TWM279914U - Liquid-cooling computer structure - Google Patents

Liquid-cooling computer structure Download PDF

Info

Publication number
TWM279914U
TWM279914U TW94210447U TW94210447U TWM279914U TW M279914 U TWM279914 U TW M279914U TW 94210447 U TW94210447 U TW 94210447U TW 94210447 U TW94210447 U TW 94210447U TW M279914 U TWM279914 U TW M279914U
Authority
TW
Taiwan
Prior art keywords
liquid
cooled
computer
air inlet
radiator
Prior art date
Application number
TW94210447U
Other languages
Chinese (zh)
Inventor
Rung-Feng Huang
Jr-Jian Huang
Original Assignee
Forward Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Forward Electronics Co Ltd filed Critical Forward Electronics Co Ltd
Priority to TW94210447U priority Critical patent/TWM279914U/en
Priority to JP2005242543A priority patent/JP2007004765A/en
Publication of TWM279914U publication Critical patent/TWM279914U/en

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

M279914 八、新型說明: 【新型所屬之技術領域】 本創作係關於一種電腦結構,尤指— 冷式散熱系統之電腦結構。 i用於具有液 【先前技術】 10 15 請參閱圖1係一習知液冷式電腦内部 圖中顯示有—f知液冷式散熱系統4,液冷式散教=圖。 含散熱風扇4 5,液冷式散熱系統4主要功用為散逸^統4 ^ 處理器運作時產生之高熱。 -¾¾中央 然而,習知散熱風扇45裝設的位置沒有特定方向口 是將熱風吹散至電腦機殼内部空間,無法有效地將液冷= =熱线3自中央處理器所吸收的熱能,以有效方式排:電 腦機殼之外’而僅在機殼之内產生内部奮流,散熱】 不理想。 【新型内容】 本創作是有關一種液冷式電腦之結構,包含電腦外 殼、電源供應器、以及液冷式散熱系統。電腦外殼包含上 20 盖、以及底殼’電腦外殼側面並貫設有一出風口,電源供 應為與液冷式散熱系統皆裝設於電腦外殼的内部空間裡。 電源供應器亦具有一殼體、及一散熱風扇。電源供應 ^的殼體包含前板、後板、以及側板。在前板上開設的前 入風口’可連通到電腦外殼的内部空間,在後板開設的後 M279914 • 排風口則是對應連通到電腦外殼側面的出風口,而在侧板 亦開設有至少一個側入風口。電源供應器的散熱風扇是組 設在殼體之内,且對應到前板上的前入風口。 液冷式散熱系統,包含儲液箱、泵浦、集熱器、散熱 5器、複數支連通管、循環管路、以及散熱風扇。儲液箱、 泵’財木熱為、散熱裔依序由複數支連通管串接形成循寶 笞路。集熱為是貼附組設在中央處理器上方,以收集中央 處理器運作時產生之高熱。散熱器含有散熱鰭片模組,散 f 熱器内側組設在電源供應器側板外,且對應至開設於電源 i、應时侧板上的至少一個側入風口,而散熱器外側則組設 有散熱風扇。 ^ ^如此一來,當液冷式散熱系統的散熱風扇旋轉而吹出 氣机得以先流經散熱器以帶走熱能,再經由電源供應器 =板上的至少一個側入風口而進入電源供應器殼體内部; 、隱而又到電源供應器的散熱風扇旋轉所產生的氣流吹動, 而一併經由電源供應器後板的後排風口、與電腦外殼側面 的出風口散逸至電腦外殼外部。 旦因此,本創作不但能夠增加流入電源供應器内之氣流 針對私源供應器散逸更多熱能之外;更可在電腦外殼 Μ的^部空間裡形成有效風場,以引導各種電子元件所發出 之阿熱,能順利流進電源供應器並一起排出電腦外殼之外。 ,/、中本創作之循環管路内所流通之液體是為水、酒 精、或其他流體。 M279914 一此外,本創作之集熱器亦可貼附組設在其他發熱電子 元件上,例如顯不卡晶片、以及繪圖晶片等。 【實施方式】 明先併麥閱圖2係本創作一較佳具體實施例之俯視 圖以及圖3係本創作一較佳具體實施例之局部分解圖。圖 中顯示有本實施例之電腦外殼丨、電源供應器2、以及液冷 式散熱系統3。 本例之電腦外殼1是由一上蓋丨丨蓋合於底殼12上所組 10成,而底殼12之側方具有一側面121。電腦外殼1的内部形 成一内部空間10,並在側面121上貫設有出風口 122。 黾源供應器2組設在内部空間1 〇之内,並包含殼體21、 以及政熱風扇22。设體21更包含前板211、側板212、以及 後板213。说板211上開設有前入風口 214,前入風口 214可 15 連通到電腦外殼1之内部空間10。側板212上開設有複數個 側入風口 215 ;而後板213上開設有後排風口 216,後排風口 216可對應連通到出風口 122。散熱風扇22則組設在殼體21 之内,並對應到前入風口 214。 請再同時參閱圖4係本創作一較佳具體實施例之冷卻 20 迴路圖。 圖中顯示有一液冷式散熱系統3,其包含儲液箱3 1、泵 潘3 2、集熱器3 3、散熱器3 4、複數支連通管3 〇、以及散熱 風扇3 5。複數支連通管3 0依序將儲液箱3 1、泵浦3 2、集熱 器33、以及散熱器34串接形成一循環管路。集熱器33是貼 M279914 • 附組设在中央處理器(Central Processing Unit,CPU)上方, 以收集中央處理器運作時產生之高熱。散熱器34具有散熱 鰭片模組,並包含外側341、以及内側342。散熱風扇35是 組在外側341上,而内側342並結合組設在側板212外,且對 5 應到複數個側入風口 215。 故當散熱風扇35旋轉而吹出氣流,能先流經散熱器34 以帶走熱能,再通過複數個側入風口 215而進入殼體21内 部,繼而受到散熱風扇22之旋轉氣流吹動,而一起經由後 排風口 216、以及出風口 122散逸到電腦外殼1的外部。 〇 如此一來,不但能夠增加流入電源供應器2内之氣流 里針對電源供應器2散逸更多熱能之外;更可在電腦外殼 1的内部空間1〇裡形成有效風場,以引導各種電子元件所發 咼…、此順利/瓜進電源供應器2並一起排出電腦外殼工 之外。 5 上述實施例僅係為了方便說明而舉例而已,本創作所 主張之權利範圍自應以申請專利範圍所述為準,僅限 於上述實施例。 【圖式簡單說明】 2〇圖1係-習知液冷式電腦内部結構之俯視圖。 圖2係本創作一較佳具體實施例之俯視圖。 圖3係本創作-較佳具體實施例之局部分解圖。 圖4係本創作一較佳具體實施例之冷卻迴路圖。 M279914 【主要元件符號說明】 電腦外殼1 内部空間10 i蓋11 底殼12 侧面121 出風口 122 電源供應器2 殼體21 前板211 側板212 後板213 前入風口 214 側入風口 21 5 後排風口 216 散熱風扇22 液冷式散熱系統3 連通管30 儲液箱3 1 泵浦32 外側341 /夜冷式散熱系統4 集熱器33 内側342 散熱風扇45 散熱器3 4 散熱風扇35M279914 VIII. Description of the new type: [Technical field to which the new type belongs] This creation is about a computer structure, especially a computer structure of a cooling system. i is used to have a liquid [prior art] 10 15 Please refer to Figure 1 for the interior of a conventional liquid-cooled computer. The figure shows -f known liquid-cooled heat dissipation system 4, liquid-cooled diffuse education = figure. Including cooling fan 45, the main function of the liquid-cooled cooling