TWM278213U - Heat dissipation device - Google Patents

Description

M278213 P623 亞毅-001.doc 九、新型說明： 【新型所屬之技術領域】 本案為-種散減置’尤如於發熱電子元件，藉以增加散 4效果之散熱裝置。 【先前技術】 散缝置在電驗使_當叙，尤其賴，其㈣的中央 處理器CPU都必須加-触裝置，且有風扇加在該散熱聚置上， 以增加散熱效果。如果散歸㈣效果不佳，⑽可能會過孰，與 嚮麵的運作速度，情況糟一點可能會導致CPU燒掉。因此〜 一個好的散熱裝置，對—些講求效能的電器（例如電腦）而言， 乃為一不可獲缺的元件。 第-圖為制的散熱裝置示意圖。該散熱裝置之上面U 2接-風扇，下面12 _來與發熱電子邮（例如⑽ 扇運轉時’可·散鱗置賴量糾餅部。這 7 為在實，⑽漱時: 由：二::：:’但是這種散熱裝置的熱量卻是 接，熱量最多，風扇所:戶出。:為中間她 散熱―2==。亦即，這種 第二圖為習用另—散鮮立 衣置不意圖。這種散熱裝置係由複數 5 M278213 . P623 ¢15-0()1.doc 個散熱葉片22、幾根熱管21(Heat Pipe)與底座23組成。這種散 熱裝置的設計，製作並不容易’因為熱管21必須從每片散熱葉片 22中間穿過去，製作成本高；而且所需體積較大，較佔空間，散 熱不平均。 【新型内容】 鲁本f的目的係針對制技術缺失，提出—新穎的散熱裝置， 可達均勻散熱、散熱面積增加、散熱效果提昇、整體體積縮小及 使風扇達成最大的散熱的目的。 為達上述目的，本案提出一種散熱裝置，包含：一散熱體； 至少-熱管(Heat Pipe)，係貼附在該散熱體之表面上，藉以將熱 迅速平均導引至該散熱體，以達散熱之效果。 如所述之散熱裝置，其中熱裝置更包含—底座，藉以與 • 一發熱之電子元件連接。 μ 如所述之散熱裝置，其中該散熱體係用以連接一風扇。 如所述之散熱裝置，其中該^^體係為—圓域熱體，該圓 才主政熱體係由複數散熱片組成。 如所述之散熱裝置，其中該熱管係以焊接的方式，整根貼附 在該散熱體之表面。 【貫施方式】 第三圖為本錄佳實施例之散練置示意圖。本案之散熱襄 6 M278213 ， h p623 亞毅_〇()i _d〇c 置包含了散熱體3卜熱管32及底座33。底座33以可與一發熱電 子凡件(未繪出)連接，熱管32_來將電子元件的熱量導至散熱 體。散熱體31可為圓柱狀也可其他各種形狀，其由複數個散熱葉 片組成。Φ於電子元件的熱量係由底座沿著熱管㈣，再傳至散 熱體的散熱^上’因此在越體上的分佈細外部往内分 佈，較為均勻，且容易被風扇的風帶出，使散熱的效果大為增加。 糾，這樣的設計更可在最傾射，創如最多的散熱面曰積， 散熱面積愈大’則散熱效果也就跟著提昇。另外，第四圖為本案 較佳實施例之散熱裝置分解示意圖。 木 綜上所述’本案為—新穎、進步及伽的設計，可以達到均 勾散熱、散熱面積增加、整龍積縮小、散熱效果提昇及使風扇 ，成最大的散熱功效。如其在外觀的變更設計，例如熱管的數量、 散1 體的樣式等_改變，只要是以鮮_在散熱體外圍表面 的没計方式皆為本案所欲保護者。 本案所揭露之技術，得_f本技術人士據以實施，而並前 所未有之作法亦諸專抛，纽法提料利之申請。惟上述之 實施例尚从獅蓋本案所絲密之專職圍，耻 專利範圍如附。 甲5月 M278213 口623 亞毅-001.如。 【圖式簡單說明】 第一圖為習用的散熱裝置示意圖。 第二圖為習用另一散熱裝置示意圖。 第三圖為本案較佳實施例之散熱裝置示意圖。 第四圖為本案較佳實施例之散熱裝置分解示意圖。 【主要元件符號說明】 上面.....11 下面.....12 熱管.....21 散熱葉片· · · 22 底座.....23 散熱體· · · · 31 熱管.....32 底座.....33M278213 P623 Yayi-001.doc IX. Description of the new model: [Technical field to which the new model belongs] This case is a kind of heat dissipation device that is especially suitable for heating electronic components to increase the heat dissipation effect. [Previous technology] The loose stitches are placed in the electric tester _ Dangxu, especially, the CPU of its sloppy central processing unit must be added with a touch device, and a fan is added to the heat sink to increase the heat dissipation effect. If the dispersion effect is not good, it may be too high, and the speed of the operation may be worse, which may cause the CPU to burn out. Therefore, a good heat sink is an indispensable component for some performance-critical appliances (such as computers). The first figure is a schematic diagram of the heat dissipation device. The upper part of the heat dissipation device is U 2 connected to the fan, and the lower part 12 _ comes with the heating e-mail (for example, when the fan is running, the 'can · scattered scales can be placed on the cake correction section. This 7 is true, when you rinse: by: two :::: 'But the heat of this cooling device is connected, the heat is the most, the fan is: the household .: She dissipates heat in the middle ― 2 ==. That is, this second picture is a conventional one-San Xianli The clothing is not intended. This heat sink is composed of a plurality of 5 M278213. P623 ¢ 15-0 () 1.doc heat sink blades 22, several heat pipes 21 (Heat Pipe) and the base 23. The design of this heat sink, It's not easy to make 'because the heat pipe 21 must pass through the middle of each radiating blade 22, the production cost is high; and the required volume is large, it takes up space, and the heat dissipation is uneven. [New content] The purpose of Ruben f is to produce The technology is lacking, and it is proposed that a novel heat sink can achieve uniform heat dissipation, increased heat dissipation area, improved heat dissipation effect, overall volume reduction, and maximum fan heat dissipation. To achieve the above purpose, this case proposes a heat sink, including: Heat sink; at least-heat pipe (Heat Pi pe), is attached to the surface of the heat sink, so as to quickly and evenly guide the heat to the heat sink, so as to achieve the effect of heat dissipation. As described in the heat sink, the heat apparatus further includes a base, so as to • A heat-generating electronic component is connected. Μ The heat-dissipating device as described above, wherein the heat-dissipating system is used to connect a fan. The system is composed of a plurality of heat sinks. As described in the heat dissipation device, the heat pipe is adhered to the surface of the heat sink in a welding manner. [Performance Method] The third figure is a fragment of the best embodiment of the present record. Schematic diagram of the training. The heat sink 6 M278213, h p623 Yayi_〇 () i _d〇c in this case contains a heat sink 3 heat pipe 32 and a base 33. The base 33 can be connected with a heating electronic component (not shown) ) Connection, the heat pipe 32_ to guide the heat of the electronic components to the heat sink. The heat sink 31 can be cylindrical or other various shapes, and is composed of a plurality of heat dissipation blades. Φ The heat of the electronic components is formed by the base along the heat pipe. ㈣, and then transmitted to the heat sink ^ 上 'Therefore, the distribution on the outer body is thin and distributed inward and outward, it is relatively uniform, and it is easy to be taken out by the wind of the fan, which greatly increases the heat dissipation effect. This design can be more inclined at the most inclined, such as The largest heat dissipation surface is accumulated, and the larger the heat dissipation area, the better the heat dissipation effect. In addition, the fourth figure is a schematic diagram of the heat dissipation device of the preferred embodiment of the present invention. Gamma's design can achieve uniform heat dissipation, increased heat dissipation area, reduced overall product, improved heat dissipation effect, and maximized cooling effect of the fan. Such as the design change in appearance, such as the number of heat pipes, the style of the body, etc. _Change, as long as it is fresh _ the countless ways on the outer surface of the heat sink are all those who want to protect this case. The technology disclosed in this case can be implemented on the basis of this technical person, and the previous unprecedented methods are also dedicated to the application of Newfat's benefits. However, the above-mentioned embodiment is still based on the full-time professional skills in the case of Shigai. The scope of the patent is attached. A May M278213 mouth 623 Yayi-001. Such as. [Schematic description] The first diagram is a schematic diagram of a conventional heat sink. The second figure is a schematic diagram of another conventional heat sink. The third figure is a schematic diagram of a heat dissipation device according to a preferred embodiment of the present invention. The fourth figure is an exploded view of the heat dissipation device of the preferred embodiment of the present invention. [Description of main component symbols] Upper ..... 11 Below ..... 12 Heat pipes ..... 21 Radiating blades ... 22 Bases ... 23 Heat sinks ... 31 Heat pipes ... ... 32 Base ... 33

