TWM274764U

TWM274764U - Heat dissipation device with thermoelectric cooling module

Info

Publication number: TWM274764U
Application number: TW94205037U
Authority: TW
Inventors: Chun-Wei Pan
Original assignee: Channel Well Technology Co Ltd
Priority date: 2005-03-31
Filing date: 2005-03-31
Publication date: 2005-09-01

Description

M274764 八、新型說明：【新型所屬之技術領域】本創作是有關於一種散熱裝置，且特別是有關於一種適用於電子儀器設備之具有冷熱交換功能之散熱裝置。【先前技術】M274764 8. Description of the new type: [Technical field to which the new type belongs] This creation relates to a heat sink, and in particular to a heat sink with a cold and heat exchange function suitable for electronic instruments and equipment. [Prior art]

隨著資訊科技的高度發展，例如積體電路之製程的改進，以及對積體電路功能規格的要求日益升高，現今積體電路的設計已是十分的精緻與複雜。肇因於複雜的電路設汁所引發之龐大電能的消耗，而這些消耗的電能將會造成晶片溫度的上升。以積體電路為基礎的相關元件在電腦的應用上相當重要，現今電腦機殼設計為了成本及空間節省考量，内部難以預留足夠之自然對流之空間，因此使得電腦上元件，例如中央處理器及週邊裝置控制晶片之溫度上升更形嚴重，造成整個系統内部產生溫度過高的問題。當熱量聚集在機殼内部而無法即時散掉時，將造成電子元件無法正常工作，甚至使整個電腦系統當機。傳統之電腦散熱器，在處理高功率之中央處理器時， -般而言’可採用直接安裝於中央處理器上之散㈣，直風扇直接吹向中央處理器上方的散熱鰭片，將熱量排出電二部目：了有效的將中央處理器所產生的熱量排出電腦採用以熱管與編片的方式料中央處理盜之…里’再由風扇的氣流將熱量移除的運作速度提高，其—熱量越來越高，散2= M274764 的體積也就越來越大，以提高移除熱量的能力。而在將中央處理器上之熱移除後，熱交b換後之氣流仍在機殼㈣，因此必須再進行系統内部之散熱，通常是裝设-散熱風扇於機殼上’例如利用電源供應器上之風扇裝置，藉此將内部溫度較高流體排出至環境。i収散= 式能達到的效果與環境溫度相關，亦即其所能獲致平衡之溫度最多與室溫相當，同時經由氣體對流之散熱方式效率往往不佳，因此需要—種散熱裝置，解決f知之散熱風扇為主的散熱系統所遭遇散熱效率有限之問題。【新型内容】因此本創作之-目的，就是在提供一種具有冷熱交換功月b之散熱裝置，用以有效達成電子設備或儀器之散熱。五本創作的另一目的，是在提供一種具有冷熱交換功能之散熱裝置’用以改善傳統之風扇散熱系統之散熱效果，使散熱效果不受限於環境溫度。 ^本創作的再一目的，是提供一種具有冷熱交換功能之政熱裝置’不單利用傳統氣體對財式來散熱，使得散熱效率更好。據本創作之上述目的，提出一種具有冷熱交換功能之政熱裝置。散熱裝置主要包含一殼體、一第一導流裝置、致冷曰曰片與一第二導流裝置。殼體包含一第一空間，具有第進氣口與一冷氣出口，以及一第二空間，具有一第二進氣口與一熱氣出口。第導流裝置位於第一進氣口旁，用以導引一熱源流 ⑧ 6 M274764 體自第一進氣口進入殼體。致冷晶片位於該殼體内，具有冷側與熱側，冷側與第一空間耦合，用以冷卻熱源流體，熱側與第二空間耦合。第二導流裝置位於第二進氣口旁，用以導引外部環境流體自第二進氣口進入殼體，進行一熱父換，熱源流體經冷卻後自冷氣出口流出殼體，外部 % i兄流體經熱交換後自熱氣出口流出殼體。致冷晶片之冷側與熱側更可分別連接第一散熱片與第二散熱片，以加強流體之熱交換效果。由上述可知，應用本創作之具有冷熱交換功能之散熱裝置，因為導流裝置將流體強制性地送往致冷晶片冷側與熱側，分別促進了熱源流體與外部環境流體的熱交換，不僅充分發揮致冷效果，也兼顧致冷晶片之熱側，即放熱一側之熱排除，構成一相對於習知以風扇為主之散熱系統，有較佳散熱效果之冷熱交換系統。本創作不僅對各式電子儀器設備、裝置提供一良好之政熱方式’尤其在技術進步快速的電腦產業中，更解決了政熱此一影響技術發展之重要問題。【實施方式】參照第1A至1C圖。第ΙΑ、1B圖係分別繪示依照本創作之具有冷熱交換功能之散熱裝置一較佳實施例的前視圖與後視圖。第1C圖係繪示第1A圖之側剖面圖。具有冷熱交換功能之散熱裝置主要包含一殼體1〇〇、一第一導流裝置110a、一致冷晶片120與一第二導流裝置u〇b。殼體100包含一第一空間l〇〇a，具有一第一進氣口 ⑧ M274764 l〇2a與一冷氣出口 1〇4，以及一第二空間l〇〇b，具有一第二進氣口 102b與一熱氣出口 106。第一導流裝置u〇a位於笫進氡口 i〇2a旁，用以導引一熱源流體自第一進氣口 l〇2a進入殼體1〇〇，熱源流體經冷卻後自冷氣出口流出殼體，外部環境流體經熱交換後自熱氣出口流出殼體。致冷晶片120位於該殼體1〇〇内，具有一冷侧12〇a與一熱側120b，冷側120a與第一空間l〇〇a耦合，用以冷卻熱源流體，熱側120b與第二空間l〇0b耦合。第二導流裝置110b位於第二進氣口丨〇2b旁，用以導引外部環境流體自第二進氣口 102b進入殼體100，進行一熱交換。本創作所稱之冷侧係指致冷晶片上吸熱之一侧，熱侧係指放熱之一側0 於一較佳實施例中，致冷晶片120與導流裝置11〇a、 ii〇b位於一殼體100内。殼體100分隔出第一空間1〇如與第二空間l〇〇b，第一空間l〇〇a具有一第一進氣口 1〇2a 與一冷氣出口 104,第二空間具有一第二進氣口 1〇孔與一熱氣出口 106，其中第一進氣口 102a位於冷氣出口 1〇4之上方’第二進氣口 l〇2b位於熱氣出口 1〇6上方。致冷晶片120之冷側220a耦合連接一第一散熱片 122，例如為一金屬散熱片，或較佳為一鋁質散熱片，第一散熱片122受冷側220a冷卻，並與熱源流體進行熱交換。第一導流裝置ll〇a設置於第一進氣口 i02a旁，包含一第一風扇112a，係連接於一馬達1丨4,第一風扇112a係吹向殼體100内。一導熱體124具有一第一側124a與一第二側i24b，第 8 ⑧ M274764 側124a耦合於致冷晶片12〇之熱側12〇b，第二側12朴 ’、第一政熱片126耦合，導熱體124用以把熱侧120b之熱傳導至該第二散熱片126，其中第二散熱片126位於熱氣出口 106旁。較佳地，第二側124b面積大於第一側12如，以加快傳熱速度。導熱體124例如為一金屬導熱體，或較佳為一鋁質導熱體。第一導流裝置110b使用一第二風扇112b，在馬達114 與第一風扇112a相接之另一側，馬達114同時連接第二風扇112b，共用馬達114節省了額外的驅動裝置需求。第二風扇112b係設置於第二進氣口 1〇2b旁，並吹向殼體1〇〇内，用以導引外部環境之流體進入殼體100,與第二散熱片 126進行熱交換。當本創作之具有冷熱交換功能之散熱裝置使用於一電腦系統時，第一進氣口 102&係朝向電腦系統之機殼内部，而第二進氣口 102b係朝向外部環境。首先，馬達114同時驅動第-風扇112a與第二風扇U2b，來自機殼内之一熱流體受第一風扇112a之吸取，經由第一進氣口 1〇2a進入殼體100内。提供一電壓使致冷晶片120運作。冷側12〇a因為是一吸熱端，因此第一散熱片122受到冷卻，溫度下降。而熱源流體流經第-散熱片122時將進行熱交換，因此當此熱源流體自冷氣出口 104流出殼體100至機殼内時，為一低 /m之流體，此低溫之流體流入機殼内部再進一步進行熱交換’達到冷卻電腦系統内部之效果。而致冷晶片120之熱側120b因為是一放熱端，經由導 ⑧ 9 M274764With the rapid development of information technology, such as the improvement of the integrated circuit manufacturing process and the increasing requirements for the functional specifications of integrated circuits, the design of integrated circuits is now very sophisticated and complex. It is caused by the huge power consumption caused by the complicated circuit design, and these consumed power will cause the temperature of the chip to rise. Relevant components based on integrated circuits are very important in the application of computers. At present, in the design of computer cases, in order to save cost and space, it is difficult to reserve enough natural convection space inside. Therefore, components on computers such as central processing units The temperature rise of the control chip and peripheral devices is even more serious, causing the problem of excessive temperature inside the entire system. When the heat is accumulated inside the case and cannot be dissipated immediately, the electronic components will not work properly, and even the entire computer system will be down. Traditional