system 4 is to dissipate the high heat generated by the processor during operation. -¾¾Central However, there is no specific direction for the location where the cooling fan 45 is installed. It is used to blow hot air to the internal space of the computer case, and it cannot effectively cool the liquid. = = Heatline 3 The heat energy absorbed from the CPU. Arrange in an effective way: 'outside the computer case' and generate internal flow, heat dissipation only inside the case] Not ideal. [New Content] This creation is about the structure of a liquid-cooled computer, which includes a computer case, a power supply, and a liquid-cooled cooling system. The computer case includes an upper cover and a bottom case. The side of the computer case is provided with an air outlet. The power supply and liquid cooling system are installed in the internal space of the computer case. The power supply also has a casing and a cooling fan. The power supply housing includes a front plate, a rear plate, and a side plate. The front air inlet 'opened on the front panel can be connected to the internal space of the computer case, and the rear M279914 opened on the rear panel is the air outlet corresponding to the side of the computer case, and at least one is also opened on the side panel. Side inlet. The cooling fan of the power supply is assembled in the housing and corresponds to the front air inlet on the front panel. The liquid-cooled heat dissipation system includes a liquid storage tank, a pump, a heat collector, a heat sink, a plurality of branch communication pipes, a circulation pipeline, and a heat dissipation fan. The liquid storage tank, the pump ’s heat and heat, and the heat sink are connected in series by a plurality of communication pipes to form the Xunbao Kuo Road. The heat collection is a set attached above the central processing unit to collect the high heat generated during the operation of the central processing unit. The heat sink contains a heat sink fin module. The inside of the heat sink is arranged outside the power supply side plate, and corresponds to at least one side air inlet provided on the power supply i, the side plate, and the outside of the heat sink is arranged. There are cooling fans. ^ ^ In this way, when the cooling fan of the liquid-cooled cooling system rotates, the blower can first flow through the radiator to take away the heat, and then enter the power supply through the power supply = at least one side air inlet on the board. Inside the housing; The airflow generated by the rotation of the cooling fan that is hidden but also to the power supply is dissipated to the outside of the computer case through the rear air outlet of the rear panel of the power supply and the air outlet on the side of the computer case. Therefore, this creation can not only increase the airflow flowing into the power supply, but also dissipate more heat energy from the private supply; it can also form an effective wind field in the space of the computer casing M to guide the various electronic components. A heat can smoothly flow into the power supply and drain out of the computer case together. 、 / 、 The liquid circulating in the circulation pipeline created by Nakamoto is water, alcohol, or other fluids. M279914 In addition, the collector of this creation can also be attached to other heat-generating electronic components, such as display chip and graphics chip. [Embodiment] Figure 2 is a top view of a preferred embodiment of the present invention and Figure 3 is a partial exploded view of the preferred embodiment of the present invention. The figure shows the computer case 丨, the power supply 2, and the liquid-cooled heat dissipation system 3 of this embodiment. The computer case 1 of this example is composed of