M270358 八、 新型說明： 【新型所屬之技術領域】 本創作係關於一種積體電路（1 C )元件檢測設備’ 尤指-種設置於該檢測設備中，提供承載積體電路元件定 位進行測試用途之測試座結構設計。 【先前技術】 為維護積體電路元件的產品品質，除在製程中設置多 道檢測機制外，在該積體電路元件完成構裝後，仍合對該 :體電路元件成品作最後的功能性檢測，在檢測的過程 ，即係以檢測設備上測試座提供取置裝置將待測積體電 -件移置其上，透過測試座上複數探針分別與該積體電 兀件底面各錫球凸塊或接腳接觸後，由檢測設備 ==進行積體電路元件的功能檢測，並選 =準的積體電路元件產品，剔除不合格的積體電路元 目前既有的測試座組成主要係於—可提供積體 接;，定位的座體對應上方定位槽的底部裝設—探針上保 、為’再於座體底部裝設_探針下保持器，該探針上 保持器上預設相對應之探針孔中分別裝設有’下 應用於檢測設備中提供積體電路元件檢測之用。’使其可 前述既有測試座雖可被應用於檢測設備 承載㈣電路元件定位進行功能性 試座於積體電路元件的測試過程中會有以下^牛題然而該測 M270358 1 '測試良率無法有效提昇： …、<ι>、因積體電路元件被移置該測試座上進行功能性 測试時，尤其是高功率積體電路元件產品，在測試的過程 中積體電路元件自體會產生高溫，由於該測試座本身並益 散熱的機制，以致熱無法有效排除，造成本應為良品之積 體電路元件經測試後被誤判為不良品，影響測試良率而造 成損失。 ° <2>、傳輸阻抗增高··因積體電路元件於該測試座上 進行測試時會產生高溫，此高溫傳導至積體電路元件底邻 的錫球凸塊或接腳處，造成該錫球凸塊或接腳受熱軟化， 娜針與錫球凸塊或接聊接觸的部位快速累積錫渣並起 :化作用而形成氧化錫，由於此氧化錫之產生及累積於探 造成探針的阻抗增加，而導致測試時訊號傳輸的 哀減，仏成積體電路元件須"式良率難以提昇。 2、探針的清潔保養頻率高’降低測試生產效率：因積 體電路兀件於該測試座上進行測試產生的高溫 電路元件底部的錫球凸塊或接腳受熱軟化而污染探針，、： /可染物累積於抹針上’而使探針阻抗增加’故為達到預定 的測試良率’需經常性的對探針進行清潔保養作掌，不僅 須配二乂來執行，清潔保養作業’更影響其測試產能。 …木針使用释命短’增加探針的汰換成本：因污毕換 累積於探針上’而使探針阻抗增加；再者，該探針處於高 溫狀態下易變形’會影響其探針本身與測試座座體間之尺 M270358 寸配合精度，探針在測試過程易產生作動不順暢而增加探 針的磨損，不僅影響探針使用壽命而且增加其汰換成本。衣 【新型内容】 本創作之主要目的在於提供一種積體電路元件測試 座，用以解決目前既有測試座因無有效的散熱機制，造成 測試良率不佳以及探針使用壽命短等問題。 )為達成前揭目的，本創作所提供之技術方案主要係令 该積體電路元件測試座包括一可提供積體電路元件置入定 /、H式基座及多數支分別裝設於測試基座中陣列狀 ==之仏針’且該測試基座内部具有涵括探針分佈區間 、畜=通道’另於測試基座上設置由外側延伸連通至氣流 ==孔可=該測試座應用於積體電路元件進行 孔中，對探斜將冷空氣經由進氣孔導入氣流通道及探針 以冷卻作用者。、積體電路元件底部的錫球凸塊或接腳等施 結合==電路元件測試座中，其測試基座可為座體 上保持器及探^寻二構件之組合體，或為座體結合探針 合定位件、；:十下保持器等三構件之虹合體，或為座體結 體等設計。保持器及探針下保持器等四構件之組合 不創作^ 广 ^ 則揭技術方案之設計相鲈太、d — 士 座，其遠味、 T相季乂扣曰刖既有之測 曰之功效至少包括有： 1、提高測試良率： M270358 <ι>·,降低積體電路元件於測試時自體所產生之高溫： 本創作可導入冷空氣作用於探針及測試座測試基座上:積 體電路元件，有效率^ @ Λ _ 、 “ a 革地將積體電路元件測試時產生之敎量 消散於大氣中，確保測試品質。 ”，、里 <2>、降低測試時僂· 本創作應肖於積體電 路兀件測斌時，因可導 勣锔扑几梯十枝 7工孔~部積體電路元件底部複 數錫球凸塊或接腳使之不 污染物之產生及累積於… 進而避免氧化錫 腳的接觸阻抗維持在預定r〜 ”妫欠凸塊或接 ^ ^ # &圍内，確保測試時訊號傳輸強 度的-疋性，進而提昇對積體電路元件之測試良率。 2、降低楝針的清潔保養 卜辦、+、 m β 、羊棱向測試生產效率··同 上所述，因降低探針氧化一 $ /亏& ’使用者即可減少董+摄 針進行清潔保養作業n 卩了減^木 、、杳、言徂盖从弈 不僅減輕人力配置來執行此 試產能產生„ 丁此清潔保養作業而對其測 3、延長探針使用壽命， 述，除降低探針氧化錫的污；;卜=汰換成本：同上所 高溫狀態下產生之變形，維^，再者’減低因探針處於 尺寸配合精度，使得探 ^門之 暢而增加探針的磨#，心=過程不致於產生作動不順 成本。 、以延長探針使用壽命並減少其汰換 【實施方式】 依據前揭技術方案之貪 J思、’本創作積體電路元件測試 M270358 座至少可設計成以下數種具體可行之實施例，其中· 如第-至三圖所示，係揭示本創作積體電路元件測試 座之第一較佳實施例立體分解示意圖，由 闺式中可以清楚 看出：該測試座包括一組由座體（i 〇 A )及設於座體（工 〇…底部之探針下保持器（30A)組成之測試基：（1 A )，以及多數支裝設於測試基座（丄A )中的探針（5 〇A)，該座#(1〇A)中央具有提供積體電路元件置 ,其中的定位槽（11A) ’該定位肖（11A)頂緣可 形成朝外擴張的斜面，以利積體電路元件對位置入其中 又該座體（10幻於定位槽（11Α)Γ&部—體:形有 :具有多數個陣列狀上探針孔（丄7丄Α)之探針上保持 -(1 7 A )，且座體（1 〇 A )相對於探針上保持器（1 7 A)下方設有一涵括該上探針孔（工7丄a)分佈範圍 之氣流通道（14)，座體（1〇A)上並設有至少—個 自側邊朝内延伸連通氣流通道（丄4 A )㈣氣孔（丄3 A ) ’另該座體（1 〇 A )亦可於相對於進氣孔（丄3 A ) 之另側增設至少一個由外側邊延伸連通氣流通道（丄4 A )的排氣孔（：l 5 A ) ’該探針下保持器（3 〇 a )係 對應組設於座ϋ ( i 〇A)底部’其上設有分別對應座體 (1 0 A )各上探針孔（i 7 i A )之下探針孔（3丄A ). 該多數支探針（5 0A)係以其上下端分別設於置上下對 應^上探針孔（i 7 i A )及下探針孔（3丄A )，前述 座奴（1 0 A )頂面可設置一個或以上自側邊延伸至定位 M270358 槽（1 1A)之凹槽 其中。 A )，用以提供感測元件組設 °〜七圖所示’係揭示本創作積體n 座之第二較佳實施例立體分解 乍：…-帅 看出··該測試座包括—組由座圖式中可以清楚 哭r 9 n r、 且（1 0 Β )、探針上伴转 “ 2 Ο Β )及探針下保持 t上保持 (…，以及多數支裝設於測丄二成之測試基座 (5〇B)，該座體（1〇B)座（1B”的探針 =置入/、中的疋位槽（1 1β)，該^位 緣可形成朝外擴張的斜面定 ）頂 設有-組接槽（i 2 Β) 1Β)下方 ( ο Ί R , 美供一具有多數陣列狀上 私針孔（21B)之探針上保持 設皇中，座許广Ί n D、 ）藉由螺'絲组 下"， 相對於探針上保持器（20” 下方a又有-涵括該多數上探針孔 流:道(14B)，座體上並=二I: 側邊朝内延伸連通氣流通 自 、迫（丄4 B )的進氣孔（2 另該座體（1 〇B)亦可於相對於進氣孔（1 3B)之另 側增設至少-個由外側邊 排氣孔（15B)，該探針下^ 通道（146)的 拉…， 保持器（3 0 B )可黏貼或 措螺、、.