M280096 八、新型說明： 【新型所屬之技術領域】 本創作係關於一種能多方向調整風扇位置之散熱裝置，兮壯 ^ 衣置上设有一散 熱體，該散熱體上設有一架體，該架體上安裝有一個可調整至不同位置 之風扇，以能使風扇之出風口靠近會產生高溫之電子部件，俾可八電俨主機又 部需要散熱之電子元件，可迅速地散熱，俾提供電助部之組件可在穩定之产 境中作業。 、疋之％ • 【先前技術】 按，現今之晶片處理器因運算速度相當迅速，因此，當該晶片處理器在全 負載之執行狀態下，其表面之溫賴相當高，其溫度甚至可高達攝氏95度以上。 故，-般晶片處理器上均接設有散熱風扇或冷卻器（cooler)，俾藉由該散熱風 扇或該冷卻器將該晶片處理器所產生之熱能驅散，以避免因晶片處理器過熱而" 造成系統不穩定，甚至發生當機之情況。 該散熱風扇之散熱方式係藉由扇葉轉動產生氣流之流動現象，令氣流之冷 擎空氣吸收該晶片處理器所產生之熱能以達降溫之目的，另，該冷卻器則係扣二 在晶片處理器之表面，俾藉由其易散熱之村料，及其上所突設之複數片葉片， 以擴大該晶片處理器之散熱面積，有效降低該晶片處理器之表面溫度。 惟’不論習知技術係藉由前述之該散熱風扇及該冷卻器輔助該晶片處理器 降低其表面之溫度，上述之散熱方式在散熱降溫之效率上，仍並不理想，其主 要原因係： 風扇皆係關定方式固絲冷卻紅，如此，並無法隨著溫度或熱源之所 在而改變其位置，更會產生死角，此外，在靠近晶片處理器之電子部件也會因 M280096 無任何政熱裝置，而有過熱之情形產生。 【新型内容】 有鑑於前述習知散«置之缺失，創作人骑究出本創作之能多方向調整 風扇位置讀«置，婦由本_可令f齡彻之溫度，尤其是晶片處理 器及靠近；處麵各電子部件可保持在更加低溫穩定之作業環境。 i乍之目的係提供—種能多方向調整風扇位置之散熱裝置，該裝置 上設有-散熱體，該散麵_作微晶片處麵議，且該麟體上設有一 使用時，可藉由枢接件之調整，使風扇位於不同之角度及位置，而將熱源所產 生之熱可迅速排除’降低晶片處理器或其它電子組件，因過熱而造成系統不释 定，並可有效地將溫度降低，俾系統可處_當之工作環境中而不致有發生當 機之情況。 $ 本創作之再-目的，係提供—種能多方向風扇位置之散録置，其散 熱體上設有一開槽，該開槽中怜可交 μ了合置—風扇，使散熱體之溫度可迅速降低。 【實施方式】 請參閱第1、2、3圖所示，本創作係一種能多方向調整風扇位置之散執裂 置，《置找有-散熱體1G，該散熱體iQ係作為晶片處理器散熱用，且該散 二1〇:又有底座11 ’於本實施例為一框體’該底座11上設有複數個排列 整齊之散熱則12 ’該等散熱㈣12以水平方向互婦靠在_起，射 u上設有-個以上貫穿該等散熱鰭片12之導熱管13，於本實施例為—^丄型 之中空管體’且該導熱管13遠離底座1卜端並凸露在散熱鰭片13上。 再者，該等散熱鰭片12中設有—貫穿其中之開槽14，該開槽14中可容置 M280096 有風扇20(如第4及5圖所示），且該等散熱韓片12上設有—架體i5，該架體 15上設有-***之拱板151，該拱板151與架體15保持一定空間，而令風扇2〇 及導熱管13可凸露其巾，且雌板151至少—側設有—樞接件152，於本實施 例為在拱板151兩側分別設有一萬向軸承，該樞接件152上樞設有一懸置在散 熱體1〇外之風扇30，該風扇30上設有與樞接件152相對應之軸桿&，以令該 Η扇30可藉由軸才干31與樞接件152嵌套，而樞接在架體15上，該等風扇M280096 8. Description of the new type: [Technical field to which the new type belongs] This creation is about a cooling device that can adjust the position of the fan in multiple directions. The clothes are equipped with a heat sink, and a heat sink is provided on the heat sink. A fan that can be adjusted to different positions is installed on the body so that the fan's air outlet can be close to the electronic components that generate high temperature. The electric power can be quickly dissipated by the main unit and the electronic components that need heat dissipation. The components of the assistant department can be operated in a stable production environment. % Of 疋 • [Previous technology] According to the current, the chip processor is very fast due to its high computing speed. Therefore, when the chip processor is under full load, the surface temperature is quite high, and its temperature can even reach as high as Above 95 degrees Celsius. Therefore, a cooling fan or cooler is connected to the general chip processor, and the heat generated by the chip processor is dissipated by the cooling fan or the cooler, so as to avoid overheating of the chip processor. " Causes system instability or even crashes. The cooling method of the cooling fan is to generate the flow of airflow by rotating the blades, so that the cold engine air of the airflow absorbs the thermal energy generated by the chip processor to reduce the temperature. In addition, the cooler is buckled on the chip. On the surface of the processor, the heat dissipation area of the chip processor is enlarged by its easily