computer radiators, when dealing with high-powered central processing units,-in general, can use the fan directly installed on the central processing unit, the direct fan blows directly to the heat sink fins above the central processing unit, to dissipate heat The second part of discharging electricity: the heat generated by the central processor is effectively discharged to the computer. The central processing is stolen by means of heat pipes and editing. The operation speed of the heat removal by the fan's airflow is increased. —The heat is getting higher and higher, and the volume of Scatter 2 = M274764 is getting larger and larger to improve the ability to remove heat. After the heat on the CPU is removed, the airflow after the heat transfer is still in the chassis, so it is necessary to perform heat dissipation inside the system. Usually, a cooling fan is installed on the chassis. For example, using a power supply The fan unit on the supply unit is used to discharge the fluid with higher internal temperature to the environment. The effect of the i dispersion = formula is related to the ambient temperature, that is, the temperature at which it can achieve equilibrium is at most equivalent to room temperature. At the same time, the heat dissipation method by gas convection is often inefficient, so a kind of heat dissipation device is needed to solve f Known cooling fan-based cooling systems suffer from limited cooling efficiency. [New content] Therefore, the purpose of this creation is to provide a heat dissipation device with cold and heat exchange function b, which can effectively achieve the heat dissipation of electronic equipment or instruments. Another purpose of the five books is to provide a heat-dissipating device with a cold-heat exchange function to improve the heat-dissipating effect of the traditional fan cooling system, so that the heat-dissipating effect is not limited to the ambient temperature. ^ Another purpose of this creation is to provide a government-heated device with a cold-heat exchange function. It not only uses traditional gas to dissipate heat, which makes the heat dissipation more efficient. According to the above purpose of this creation, a political heating device with a cold and heat exchange function is proposed. The heat dissipating device mainly includes a housing, a first flow guiding device, a cooling chip and a second flow guiding device. The housing includes a first space having a first air inlet and a cold air outlet, and a second space having a second air inlet and a hot air outlet. The second deflector is located next to the first air inlet, and is used to guide a heat source ⑧ 6 M274764 body from the first air inlet into the housing. The refrigerating chip is located in the casing and has a cold side and a hot side, the cold side is coupled with the first space for cooling the heat source fluid, and the hot side is coupled with the second space. The second diversion device is located next to the second air inlet, and is used to guide the external ambient fluid from the second air inlet into the casing for a heat exchange. After cooling, the heat source fluid flows out of the casing from the cold air outlet. The fluid flows out of the casing from the hot gas outlet after heat exchange. The cold side and the hot side of the cooling chip can be connected to the first heat sink and the second heat sink, respectively, to enhance the heat exchange effect of the fluid. From the above, it can be known that the heat dissipation device with cold and heat exchange function applied in this creation, because the flow guiding device forcibly sends the fluid to the cold side and the hot side of the cooling chip, which promotes the heat exchange between the heat source fluid and the external environment fluid, Give full play to the cooling effect, and also take into account the heat removal of the hot side of the cooling chip, that is, the heat dissipation side, to form a cold and heat exchange system that has a better heat dissipation effect than the conventional fan-based heat dissipation system. This creation not only provides a good political hot way for all kinds of electronic instruments and devices', especially in the computer industry with rapid technological progress, but also solves the important problem of political hot that affects the development of technology. [Embodiment] Refer to FIGS. 1A to 1C. Figures IA and 1B are respectively a front view and a rear view of a preferred embodiment of a heat sink with a cold and heat exchange function according to the present invention. Figure 