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Claims (1)

M278213 卩623亞毅-001.廿〇。 十、申請專利範圍： 1. 一種散熱裝置，包含： 一散熱體； 至少-熱管（Heat Pipe) ’係_錢散熱體之表面上，藉以將熱 導引至該散熱體，以達散熱之效果。 2_如申請專利範圍第彳項所述之散熱裝置，其中該散熱裝置更包 含一底座，藉以與一發熱之電子元件連接。 ^如申請專利範圍第1項所述之散熱裝置，其中該散熱體係用以 連接一風扇。 个如:請專概圍第彳項所述之散絲置，其中該健體係為一 圓柱政熱，，該圓柱散熱體係由複數散熱片組成。 申月專利槐圍第]項所述之散熱襄置，其中該熱管係以焊接 在該散熱體之表面。 9M278213 卩 623 Yayi-001. 廿 〇. X. Scope of patent application: 1. A heat sink including: a heat sink; at least-Heat Pipe on the surface of the heat sink to direct heat to the heat sink to achieve the effect of heat dissipation . 2_ The heat dissipating device according to item 彳 of the scope of patent application, wherein the heat dissipating device further comprises a base for connecting with a heat-generating electronic component. ^ The heat dissipation device described in item 1 of the scope of patent application, wherein the heat dissipation system is used to connect a fan. For example, please outline the loose wire described in item 彳, where the health system is a cylindrical heat, and the cylindrical heat dissipation system is composed of a plurality of heat sinks. The heat dissipation device according to item [Shenyue Patent Huaiwei], wherein the heat pipe is welded to the surface of the heat sink. 9