糸對應組設於座體（1〇B)底部，其上設有 應探針上保持器（20B)各上探針孔（ 探 針孔（3 1 B )，該下探 ^ 3 1 B )之數量可相同於 3夕、k針孔（2 1 B )之數量；該多數支探針（5 〇 M270358 B )係以其上下端分別設於上τ對應之上探針孔（2 1 b ) 及下探針孔（3 i B)中’且藉由探針上保持器（2 〇 b) 與座體（1 〇 B ) @為可拆、组之設計，使該探針上保持哭 (2 Ο B )可因應不同規格型式之待測積體電路元件產： 更換-對應匹配之探針上保持器（2〇B)提供探針J Ο B )組設其中；又前述座冑（丄〇 B )頂面可設置一個 或以上自側邊延伸至定位槽（i i B )之凹槽（丄6 B )， 用以提供感測元件組設其中。M270358 8. Description of the new type: [Technical field to which the new type belongs] This creation relates to a integrated circuit (1 C) component testing equipment ', especially-a type provided in the testing equipment to provide positioning of the integrated circuit component for testing purposes Design of the test seat structure. [Previous technology] In order to maintain the product quality of integrated circuit components, in addition to setting multiple detection mechanisms in the manufacturing process, after the integration of the integrated circuit components is completed, the final functionality of the integrated circuit component products is still required. Testing, in the process of testing, is to use the test stand on the testing equipment to provide a pick-up device to move the electrical component under test on it, through the probe on the test base with a plurality of probes and the tin After the ball bumps or pins are in contact, the testing equipment == performs the functional test of the integrated circuit components, and selects the standard integrated circuit component products, and eliminates the unqualified integrated circuit elements. The existing test sockets are mainly composed of Tie to-can provide integrated connection ;, the positioning of the seat corresponding to the bottom of the upper positioning slot is installed-probe upper protection, and then installed at the bottom of the seat _ probe lower holder, the probe upper holder The probe holes corresponding to the upper presets are respectively provided with 'lower applications' for detecting integrated circuit components in the testing equipment. 'It can be used for the aforementioned existing test seat. Although it can be used to detect the bearing of the device. Circuit component positioning for functional test seat. The test process of integrated circuit components will have the following ^ cattle question. However, this test M270358 1' Test yield Can't effectively improve:…, < ι > When integrated circuit components are moved to the test stand for functional testing, especially for high-power integrated circuit component products, the integrated circuit components are I can experience high temperature, because the test seat itself and the heat dissipation mechanism, so that the heat can not be effectively eliminated, resulting in integrated circuit components that should be good products after the test was misjudged as bad products, affecting the test yield and causing losses. ° < 2 > Increased transmission impedance ... Because integrated circuit components are tested on the test block, high temperatures are generated, and this high temperature is conducted to the solder ball bumps or pins adjacent to the bottom of the integrated circuit components, causing the The solder ball bumps or pins are softened by heat. The contact between the pin and the solder ball bumps or the contact quickly accumulates tin slag and acts as a chemical agent to form tin oxide. Due to the generation and accumulation of this tin oxide, the probe is formed. The increase in impedance results in the loss of signal transmission during the test. It is difficult to improve the yield of integrated circuit components. 2. The frequency of cleaning and maintenance of the probe is high, which reduces the test production efficiency: the solder ball bumps or pins on the bottom of the high-temperature circuit components generated by the integrated circuit components being tested on the test base are contaminated by heat and soften the probe, ： / Dyeable substance accumulates on the wiper needle and increases the probe impedance. Therefore, in order to reach the predetermined test yield, the probe needs to be cleaned and maintained regularly. It is not only necessary to carry out cleaning and maintenance operations. 'More impact on its test capacity. … The use of wooden needles is short. 'Increase the replacement cost of the probe: due to the accumulation of dirt on the probe', which increases the impedance of the probe; Moreover, the probe is easily deformed at high temperatures, which will affect its The precision of the M270358-inch rule between the probe itself and the test base body is prone to cause the probe to not move smoothly during the test process and increase the wear of the probe, which not only affects the service life of the probe but also increases its replacement cost. Clothing [New content] The main purpose of this creation is to provide an integrated circuit component test stand to solve the problems of poor test yield and short probe life due to the lack of an effective heat dissipation mechanism in the existing test stand. ) In order to achieve the purpose of pre-disclosure, the technical solution provided by this creation is mainly to make the integrated circuit component test base include an integrated circuit component placement fixing, H-type base and most of the support are installed on the test base, respectively. The array in the seat is equal to the sting needles, and the test base has a probe distribution interval, and the animal = channel is set on the test base to extend from the outside to the air flow == holes can be used in the test base. In the integrated circuit element hole, the oblique probe introduces cold air into the air flow channel and the probe through the air inlet hole to cool the person. 、 Combination of solder ball bumps or pins on the bottom of integrated circuit components == In the circuit component test socket, the test base can be a combination of the holder on the base and the two components, or the base Combining probes and positioning parts ;; three-member iris ensemble, such as ten holders, or a seat body design. The combination of the four components, such as the retainer and the lower probe holder, is not created. ^ ^ ^ The design of the technical solution is similar to that of the perch, d — taxi seat, its long-distance taste, T phase season. Efficacy includes at least: 1. Improve test yield: M270358 < ι > ·, reduce the high temperature generated by integrated circuit components during testing: This creation can introduce cold air to the probe and test base test base Top: Integrated circuit components, effective ^ @ Λ _, "a dissipate the volume generated during the testing of integrated circuit components to the atmosphere to ensure the quality of the test.", 里 < 2 >, reduce the test time创作 · This creation should be used when measuring the integrated circuit circuit components, because it can lead to a few ladders, 7 branches, and multiple solder ball bumps or pins