a top cover 丨 which is assembled on the bottom case 12, and the side of the bottom case 12 has a side surface 121. An internal space 10 is formed inside the computer case 1, and an air outlet 122 is continuously provided on the side surface 121. The 黾 source supplier 2 is set in the internal space 10 and includes a housing 21 and a political heat fan 22. The body 21 further includes a front plate 211, a side plate 212, and a rear plate 213. The front panel 211 is provided with a front air inlet 214, and the front air inlet 214 can communicate with the internal space 10 of the computer case 1. The side plate 212 is provided with a plurality of side air inlets 215; and the rear plate 213 is provided with a rear air outlet 216, and the rear air outlet 216 may be connected to the air outlet 122 correspondingly. The cooling fan 22 is arranged in the casing 21 and corresponds to the front air inlet 214. Please refer to FIG. 4 at the same time, which is a circuit diagram of the cooling 20 of a preferred embodiment of the present invention. The figure shows a liquid-cooled heat dissipation system 3, which includes a liquid storage tank 3 1, a pump pan 3 2, a collector 3 3, a radiator 3 4, a plurality of branch communication pipes 3 0, and a cooling fan 35. The plurality of branch communication pipes 30 sequentially connect the storage tank 31, the pump 3, the collector 33, and the radiator 34 in series to form a circulation pipeline. The collector 33 is attached M279914 • The attached unit is set above the Central Processing Unit (CPU) to collect the high heat generated during the operation of the central processor. The heat sink 34 includes a heat dissipation fin module, and includes an outer side 341 and an inner side 342. The cooling fan 35 is grouped on the outer side 341, and the inner side 342 is combined with the group outside the side plate 212, and corresponds to a plurality of side air inlets 215. Therefore, when the cooling fan 35 rotates and blows out airflow, it can first flow through the radiator 34 to take away the heat energy, and then enter the inside of the casing 21 through the plurality of side air inlets 215, and then is blown by the rotating airflow of the cooling fan 22, and together Dissipated to the outside of the computer case 1 through the rear exhaust vent 216 and the air outlet 122. 〇In this way, not only can increase the airflow flowing into the power supply 2 to dissipate more heat energy for the power supply 2; it can also form an effective wind field in the internal space 10 of the computer casing 1 to guide various electronics The components sent out ..., this goes well into the power supply 2 and is discharged out of the computer case. 5 The above embodiments are just examples for the convenience of explanation. The scope of the rights claimed in this creation shall be based on the scope of the patent application, which is limited to the above embodiments. [Brief description of the drawings] Figure 20 is a top view of the internal structure of a conventional liquid-cooled computer. FIG. 2 is a top view of a preferred embodiment of the present invention. FIG. 3 is a partial exploded view of the present invention-the preferred embodiment. FIG. 4 is a cooling circuit diagram of a preferred embodiment of the present invention. M279914 [Description of main component symbols] Computer case 1 Internal space 10 i-cover 11 Bottom case 12 Side 121 Air outlet 122 Power supply 2 Housing 21 Front plate 211 Side plate 212 Rear plate 213 Front air inlet 214 Side air inlet 21 5 Rear row Air outlet 216 Cooling fan 22 Liquid-cooled cooling system 3 Connecting pipe 30 Storage tank 3 1 Pump 32 Outside 341 / Night cooling system 4 Heat collector 33 Inside 342 Cooling fan 45 Cooling fan 3 4 Cooling fan 35