dissipative materials and a plurality of blades protruding thereon, which effectively reduces the surface temperature of the chip processor. However, 'whether the conventional technology uses the aforementioned cooling fan and the cooler to assist the chip processor to reduce the surface temperature, the above-mentioned cooling methods are still not ideal in terms of the efficiency of cooling and cooling. The main reasons are: The fans are all fixed-wire cooling red. In this way, the position cannot be changed with the temperature or the heat source, and there will be dead angles. In addition, the electronic components near the chip processor will also have no political heat because of M280096. Device and overheating occurs. [New content] In view of the foregoing lack of knowledge, the creator can find out how to adjust the fan's position in various directions. This can be used to make the temperature of F, especially the chip processor and Close; all electronic parts can be kept in a more low temperature and stable working environment. The purpose of iZhu is to provide a heat dissipation device that can adjust the position of the fan in multiple directions. The device is provided with a heat sink. The scattered surface is negotiable at the microchip. By the adjustment of the pivots, the fans are located at different angles and positions, and the heat generated by the heat source can be quickly eliminated. 'Lower the chip processor or other electronic components, the system is indeterminate due to overheating, and can effectively The temperature is reduced, and the system can be used in the current working environment without crashing. $ The re-purpose of this creation is to provide—a kind of multi-directional fan position. The heat sink is provided with a slot, and the slot can be placed together—the fan, so that the temperature of the heat sink Can be lowered quickly. [Embodiment] Please refer to Figs. 1, 2, and 3, this creation is a kind of discrete splitting that can adjust the position of the fan in multiple directions. "Looking for-heat sink 1G, this heat sink iQ is used as a chip processor For heat dissipation, and the second two 10: there is a base 11 'in this embodiment is a frame' The base 11 is provided with a plurality of neatly arranged heat dissipation rules 12 'The heat sinks 12 lean against each other in a horizontal direction From the above, there is more than one heat conducting tube 13 penetrating through the heat dissipation fins 12 in this embodiment. In this embodiment, the heat conducting tube 13 is a ^ 丄 type hollow tube body, and the heat conducting tube 13 is far from the base 1 and is convex. Exposed on the heat radiation fins 13. Furthermore, the heat sink fins 12 are provided with a slot 14 therethrough, and the slot 14 can accommodate a M280096 fan 20 (as shown in Figures 4 and 5), and the heat sink fins 12 A-frame body i5 is provided on the frame body 15-a raised arch plate 151 is provided on the frame body 15 to maintain a certain space with the frame body 15 so that the fan 20 and the heat pipe 13 