at the bottom of the integrated circuit components to prevent pollution. Generates and accumulates in ... and further prevents the contact resistance of the tin oxide foot from being maintained within a predetermined range of r ~ "妫 under bumps or connections ^ ^ # & to ensure the-疋 nature of the signal transmission strength during the test, thereby improving the integrated circuit Test yield of components 2. Reduce cleaning and maintenance of the needle +, M β, Sheep's edge test production efficiency · As mentioned above, because the probe oxidation is reduced by one dollar / loss & 'users can reduce Dong + needles for cleaning and maintenance operations n reduced wood ,,徂, Yan Congyi not only reduces the manpower allocation to perform this trial production, but also measures the cleaning and maintenance operations to extend the service life of the probe, in addition to reducing the pollution of the probe's tin oxide; Replacement cost: the same as the deformation produced in the high-temperature state, dimension ^, and 'reduced because the probe is in dimensional matching accuracy, so that the probe is smooth and increase the grinding of the probe #, the heart = process will not cause irregular movement cost. In order to prolong the service life of probes and reduce their replacement [Implementation] According to the previous technical solution, the idea of 'Integrated circuit components test M270358 can be designed into at least the following specific and feasible embodiments, of which · As shown in Figures 1-3, it is a three-dimensional exploded view showing the first preferred embodiment of the integrated circuit component test stand of the creation. It can be clearly seen from the boudoir style that the test stand includes a set of base bodies ( i 〇A) and a test base consisting of a holder under the probe (30A) at the bottom of the base (work…): (1 A), and most of the probes installed in the test base (丄 A) (50 OA), the center of the seat # (1〇A) is provided with integrated circuit components, wherein the positioning groove (11A) 'the top edge of the positioning shawl (11A) can form an outwardly expanding slope to facilitate product accumulation The body circuit components are located in the same position and the base body (10 imaginary in the positioning groove (11A) Γ & Department-Body: Shaped: Hold on a probe with a plurality of array-shaped upper probe holes (丄 7 丄 Α)- (1 7 A), and the base (1 OA) is provided below the holder (1 7 A) on the probe with a cover The airflow channel (14) in the distribution range of the pinhole (7a), the base (10A) is provided with at least one airflow channel (丄 4 A) extending from the side inwards, and the air hole (丄 3 A) 'In addition, the seat (10A) may be provided with at least one exhaust hole (孔 4 A) extending from the outer side and communicating with the air flow passage (丄 4 A) on the other side of the air inlet hole (丄 3 A) (: l 5 A) 'The lower holder (30a) of the probe is correspondingly set on the bottom of the seat (iA)', and there are upper probe holes (i) corresponding to the base (1 0A) respectively. 7 i A) lower probe hole (3 丄 A). The majority of the probes (50A) are provided with upper and lower ends respectively corresponding to the upper probe hole (i 7 i A) and the lower probe. Hole (3 丄 A), the top surface of the aforementioned seat (1 0 A) may be provided with one or more grooves extending from the side to the positioning M270358 slot (1 1A). A) is used to provide a set of sensing elements ° ~ Seven pictures' show the second preferred embodiment of the n-seat of this creative product. Three-dimensional decomposition at first glance: ...-handsomely seen. The test seat includes-the group can clearly cry in the pattern of the seat r 9 nr , And (1 0 Β), with the probe on "2 Β) and the probe under the holding t (..., and most of the test base (50B) installed in the test base 20%, the base (10B) the base (1B "probe = set / 位 槽 （1 1β）, the ^ position edge can form a bevel that expands outwards. The top is provided with-assembly groove (i 2 Β) 1B) below (ο Ί R, US for one has Most of the array-like upper private pinholes (21B) have a probe set on the middle, and Xu Guangye n D,) with the screw 'wire group down', relative to the probe upper holder (20 "below a and Yes-contains the majority of the upper probe hole flow: channel (14B), and the base body is equal to two I: the side extends inward to communicate with the airflow hole (迫 4 B) of the air inlet (2 another seat The body (10B) can also be provided with at least one exhaust hole (15B) from the outer side relative to the other side of the air inlet (1 3B), the probe is pulled under the channel (146) ... The holder (30B) can be attached or attached to the bottom of the base body (10B), and there are probe holes (probe holes) on the holder (20B) for the probe. (3 1 B), the number of the ^ 3 1 B) can be the same as the number of 3 pin holes (2 1 B) The majority of the probes (50M270358 B) are provided with their upper and lower ends respectively in the upper probe hole (2 1 b) and the lower probe hole (3 i B) corresponding to the upper τ, and The upper holder (2 0b) and the base (1 0B) @ are detachable and group design, so that the probe can keep crying (2 0 B) can be produced according to different specifications of the integrated circuit components to be tested : Replacement-Corresponding matching probe holder (2〇B) provided with probe J 〇 B) set; and the top surface of the aforementioned seat (胄 〇B) can be provided with one or more extending from the side to the positioning groove (Ii B) a groove (丄 6 B) for providing a sensing element set therein.
如第九〜十一圖所不，係揭示本創作積體電路元件測 試座之第三較佳實施例立體分解示意圖，由圖式中可以清 楚看出：該測試座包括一組由座體（丄〇 C )、積體電= 元件***（40C)、探針上保持器（2〇c):探針 下保持益（3 0 C )等四構件組成之測試基座（1〇）， 以及多數支裝設於測試基座（丄c )中的探針（5 〇 c )， 該座體（1 〇 )中央具有—上下貫通狀之裝配槽（丄丄c )As shown in the ninth to eleventh figures, it is a three-dimensional exploded schematic view of the third preferred embodiment of the integrated circuit component test stand of the creation. It can be clearly seen from the figure that the test stand includes a set of base bodies (丄 〇C), integrated electric = component locator (40C), holder on the probe (20c): the test base (10) composed of four components, such as holding under the probe (30 C), And most of the probes (50c) installed in the test base (丄 c), the base (10) has a center-upper-through mounting groove (上下 c) in the center.
提供積體電路元件***（4 〇 C )對應組設其中1， 體電路元件***（4 〇 )係於-底板（4 2 C )周：2 凸設定位塊"3C)使其中央形成具有—可提供積體^ 路兀件置入其中的定位槽（4 4 c )，該底板（4 2 c ) 上且設多數個呈陣列狀之頂探針孔（4 χ C )， y 入5玄座體 (1〇 c)可於其裝配槽（丄丄c)頂緣可形成朝 的斜面’相對於裝配槽（丄丄c)下方設有一組接槽：^ 2 c )，用以提供一具有多數陣列狀上探針孔（2 1 c 10 M270358 之楝針上保持器（2 〇 C )組設其中，座體（1 〇 c )相 對於探針上保持器（2 〇 C )下方設有一涵括該多數上探 針孔（2 1 C )分佈範圍之氣流通道（1 4 C )，座體（工 0 c)上並設有至少一個自側邊朝内延伸連通氣流通道（1 4C)的進氣孔（13C)，另該座體（1〇c)亦可於 相對於進氣孔（1 3 c )之另側增設至少一個由外側邊延 伸連通氣流通道（H C )的排氣孔（圖未示），該探針 下保持裔（3 〇 C )可黏貼或藉螺絲對應組設於座體（1 〇 c)底部，其上設有分別對應探針上保持器（2 c) 各上！木針孔（2 1 C)及積體電路元件***（4〇c) 各頂探針孔（41C)之下探針孔（31C)，該下探針 (3 1 C )之數罝可對應相同於或多於上探針孔（2 1 c)、頂探針孔（4 1▲ r , 4 1 C )之數ϊ ,·該多數支探針（5 ο c )係以其上下端分 Γ, 而刀別0又於上下對應之頂探針孔（4 i 、 上仏針孔（2 1 C )及下探針孔（3 1 C )中，$ 測試基座（1 C )且夢由穑雕 ，“ . 精由積電路元件定位哭（4 Π Γ、 探針上保持器（2 〇 C )盘广 疋I口（ 4 0 C )、 與座體（ 設計，使該積體電路元件定位oc間為可拆組之 器（20c)可因應不同規格=2、）及探針上保持 品更換一組可與其對應匹 ：：：體電路-件產 C)、探針上保持器 一路-件***（40 其中。 ）提供探針（5 0 C )組設 實施例設計 本創作以前揭積體電路元件測試座較佳 M270358 當其應用於檢測設備時，以第四圖所示之… 為例，如第七、八圖所示，先依待測—乂土貝施例 、、體電路元件的才夂 型式選用相對應之探針上保持器（9 Ω th Ο B )與下保持器（3 Ο B )之門 且。又於座體（1 (2 0 B )各上探針孔（2 i B ) , T保持口口 展0又铋針（5 〇 B )， 且令探針（5 Ο B )下端分別伸入 卜万下保持器（3 Ο B )Provide integrated circuit component locator (40 ° C) corresponding set of 1, which is the circuit board locator (40) tied to-the bottom plate (4 2C) perimeter: 2 convex setting block (quote 3C) to the center Forming a positioning groove (4 4 c) into which a building element can be provided, and a plurality of top probe holes (4 χ C) in an array shape are provided on the bottom plate (4 2 c), y The 5 basal body (10c) can be formed with a slope at the top edge of its mounting groove (丄 丄 c). 'Compared with the mounting groove (丄 丄 c), a set of connection grooves: ^ 2 c), with A plurality of array-like upper probe holes (2 1 c 10 M270358) is provided in which the holder (1 0c) is opposite to the probe upper holder (2 0C). An airflow channel (1 4C) covering the distribution range of the majority of the upper probe holes (2C) is provided below the base), and at least one airflow channel extending inwardly from the side is provided on the base (work 0c). (1 4C) air inlet hole (13C), and the base body (10c) may be provided with at least one air flow channel (HC) extending from the outer side relative to the other side of the air inlet hole (1 3c) ) Exhaust hole ( (Not shown in the figure), the holder (30 ° C) under the probe can be pasted or set on the bottom of the base (10c) by screws, and the holder (2c) corresponding to the probe Up! Wooden pin hole (2 1 C) and integrated circuit component locator (4〇c), the top probe hole (41C), the lower probe hole (31C), the number of the lower probe (3 1 C)罝 may correspond to the same or more than the number of upper probe holes (2 1 c) and top probe holes (4 1 ▲ r, 4 1 C), and the majority of probes (5 ο c) are The upper and lower ends are divided into Γ, and the knife type 0 is in the corresponding upper and lower probe holes (4 i, upper pin hole (2 1 C), and lower probe hole (3 1 C)), $ test base (1 C ) And the dream is engraved, ". Fine by the integrated circuit element positioning cry (4 Π Γ, the probe on the holder (2 0C) Pan Guangyi I (4 0 C), and the base (designed so that The integrated circuit element positioning (20c) is a detachable device (20c), which can be replaced according to different specifications = 2, and the probe on the probe can be replaced with a corresponding one ::: body circuit-product C), probe Upper retainer all the way-piece locator (40 of which.) Provide probe (50 C) set Example design: This test piece is better than the previous test piece M270358. When it is applied to testing equipment, take the picture shown in the fourth picture as an example. In the example, the talent type of the body circuit element is selected by the corresponding door of the upper holder (9 Ω th Ο B) and the lower holder (3 Ο B). Put probe holes (2 i B) on the base body (1 (2 0 B)), T keeps the mouth opening 0 and bismuth needles (50B), and let the lower ends of the probes (50B) extend into Bu Wanxia retainer (3 〇 B)
相對應之下探針孔（3 1 B )中， U 再將该测試座裝設於檢 測設備的電路載板上，使每一探 、牙 1 、ο υ β )雷性；查妓雷 路載板電路上之預定位置處，且 穩壓器之導管（7〇)連接座供應器經由具有 ” 0)連接座體（1〇)側邊的進氣孔（1 3)，另將感測元件裳設於座體（1〇)上的凹槽（u Β )中，並電性連接檢測試設備的控制裝置等。 於檢測時，該檢測設備可令其 处S於船L 置裝置自積體電路元 件承載盤上吸取一積體電 — (6 0 )矛多置測試座座體 ⑴）的疋位槽（11B)中定位，此時，可經由感測 凡件判斷該積體電路元件（ " ? ^ ^ ^ ^ )疋否精確定位，又該取 置叙置並對該積體電路 皆二 门 千C 6 Ο)施以預定的壓力，如 八所不，使該積體電路元件（β 〇 φ & 凸塊（或接腳^ (6〇)底面的錫球 P丄 一母一铋針（5 〇 B)抵接一起，之後， 即由檢測設備依褚A 傻 、疋榀測步驟對該積體電路元件（6 0 ) 進订功性的檢、、目丨| , 高溫，因此，在;^由於積體電路元件進行檢測時會羞生 器將冷空氣自：;τ，該測試座並經由冷空氣供應 庄月直（1 ΟΒ)的進氣孔（1 3β)導入刻 12 M270358 試座内部的氣流通道（1 4 B )中，對夂批Η / ^ r對各钕針（5 Ο β ) 施以冷卻作用’同時經由各探針（5 木玎（ϋ ϋ β )與探針上保持 器（2〇w之上探針孔（2ΐβ)間之縫隙吹向檢測中 的積體電路元# (6 0)底部各錫球凸塊（或接腳）及元 件基板，提供冷卻作用，用以有效率地將積體電路元件 0 )測試時產生之熱量排放於外界的大氣中，避免探針（5 〇 Β )與錫球凸塊接觸部位因錫球高溫軟化而產生污毕， 並避免因此污染而使得測試阻抗升高，確保檢測的品質達 成極佳的良率’並可藉以減少探針清潔保養的頻率且可延 長其使用壽命。 【圖式簡單說明】 第一圖係本創作積體電路元件測試座第一較佳實施例 之立體分解示意圖。 第一圖係第一圖所不第一較佳實施例組合後俯視 平面示意圖及側視剖面示意圖。 第四圖係本創作積體電路元件測試座第二較佳實施例 之立體分解示意圖。 第五圖係第四圖所示第二較佳實施例組合後之立體外 觀示意圖。 第六係第四圖所示第二較佳實施例組合後俯視平面示 意圖示意圖。 第七圖係第四圖所不第二較佳實施例應用方㈣體電路 元件檢測時之側視平面示意圖。 13 M270358 第八圖為第七圖之局部放大示意圖。 第九圖係本創作積體電路元件測試座第三較佳實施例 之立體分解示意圖。 第十、十一圖係第九圖所示第三較佳實施例組合後俯 視平面示意圖及側視剖面示意圖。 【主要元件符號說明】 (1 A )測試基座 (1 1 A )定位槽 (1 4 A )氣流通道 (1 6 A )凹槽 (1 7 1 A )上探針孔 (3 0 A )探針下保持器 (5 0 A )探針 (1 B )測試基座 (IIB) 定位槽 (1 3 B )進氣孔 (1 5 B )排氣孔 (2 Ο B )探針上保持器 (3 Ο B )探針下保持器 (5 Ο B )探針 (1 C )測試基座 (IIC) 裝配槽 (1 3 C )進氣孔 (1 0 A )座體 (1 3 A )進氣孔 (1 5 A )排氣孔 (1 7 A )探針上保持器 (3 1 A )下探針孔 (1 Ο B )座體 (1 2 B )組接槽 (1 4 B )氣流通道 (1 6 B )凹槽 (2 1 B )上探針孔 (3 1 B )下探針孔 (1 0 C )座體 (1 2 C )組接槽 (1 4 C )氣流通道 M270358 (1 5 C )排氣孔 (2 0 C )探針上保持器 （2 1 C )上探針孔 (3 0 C )探針下保持器 （3 1 C )下探針孔 (4 0 C )積體電路元件***（4 1 C )頂探針孔 (4 2 C )底板 （4 3 C )定位塊 (4 4 C )定位槽 (5 0 C )探針 (60)積體電路元件 (7 0 )導管Correspondingly, in the probe hole (3 1 B), U then mounts the test socket on the circuit carrier board of the testing equipment to make each probe, tooth 1 and ο β β) thunder; At a predetermined position on the circuit board circuit, and the conduit (70) connector of the voltage stabilizer is supplied through the air inlet (1 3) on the side of the connector body (1) with "0", The measuring element is installed in the groove (u Β) on the base (10), and is electrically connected to the control device of the testing equipment. During the testing, the testing equipment can be placed on the ship L. An integrated circuit is drawn from the integrated circuit component bearing plate— (6 0) spear multi-position test base (⑴) in the positioning slot (11B). At this time, the integrated circuit can be judged by sensing all parts The circuit element ("? ^ ^ ^ ^), Whether it is accurately positioned, and it should be set and applied to the integrated circuit (two gates (C 6 〇)), such as Hachisuo, to make the product The body circuit components (β 〇φ & bumps (or pins ^ (6〇) on the bottom of the solder ball P 丄 female female bismuth pin (50B) abut together, after that, the testing equipment according to Chu A silly疋The test step performs a functional check of the integrated circuit element (60), and the temperature is high. Therefore, when the integrated circuit element is tested, it will generate cold air from: τ The