Claims (1)

M279914 九、申請專利範圍: 1 ·—種液冷式電腦結構,包括: 一電腦外殼,包括有一内部空間、一侧面、及一出風 口其係貫設於該側面上;M279914 9. Scope of patent application: 1. A kind of liquid-cooled computer structure, including: a computer casing, which includes an internal space, a side, and an air outlet which are arranged on the side; 10 1510 15 一電源供應器,組設於該電腦外殼之該内部空間内, A笔源供應杰並包括有一殼體、及一散熱風扇,該殼體並 包括有一前板、一側板、及一後板,該前板開設有一前入 風口其係連通至該電腦外殼之該内部空間,該側板開設有 至少一個側入風口,該後板開設有一後排風口其係對應連 通至^電腦外殼之該出風口,該散熱風扇係組設於該殼體 内並對應至該前板之該前入風口;以及 液冷式散熱系統,包括有一散熱器、及一散熱風扇 其係組設於該散熱器之外側,該散熱器之内側並組設於該 電源供應器之該側板外、並對應至該至少一個側入風口。 2·如申請專利範圍第丨項所述之液冷式電腦結構,其 中攻液冷式散熱系統之該散熱器包括有一散熱鰭片模組。 3·如申睛專利範圍第丨項所述之液冷式電腦結構,其 中。:該液冷式散熱系統並包括有一儲液箱、一泵浦、一集 ^器、及複數支連通管,該料通管係依序將該儲液箱、 «浦、該集熱器、及該散熱器串接形成_循環管路。 ^ 士申叫專利範圍第3項所述之液冷式電腦結構,其 中,該集熱器係貼附組設於一中央處理器上方。 20A power supply unit is arranged in the internal space of the computer case. A pen source supply includes a case and a cooling fan. The case includes a front plate, a side plate, and a rear plate. The front panel is provided with a front air inlet, which is connected to the internal space of the computer case, the side panel is provided with at least one side air inlet, and the rear panel is provided with a rear air outlet, which is corresponding to the air outlet connected to the computer case. The cooling fan is arranged in the casing and corresponds to the front air inlet of the front plate; and the liquid-cooled cooling system includes a radiator and a cooling fan which is arranged outside the radiator The inner side of the radiator is arranged outside the side plate of the power supply and corresponds to the at least one side air inlet. 2. The liquid-cooled computer structure described in item 丨 of the patent application scope, wherein the heat sink of the liquid-cooled heat dissipation system includes a heat sink fin module. 3. The liquid-cooled computer structure as described in item 丨 of Shenjing's patent scope, among them. : The liquid-cooled heat dissipation system includes a liquid storage tank, a pump, a collector, and a plurality of branch pipes. The material flow pipe sequentially connects the liquid storage tank, the pump, the collector, And the radiator is connected in series to form a _ circulation pipeline. ^ Shishen called the liquid-cooled computer structure described in item 3 of the patent scope, in which the collector is attached above a central processing unit. 20
TW94210447U 2005-06-21 2005-06-21 Liquid-cooling computer structure TWM279914U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW94210447U TWM279914U (en) 2005-06-21 2005-06-21 Liquid-cooling computer structure
JP2005242543A JP2007004765A (en) 2005-06-21 2005-08-24 Liquid-cooled computer device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94210447U TWM279914U (en) 2005-06-21 2005-06-21 Liquid-cooling computer structure

