M265680 四、創作說明（1) 【新型所屬之技術領域】M265680 4. Creation Instructions (1) [Technical Field to which the New Type belongs]
本新型係有關筆記型電腦下機殼的一開口的蓋子，該 開口係相對於CPU (中央處理單元）或發熱晶片等發熱元^ 件的位置者。 W 【先前技術】The present invention relates to an opening cover of a lower case of a notebook computer, and the opening is relative to a position of a heating element such as a CPU (Central Processing Unit) or a heating chip. W [Prior art]
請參閱圖1所示。目前有一些筆記型電腦1〇的下機殼 11具有一開口 111。開口 111相對於CPU (中央處理單元） 下方散熱模組12的位置。散熱模組12的側邊具有一風扇 1 3。下機殼11結合一蓋子1 4以封閉開口丨][1。風扇丨3由下 機殼11的外部13吸入空氣，如圖中箭號所示，吹向散熱模 組12 ’並將熱空氣吹向下機殼Η另一邊的外部使cpu散 熱。散熱模組12具有彈性元件，使其散熱片彈性接觸 CPU，以提升散熱效率。 已知的散熱模組係利用螺絲鎖固於主機板，主機板必 須開設相對應的螺孔，因此甚不容易在主機板上、下邊於 CP11的附近區域進行電路佈線設計。且當要更換cpu時，必 須將散熱模組連同整個CPU模組一起拆下，才能更換cpu , 更換CPU的作業很不方便。且下機殼開σ的A小必須配合 整個CPU模組的大小，因為開口較大，所以會降低下機殼See Figure 1. At present, the lower casing 11 of some notebook computers 10 has an opening 111. The position of the opening 111 relative to the heat dissipation module 12 under the CPU (Central Processing Unit). A fan 1 3 is provided on a side of the heat dissipation module 12. The lower casing 11 is combined with a cover 14 to close the opening 丨] [1. The fan 3 is sucked into the air from the outside 13 of the lower case 11, as shown by the arrow in the figure, and blows to the heat dissipation module 12 'and blows the hot air down to the outside of the case 使 to dissipate heat from the CPU. The heat dissipation module 12 has an elastic element, and its heat sink is elastically contacted with the CPU to improve heat dissipation efficiency. The known cooling module is fixed to the motherboard with screws, and the motherboard must have corresponding screw holes, so it is not easy to design circuit wiring on the motherboard and below the area near CP11. In addition, when the CPU is to be replaced, the cooling module must be removed together with the entire CPU module to replace the CPU. The operation of replacing the CPU is very inconvenient. And the lower A of the lower casing must match the size of the entire CPU module. Because the opening is larger, the lower casing will be lowered.
j強度，受外力時容易變形，而影響散熱模組壓向cpu的 力量，甚至變形太大而損壞”^。 【新型内容】 為了改善目前必須在主機板上開設螺孔，以結合散熱 模組所造成的諸多缺失，而提出本新型。j strength, easy to deform when exposed to external forces, which affects the force of the heat sink module to press the cpu, and even deforms too much and damages "^ [New content] To improve the current, it is necessary to open a screw hole on the motherboard to combine the heat sink module Many shortcomings caused by this, this new type is proposed.