1C is a side sectional view of Figure 1A. The heat dissipating device having a cold and heat exchange function mainly includes a housing 100, a first diversion device 110a, a uniform cold wafer 120, and a second diversion device uOb. The housing 100 includes a first space 100a, having a first air inlet ⑧ M274764 l02a and a cold air outlet 104, and a second space 100b, having a second air inlet 102b and a hot gas outlet 106. The first diversion device u〇a is located next to the inlet port i〇2a, and is used to guide a heat source fluid from the first air inlet port 102a into the housing 100, and the heat source fluid flows out of the cold air outlet after cooling. Shell, the external ambient fluid flows out of the shell from the hot gas outlet after heat exchange. The cooling chip 120 is located in the housing 100, and has a cold side 120a and a hot side 120b, and the cold side 120a and the first space 100a are coupled to cool the heat source fluid. The hot side 120b and the first side The two spaces 100b are coupled. The second diversion device 110b is located beside the second air inlet port 02b, and is used to guide the external ambient fluid from the second air inlet port 102b into the housing 100 for a heat exchange. The cold side referred to in this creation refers to one side that absorbs heat on the refrigerated wafer, and the hot side refers to one side that emits heat. In a preferred embodiment, the refrigerated wafer 120 and the diversion device 11a, ii〇b Located in a casing 100. The housing 100 separates the first space 10 and the second space 100b. The first space 100a has a first air inlet 102a and a cold air outlet 104, and the second space has a second The air inlet 10 hole and a hot air outlet 106, wherein the first air inlet 102a is located above the cold air outlet 104 and the second air inlet 102b is located above the hot air outlet 106. The cold side 220a of the refrigerating chip 120 is coupled to a first heat sink 122, such as a metal heat sink, or preferably an aluminum heat sink. The first heat sink 122 is cooled by the cold side 220a, and carries out heat transfer with the heat source fluid. Heat exchange. The first diversion device 110a is disposed beside the first air inlet i02a, and includes a first fan 112a connected to a motor 1-4, and the first fan 112a is blown into the casing 100. A heat conductor 124 has a first side 124a and a second side i24b. The 8th M274764 side 124a is coupled to the hot side 12b of the cooling chip 120, the second side 12b ', and the first political heat plate 126. Coupling, the heat conducting body 124 is used to conduct the heat of the hot side 120 b to the second heat sink 126, wherein the second heat sink 126 is located beside the hot air outlet 106. Preferably, the area of the second side 124b is larger than that of the first side 12b, so as to accelerate the heat transfer rate. The thermal conductor 124 is, for example, a metal thermal conductor, or preferably an aluminum thermal conductor. The first deflector 110b uses a second fan 112b. On the other side where the motor 114 is connected to the first fan 112a, the motor 114 is connected to the second fan 112b at the same time. The shared motor 114 saves additional drive requirements. The second fan 112b is disposed beside the second air inlet 102b and blows into the housing 100 to guide the fluid from the external environment into the housing 100 and exchange heat with the second heat sink 126. When the heat-dissipating device with cold and heat exchange function used in this creation is used in a computer system, the first air inlet 102 & faces the inside of the casing of the computer system, and the second air inlet 102b faces the external environment. First, the motor 114 drives the first fan 112a and the second fan U2b at the same time. A heat fluid from the casing is sucked by the first fan 112a and enters the casing 100 through the first air inlet 102a. A voltage is provided to operate the cooling chip 120. Because the cold side 12a is a heat-absorbing end, the first heat sink 122 is cooled and the temperature is lowered. The heat source fluid will exchange heat when passing through the first heat sink 122. Therefore, when the heat source fluid flows out of the casing 100 from the cold air outlet 104 into the casing, it is a low / m fluid, and the low temperature fluid flows into the casing Further internal heat exchange is performed to achieve the effect of cooling the computer system. The hot side 120b of the refrigerating chip 120 is a heat releasing end, and is guided by the guide tube 9 M274764.

