this creation, and that they need to have special structures and technical means of operation, a detailed description of an embodiment is given below. [Embodiment] Please refer to the third and fourth figures. This creative system is a fanless and expandable industrial chassis, which includes a heat dissipation casing (1), a motherboard (2), a thermal block (3), a carrier (4), The front cover (5), the rear cover (6), and the bottom @ cover (7); among them, the heat dissipating shell (1) is made of aluminum or other metal materials after preheating, and is made of extrusion molds, with an appearance Extending outward into a plurality of fins (1 1), the direction of the fins (11) can be longitudinally arranged or horizontally arranged, the purpose of which is to increase the area of the heat dissipation shell (1) in contact with the outside air. A plurality of screw holes are provided on the front and rear cut surfaces (1 2)
M282241 四、創作說明（4) ( 1 3 )，可供前蓋板（5 )及後蓋板（6 )以螺絲螺合固 •定； 再參閱第五及第六圖，其中，前蓋板（5)上設有開 關（5 1 )、記憶卡抽拔區（5 2 )及連接埠（5 3 )，後蓋板 (6 )則設有連接埠（6 1 )及一矩形開口 （ 6 2 )，以便增 設之介面卡上的連接埠，可穿過該矩形開口 （ 6 2 )凸露於 機箱外部，方便操作者接駁纜線； 該主機板（2 )上裝置有一插槽（2 3 )與數種電子元 件，其中包含運作時會發熱者，如微處理器（2 1 )及北橋 $晶片（2 2 )等，導熱塊（3 )的一端即與主機板（2 )上發 熱的電子元件相接觸，導熱塊（3 )的橫切面形狀可以視 需要傳導熱量的電子元件的形狀，作相對應之改變；當微 處理器（2 1 )及北橋晶片（2 2 )等電子元件運作後產生的 熱，隨即透過導熱塊（3 )、將熱傳導至散熱外殼（1 )，透 過散熱外殼（1 )的鰭片狀外表將熱散到外部，因此内部 不需設置風扇；該位於主機板（2 )上之插槽（2 3 )係作 為承載架（4)組設之用，並藉由承載架（4)所具有的擴 充插槽（41 )及多數個裝設點（4 2 )，增設如介面卡、硬 碟機、光碟機等設備，且該承載架（4 )亦可為配置多數 個擴充插槽（41 )的型式，以裝設更多的設備，提供工業 機箱進行擴充的可能性； 該底蓋板（7 )藉由螺孔（7 1 )螺合於散熱外殼（1 ) 的下方，使整個工業機箱呈現密閉狀態，以防止水分、污 物侵入，維護機箱内部組件之正常運作；M282241 4. Creation instructions (4) (1 3), which can be used to fix and fix the front cover (5) and the rear cover (6); see also the fifth and sixth figures, where the front cover (5) A switch (5 1), a memory card extraction area (5 2), and a connection port (5 3) are provided, and a rear cover (6) is provided with a connection port (6 1) and a rectangular opening (6) 2), so that the additional port on the interface card can pass through the rectangular opening (62) to be exposed on the outside of the chassis, so that the operator can connect the cables; the motherboard (2) has a slot (2) 3) and several kinds of electronic components, including those that will generate heat during operation, such as the microprocessor (2 1) and the North Bridge $ chip (2 2), etc., one end of the heat conduction block (3) is heated on the motherboard (2) The electronic components are in contact with each other, and the shape of the cross section of the heat conducting block (3) can be changed according to the shape of the electronic component that conducts heat. When the electronic components such as the microprocessor (2 1) and the Northbridge chip (2 2) are changed accordingly. The heat generated after the operation passes through the thermal block (3), and then conducts the heat to the heat dissipation casing (1). The fin-shaped appearance of the heat dissipation casing (1) will then Fan to the outside, so there is no need to set a fan inside; the slot (2 3) on the motherboard (2) is used to set up the carrier (4), and the expansion of the carrier (4) The slot (41) and a plurality of installation points (42) are added with equipment such as an interface card, a hard disk drive, an optical disk drive, and the carrier (4) can also be configured with a plurality of expansion slots (41). Type to install more equipment and provide the possibility of expansion of the industrial chassis; the bottom cover (7) is screwed under the heat dissipation casing (1) through screw holes (7 1) to make the entire industrial chassis present Closed state to prevent moisture and dirt from entering and maintain the normal operation of the internal components of the case;
第8頁 M282241 四、創作說明（5) 綜上所述，本創作已具備了新型專利之實用性、新穎 •性及進步性要件，爰依法具文提出申請。惟以上所述者， 僅為本創作之較佳實施例而已，當不能以之限定本創作實 施之範圍，即大凡依本創作申請專利範圍所作之均等變化 與修飾，皆應仍屬本創作專利涵蓋之範圍内。Page 8 M282241 IV. Creation Instructions (5) In summary, this creation has already possessed the practicability, novelty, and progressiveness of a new type of patent. However, the above are only the preferred embodiments of this creation. When the scope of implementation of this creation cannot be limited, that is, all equal changes and modifications made in accordance with the scope of the patent application for this creation shall still belong to this creation patent. Covered.
第9頁 M282241 圖式簡單說明 【圖式簡單說明】 第一圖 係習式工業機箱之立體分解圖 第二圖 係習式工業機箱之使用狀態示意圖 第三圖 係本創作之立體分解圖 第四圖 係本創作之主機板立體圖 第五圖 係本創作之使用狀態示意圖（一） 第六圖 係本創作之使用狀態示意圖（二） 【主要元件符號說明】 (A )散熱外殼 ，（A 1 )鰭片 （A 2 )切面 （A 3 )螺孔 (B )導熱塊 (C )主機板 （C 1 )微處理器 （C2 )北橋晶片 (D )前蓋板 (D 1 )開關 （D2 )缚接埠 （D3 )記憶卡抽拔區 (E )後蓋板 (1 )散熱外殼 (11 )籍片 (12 ) 切 (2 ) 主機板 (21 )微處理器 (22 ) 北 (3 ) 導熱塊 (4 ) 承載架 (41 ) 擴 (5 ) 前蓋板 (51 )開關 (52 ) 記 面 （1 3 )螺孔 橋晶片 （2 3 )插槽 充插槽 （4 2 )裝設點 憶卡抽拔區 （5 3 )連接埠Page 9 M282241 Simple illustration of the drawings [Simplified illustration of the drawings] The first picture is an exploded perspective view of a conventional industrial case. The second picture is a schematic view of the use state of a conventional industrial case. The third picture is the three-dimensional exploded view of this creation. The drawing is a perspective view of the main board of this creation. The fifth drawing is a schematic view of the use of this creation (1). The sixth drawing is a schematic view of the use of this creation. Fin (A 2), cut plane (A 3), screw hole (B), thermal block (C), main board (C 1), microprocessor (C2), north bridge chip (D), front cover (D 1), switch (D2), Port (D3) Memory card extraction area (E) Rear cover (1) Heat-dissipating housing (11) Sheet (12) Cut (2) Motherboard (21) Microprocessor (22) North (3) Thermal block (4) Carrier (41) Expansion (5) Front cover (51) Switch (52) Surface (1 3) Screw hole bridge chip (2 3) Slot filling slot (4 2) Installs a point memory card Extraction area (5 3) port
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