M274533 八、新型說明： 【新型所屬之技術領域】 本創作係有關一種晶片檢測治具，特別指一種可任意 更換治具構件，俾適於各式封裝晶片實際運作使用以進行 晶片產品品質檢測之晶片檢測治具設計。 【先前技術】 現今的晶片封裝製程，均於完成產品封裝後，對每一 顆晶片進行檢測，俾確保其品質。習見的晶片測試裝置， 參考第六圖所示，具有一電路板1〇於板面設有數個晶體承 座30，於一選定邊設有數個訊號接點2〇，該晶體承座加係 可供電晶體簡易插拔之座體，於其内部並設有訊號接點4〇 及扣持裝置與其他構件；藉此將該電路板1〇以其訊號接點 20插接於一主機板等其他設備，即可於所述之數個晶體承 座30中置入晶片50,俾進行該晶片5〇之品質測試作業。M274533 8. Description of the new model: [Technical field to which the new model belongs] This creation relates to a wafer inspection jig, especially a jig component that can be arbitrarily replaced, which is suitable for the actual operation and use of various types of packaged wafers for quality inspection of wafer products. Wafer inspection fixture design. [Previous technology] In today's chip packaging process, after each product is packaged, each chip is inspected to ensure its quality. The conventional wafer testing device, as shown in the sixth figure, has a circuit board 10 provided with a plurality of crystal sockets 30 on the surface of the board, and a plurality of signal contacts 20 on a selected side. The base body of the power supply crystal is easily inserted and provided with a signal contact 40 and a holding device and other components; thereby, the circuit board 10 is connected to a motherboard with its signal contact 20 and other components. The device can put a wafer 50 into the several crystal holders 30, and perform a quality test operation of the wafer 50.
惟上揭習知的晶片測試裝置，係因應特定封裝型式的 晶片所製成，不能應用於其他型式的封裝晶片，特別^現 今各種電子產品的晶片，將依該電子產品需求或㈣ 不同封裝型式，不啻要求預先準備各種晶片測試裝置， 對的增加業者的測試成本；其次，該晶片測試裝置之 實施方？ ’須以人工將晶片50 一一壓入晶體承座3〇中:利 用内部彈性扣持裝置扣住晶片5〇 ,且取出各晶片時 裝置脫離再取出各 :二覆此種下麗晶片5〇及彈性扣持袭置之動作， 冒造成作業人員手部疲勞，成為一種職業傷宝。 【新型内容】 ” ^ ° 藉構::提= M274533 :合具元件’使-種晶片測試裝置可廣泛適用現今及將來的 封裝ί片檢測之效果’俾進—步獲致降低檢測成本， 並月b獲致簡易操作使用效益者。 依上述目的，本創作之實施内容係包括一電路基板、 一框架、-蓋板及複數導接裝置所組成，其中··該電路基 板，係板面設有電路、電子元件以及可與導接裝置電性連 接之稷數電路接點組；該框架，乃呈板片狀貼覆固設於電 路基板，並構成有複數貫通狀容置槽，令該容置槽對應電 路基板之電路接點組；該蓋板，係樞設於框架選定側之板 片；而該導接裝置，乃包含一絕緣體及複數導接端子延伸 於絕緣體上、下二面構成；藉此，組成導接裝置可任意更 換不同構成形態，以因應不同封裝形式晶片之晶片檢^治 具，令導接裝置之導接端子一端可與電路基板之電路接點 組電性連接’而另一端能與置入容置槽中的受測晶片電性 連接’俾進行封裝晶片檢測工作。 【實施方式】 茲依附圖實施例將本創作之結構特徵及其他之作用、 目的詳細說明如下： 參閱第一圖及第二圖所示，本創作所為『晶片檢測治 具』，係包括一電路基板X、一框架2、一蓋板3及複數導 接裝置4所組成，其中： 電路基板1，如第三圖所示，可為一電路板（PCB)， 於其板面設有相關電路、電子元件，以及可各別與一導接 裝置4形成電性連接之複數電路接點組11 ( 一電路接點組 11可為二排排列狀之複數電路接點組成），於選定處設有下 述框架2之固定部12，並可設有與其他電路母板或電子設 備插接組裝之電連接部13 ;其中，所述該固定部12可為複 數貫穿狀定位孔；而該電連接部1 3係可為設於電路基板工 M274533 一邊側之金手指結構； 框架2，如第二圖所示，係構成一板片狀，於板面設 有複數個貫穿狀且對應各電路接點組11之容置槽21，於選 定側設有一樞接部22，並於底面設有匹配於電路基板丄其 固定部12之被固定部23;其中，所述該容置槽21可構成為 矩开> 狀，且可選定相對應二邊側分別設有一凹槽狀之定位 部211，俾定位下述之導接裝置4，·該樞接部以可為形成於 框架2上之凸座；而該被固定部23，係可為相匹配定位孔 狀固定部12之凸銷（如第二圖所示）；However, the conventional wafer testing device disclosed above is made according to a specific package type of wafer and cannot be applied to other types of packaged wafers. In particular, today's various electronic product wafers will be based on the needs of the electronic product or different package types. It is necessary to prepare various wafer test devices in advance, which will increase the test cost of the operator; secondly, the implementation party of the wafer test device? 'Manually press the wafer 50 into the crystal holder 30 one by one: use the internal elastic retaining device to hold the wafer 50, and when the wafers are removed, the device is detached and then taken out: double the wafers 5 And the action of elastic detention strikes, causing the operator's hand to become fatigued, which becomes a kind of occupational injury. [New content] ”^ ° Borrowing structure :: mention = M274533: combined component 'makes-a variety of wafer test equipment can be widely applied to the effect of present and future package inspection' advancement-further reduction in inspection costs, and monthly b Those who have obtained the benefits of simple operation. According to the above purpose, the implementation content of this creation is composed of a circuit board, a frame, a cover plate, and a plurality of lead-in devices, where the circuit board is provided with a circuit on the board surface , Electronic components, and a plurality of circuit contact groups that can be electrically connected to the lead-in device; the frame is fixed on the circuit substrate in a plate-like manner and is formed with a plurality of through-shaped accommodation grooves for the accommodation The slot corresponds to the circuit contact group of the circuit substrate; the cover plate is a plate pivotally arranged on a selected side of the frame; and the lead connection device includes an insulator and a plurality of lead terminals extending on the upper and lower sides of the insulator; In this way, the composition of the connection device can be arbitrarily replaced with different configuration forms to respond to the wafer inspection fixture of the chip in different packaging forms, so that one end of the connection terminal of the connection device can be electrically connected to the circuit contact group of the circuit substrate. "The other end can be electrically connected with the test chip placed in the receiving slot" to carry out the package chip inspection. [Embodiment] The structure and other functions and purposes of this creation will be described in detail according to the embodiment of the accompanying drawings. The description is as follows: Referring to the first and second figures, this studio is a "wafer inspection jig", which consists of a circuit board X, a frame 2, a cover 3, and a plurality of lead-in devices 4, of which: As shown in the third figure, the circuit substrate 1 may be a circuit board (PCB), and the circuit board 1 is provided with relevant circuits, electronic components, and a plurality of circuit connections that can be electrically connected to a conducting device 4 respectively. Point group 11 (a circuit contact group 11 may be composed of a plurality of circuit contacts arranged in two rows), and a fixed portion 12 of the following frame 2 is provided at a selected place, and may be provided with other circuit motherboards or electronic equipment The electrical connection portion 13 of the plug-in assembly; wherein the fixing portion 12 may be a plurality of through-shaped positioning holes; and the electrical connection portion 13 may be a gold finger structure provided on one side of the circuit board worker M274533; the frame 2 , As shown in the second figure, In a sheet shape, a plurality of through grooves 21 corresponding to the circuit contact groups 11 are provided on the surface of the board, a pivotal portion 22 is provided on the selected side, and a fixed portion 12 matching the circuit substrate and its fixing portion 12 is provided on the bottom surface. The fixed portion 23; wherein, the receiving groove 21 may be formed in a moment opening shape, and a corresponding groove-shaped positioning portion 211 may be respectively selected on the corresponding two sides, and the following guides are positioned. Device 4, the pivotal portion may be a convex seat formed on the frame 2; and the fixed portion 23 may be a convex pin matching the positioning hole-shaped fixing portion 12 (as shown in the second figure);
蓋板3，如第三圖所示，係可構成一板片狀或其他結The cover plate 3, as shown in the third figure, can form a plate or other structure.