第二風扇112b抽取外部環境流體二散熱片126,同時，藉由 ’自第二進氣口 102b流 ^，將第二第二進氣The second fan 112b draws the external ambient fluid, the second heat sink 126, and at the same time, ′ flows from the second air inlet 102b, and the second air

100 外。 i〇6排出殼體藉由上述之冷側i20a負責電腦系統内部流體而熱側120b亦藉由第二導流裝置u〇b % 部流體之冷卻，以及第二散熱片126 之散熱機制，將熱量適時排放至外部環境，如此構成一具有冷熱交換功能及致冷效果之冷熱交換系統。〃100 outside. The i06 discharge case is responsible for the internal fluid of the computer system through the cold side i20a described above, while the hot side 120b is also cooled by the second fluid guide device u0b% of the fluid, and the heat dissipation mechanism of the second heat sink 126. The heat is timely discharged to the external environment, thus forming a cold and heat exchange system with a cold and heat exchange function and a cooling effect. 〃

放置隔熱物質14G’例如填充隔熱泡綿於其間，提供一隔熱Place a heat-insulating material 14G ’, such as filling a thermal insulation foam therebetween, to provide a thermal insulation

具有冷熱交換功能之散熱裝置更包含一電路控制板 170 ’具有不同功能之輸出指示燈丨7〇a至丨7〇c。第一指示燈170a為一預備指示燈，表示散熱裝置處於運作前之準備狀態（stand by)，第二指示燈170b表示裝置處於運作狀態，第三指示燈17〇c為一過熱警示燈，當裝置排熱端異常，無法正常散熱或散熱不及時，第三指示燈17(^發出訊號。開關160用以控制散熱裝置之啟動。參考第4圖，其繪示依照本創作之具有冷熱交換功能之散熱裝置一較佳實施例的溫度控制系統之示意圖。於本實施例中，更可於電腦系統内裝設一溫度感測器，例如致冷晶片之冷側附近，且電性連接一調整器，用以監控系統内部之環境溫度，將監控訊號傳送至調整器。調整器電性 M274764 連接於直流電壓轉換器，其中直流電壓轉換器係與致冷晶片電性連接，用以控制致冷晶片之一輸入電壓，例如將i2v 直流輸入電壓轉換成3V至12V，並將轉換後之電壓輸送至致冷晶片，可調整致冷晶片之功率效能。藉由加入溫度感測器、調整器，構成一溫度控制系統。調整器根據溫度感測器傳回之監控訊號，傳送一調整訊號至直流電壓轉換器，進行致冷晶片電壓之調控，進而達到控制冷卻溫度之目的，例如將系統内外溫差控制於約5至8 度内，避免當系統内部溫度驟然降低，使系統内外溫差過尚可能遭遇露點產生之問題，造成元件損害。參考第3圖，其繪示依照本創作之具有冷熱交換功能之散熱裝置一較佳實施例中的導流罩示意圖。於上述較佳實施例中，更包含一導流罩3〇〇，主要包含一伸縮部3〇2 與一固定部304。固定部3〇4耦合固定於散熱裝置之第一進氣口之外側，例如以螺絲鎖附或黏貼方式。利用此導流罩 300之可延伸特性，將伸縮部3〇2拉到所欲加強排熱之位置，集中地吸取熱源流體。導流罩3〇〇亦可裝設於冷氣出口之外側，用以導引經冷卻之流體較為集中地流至欲冷卻之位置。參考第2A至2D圖。第2A至2C圖係繪示依照本創作之具有冷熱父換功能之散熱裝置另一較佳實施例的前視圖、上視圖與側視圖。第2D圖係繪示第2A圖之剖面圖。在本創作之另一實施例中，第一風扇與第二風扇使用軸流式風扇。一致冷日日片220與導流裝置21〇a、21 裝設於一殼體The heat-dissipating device having the cold and heat exchange function further includes a circuit control board 170 ′, which has output lamps 丨 70a to 丨 c with different functions. The first indicator 170a is a standby indicator, which indicates that the heat sink is in a standby state before operation, the second indicator 170b indicates that the device is in operation, and the third indicator 170c is an overheating warning lamp. The heat-dissipating end of the device is abnormal and cannot be cooled properly or in a timely manner. The third indicator light 17 (^ sends a signal. The switch 160 is used to control the startup of the heat-dissipating device. Refer to Figure 4, which shows the cold and heat exchange function according to this creation A schematic diagram of a temperature control system of a preferred embodiment of a heat dissipation device. In this embodiment, a temperature sensor can be installed in the computer system, such as near the cold side of a cooling chip, and the electrical connection is adjusted. Controller for monitoring the ambient temperature inside the system and transmitting the monitoring signal to the regulator. The regulator is electrically connected to the DC voltage converter, and the DC voltage converter is electrically connected to the cooling chip to control the cooling. One of the chip's input voltages, for example, the i2v DC input voltage is converted into 3V to 12V, and the converted voltage is transmitted to the cooling chip, and the power of the cooling chip can be adjusted. Rate performance. By adding a temperature sensor and regulator, a temperature control system is formed. The regulator sends an adjustment signal to the DC voltage converter to regulate the voltage of the cooling chip according to the monitoring signal returned by the temperature sensor. In order to achieve the purpose of controlling the cooling temperature, for example, the temperature difference between the inside and outside of the system is controlled within about 5 to 8 degrees, so as to avoid a sudden decrease in the internal temperature of the system, which may cause problems caused by the dew point and cause damage to the components. FIG. 3 is a schematic view of a shroud in a preferred embodiment of a heat dissipation device having a heat exchange function according to the present invention. In the above preferred embodiment, a shroud 300 is further included, which mainly includes a The telescoping portion 302 and a fixing portion 304. The fixing portion 304 is coupled and fixed to the outside of the first air inlet of the heat sink, for example, by screwing or pasting. Using the extensibility of the shroud 300, Pull the telescopic part 30 to the position where you want to enhance heat removal, and absorb the heat source fluid intensively. The shroud 300 can also be installed outside the cold air outlet to guide the warp The cooling fluid flows more concentratedly to the place to be cooled. Refer to Figures 2A to 2D. Figures 2A to 2C are front views of another preferred embodiment of a heat sink with a hot and cold parent replacement function, Top view and side view. Figure 2D is a cross-sectional view showing Figure 2A. In another embodiment of this creation, the first fan and the second fan use an axial flow fan. Flow device 21〇a, 21 installed in a casing