can expose their towels, and At least one side of the female plate 151 is provided with a pivoting member 152. In this embodiment, a universal joint bearing is provided on both sides of the arch plate 151, and the pivoting member 152 is pivotally provided with a suspension outside the heat sink 10. The fan 30 is provided with a shaft & corresponding to the pivot member 152, so that the fan 30 can be nested with the pivot member 152 through the shaft talent 31 and pivotally connected to the frame 15 On the fan
及30可為排風風扇或抽風風扇，又，該架體15上設有一個以上之鎖孔153，以 令該架體15可藉娜_中未示）f過鎖孔153，而鎖合細_ 12上。 月"’、、第1 2 3 4、5圖所示’先將風扇3〇樞接在架體上，而使風 扇30懸置在架體15外’使風扇3〇可藉由軸桿&在樞接件152中轉動，而調 整至不同之角度及位置上，再將底座n安置在晶聽理㈣上，並調整該等 風扇30可分別靠近主機内部不同之熱源處（如晶片處理器、介面卡5〇等等）， 而將該等熱源所產生之熱可迅速嫌，降低晶片處理器或其它電子組件，因過 熱而造成綠不歡，並可械地將溫度降低，⑽、統可處於適當之工作環境 中而不致有發生當機之情況。 以上所述，僅係本創作之較佳實施例，惟，本創作所主張之權利範圍，並 不侷限於此’按凡熟悉該項技藝人士，依據本創作所揭露之技術内容，可輕易 思及之等效變化，均應屬不脫離本創作之保護範疇。 【圖式簡單說明】 第1圖乃本創作一實施例之立體示意圖。 第2圖乃本創作一實施例實施時之立體示意圖。 第3圖乃本創作一實施例實施時之側視示意圖。 M280096 第4圖乃本創作另一實施例之立體分解圖。 第5圖乃本創作另一實施例之立體示意圖。 【主要元件符號說明】 散熱體 10 底座 11 散熱鰭片 12 導熱管 13 開槽 14 架體 15 拱板 151 極接件 152 鎖孔 153 風扇 20、30 軸桿 31 晶片處理器 40And 30 may be an exhaust fan or an exhaust fan, and the frame 15 is provided with more than one keyhole 153, so that the frame 15 can pass through the keyhole 153 and lock. Fine_ 12 on. Month " ',, 1 2 3 4, 5 shows' the fan 30 is first pivoted to the frame, and the fan 30 is suspended outside the frame 15' so that the fan 30 can be passed through the shaft & Rotate in the pivot member 152, and adjust to different angles and positions, and then place the base n on the crystal hearing pad, and adjust these fans 30 to be close to different heat sources (such as wafers) inside the host, respectively. Processor, interface card 50, etc.), and the heat generated by these heat sources can be quickly detected, which can reduce the chip processor or other electronic components, which can cause discomfort due to overheating, and can lower the temperature mechanically. 2. The system can be in a proper working environment without crashing. The above is only a preferred embodiment of this creation. However, the scope of the rights claimed in this creation is not limited to this. According to the technical content disclosed by this creation, those who are familiar with the art can easily think about it. And the equivalent changes should belong to the protection scope of this creation. [Schematic description] Figure 1 is a three-dimensional schematic diagram of an embodiment of the present invention. FIG. 2 is a schematic perspective view of an embodiment of the present invention when it is implemented. FIG. 3 is a schematic side view of an embodiment of the present invention. M280096 Figure 4 is an exploded perspective view of another embodiment of this creation. FIG. 5 is a schematic three-dimensional view of another embodiment of the present invention. [Description of main component symbols] Heat sink 10 Base 11 Heat sink fins 12 Heat pipe 13 Slotted 14 Frame 15 Arch plate 151 Pole connector 152 Keyhole 153 Fan 20, 30 Shaft 31 Chip processor 40