M265680 本新型之主要目的，在 子’主機板不需結合散熱模 更為容易。 提供一種具動態散熱模組的蓋 組，使CPU的組裝或更換作業 本新型之另一目的’在提供一種具動態散熱模組的蓋 子，不需在主機板上開設結合散熱模組的螺孔，使在主機 板兩邊的電路佈線設計更為容易。 本新型之又一目的，在提供一種具動態散熱模組的蓋 子，使下機殼具有較小的開口，較不影響下機殼的強度， 受外力時較不會變形，而損壞以^。 本新型包括：一板體的内側邊結合一散熱模組，該散 熱模組具有一壓板，壓板的一邊延伸有複數支散熱片；一 彈性元件被結合於板體及壓板之間，使板艎彈性結合壓 板’俾使壓板彈性壓制發熱元件；本新型使主機板不需結 合散熱模組，使發熱元件如CPU等的組裝或更換作業更為 容易’並使在主機板兩邊的電路佈線設計更為容易。 本新型的其他目的、功效，請參閱圓式及實施例，詳 細說明如下。 【實施方式】 請參閱圖2、3所示。本新型第一實施例之具動態散 熱模組的蓋子，包括：一板體20具有複數個螺孔21及螺栓 孔22，其一側端具有向外凸出的卡榫23 ; —散熱模組30， 具有一壓板31，壓板31的一邊延伸有複數支散熱片32，壓 板31相對於板體20的螺孔21具有相對應的螺栓孔311 ;複 數支螺栓40的一端，分別由壓板31的外側邊穿過螺栓孔The main purpose of this new model of M265680 is to make it easier for the daughter's motherboard without the need for a heat sink. Provide a cover set with a dynamic heat dissipation module to enable the assembly or replacement of the CPU. Another purpose of the present invention is to provide a cover with a dynamic heat dissipation module without opening a screw hole for the heat dissipation module on the motherboard. To make the circuit wiring design on both sides of the motherboard easier. Yet another object of the present invention is to provide a cover with a dynamic heat dissipation module, so that the lower case has a smaller opening, which does not affect the strength of the lower case, and is less likely to deform when subjected to external forces, and is damaged. The novel model includes: a heat dissipation module is combined on the inner side of a plate body, the heat dissipation module has a pressure plate, and one side of the pressure plate is extended with a plurality of heat sinks; an elastic element is coupled between the plate body and the pressure plate, so that the plate艎 The elastic combination of the pressure plate '俾 makes the pressure plate elastically press the heating element; this new type eliminates the need for the motherboard to incorporate a heat sink module, makes it easier to assemble or replace the heating elements such as the CPU, and makes the circuit wiring design on both sides of the motherboard Easier. For other purposes and effects of the new model, please refer to the round form and the embodiment, and the detailed description is as follows. [Embodiment] Please refer to Figs. A cover with a dynamic heat dissipation module according to the first embodiment of the present invention includes: a plate body 20 having a plurality of screw holes 21 and bolt holes 22, and one side end thereof has a protruding tongue 23 protruding outward;-a heat dissipation module 30. A pressing plate 31 is provided. One side of the pressing plate 31 is provided with a plurality of fins 32. The pressing plate 31 has corresponding bolt holes 311 with respect to the screw holes 21 of the plate body 20; Outside edge through bolt hole
第6頁 M265680__ 四、創作說明（3) 311、螺旋彈簧41的中間孔，其具螺紋段螺接板體20的螺 孔21，使壓板31與板體20之間結合複數個螺旋彈簧41 ;其 中螺旋彈簧41的長度大於散熱片32的高度，使壓板31與板 體20之間的間隙大於散熱片32的高度。如圓3所示，卡榫 23置於下機殼51内側邊，複數支螺栓42的一端穿過板體20 的螺栓孔22，螺接於下機殼51相對應的螺孔内，使板體2〇 結合下機殼51並遮閉下機殼51的開口511，並使壓板31彈 性壓制CPU52，使CPU52產生的熱量傳送至散熱片 32 cCPU52結合CPU插座53，CPU插座53結合主機板54。一 風扇5 5置於散熱模組3 0的側邊，可沿圖3所示箭號的方向 帶動空氣，吹向散熱片32以帶走CPU52傳送至散熱片32的 熱量。 請參閱圖4、5所示。本新型第二實施例的散熱模組 30，係以一彈性元件33取代上述笫一實施例中的複數個螺 旋彈簧41，其他組件均相同。彈性元件33相對於壓板31的 複數個螺栓孔3 11的位置，具有相對應彆折的彈臂33 1，彈 臂331的垂直高度大於散熱片32高度，彈臂mi具有供螺栓 40穿過的螺栓孔332。使螺栓40的一端穿過的螺栓孔3 u、 332後，其具螺紋段螺接板體2〇的螺孔21。板體2〇與散熱 模組30的壓板31之間結合彈性元件33，藉由彈性元件33使 壓板31彈性壓制CPU52。 