構形狀，並不揭限，於選定側設有匹配於框架2柩接部U 之被樞接部31，該被柩接部&可為形成於蓋板3邊側之凸 座，並可於蓋板3開啟側設有一扣持裝置32;且蓋板3下 面對應框架2各容置槽21部位，係可分設有一壓持部33， 該壓持部33可為凸塊或弧形凸面，藉此能確實下壓下述之 受測晶片50 ; 導接裝置4，如第二圖、第三圖及第五圖所示，係包 含有-絕緣體41及複數導接端子42、42，所構成，該絕緣體 41可為矩形板塊狀，於相對應二側邊分別設有一凸塊狀之 被定位部411，·該複數導接端子42、42，係為複數金屬片固 植於絕緣體41選定處，且於絕緣體41上下分別凸設有上、 H部421、、421，、422、422,所構成，作為受：晶月與 駚土板1之導接媒介；另如第六圖所示，亦可於該絕緣 喊有複數穿孔412a，而該複數導接端子仏之實施方 式，係可於各穿孔412a中植設一彈性元件“Μ，於彈性元 件423a上、下端分設成上、下導接部42ia、，並令導 於穿孔仙孔緣形成略突出絕緣體4ia，藉此特別 t用於球柵陣列封裝型式之受測晶片50應用； M274533 藉此，參閱第一圖、第二圖及第五圖所示，令框架2 之被固定部2 3與電路基板1之固定部1 2相結合（即凸銷穿 植於疋位孔），使框架2固定於電路基板1之電路接點組]^ 面’令蓋板3之被樞接部31與框架2之樞接部22相互樞接 (即凸座相互樞接）’使蓋板3呈可翻掀封閉或開啟框架2 容置槽21狀態，且能藉扣持裝置32扣定於框架2選定處， 並令複數導接裝置4分別置設入框架2之容置槽21，藉其 定位部211與被定位部411嵌合結構（即二凸塊嵌合於二定 位槽結構），使各導接端子42、42,之下導接部422、422，精 • 確與電路基板1其電路接點組11接觸形成電性連接，即可 組成本創作晶片檢測治具，用於檢測不同封裝晶片。 如上所述，本創作該導接裝置4之複數導接端子42， 係可為複數圓鉤狀金屬彈片植固於絕緣體41二側邊構成（ 明參閱第三圖及第四圖所示），藉以圓鉤狀金屬彈片之上、 下弧面構成所述上、下導接部421、422，·或請參閱第五圖 所示，亦可為二排複數金屬彈片貫穿固定於絕緣體41中， 藉此構成所述導接端子42,，並於絕緣體41上、下凸伸有斜 彈片狀之上、了導接部421，、422,構成，·是以，本創作該複 籲 料接端子42形狀，並不限定，舉凡可構成於絕緣體^上 、下面作為導接媒介者，均可應用實施。 抑本創作晶片檢測治具應用實施於封裝晶片檢測時，可 早=應用電路基板！進行，或令電路基以其電連接部 13連接於其他電路母板或相關電子設備進行。若此，浐參 =第：圖及第五圖所示，即可視受測晶片5〇封裝型式二 同，選定不同導接裝置4分別置入框架2之容置槽 位’令各導接端子42、42’之下導接部似、似，與 =路接點組”接觸形成電性連接；再將受測晶片5〇: 一 於導接裝置4上，使受測晶片50之外電性接點5〇1 M274533 與各導接端子42、42’之上導接部421、421，接觸形成電性 連接；即可翻轉所述蓋板3扣設封閉於框架2上，藉其遂 持部33同步下塵各受測晶片50，使外電性接點501與上導接 部421、421 ’更臻緊密接觸，即能進行檢測工作。 由上可見，本創作晶片檢測治具係能視不同封裝型式 之受測晶片50,置換不同導接裝置4形成電性連接，無焊 接固定以改善不能任意更換的缺憾，故能避免一種受測晶 片即製作一種晶片檢測治具 且檢測成本降低等效果；且 成後，再下壓所述蓋板3， 能改善習知晶片檢測裝置需 降低人力作業時的職業傷害 電路基板1快速插接組合， 是以能隨時因應不同受測晶 方便更換效果。 ，並達成檢測治具管理方便， 因受測晶片50係於一一置放完 進一步形成彈性接觸結構，即 下壓晶片的麻煩程序，並 。其次’本創作該框架2係與 免除螺絲鎖固或焊接的麻煩， 片50型式更換框架2，並獲致 綜上所述，本創作『晶片檢測治具 =性，其手段之運用亦出於新穎無疑』，且已= 已稱合理進步至明。為此，依法提出 ，惟_ _局惠予詳審，並賜准專利為禱，至感 M274533The configuration is not limited, and a pivoted portion 31 matching the joint portion U of the frame 2 is provided on the selected side. The joint portion & may be a convex seat formed on the side of the cover 3, and A holding device 32 is provided on the opening side of the cover plate 3; and a portion of the receiving groove 21 of the frame 2 below the cover plate 3 can be separately provided with a holding portion 33, which can be convex or curved Convex surface, which can surely press down the test chip 50 described below; the lead-in device 4, as shown in the second, third and fifth figures, comprises an insulator 41 and a plurality of lead terminals 42, 42 As a result, the insulator 41 may be rectangular plate-shaped, and a convex-shaped positioned portion 411 is provided on the corresponding two sides. The plurality of lead terminals 42 and 42 are fixed by a plurality of metal pieces. The insulator 41 is selected, and upper and H parts 421, 421, 422, 422 are respectively convexly arranged above and below the insulator 41, and are constituted as a receiving medium for the crystal moon and the earth plate 1; As shown in the figure, a plurality of through-holes 412a can also be called in the insulation, and the embodiment of the plurality of lead terminals 仏 can be constructed with an elastic element in each of the through-holes 412a. "M, the upper and lower ends of the elastic element 423a are respectively divided into upper and lower guide portions 42ia, and the guides are formed at the edge of the perforated fairy hole to form a slightly protruding insulator 4ia, thereby being especially used for the test of the ball grid array package type Application of chip 50; M274533 By this, referring to the first, second and fifth figures, the fixed part 23 of the frame 2 and the fixed part 12 of the circuit board 1 are combined (that is, the convex pin is planted in (Position hole), so that the frame 2 is fixed to the circuit contact group of the circuit substrate 1] ^ surface 'so that the pivoted portion 31 of the cover plate 3 and the pivot portion 22 of the frame 2 are pivoted to each other (that is, the convex seats are pivoted to each other) ) 'Make cover plate 3 in a state of being able to flip or close or open frame 2 receiving slot 21, and be able to be fastened to a selected position of frame 2 by means of a holding device 32, and the plurality of guiding devices 4 may be respectively placed in the frame 2. The accommodating groove 21 has a fitting structure of the positioning portion 211 and the positioned portion 411 (that is, two projections are fitted into the two positioning groove structure), so that each of the lead terminals 42 and 42 and the bottom lead portions 422 and 422, • Make contact with the circuit board 1 and its circuit contact group 11 to form an electrical connection. This can be used to form the original wafer inspection jig for detecting different packages. As mentioned above, the plurality of lead terminals 42 of the lead connection device 4 in the present invention can be formed by planting a plurality of round hook-shaped metal springs on the two sides of the insulator 41 (refer to the third and fourth figures for details). ), The upper and lower guide portions 421 and 422 are formed by the upper and lower arc surfaces of the hook-shaped metal spring sheet, or as shown in the fifth figure, two rows of metal spring sheets may also be fixed to the insulator 41 In this way, the lead-in terminal 42 is formed, and the oblique elastic sheet-shaped protrusions are formed on the insulator 41 above and below, and the lead-in portions 421, and 422 are formed. The shape of the material connection terminal 42 is not limited, and anyone who can be formed on the insulator ^ as a conductive medium can be implemented. When the application of the wafer inspection jig is implemented in the inspection of the packaged wafer, the circuit board can be applied as early as possible! This may be performed by having the electrical base 13 connected to another circuit motherboard or related electronic equipment. If this is the case, as shown in Figure 5 and Figure 5, you can see that the tested chip 50 is of the same packaging type. Select different lead-in devices 4 and place them in the receiving slots of the frame 2 to make each lead-in terminal. 42, 42 ', the contact portions are similar to each other, and make contact with the "circuit contact group" to form an electrical connection; then, the test chip 50 is placed on the conduction device 4 so that the test chip 50 is not electrically conductive. The contact 501 M274533 is in electrical contact with the lead portions 421 and 421 above each lead terminal 42 and 42 '; the cover plate 3 can be flipped and closed on the frame 2 to hold it. The part 33 synchronously dusts each of the tested wafers 50, so that the external electrical contact 501 and the upper lead parts 421 and 421 'are brought into closer contact, so that the inspection can be performed. As can be seen from the above, the original wafer inspection jig can be visually inspected. The tested chip 50 of different package types is replaced with different lead-in devices 4 to form an electrical connection. There is no soldering to improve the defect that it cannot be arbitrarily replaced. Therefore, it is possible to avoid the production of a wafer testing jig for a tested chip and reduce the testing cost. Effect; and after completion, pressing the cover 3 again can improve the conventional wafer inspection equipment It is necessary to reduce the occupational injury during the manual operation. The quick plug-in combination of the circuit board 1 can be easily replaced at any time according to the different test crystals. And it is convenient to manage the test fixtures, because the test chips 50 are placed one by one. Further forming an elastic contact structure, that is, the troublesome procedure of pressing down the wafer, and. Secondly, the frame 2 of this creation is to eliminate the trouble of screwing or welding, and the frame 50 is replaced with the type 50, and in conclusion, this creation "Wafer detection fixture = sex, the use of its means is also out of novelty", and has been = has been said to have progressed reasonably. To this end, it is proposed in accordance with the law, but _ _ Bureau benefits for detailed review and grant a patent for prayer , To sense M274533
【圖式簡單說明】 第一圖為本創作組成狀態之立體示意圖。 第二圖為本創作組成狀態之斷面局部示意圖。 第三圖為本創作分解狀態之立體示意圖。 第四圖為本創作應用實施狀態之斷面示意圖。 弟五圖為本創作導接裝置另 *一實施例不意圖之 第六圖為本創作導接裝置另 一實施例示意圖之 第七圖為習知晶片測試裝置之示意圖Q 【主要元件符號說明】 電路基板1 ; 電路接點組11 固定部1 2 ; 電連接部1 3 ; 框架2 ; 容置槽21 ; 定位部211 ; 樞接部22 ; 被固定部23 ; 蓋板3 ; 被樞接部31 ; 扣持裝置32 ; 壓持部33 ; 導接裝置4 ; 絕緣體41、41a ; 穿孔412a ; 導接端子42、42’、42a ; 上導接部 421、421’、421a ; 下導接部 422、422’、422a ; 被定位部411 ; 彈性元件423a ; 受測晶片50 ; 電性接點501 ;[Schematic description] The first picture is a three-dimensional schematic diagram of the composition of the creation. The second figure is a partial schematic view of the composition of the creation. The third picture is a three-dimensional schematic view of the decomposition state of the creation. The fourth figure is a schematic sectional view of the implementation status of the creative application. The fifth figure is the sixth embodiment of the creative lead-in device. The sixth figure is the schematic diagram of another embodiment of the creative lead-in device. The seventh figure is the schematic diagram of the conventional chip test device. Circuit board 1; circuit contact group 11; fixing part 12; electrical connection part 13; frame 2; accommodating groove 21; positioning part 211; pivot part 22; fixed part 23; cover plate 3; pivoted part 31; holding device 32; pressing portion 33; lead connection device 4; insulator 41, 41a; through hole 412a; lead terminal 42, 42 ', 42a; upper lead portion 421, 421', 421a; lower lead portion 422, 422 ', 422a; positioned portion 411; elastic element 423a; chip under test 50; electrical contact 501;