test seat is introduced into the air flow channel (1 4 B) inside the 12 M270358 test seat through the air inlet (1 3β) of Zhuang Yuezhi (1 〇Β) through the cold air supply. The neodymium needle (5 Ο β) is cooled, and blown through the gap between each probe (5 玎 (玎 ϋ β) and the holder on the probe (20 〇 above the probe hole (2 ΐ β)). The integrated circuit element # (6 0) in the bottom of each solder ball bump (or pin) and the component substrate provides cooling effect to efficiently discharge the heat generated during the test of the integrated circuit element 0) to the outside In the atmosphere, avoid contact between the probe (50 Β) and the solder ball bumps due to the softening of the solder ball, resulting in contamination, and avoid the increase of the test impedance due to the pollution, ensuring that the quality of the test achieves an excellent yield. 'It can reduce the frequency of probe cleaning and maintenance and extend its service life. The figure is a three-dimensional exploded schematic view of the first preferred embodiment of the integrated circuit component test stand of the creative. The first figure is a schematic plan view and a side sectional view of the first preferred embodiment combined with the first preferred embodiment. The fourth figure It is a three-dimensional exploded schematic diagram of the second preferred embodiment of the integrated circuit component test stand of the creative. The fifth diagram is a three-dimensional appearance diagram of the second preferred embodiment shown in the fourth diagram in combination. The sixth diagram is shown in the fourth diagram. The second preferred embodiment is a schematic plan view of the top plane after combination. The seventh diagram is a schematic side plan view of the second preferred embodiment when the second preferred embodiment is applied to the detection of a rectangular circuit element. 13 M270358 Figure 8 is a partially enlarged schematic diagram of Figure 7. The ninth figure is a three-dimensional exploded view of the third preferred embodiment of the integrated circuit component test stand of the present invention. The tenth and eleventh figures are a schematic plan view and a side cross-sectional view of the rear combination of the third preferred embodiment shown in the ninth figure. [Description of main component symbols] (1 A) Test base (1 1 A) Positioning groove (1 4 A) Air flow channel (1 6 A) Groove (1 7 1 A) Probe hole (3 0 A) Under-pin holder (50 A) Probe (1 B) Test base (IIB) Positioning groove (1 3 B) Inlet hole (1 5 B) Exhaust hole (2 0 B) Probe upper holder ( 3 〇 B) Lower probe holder (5 〇 B) Probe (1 C) Test base (IIC) Assembly slot (1 3 C) Air inlet (1 0 A) Base (1 3 A) Air inlet Hole (1 5 A) exhaust hole (1 7 A) probe upper holder (3 1 A) lower probe hole (1 0 B) base body (1 2 B) assembly slot (1 4 B) air flow channel (1 6 B) Groove (2 1 B) Upper probe hole (3 1 B) Lower probe hole (1 0 C) Base body (1 2 C) Assembly slot (1 4 C) Air flow channel M270358 (1 5 C) Exhaust hole (20 C) Upper probe holder (2 1 C) Upper probe hole (3 0 C) Lower probe hole (3 1 C) Lower probe hole (4 0 C) Body circuit component locator (4 1 C) Top probe hole (4 2 C) Bottom plate (4 3 C) Positioning block (4 4 C) Positioning groove (50 C) Probe (60) Integrated circuit component (7 0) Catheter
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