Publications (1)

Publication Number Publication Date
TWM279914U true TWM279914U (en) 2005-11-01

Family

ID=37022299

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94210447U TWM279914U (en) 2005-06-21 2005-06-21 Liquid-cooling computer structure

Country Status (2)

Country Link
JP (1) JP2007004765A (en)
TW (1) TWM279914U (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004042034A1 (en) * 2004-08-26 2006-03-16 Laing, Oliver An electrical device power supply device and method for providing electrical power to components of an electrical device
CN108803845B (en) * 2018-06-15 2023-01-17 康惠 Water-cooled computer radiator convenient to installation
CN113099651B (en) * 2021-03-26 2022-08-05 马丹 Server cabinet based on big data
CN114895753B (en) * 2022-03-31 2023-11-03 淮南联合大学 Multifunctional computer case and application method thereof

Also Published As

Publication number Publication date
JP2007004765A (en) 2007-01-11

Similar Documents

Publication Publication Date Title
US7626815B2 (en) Drive bay heat exchanger
TW200421073A (en) System and method for cooling an electronic device
US20070175610A1 (en) Heat dissipating device
JP2006207881A (en) Cooling device and electronic apparatus comprising the same
TW201251591A (en) Computer case
JP2009128947A (en) Electronic apparatus
JP2010216482A (en) Centrifugal fan, heat dissipation device having the centrifugal fan, and electronic device using the heat dissipation device
TWM309846U (en) Heat dissipation device
JP2009169752A (en) Electronic equipment
TW200821807A (en) A system for cooling a heat-generating electronic device with increased air flow
JP2007234957A (en) Heat sink with centrifugal fan
US20090014160A1 (en) Heat dissipation module
JP2011061201A (en) Radiator module
US20050094371A1 (en) Electronic device and heat-dissipating module thereof
TWM279914U (en) Liquid-cooling computer structure
TW200406663A (en) Computer main body cooling system
TWM259219U (en) Heat dissipation structure of computer host interior
JP5061068B2 (en) Electronics
JPH06318124A (en) Electronic device
TWM309314U (en) Heat-dissipating mechanical housing
TW201538063A (en) Electronic device and cooling fan thereof
TWI777653B (en) Water cooling device and electronic device
CN102270026B (en) There is the multi-fan heat abstractor of separate airflow passage
JPH118485A (en) Cooling structure of electronic equipment
JP4897107B2 (en) Electronics

Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees