M262969 八、新型說明： 【新型所屬之技術領域】 本新型係有關一種應用於液晶顯示屏之散熱架構，應用於背光 模組熱量的均勻分佈並迅速散去。 【先前技術】 月光杈組如電漿電視，液晶電視及電腦用之平面顯示器，其 中液晶本身並不會發光，其發光方式係採背光源（直下式背光模 ，’主要係由背光模組提供顯示所需光源，光源必須亮度高且均 勻，内部主要由複數支冷陰極燈管（_⑽他Fl_s_ =mp fFL)構成’由於燈管發光產生熱，且背光模組為一封閉 ，造，f無法有效立即的散熱，將會造成#光餘過熱而造成冷 燈ΐ的損壞，且如「第1圖」所示，習知將冷陰極燈管廳 牙汉燈架101後，再以焊接方式組接冷陰極燈管1〇5電力線 ^外部電源端103形成焊接點104，但若其-冷陰極燈管1〇5損 裘，必須先將其焊接點1〇4拆除才能進行維修更換， ΐ極也須再以焊接方式才能進行接線，因此 二，換冷陰極燈管1()5,造成使用者維修上一大困擾，亦因此接 線問題，更造成液晶顯示屏一但燈架101損壞（即便是只有 臨被丢棄不用的下場，不僅造成液晶顯 不屏未疋王發揮其應有使用壽命效益，更造成相關環保問題。 曰1=^管與背光模組連接處之電極因為高壓會產生大量埶 =造成燈㈣侧溫度上升，而熱制隨冷熱空氣對流，使^ 工乳士升聚集於-特定位置，長期使用將使得該處元件因敎量累 積k成溫度上升，使得該元件使用壽命縮短，及 ^兩 側電極因為過熱而毀損。 知且g兩 -产：曰趨輕薄化，或背光模組的尺寸增加，對於 同又的而求也棱同，必須增加燈管數才能達到足夠 也使月光模組產生更多的熱，造成過熱現象而影響晝 二^ 命，故愈顯散熱的重要性，對於其内部生成熱量之散發如果= 5 M262969 ，^透過自然的熱對流作用，顯示屏内部的高埶未能及Β±Λ ===屏之正常運作，重則縮短顯^的^ 【新型内ίί效地避免熱量聚集便成為—重要的課題。" 中户本ΐΐίΐ要目的係、透過散熱架構設置於背光模組之敎界隹 中處猎以散去背光模組產生之熱量。 …原市 用钕ϋ述目的’本_之散熱架構包括有—⑽元件，係谨 隹佳之材f製作’用以將背光模組之熱能集中並傳導至 元=集ΐ元件接設至少一熱導元件，又該熱導= =也、了 7〇件連接，透過集熱元件熱傳導性佳，以防止熱量 W^利用熱導元件可將餘元件的熱源導引至擴航件，以 致;:迅速散去熱量’避免背光模組内熱量累積造 埶- 更可於集熱元件上增設至少—風扇，及於殼體對應該擴 二^件處設有散熱孔與外界流通，藉由該風扇的運轉將擴熱元侔 、…、彳文政熱孔排出，透過氣流流動的方式，更可加速散熱效果。 有關本新型之詳細說明及技術内容，現就配合圖式說明如\ 【實施方式】 睛參閱「第2圖」，係本新型之實施例之立體結構示意圖，如 圖所示：液晶顯示屏依序有一顯示單元（圖中未示），用以輸出影 像晝面、一背光模組2，其上具有複數支冷陰極燈管2〇 (c〇=M262969 8. Description of the new type: [Technical field to which the new type belongs] This new type relates to a heat dissipation structure applied to a liquid crystal display screen, which is used to uniformly distribute the heat of the backlight module and quickly dissipate. [Prior technology] Moonlight TV sets such as plasma TVs, LCD TVs and flat displays for computers, in which the liquid crystal itself does not emit light, and its light emitting method is backlight (direct-type backlight mode, 'mainly provided by the backlight module The light source required for display must be high in brightness and uniform. The interior is mainly composed of a plurality of cold cathode lamps (_⑽ 他 Fl_s_ = mp fFL). 'Because the lamp emits heat, and the backlight module is a closed, built-in, f cannot Effective and immediate heat dissipation will cause damage to the cold lamp due to overheating of the light. As shown in "Figure 1", the cold cathode lamp hall Yahan lamp holder 101 is known, and then assembled by welding. The cold cathode lamp tube 105 power line ^ external power terminal 103 forms a welding point 104, but if its-cold cathode lamp tube 105 is damaged, its welding point 104 must be removed before it can be repaired and replaced. It also needs to be welded again for wiring. Therefore, changing the cold cathode lamp 1 () 5 will cause a lot of trouble for user maintenance. The wiring problem will also cause the LCD screen to be damaged once the lamp frame 101 is damaged (even Is only discarded The end result is that not only does the LCD display screen fail to display its due service life benefits, but also causes related environmental protection problems. 