M274764 200内。殼體200包含第一空間200a與第二空間2〇〇b。第一空間200a具有一第一進氣口 202a與一冷氣出口 2〇4，第二空間200b具有一第二進氣口 202b與一熱氣出口 2〇6。第一進氣口 202a位置係在相對於冷氣出口 204之下方，第一進氣口 202b位置係在相對於熱氣出口 206之下方。致冷晶片220之冷側220a與'第"一散熱片222搞人熱側220b與一導熱體224之第一側224a麵合，導熱體224 之第二側224b則耦合於一第二散熱片226。第一導流梦置 210a包含一第一軸流風扇212a與一馬達214,第二導流裝置210b包含一第二軸流風扇212b與馬達214。當轴流風扇212a、212b同時受馬達214驅動運轉時， =第一進氣口 202a進入之熱流體往上流動，途中經過第一散熱片222而進行熱交換，接著從冷氣出口 2〇4排出。同樣地，外部環境之流體則由第二進氣口 2〇2b進入向上冷動，途中經過第二散熱片226而進行熱交換，再從口 206排出，構成一冷熱交換交換***。 …… 本實施例中包含-電路控制板27〇，具有第一指示燈〇a ’係為一預備指示燈、第二指示燈2鳩，表示裝置處於運作狀態’以及第三指示燈，，為-過熱警示燈气敎Γΐ第1八圖之實施例中’散熱裳置之厚度包含第- 散熱片及導熱體之總厚度，而本實施例之散上只相關於其中一元件之厚度，因此本實施放,、、、裝置具有較小的厚度。優由上述本創作較佳實施例可知，點：本創作之具有冷熱交換功能之應用本創作具有下列散熱裝置利用致冷晶 12 M274764 片之效應，以致冷晶片吸熱端提供致冷效果，並辅以導流裝置之設計，加強流體之強制流動，達到較佳致冷效果：而放熱端藉由另一導流裝置加強排熱之效果。本創作之裝置屏除傳統散熱風扇以環境溫度來進行散熱的方式，而是以低於環境溫度的適當溫度（為避免露點的產生）來進行散熱，並將熱端完全隔絕在系統的外部，而達到快速且均勻的散熱目的。同時，本創作應用於各式電子設備上，例如桌上型電腦系統機殼、筆記型電腦、投影機、音響或其他有散熱需求之電器3戈電子$器設備等機殼上，$有極佳的散熱效果，最大散熱平衡溫度不再受限於外部環境溫度，解決了傳統之風扇散熱裝置所遭遇的困難。利用導流罩更提供了一選擇性，可加強特定熱源流體之吸取，以及冷卻流體對特定位置之冷卻，以配合不同使用環境之需求。雖然本創作已以較佳實施例揭露如上，然其並非用以限定本創作，任何熟習此技藝者，在不脫離本創作之精神和範圍内，當可作各種之更動與潤飾，因此本創作之保護範圍當視後附之申請專利範圍所界定者為準。【圖式簡單說明】為讓本創作之上述和其他目的、特徵、優點與實施例能更明顯易懂，所附圖式之詳細說明如下：第1A、1B圖係分別繪示依照本創作之具有冷熱交換功能之散熱裝置一較佳實施例的前視圖與後視圖。 13 M274764 第1C圖係繪示第丨A圖之側剖面圖。 &第2A至2C圖係分別繪示依照本創作之具有冷熱交換功此之政熱裝置另一較佳實施例的前視圖、上視圖與側視第2D圖係繪示第2A圖之剖面圖。第3A與第3B圖係分別繪示依照本創作之具有冷熱交換功能之散熱裝置一較佳實施例中的導流罩上視圖與側視圖。M274764 200. The housing 200 includes a first space 200a and a second space 200b. The first space 200a has a first air inlet 202a and a cold air outlet 204, and the second space 200b has a second air inlet 202b and a hot air outlet 204. The first air inlet 202a is positioned below the cold air outlet 204, and the first air inlet 202b is positioned below the hot air outlet 206. The cold side 220a of the cooling chip 220 and the "first" heat sink 222 are connected to the hot side 220b and the first side 224a of a heat conductor 224, and the second side 224b of the heat conductor 224 is coupled to a second heat sink Sheet 226. The first diversion device 210a includes a first axial fan 212a and a motor 214, and the second diversion device 210b includes a second axial fan 212b and a motor 214. When the axial fans 212a and 212b are driven by the motor 214 at the same time, the hot fluid entering the first air inlet 202a flows upwards, passes through the first heat sink 222 for heat exchange, and then is discharged from the cold air outlet 204. . Similarly, the fluid from the external environment enters the upward cooling movement through the second air intake port 202b, passes through the second heat sink 226 for heat exchange, and is discharged from the port 206 to form a cold heat exchange system. ... This embodiment includes a circuit control board 27o, which has a first indicator light 0a, which is a standby indicator light, a second indicator light 2 indicating that the device is in operation, and a third indicator light, which is -Overheating warning lamp gas 敎 Γΐ In the embodiment of Figure 18, the thickness of the heat dissipation skirt includes the total thickness of the-heat sink and the heat conductor, and the dispersion of this embodiment is only related to the thickness of one of the components, so In this embodiment, the device has a small thickness. It can be known from the above-mentioned preferred embodiment of the present invention that the point is: the application of this creation with cold and heat exchange function. This creation has the following heat dissipation device using the effect of the cooling crystal 12 M274764 chip, so that the cooling end of the cooling chip provides the cooling effect, and assists With the design of the diversion device, the forced flow of the fluid is enhanced to achieve a better cooling effect: while the heat release end is enhanced by another diversion device to enhance the effect of heat removal. The device screen of this creation removes the traditional cooling fan to dissipate heat at ambient temperature. Instead, it dissipates heat at an appropriate temperature lower than the ambient temperature (to avoid the dew point), and completely isolates the hot end from the outside of the system. To achieve fast and uniform heat dissipation. At the same time, this creation is applied to all kinds of electronic equipment, such as desktop computer system cases, notebook computers, projectors, stereos or other electrical appliances with heat dissipation requirements. The excellent heat dissipation effect and the maximum heat dissipation equilibrium temperature are no longer limited by the external ambient temperature, which solves the difficulties encountered by traditional fan cooling devices. The use of the shroud also provides a selectivity, which can enhance the absorption of specific heat source fluids and the cooling of cooling fluids to specific locations to meet the needs of different use environments. Although this creation has been disclosed as above with a preferred embodiment, it is not intended to limit this creation. Any person skilled in this art can make various changes and decorations without departing from the spirit and scope of this creation. Therefore, this creation The scope of protection shall be determined by the scope of the attached patent application. [Schematic description] In order to make the above and other purposes, features, advantages and embodiments of this creation more comprehensible, the detailed description of the drawings is as follows: Figures 1A and 1B respectively show the A front view and a rear view of a preferred embodiment of a heat sink with a cold and heat exchange function. 13 M274764 Figure 1C is a side sectional view of Figure 丨 A. & 2A to 2C are front views, top views, and side views of another preferred embodiment of a political and thermal device having a cold and heat exchange function according to this creation. 2D is a cross-section of FIG. 2A. Illustration. Figures 3A and 3B are a top view and a side view, respectively, of a shroud in a preferred embodiment of a heat dissipating device with a cold and heat exchange function according to the present invention.

第4圖係繪示依照本創作之具有冷熱交換功能之散熱裝置一較佳實施例的溫度控制系統之示意圖。FIG. 4 is a schematic diagram showing a temperature control system of a preferred embodiment of a heat dissipation device with a cold and heat exchange function according to the present invention.

【主要元件符號說明】 100、200 ·•殼體 100b、200b :第二空間 102b、202b :第二進氣口 106、206 :熱氣出口 110b、210b :第二導流裝置 112b、212b :第二風扇 120、220 :致冷晶片 120b、220b :熱側 124、224 ··導熱體 124b、224b :第二側 140、240 :隔熱物質 170、270 :電路控制板 170b、270b ··第二指示燈 100a、200a :第一空間 102a、202a :第一進氣口 104、204 :冷氣出口 110a、210a :第一導流裝置 112a、212a:第一風扇 114、214 :馬達 120a、220a :冷側 122、222 :第一散熱片 124a、224a·第—側 126、226 :第二散熱片 160 、 260 :開關 170a、270a :第一指示燈 170c、270c :第三指示燈[Description of main component symbols] 100, 200 · • Housings 100b, 200b: Second spaces 102b, 202b: Second air inlets 106, 206: Hot air outlets 110b, 210b: Second diversion devices 112b, 212b: Second Fans 120 and 220: Refrigerating wafers 120b and 220b: Hot side 124 and 224.Heat conductors 124b and 224b: Second side 140 and 240: Thermal insulation material 170 and 270: Circuit control boards 170b and 270b. Lamps 100a, 200a: first spaces 102a, 202a: first air inlets 104, 204: cold air outlets 110a, 210a: first air guides 112a, 212a: first fans 114, 214: motors 120a, 220a: cold side 122, 222: first heat sink 124a, 224a, first side 126, 226: second heat sink 160, 260: switches 170a, 270a: first indicator 170c, 270c: third indicator

Claims

用以與熱 M274764 九、申請專利範圍： L一種具有冷熱交換功能之散熱裝置，至少包含：一殼體，至少包含：第一空間，具有一第一進氣口與一冷氣出口；以及开蜩一弟二進氣―六抑心叫-’ 第導流裝置，位於該第一進氣口旁，用以導引一熱源：體自，第一進氣口進入該殼體；盆▲致冷曰曰片，位於該殼體内，具有一冷側與一熱側，中及冷側與③第—空間輕合’用以冷卻該熱源流體，該熱側與該第二空間耦合；以及外邻：：二導流裝置，位於該第二進氣…用以導引-卜=:流體自該第二進氣口進入該殼體，進行一熱交換，體，ς中’該熱源流體經冷卻後自該冷氣“流出該殼體。…環境流體經該熱交換後自該熱氣出口流出該殼含-2第利範圍f 1項所述之散熱裝置，其中更包源流體進：、、#合於該致冷晶片之該冷側， ,L體進仃一熱交換。 15 M274764 4·如申請專利範圍第3項所述之散熱裝置，其中該第一導机骏置至少包含一第二風扇，係位於該第二進氣口旁，連接於該馬達。 _ 5·如申請專利範圍第1項所述之散熱裝置，其中更包含一第二散熱片，耦合於該致冷晶片之該熱側，用以提供一散熱機制於該熱側。 6·如申請專利範圍第5項所述之散熱裝置，其中更包 :導熱體’具有一第一側與一第二側，該第一側耦合於該熱側’ 1亥第二側麵合於該第二散熱片，用以將該熱側之熱傳至該第二散熱片。 7·如申請專利範圍帛6項所述之散熱裝置，其中熱體為一金屬導熱體。、 _ 8.如申明專利範圍帛丨項所述之散熱裝置，其中更包含隔熱泡綿，位於該第一空間與該第二空間之間:、用以隔熱該第一空間與該第二空間。 9·如申請專利範圍帛i項所述之散熱裝置，其中更包 .含一溫度感測器與—調整器，該溫度感測器與該調整器電性連接’用以感測一李轉提乐、、死％楗溫度並傳輸一監控訊號至該調整器，該調整器電性逯桩於—吉、、六带丨連接於直流電壓轉換器，根據該監控訊號傳送-調整訊號至該直流電壓轉換器，其中該直 ⑧ 16 M274764 流電壓轉換器係電性連接於該致冷晶片，控制該致冷晶片之一輸入電壓。 10·如申請專利範圍第9項所述之散熱裝置，其中上述之溫度感測器控制該系統内外溫差於約5至8度内。 π,如申請專利範圍第1項所述之散熱裝置，其中上述之第一進氣口外側更包含一導流罩，利用該導流罩可延伸特性，可集中地吸取該熱源流體。 12. 一種具有冷熱交換功能之散熱裝置，適用於一電腦系統、電器、電子儀器設備等需散熱產品之機殼，至少包含：一殼體，至少包含：一第一空間，具有一第一進氣口與一冷氣出口；以及一第二空間，具有一第二進氣口與一熱氣出口；一第一導流裝置，位於該第一進氣口旁，用以導引一熱源流體自該第一進氣口進入該殼體；一致冷晶片，位於該殼體内，具有一冷側與一熱側，其中該冷側與該第一空間耦合，用以冷卻該熱源流體，該熱側與該第二空間耦合；一第一散熱片，耦合於該冷侧，用以冷卻該熱源流體；一第二導流裝置，位於該第二進氣口旁，用以導引一外部環境流體自該第二進氣口進入該殼體；以及 17 ⑧ M274764 一第二散熱片，耦合於該熱側，用以與該外部環境流體進行一熱交換，其中，該熱源流體經冷卻後自該冷氣出口流出該殼體’該外部環境流體經該熱交換後自該熱氣出口流出該殼 13·如申請專利範圍第12項所述之散熱裝置，其中該第一導流裝置至少包含一第一風扇，係連接於一馬達。 14·如申請專利範圍第12項所述之散熱裝置，其中該第二導流裝置至少包含一第二風扇，係連接於該馬達。 15·如申請專利範圍第12項所述之散熱裝置，其中更包含一導熱體，具有一第一側與一第二側，該第一侧耦合For use with heat M274764 IX. Patent application scope: L A heat sink with cold and heat exchange function, at least: a housing, at least: a first space, with a first air inlet and a cold air outlet; One brother and two intakes—six suppressing heart calls— 'The second diversion device is located next to the first air inlet, and is used to guide a heat source: the body, the first air inlet enters the shell; the basin ▲ refrigeration Said piece is located in the housing, and has a cold side and a hot side, a middle and cold side and a third space-light-closed to cool the heat source fluid, and the hot side is coupled to the second space; and Neighbors: Two diversion devices, located on the second intake air ... to guide-Bu =: fluid enters the housing from the second air inlet, and conducts a heat exchange. After cooling, the cold air "flows out of the casing .... The ambient fluid flows out of the casing from the hot gas outlet after the heat exchange. It contains the heat dissipation device described in item -2, which includes the source fluid into: ,,, # 合 At the cold side of the cooling chip, the L body enters a heat exchange. 15 M2 74764 4. The heat dissipation device according to item 3 of the scope of patent application, wherein the first guide unit includes at least a second fan, which is located beside the second air inlet and connected to the motor. _ 5 · 如The heat dissipation device described in item 1 of the patent application scope further includes a second heat sink coupled to the hot side of the cooling chip to provide a heat dissipation mechanism to the hot side. The heat dissipating device according to item 5, further including: the heat conductor 'has a first side and a second side, the first side is coupled to the hot side, and the second side is coupled to the second heat sink, It is used to transfer the heat from the hot side to the second heat sink. 7. The heat dissipation device according to item 6 of the patent application scope, wherein the heat body is a metal heat conductor. _ 8. As stated in the patent scope 帛丨The heat dissipating device described in the above item further includes a thermal insulation foam, which is located between the first space and the second space: to insulate the first space and the second space. The heat dissipation device described in item i, which further includes a temperature sensor and adjustment The temperature sensor is electrically connected to the regulator, and is used to sense the temperature of a Li to Ti Le, dead temperature, and transmit a monitoring signal to the regulator. The regulator is electrically connected to The six bands are connected to a DC voltage converter and transmit-adjust signals to the DC voltage converter according to the monitoring signal. The direct current 16 M274764 current voltage converter is electrically connected to the cooling chip to control the refrigeration. Input voltage of one of the chips. 10. The heat dissipation device as described in item 9 of the patent application range, wherein the temperature sensor controls the temperature difference between the inside and outside of the system within about 5 to 8 degrees. Π, as in the first item of the patent application range In the heat dissipating device, the outer side of the first air inlet further includes a shroud. The shroud can be extended to absorb the heat source fluid in a concentrated manner. 12. A heat-dissipating device with a cold-heat exchange function, which is suitable for a computer system, electrical appliances, electronic equipment, and other products that need to dissipate heat. It includes at least: a housing, at least: a first space with a first inlet. An air port and a cold air outlet; and a second space having a second air inlet and a hot air outlet; a first diversion device positioned beside the first air inlet to guide a heat source fluid from the air inlet; A first air inlet enters the housing; a uniform cold wafer is located in the housing and has a cold side and a hot side, wherein the cold side is coupled with the first space for cooling the heat source fluid, and the hot side Coupled to the second space; a first heat sink coupled to the cold side to cool the heat source fluid; a second flow guiding device located beside the second air inlet to guide an external environmental fluid Enter the casing from the second air inlet; and 17 ⑧ M274764 a second heat sink coupled to the hot side to perform a heat exchange with the external ambient fluid, wherein the heat source fluid is cooled from the Air-conditioning The shell flows out of the casing. The external ambient fluid flows out of the casing from the hot gas outlet after the heat exchange. The heat dissipation device according to item 12 of the patent application scope, wherein the first flow guiding device includes at least a first fan. , Connected to a motor. 14. The heat-dissipating device according to item 12 in the scope of the patent application, wherein the second flow-guiding device includes at least a second fan connected to the motor. 15. The heat dissipating device according to item 12 of the scope of patent application, which further comprises a thermal conductor having a first side and a second side, and the first side is coupled

之熱傳至該第二散熱片。 I6.、如申請專利範圍第14項所述之散熱裝置，其中該導熱體為一金屬導熱體。 17.如如申請專利範圍第12 包含隔熱泡綿，隔熱該第一空旧項所述之散熱裝置，其中更、、、，位於該第一空間與該第二空間之間，用以空間與該第二空間。The heat is transferred to the second heat sink. I6. The heat dissipating device according to item 14 of the scope of patent application, wherein the thermal conductor is a metal thermal conductor. 17. The heat-dissipating device according to the first empty item as described in claim 12 which includes a thermal insulation foam, wherein more ,,,, is located between the first space and the second space for Space and the second space.