M263651 八、新型說明： 【新型所屬之技術領域】 本案係關於一種電子卡之導電殼結構，尤指一種小型 電子卡之導電殼結構。 【先前技術】 近來’因為媒介的轉變導致電子卡的應用甚廣，並有 逐漸小型化之趨勢，諸如數據卡（m〇dera card)、網路卡 (Local Area Network card，LAN card)以及記憶卡（memory card)等等。電子卡常見的國際標準規格有pCMCIA卡與快 閃記憶卡（Compact Flash card，CF card)以及安全數位卡 (secure digital card)或多媒體記憶卡（multimedia mem〇ry card，MMC CARD)等，且新的規格標準亦不斷地在發展當 中。这些電子卡的規格細節雖有差異，惟其封裝的方式與 結構則大同小異…般來說，好卡之封裝必須提供足夠 的機械強度及電氣性能，’且至少須符合某些敎的標準 (standard)規範’再者，封裝電子卡所使狀方法還必需適 用於封裝製程，如此才能鈞士曰从丄士… 不犯夠大1的生產製造，當然結構強 度以及封裝成本的考量更是發展電子卡之重點。 傳統的電子卡封裝社播士夕 ^ 衣、、。構大多將上下的兩個導電殼之 周、、彖向下=折亚以卡合的方式使導電殼與㈣外框結合 後再、:二^口具Ο001)將上下的兩個導電殼鉚合起來，並 包封住塑膠框及印刷電路杌 + 兒峪板。由於此種電子卡之導電殼必 須事先經歷彎折的製程，再血询μ 再與塑膠框以卡合的方式結合，M263651 8. Description of the new type: [Technical field to which the new type belongs] This case relates to a conductive shell structure of an electronic card, especially a conductive shell structure of a small electronic card. [Previous Technology] Recently, electronic cards have been widely used due to the change of media, and there is a trend towards miniaturization, such as data cards, local area network cards (LAN cards), and memories. Card (memory card) and so on. Common international standard specifications for electronic cards include pCMCIA cards, Compact Flash cards (CF cards), secure digital cards (multimedia memry cards, MMC CARD), etc., and new The specifications are constantly being developed. Although the specifications and details of these electronic cards are different, their packaging methods and structures are similar. Generally speaking, the packaging of a good card must provide sufficient mechanical strength and electrical performance, and must meet at least some of the standards Standards. Furthermore, the method used to package an electronic card must also be applied to the packaging process, so that the soldiers can be regarded as a sergeant ... Do not make a large enough production, of course, the consideration of structural strength and packaging cost is the development of electronic cards. Focus. Traditional electronic card packaging agencies broadcast Shi Xi ^ clothing ,,. The structure mostly combines the circumference of the upper and lower conductive shells, 彖 down = Zia Ya to engage the conductive shell and the outer frame of the ㈣ in an engaging manner, and then: two ^ mouth with 0001) riveting the upper and lower conductive shells Close them together and enclose the plastic frame and printed circuit board + daughter board. Since the conductive shell of this type of electronic card must undergo a bending process in advance, the blood is inquired μ and then combined with the plastic frame in an engaging manner.
如此會使彳亍導電殼與塑豚拖T 义胗框不能緊密的連接在一起。而 M263651 且，由於導電殼係以彎折的方式所製成，因此整體結構之 機械強度較差，所能承受的扭曲力量不足，當電子卡受到 外力或撓曲力量作用時，導電殼便很容易會因為小小的外 來力量而發生凹陷或變形，進而還可能從塑膠框體上鬆動 與脫落。 請參閱第一圖，其係為目前電子卡封裝結構所使用之 立體導電殼結構不意圖。立體導電殼1係由金屬材料片利 用金屬延展性以拉伸（draft)之方式所形成，並藉由埋入射 出（INSERT MOLDING)成形或能量波植入等方式使得塑膠 框體（未圖示）之部分塑膠材料固著於該立體導電殼1周圍 之該等連接部11内，以加強塑膠框體與立體導電殼1之 間連結的強度，藉此可解決傳統電子卡之導電殼由於整體 結構之機械強度差，抗扭曲力量小，而在電子卡受外力或 撓曲力量影響時，容易產生凹陷變形或斷裂的缺失。 但上述導電殼結構與方法亦有缺點’亦即在以金屬材 料片形成立體導電殼1之抽拉過程中，由於受到立體導電 殼之金屬材料片厚度與延展性的影響，當金屬材料片抽拉 至實質上一段距離後，金屬可能就會斷裂或龜裂，尤其 是，轉角部12的位置部位，因同時受到向上的拉力以及 兩側的擠壓，應力的交互作用更容易造成轉角部12發生 斷裂或龜裂，如此一來，將影響整個立體導電殼之機械強 度以及抗扭曲力量。此外，金屬斷裂與龜裂的方向與程度 會使得當立體導電殼1與塑膠框體以埋入射出（insert MOLDING)成形或能量波植入等方式結合後，仍無法埋入 M263651 塑膠框體内，造成電子卡封裝不良的影響。特別是厚度在 0.06mm以下之立體導電殼，所可能發生斷裂與龜裂的機 率就更加提高，問題也更為嚴重。 因此，如何發展一種可改善上述習知技術之缺失且加 強小型電子卡之強度與結合度之電子卡封裝結構，實為目 前需要解決之問題。 【新型内容】 本案之主要目的在於提供一種電子卡之導電殼結 構，改善該導電殼於製造過程中，因金屬片抽拉所產生之 應力交互作用所造成轉角部金屬斷裂或龜裂的情形，並增 加導電殼整體的機械強度以及抗扭曲力量。此外，亦可以 使金屬片不因無法預期之斷裂與龜裂的方向與程度，而使 成型之導電殼無法與塑膠框體結合，影響整個電子卡之結 構。 為達上述目的，本案之一較廣義實施樣態為提供一種 電子卡之導電殼結構，其係為一體成型，且包括：一本體， 其具有一頂面與複數個側面，以該頂面與兩相鄰之該侧面 所連接之部位定義出複數個轉角部，其中至少一轉角部上 具有至少一空缺部；藉以，利用該空缺部防止導電殼於製 造過程中發生斷裂或龜裂，其中該導電殼於成型前係為一 金屬板。 於實施例中，該空缺部與該本體之該頂面間具有實質 上一特定距離，且空缺部係以於該轉角部上開孔、去除或 M263651 切斷部分金屬板的方式而形成，其中空缺部係可呈開孔、 直角、四分之一圓等形狀。其中該空缺部與該本體之頂面 間具有實質上一特定距離。 根據本案上述之構想，其中該電子裝置係為一安全數 位卡（secure digital card, SD CARD)、一 多媒體記憶卡 (multimedia memory card，MMC CARD)之封裝結構、一隨 身碟或一智慧型記憶卡。 本案之進一步更提供一種電子卡之封裝結構，其係包 含一立體導電殼以及一塑膠框體，其中，立體導電殼係由 金屬板拉伸而成，且具有一本體，其中本體更包含有一頂 面與複數個侧面，該複數個侧面上係設有複數個連接部， 且將該頂面與兩相鄰之該侧面所連接之部位定義為複數 個轉角部，而該轉角部上具有至少一空缺部，而塑膠框體 係藉由一加工方式使其部分塑膠材料固著於該立體導電 殼之該等連接部以及該空缺部，並固定於該立體導電殼下 方，其中該塑膠框體中更可容置一電路板。藉以，利用該 空缺部防止立體導電殼於製造過程中發生斷裂或龜裂，並 藉由該連接部以及該空缺部使該塑膠框體得以固定於該 立體導電殼下，以形成電子卡之封裝結構。 根據本案上述之構想，其中該立體導電殼係藉由向上 拉伸一金屬板而製成。 根據本案上述之構想，其中該加工方式係選自埋入射 出（INSERT MOLDING)、植入、卡扣、超音波接合或高週 波接合方式。 M263651 根據本案上述之構想，其中該空缺部係於該轉角部上 以開孔、去除或切斷部分金屬板的方式而形成。 根據本案上述之構想，其中該空缺部係呈開孔、直角、 四分之一圓之形狀。 根據本案上述之構想，其中該空缺部與該本體之該頂 面間具有一特定距離。 - ^ 根據本案上述之構想，其中該塑膠框體之内部係具有 一容置空間，以容置電子卡之内部電路元件。 根據本案上述之構想，其中該電子卡係為一安全數位 卡（secure digital card，SD CARD) 〇 立根據本案上述之構想，#中該電子卡係為一多媒體記 十思卡（multimedia memory card，MMC CARD)。 根據本案上述之構想，其中該電子卡係為隨身碟。 根據本案上述之構想，其巾該電子卡係為智慧型記憶 板 根據本案上述之構想，其中該電路板係為—印刷電路 且佈設有記憶體以及/或電子元件。 【實施方式】 體現本案特徵與優點的—些典型實施例將在後段的 明中詳細敘述。應理解的是本案能夠在不同的且 =各種的變化’其皆不脫離本案的範圍，且其中;;說明i 圖示在本質上係當作說明之用，而非用以限制本案。 本案電子卡之導電殼結構係為利用抽拉而—體成型 M263651 之立體導電殼，其主要包含一本體，該本體更包含有一頂 面與複數個侧面。該複數個侧面上係設有複數個連接部， 且將該頂面與兩相鄰之該侧面所連接之部位定義為複數 個轉角部。而該轉角部上具有至少一空缺部，如此便可避 免導電殼於製造過程中，因抽拉金屬片所產生應力交互作 用使導電殼之轉角部發生斷裂或龜裂的情形。 請參閱第二圖（A )，其係為本案第一較佳實例之導電殼 於成型前之俯視圖。如第二圖（A)所示，於導電殼2尚未成 型前，係為一金屬板，將金屬板上規劃一頂面21以及複 數個側面24,頂面21與每兩相鄰側面24所連接的部份則 定義為轉角部23，於轉角部23上與頂面21相距W之距 離處設一孔洞狀之空缺部22。當金屬板經過抽拉成型之 後，係可成為如第二圖（B)所示之一體成型之導電殼2，第 二圖（B)係為本案第一較佳實施例之導電殼之結構示意 圖。接著，請參閱第二圖CC)，其係為第二圖（B)中導電殼 之轉角部23之局部26放大圖，其中，由於金屬片受到抽 拉時，呈孔洞狀之空缺部22係具有空間可承受由頂面21 與側面24傳來之應力推擠，因此導電殼2之轉角部23不 會因為抽拉成型後，發生斷裂或龜裂的情形，而且，空缺 部22與頂面21之間係具有特定距離W，當導電殼2欲與 電子卡之塑膠框體（未圖示）結合時，便可利用該特定距離 W之金屬片作為與塑膠框體（未圖示）扣合之接觸端，再藉 由埋入射出（INSERT MOLDING)成形或超音波植入等方式 使得塑膠框體（未圖示）之部分塑膠材料固著於該立體導 M263651 電殼2周圍之等連接部與空缺部22内，以加強塑膠框體 (未圖不）與導電殼2之間連結的強度’如此，導電殼2 便可與塑膠框體（未圖示）緊密接合。 本案之第二較佳實施例以去除之方式來實踐。請參閱 第三圖（A)其係為本案第二較佳實例之導電殼於成型前之 俯視圖。如第三圖（A)所示，於導電殼2尚未成型前，係將 金屬板上規劃一頂面31以及複數個侧面34,頂面31與每 兩相鄰侧面34所連接的部份則定義為轉角部33，於轉角 部33上與頂面21相距W之距離以外的金屬板去除，而形 成一個四分之一圓之空缺部32，當金屬板經過抽拉成型 後，便可成為如第三圖（B)所示之一體成型之導電殼3，第 三圖（B)係為本案第二較佳實施例之導電殼結構示意圖，接 著，請參閱請參閱第三圖（C)，其係為第三圖（B)中導電殼 之轉角部33之局部36放大圖，於放大立體導電殼3之局 部轉角部35，我們可以看到除了由轉角部33上與頂面21 之距離W外，轉角部33以下之金屬板均被去除，而留下 一個空缺部32。其中由於空缺部32係具有空間可承受由 頂面31與侧面34傳來之應力推擠，因此導電殼3之轉角 部33不會因為抽拉成型後，發生斷裂或龜裂的情形，而 且，空缺部32與頂面31之間係具有特定距離W，當導電 殼3欲與電子卡之塑膠框體（未圖示）結合時，便可利用該 特定距離W之金屬片作為與塑膠框體（未圖示）扣合之接觸 端，再藉由埋入射出（INSERT MOLDING)成形或超音波植 入等方式使得塑膠框體（未圖示）之部分塑膠材料固著於 M263651 该立體導電设3周圍之專連接部與空缺部32内，以加強 塑膠框體（未圖示）與導電殼3之間連結的強度，如此， 導電殼3便可與塑膠框體（未圖示）緊密接合。 本案之第三較佳實施例以切斷之方式來實踐。請參閱 第四圖（A)，其係為本案第三較佳實例之導電殼於成型前之 俯視圖。如弟四圖（A)所不’於導電殼4尚未边型前，亦將 一金屬板上規劃一頂面41以及複數個侧面44，頂面41與 每兩相鄰側面44所連接的部份則定義為轉角部43，在於 轉角部4 3相距實質上A之距離沿頂面框線4 5虛線切斷一 _ 直角切口 42，其中由於金屬片受到抽拉時，直角切口 42 係具有空間可承受由頂面41與側面44傳來之應力推擠， 因此導電殼4之轉角部43不會因為抽拉成型後，發生斷 裂或龜髮的情形’而且’直角切口 42與頂面41之間係1 有特定距離A，當導電殼4欲與電子卡之塑膠框體（未圖示） 結合時，便可利用該特定距離A之金屬片作為與塑膠框體 (未圖示）扣合之接觸端，再藉由埋入射出（insert MOLDING)成形或超音波植入等方式使得塑膠框體（未圖 鲁 示）之部分塑膠材料固著於該立體導電殼4周圍之等連接 部與直角切口 42内，以加強塑膠框體（未圖示）與導電 殼4之間連結的強度，如此，導電殼4便可與塑膠框體（未 圖示）緊密接合。 本案之電子卡之導電殼結構主要應用於安全數位卡 (secure digital card，SD CARD)或多媒體記憶卡（multimedia memory card，MMC CARD)等小型電子卡，當然一般市面 12 M263651 . 上常見之電子卡，例如隨身碟、智慧型記憶卡、數據卡 (modern card)、網路卡（Local Area Network card，LAN card) 以及記憶卡（memory card)等等亦可應用本案之技術。 綜上所述’本案電子卡之導電殼結構之立體導電殼係 利用拉伸金屬材料之方式所形成，並於拉伸過程前在該金 屬板之複數個轉角部預先以開孔、去除或切斷的方式將複 數個轉角部上之金屬板去除。抽拉成型之後，再藉由埋入 射出（INSERT MOLDING)成形或超音波植入等方式使得塑 膠框體之部分塑膠材料固著於該立體導電殼周圍之等連 φ 接部以及該預先開孔、去除或切斷之孔洞内，如此不但可 使得立體導電殼於拉伸的過程中，不容易發生龜裂或斷裂 的現象，而且，更重要的，還可使得立體導電殼之結構較 先前技術之導電殼更加穩固並加強立體導電殼之機械強 度以及抗扭曲強度。 本案更進一步改善了習知以彎折方式所製成之導電 殼容易因為小小的外力而凹陷、變形、或扭曲的困擾。另 _ 一方面’改善導電殼在抽拉過程中金屬材料片在應力的交 互作用下’造成轉角部的金屬容易斷裂或龜裂，並增加整 體的機械強度以及抗扭曲力量。此外，亦可以使金屬材料 片不因為無法預期之斷裂與龜裂的方向與程度，而造成成 型之立體導電殼無法埋入塑膠框體内，造成電子卡之不 良，此外，還可改善因不良產品造成成本上揚的問題。是 以，本案之電子卡之導電殼結構極具產業之價值，爰依法 提出申請。 13 M263651 本案得由熟知此技術之人士任施匠思而為諸般修 飾，然皆不脫如附申請專利範圍所欲保護者。 【圖式簡單說明】 第一圖：其係為目前電子卡之立體導電殼結構示意圖。 第二圖(A):本案第一較佳實例之導電殼於成型前之俯視圖。 第二圖(B):本案第一較佳實施例之導電殼結構示意圖。 第二圖(C):其係為本案第一較佳實施例之導電殼轉角部局部放 大圖。 第三圖(A) ··本案第二較佳實例之導電殼於成型前之俯視圖。 第三圖(B):本案第二較佳實施例之導電殼結構不意圖。 第三圖(C):本案第二較佳實施例之導電殼轉角部局部放大圖。 第四圖(A):本案第三較佳實例之導電殼於成型前之俯視圖。 第四圖(B):本案第二較佳貫施例之導電殼結構不意圖。 第四圖(C》本案第三較佳實施例之導電殼轉角部局部放大圖。 11 :連接部 2 :金屬板 22 :空缺部 24 :侧面區 H·.侧面高度 3:立體導電殼 【主要元件符號說明】 1 :立體導電殼 12 :轉角部 21 ·頂面區 23 :轉角部 W:空缺部與轉角部之距 26 :局部轉角部 M263651 31 ·頂面區 33 :轉角部 35 :局部轉角部 41 :頂面框線 43 :轉角部 45侧面框線 46 :局部轉角部 32 :空缺部 34 ·側面區 4:立體導電殼 42 :切劃處 44 :侧面區 A ··切劃處與轉角部之距In this way, the conductive shell of the puppet and the plastic dome T can not be tightly connected together. And M263651, because the conductive case is made by bending, the mechanical strength of the overall structure is poor, and the torsional force it can withstand is insufficient. When the electronic card is subjected to external or flexural forces, the conductive case is easy It will sag or deform due to a small external force, and may loosen and fall off from the plastic frame. Please refer to the first figure, which is not intended for the three-dimensional conductive shell structure used in the current electronic card packaging structure. The three-dimensional conductive shell 1 is formed by a metal material sheet in a drafting manner using metal ductility, and a plastic frame (not shown) is formed by insert molding or energy wave implantation. ) Part of the plastic material is fixed in the connecting portions 11 around the three-dimensional conductive shell 1 to strengthen the strength of the connection between the plastic frame and the three-dimensional conductive shell 1, so that the conductive shell of the traditional electronic card can be solved due to the overall The mechanical strength of the structure is poor, and the anti-twisting force is small. When the electronic card is affected by external force or flexing force, it is easy to cause the lack of deformation or fracture. However, the above-mentioned conductive shell structure and method also have disadvantages. That is, during the drawing process of forming the three-dimensional conductive shell 1 with a sheet of metal material, due to the influence of the thickness and ductility of the sheet of metal material of the three-dimensional conductive shell, After being pulled to a substantial distance, the metal may break or crack. In particular, the position of the corner portion 12 is subject to upward tension and compression on both sides at the same time, and the interaction of stress is more likely to cause the corner portion 12 Fracture or cracking occurs, which will affect the mechanical strength and anti-torsion strength of the entire three-dimensional conductive shell. In addition, the direction and extent of metal breakage and cracking will prevent the three-dimensional conductive shell 1 from being embedded in the M263651 plastic frame after being combined with insert molding or energy wave implantation. , Resulting in poor packaging of electronic cards. Especially for three-dimensional conductive shells with a thickness of less than 0.06mm, the probability of cracking and cracking may increase, and the problem is more serious. Therefore, how to develop an electronic card packaging structure that can improve the lack of the above-mentioned conventional technologies and enhance the strength and combination of small electronic cards is a problem that needs to be solved at present. [New content] The main purpose of this case is to provide a conductive shell structure of an electronic card, to improve the situation where the corner metal is broken or cracked during the manufacturing process due to the interaction of the stress caused by the pulling of the metal sheet, And increase the overall mechanical strength of the conductive shell and anti-twisting force. In addition, it is also possible to prevent the metal sheet from being broken and cracked in unexpected directions and degrees, so that the formed conductive shell cannot be combined with the plastic frame, affecting the structure of the entire electronic card. In order to achieve the above purpose, one of the broader aspects of this case is to provide a conductive shell structure of an electronic card, which is integrally formed and includes: a body having a top surface and a plurality of side surfaces, and the top surface and the A plurality of corner portions are defined at the positions connected by two adjacent sides, and at least one corner portion has at least one vacant portion; thereby, the vacant portion is used to prevent the conductive shell from being broken or cracked during the manufacturing process, wherein The conductive shell is a metal plate before forming. In an embodiment, the vacant portion has a substantially specific distance from the top surface of the body, and the vacant portion is formed by making a hole in the corner portion, removing or cutting a part of the metal plate by M263651, wherein The vacant part can be in the shape of an opening, a right angle, a quarter circle, and the like. The vacant portion and the top surface of the body have a substantially specific distance. According to the above-mentioned concept of the present case, the electronic device is a package structure of a secure digital card (SD CARD), a multimedia memory card (MMC CARD), a flash drive, or a smart memory card . This case further provides an electronic card packaging structure, which includes a three-dimensional conductive shell and a plastic frame, wherein the three-dimensional conductive shell is stretched from a metal plate and has a body, wherein the body further includes a top Surface and a plurality of side surfaces, a plurality of connecting portions are provided on the plurality of side surfaces, and a portion connecting the top surface and two adjacent side surfaces is defined as a plurality of corner portions, and the corner portions have at least one The vacant part, and the plastic frame system fixes part of the plastic material to the connection parts and the vacant part of the three-dimensional conductive case by a processing method, and is fixed below the three-dimensional conductive case. Can accommodate a circuit board. Thereby, the vacant portion is used to prevent the three-dimensional conductive shell from being broken or cracked during the manufacturing process, and the plastic frame is fixed under the three-dimensional conductive shell by the connecting portion and the vacant portion to form an electronic card package. structure. According to the above idea of the present case, the three-dimensional conductive shell is made by stretching a metal plate upward. According to the above-mentioned concept of the present case, the processing method is selected from the group consisting of INSERT MOLDING, implantation, buckle, ultrasonic bonding or high-frequency bonding. M263651 According to the above-mentioned concept of the present case, the vacant portion is formed on the corner portion by making holes, removing or cutting a part of the metal plate. According to the above-mentioned concept of the case, the vacant portion is in the shape of an opening, a right angle, and a quarter circle. According to the above-mentioned concept of the present case, there is a specific distance between the vacant portion and the top surface of the body. -^ According to the above-mentioned concept of the present case, the inside of the plastic frame body has a containing space for containing the internal circuit components of the electronic card. According to the above concept of the case, the electronic card is a secure digital card (SD CARD). According to the above concept of the case, the electronic card in # is a multimedia memory card. MMC CARD). According to the above-mentioned concept of the case, the electronic card is a flash drive. According to the above-mentioned concept of the present case, the electronic card is a smart memory board. According to the above-mentioned concept of the present case, the circuit board is a printed circuit and is provided with a memory and / or electronic components. [Embodiments] Some typical embodiments that embody the features and advantages of this case will be described in detail in the description in the following paragraphs. It should be understood that the present case can be different and = various changes' which do not depart from the scope of the present case, and among them; the description i diagram is essentially used for illustration, not to limit the case. The conductive shell structure of the electronic card in this case is a three-dimensional conductive shell made of M263651 by drawing, which mainly includes a body, and the body further includes a top surface and a plurality of sides. A plurality of connecting portions are provided on the plurality of side surfaces, and a portion where the top surface is connected to two adjacent side surfaces is defined as a plurality of corner portions. The corner portion has at least one vacant portion, so that the conductive shell can be prevented from being broken or cracked during the manufacturing process due to the interaction of stress generated by pulling the metal sheet. Please refer to the second figure (A), which is a top view of the conductive case of the first preferred embodiment of the present invention before molding. As shown in the second figure (A), before the conductive case 2 is formed, it is a metal plate. The metal plate is planned with a top surface 21 and a plurality of side surfaces 24. The top surface 21 and each two adjacent side surfaces 24 The connected portion is defined as a corner portion 23, and a hole-shaped void portion 22 is provided on the corner portion 23 at a distance W from the top surface 21. After the metal plate is drawn and formed, it can become a conductive shell 2 formed as a body as shown in the second figure (B). The second figure (B) is a schematic diagram of the structure of the conductive case of the first preferred embodiment of the present invention. . Next, please refer to the second figure CC), which is an enlarged view of a part 26 of the corner portion 23 of the conductive shell in the second figure (B), in which, when the metal sheet is pulled, the void 22 There is space to withstand the stress from the top surface 21 and the side surface 24, so the corner portion 23 of the conductive case 2 will not break or crack due to drawing, and the vacant portion 22 and the top There is a specific distance W between the surfaces 21. When the conductive shell 2 is to be combined with the plastic frame (not shown) of the electronic card, a metal piece with the specific distance W can be used as the plastic frame (not shown). The contact end of the buckle is then fixed by INSERT MOLDING or ultrasonic implantation to make part of the plastic material of the plastic frame (not shown) fixed around the three-dimensional M263651 electrical housing 2. In the connecting portion and the vacant portion 22, the strength of the connection between the plastic frame body (not shown) and the conductive case 2 is strengthened. Thus, the conductive case 2 can be tightly joined with the plastic frame body (not shown). The second preferred embodiment of this case is practiced in a removing manner. Please refer to the third figure (A), which is a top view of the conductive case of the second preferred embodiment of the present invention before molding. As shown in the third figure (A), before the conductive shell 2 has been formed, a top surface 31 and a plurality of side surfaces 34 are planned on the metal plate. The portion connecting the top surface 31 and every two adjacent side surfaces 34 is It is defined as the corner portion 33. The metal plate is removed from the corner portion 33 away from the top surface 21 by a distance of W, and a quarter-round void portion 32 is formed. When the metal plate is formed by drawing, it can become The conductive shell 3 is formed as a body as shown in the third figure (B). The third figure (B) is a schematic view of the structure of the conductive shell of the second preferred embodiment of the present invention. Then, please refer to the third figure (C). It is an enlarged view of a part 36 of the corner portion 33 of the conductive case 3 in the third figure (B). When the local corner portion 35 of the three-dimensional conductive case 3 is enlarged, we can see that except the corner portion 33 and the top surface 21 Outside the distance W, the metal plates below the corner portion 33 are removed, leaving a vacant portion 32. Among them, since the vacant portion 32 has a space to withstand the stress from the top surface 31 and the side surface 34, the corner portion 33 of the conductive case 3 will not be broken or cracked after being drawn, and There is a specific distance W between the vacant portion 32 and the top surface 31. When the conductive shell 3 is to be combined with a plastic frame (not shown) of the electronic card, a metal sheet with the specific distance W can be used as a plastic frame. The contact end of the body (not shown) is buckled, and then part of the plastic material of the plastic frame (not shown) is fixed to the three-dimensional conductive body by INSERT MOLDING molding or ultrasonic implantation. The special connection part around the 3 and the vacant part 32 are set to strengthen the connection strength between the plastic frame (not shown) and the conductive case 3, so that the conductive case 3 can be tightly connected to the plastic frame (not shown). Join. The third preferred embodiment of this case is practiced in a cut-off manner. Please refer to the fourth figure (A), which is a top view of the conductive case of the third preferred embodiment of the present invention before molding. As described in the fourth figure (A), before the conductive shell 4 is not shaped, a top surface 41 and a plurality of side surfaces 44 are also planned on a metal plate, and the top surface 41 and each adjacent two side surfaces 44 are connected to each other. The portion is defined as the corner portion 43. The corner portion 43 is substantially a distance away from the corner portion A along the top surface line 4 5 and a dashed line is cut off. A right-angled cut 42 has a space when the metal sheet is pulled. It can withstand the stress from the top surface 41 and the side surface 44. Therefore, the corner portion 43 of the conductive shell 4 will not break or turbine after being drawn. Also, the right-angled cut 42 and the top surface 41 There is a specific distance A between the two. When the conductive case 4 is to be combined with the plastic frame (not shown) of the electronic card, the metal piece with the specific distance A can be used as a buckle with the plastic frame (not shown). After the contact ends are closed, part of the plastic material of the plastic frame (not shown) is fixed to the connection parts around the three-dimensional conductive shell 4 by insert molding or ultrasonic implantation. And right-angled cutout 42 to strengthen the plastic frame (not shown) and conductive 4 between the connecting strength, so the conductive housing can and the plastic frame body 4 (not shown) in close contact. The conductive shell structure of the electronic card in this case is mainly applied to small electronic cards such as secure digital card (SD CARD) or multimedia memory card (MMC CARD). Of course, the general market is 12 M263651. Common electronic cards For example, a USB flash drive, a smart memory card, a modern card, a local area network card (LAN card), and a memory card can also be used in this case. In summary, the three-dimensional conductive shell of the conductive shell structure of the electronic card in this case is formed by drawing a metal material, and before the drawing process, a plurality of corners of the metal plate are pre-cut, cut or cut in advance. The broken way removes the metal plates on the corners. After being drawn and formed, part of the plastic material of the plastic frame is fixed to the equal φ connection portion around the three-dimensional conductive shell and the pre-opening by means of INSERT MOLDING or ultrasonic implantation. , Removing or cutting the holes, this not only makes the three-dimensional conductive shell not easy to crack or break during the stretching process, but also, more importantly, it can also make the structure of the three-dimensional conductive shell more than the prior art. The conductive shell is more stable and strengthens the mechanical strength and anti-twist strength of the three-dimensional conductive shell. This case further improves the problem that the conventional conductive case made by bending is easily sunken, deformed, or twisted due to a small external force. On the other hand, ‘improving the interaction of the metal sheet under the stress during the drawing process of the conductive shell’ causes the metal at the corners to easily break or crack, and increases the overall mechanical strength and resistance to twisting. In addition, the direction and extent of the metal material sheet can not be caused by the unexpected direction and degree of fracture and cracking, and the formed three-dimensional conductive shell cannot be buried in the plastic frame, which causes the failure of the electronic card. The problem of rising costs caused by products. Therefore, the conductive shell structure of the electronic card in this case is of great industrial value, and the application was filed in accordance with the law. 13 M263651 This case can be modified by anyone who is familiar with this technology, but none of them can be protected by the scope of the patent application. [Brief description of the drawings] The first picture: it is a schematic diagram of the three-dimensional conductive shell structure of the current electronic card. Second image (A): The top view of the conductive case of the first preferred example of the case before molding. The second figure (B): a schematic view of the structure of the conductive shell of the first preferred embodiment of the present case. The second figure (C) is a partially enlarged view of the corner portion of the conductive case of the first preferred embodiment of the present invention. The third figure (A) is a top view of the conductive case of the second preferred example before the molding. Third figure (B): The conductive shell structure of the second preferred embodiment of this case is not intended. The third figure (C): a partially enlarged view of the corner portion of the conductive case of the second preferred embodiment of the present case. The fourth figure (A): the top view of the conductive case of the third preferred example before the molding. The fourth figure (B): the conductive shell structure of the second preferred embodiment of this case is not intended. The fourth figure (C) is a partially enlarged view of the corner portion of the conductive case of the third preferred embodiment of the case. 11: Connection portion 2: Metal plate 22: Vacant portion 24: Side area H .. Side height 3: Three-dimensional conductive case [Mainly Description of component symbols] 1: Three-dimensional conductive case 12: Corner portion 21 · Top surface area 23: Corner portion W: Distance between the vacant portion and the corner portion 26: Partial corner portion M263651 31 · Top surface area 33: Corner portion 35: Partial corner Section 41: Top frame line 43: Corner portion 45 Side frame line 46: Partial corner portion 32: Notched portion 34Side area 4: Three-dimensional conductive shell 42: Cut-out area 44: Side-side area A. Cut-out area and corner Department distance
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