本新型上述螺栓可用其他連結構件替代，只要其一端 具有與板體的結合部相對應的結合部，如卡榫、卡槽的固 定結合構造；而另一端具有凸出部，能抵靠於壓板的一邊Page 6 M265680__ Fourth, creation instructions (3) 311, the middle hole of the coil spring 41, which has a threaded section screwed to the screw hole 21 of the plate body 20, so that a plurality of coil springs 41 are combined between the pressure plate 31 and the plate body 20; The length of the coil spring 41 is greater than the height of the heat sink 32, so that the gap between the pressure plate 31 and the plate body 20 is greater than the height of the heat sink 32. As shown by circle 3, the tenon 23 is placed on the inner side of the lower case 51, and one end of the plurality of bolts 42 passes through the bolt hole 22 of the plate body 20 and is screwed into the corresponding screw hole of the lower case 51 so that The board 20 is combined with the lower case 51 and covers the opening 511 of the lower case 51, and the pressing plate 31 elastically presses the CPU 52, so that the heat generated by the CPU 52 is transmitted to the heat sink 32 cCPU52 is combined with the CPU socket 53, and the CPU socket 53 is combined with the motherboard 54. A fan 55 is placed on the side of the heat dissipation module 30, which can drive air in the direction of the arrow shown in FIG. 3 and blow it to the heat sink 32 to take away the heat transferred from the CPU 52 to the heat sink 32. Please refer to Figures 4 and 5. The heat dissipation module 30 of the second embodiment of the present invention replaces the plurality of coil springs 41 in the first embodiment with an elastic element 33, and other components are the same. The position of the elastic element 33 relative to the plurality of bolt holes 3 11 of the pressure plate 31 has a corresponding elastic arm 33 1. The vertical height of the elastic arm 331 is greater than the height of the heat sink 32. The elastic arm mi has a space for the bolt 40 to pass through. Bolt hole 332. After one end of the bolt 40 is passed through the bolt holes 3 u and 332, the bolt 40 has a threaded section screwed to the screw hole 21 of the plate body 20. An elastic element 33 is coupled between the plate body 20 and the pressing plate 31 of the heat dissipation module 30, and the pressing plate 31 is elastically pressed against the CPU 52 by the elastic element 33. The above-mentioned bolts of the new type can be replaced by other connecting members, as long as one end has a joint portion corresponding to the joint portion of the plate body, such as a fixed joint structure of a tenon and a groove; and the other end has a protruding portion that can bear against the pressure plate. The side of
— i— M265680 四、創作說明（4) 者即可。 請參閱圖6所示。本新型下機殼5 1内側邊於開口 5 11外 圍’及相對於風扇外圍的位置設有補強板5 1 2，以加強下 機殼11結合蓋子後的強度。 本新型的特點，係使散熱模組彈性的結合於蓋子内側 邊’當蓋體結合下機殼後，即可使散熱模組彈性抵靠CPU 或發熱晶片等發熱元件，獲得較佳的傳熱效果，而不需使 散熱模組鎖固於主機板；因此打開蓋子後，即可看到 CPU，方便CPU的更換作業；當CPU插座未結合CPU時，打開 蓋子’即可看到CPU插座，方便使CPU結合CPU插座，而不 需拆下整個散熱模組及CPU模組的麻煩作業。 本新型的另一個特點，係使主機板於CPU或發熱晶片等發 熱元件四周，不必為了結合散熱模組而必須開設螺孔，而 影響主機板兩邊的電路佈線，使電路佈線的設計更為容 易。 本新型的另一個特點，係使下機殼具有較小的開口， 因此較不影響其強度；並經由補強版的設計，更可增加其 強度’受外力時較不會變形，而損壞(；1>1]，因此也可選用 較薄的金屬材料或塑膠材料製作下機殼，以節省製作費 用。 以上所記載’僅為利用本新型技術内容之實施例，任 何熟悉本項技藝者運用本新型所為之修飾、變化，皆屬本 新型主張之專利範圍，而不限於實施例所揭示者。— I— M265680 Fourth, the person who created the description (4) is sufficient. See Figure 6. A reinforcing plate 5 1 2 is provided on the inner side of the lower case 5 1 on the inner side of the opening 5 11 and on the outer side of the fan to strengthen the strength of the lower case 11 after it is combined with the cover. The characteristics of the new model are that the heat dissipation module is elastically combined with the inner side of the cover. When the cover body is combined with the lower case, the heat dissipation module can be elastically abutted against the heating elements such as the CPU or the heating chip to obtain better transmission. Thermal effect without locking the cooling module to the motherboard; therefore, after opening the cover, you can see the CPU to facilitate the replacement of the CPU; when the CPU socket is not combined with the CPU, open the cover to see the CPU socket It is convenient to combine the CPU with the CPU socket without the troublesome operation of removing the entire heat dissipation module and the CPU module. Another feature of the new model is to make the motherboard around the heat-generating components such as CPU or heating chip. It is not necessary to open screw holes in order to combine the heat dissipation module, which affects the circuit wiring on both sides of the motherboard and makes the circuit wiring design easier. . Another feature of the new model is that the lower case has a smaller opening, so it does not affect its strength; and the design of the reinforced version can increase its strength. 'It will be less deformed and damaged when exposed to external forces (; 1 > 1], so you can also choose to use a thinner metal or plastic material to make the lower case to save production costs. The above-mentioned 'only examples using the new technical content, anyone who is familiar with this technology uses this The modifications and changes made by the new model are within the scope of the patent claimed by the new model, and are not limited to those disclosed in the embodiments.
第8頁 M265680 囷式簡單說明 圖式簡單說明·· 圓1為習知筆記型電腦下機殼結合一蓋子的立體示意圖。 圓2為本新型具動態散熱模組的蓋子第一實施例的分解狀 態示意圖。 圖3為本新型具動態散熱模組的蓋子第一實施例的側視及 部分剖面示意圖。 圓4為本新型具動態散熱模組的蓋子第二實施例的分解狀 態示意圖。 圓5為本新型具動態散熱模組的蓋子第二實施例的側視及 部分剖面示意圖。 圖6為本新型下機殼内側邊示意圊。 主要部分之代表符號： 10 筆記型電腦 11 、51下機 111 、511 開口 12 散熱模組 13 風扇 14 蓋子 20 板體 21 螺栓孔 22 ' 311、3 3 2螺栓孔 23 卡榫 30 散熱模組 31 壓板 32 散熱片 33 彈性元件 331 彈臂 40 、42螺栓 41 螺旋彈簧 512 補強板 52 CPU 53 CPU插座 54 主機板 55 風扇Page 8 M265680 Simple description of 囷 style Simple illustration of diagram · Circle 1 is a three-dimensional schematic diagram of the lower case of a conventional notebook computer combined with a cover. Circle 2 is a schematic exploded view of the first embodiment of the novel cover with a dynamic heat dissipation module. FIG. 3 is a side view and a partial cross-sectional view of a first embodiment of a cover with a dynamic heat dissipation module of the new type. Circle 4 is a schematic exploded view of the second embodiment of the cover with a dynamic heat dissipation module. Circle 5 is a side view and a partial cross-sectional view of the second embodiment of the cover of the new type with a dynamic heat dissipation module. Figure 6 is a schematic illustration of the inner side of the lower case of the new model. Representative symbols of the main parts: 10 Notebook computer 11, 51 down 111, 511 opening 12 cooling module 13 fan 14 cover 20 board 21 bolt hole 22 '311, 3 3 2 bolt hole 23 latch 30 cooling module 31 Pressure plate 32 Heat sink 33 Elastic element 331 Spring arm 40, 42 bolt 41 Coil spring 512 Reinforcing plate 52 CPU 53 CPU socket 54 Mother board 55 Fan