1 = ^ The electrodes at the junction of the tube and the backlight module will generate a large amount of high voltage due to high voltage 造成 = cause lights ㈣ The side temperature rises, and the heating system convects with the hot and cold air, so that the worker's milk rises at a specific location. Long-term use will make the component at this place increase in temperature due to the accumulation of heat, which shortens the life of the component, and ^ two The side electrode is damaged due to overheating. Known and g two-production: lighter and thinner, or the size of the backlight module is increased, the same for the same, the number of lamps must be increased to achieve enough to make the moonlight module More heat is generated, resulting in overheating and affecting the life of the day, so the importance of heat dissipation becomes more important. If the internal heat dissipation is equal to 5 M262969, ^ through natural thermal convection, the high temperature inside the display Failed to reach the normal operation of B ± Λ === screen, and shortened the ^^ [new-type internally to effectively avoid heat accumulation has become an important issue. &Quot; The main purpose of Nakatomoto is through heat dissipation. The structure is installed in the center of the backlight module to dissipate the heat generated by the backlight module.… The original city uses neodymium to describe the purpose of this book. The heat dissipation structure of this book includes-components, which are made of good materials. It is used to concentrate and conduct the thermal energy of the backlight module to the element. At least one heat conducting element is connected to the heat collecting element, and the heat conducting element is also connected to 70 pieces. The heat conductivity through the heat collecting element is good to prevent heat. W ^ Using the heat conducting element can guide the heat source of the remaining elements to the expansion part, so that: quickly dissipates the heat 'to avoid the accumulation of heat in the backlight module-more at least-a fan can be added to the heat collecting element, and Heat dissipation holes are arranged at the housing corresponding to the two expansion parts, and the heat expansion elements 侔, 彳, and 政 cultural and political heat holes are discharged by the operation of the fan, and the heat dissipation effect can be accelerated by means of airflow. For the detailed description and technical content of the new model, please refer to the diagram description as follows: [Embodiment] Please refer to "Figure 2", which is a schematic diagram of the three-dimensional structure of the embodiment of the new model, as shown in the figure: There is a display unit (not shown in the figure) for outputting the daylight image and a backlight module 2 with a plurality of cold cathode lamp tubes 20 (c〇 =
Cathode Fluorescent Lamp，CCFL)，用以提供該顯示單元所需光 f、一殼體3，用以容置上述之顯示單元及背光模組2，由於背光 巧組2為封閉構造且冷陰極燈管2〇提供光源而產生熱源，若未即 時有效散去背光模組2的熱量，則易造成液晶顯示屏内的溫度上 升，進而導致其内部元件的損害，而在冷陰極燈管2〇與背光模組 2連接處之電極因為高壓會產生大量熱量，造成燈管兩側溫度上 升’而熱量則隨冷熱空氣對流，使得熱空氣上升聚集於一特定位 置，故於背光模組2之熱源集中處連接一熱傳導性佳的集熱元件 M262969 背光模組2側部設置上制集熱轉4，隼数元 至該板’主要將背絲組2高溫叙歸迅速傳導 件21 i’9於該集熱元件4對稱位置處連接有一熱導元 將隼敎^ 可為熱導管並連接至一擴熱元件42，用以 二斤吸，之熱導引至擴熱元件42，其中該擴熱元件42 且有-固定订的擴熱籍片421所組成，任—該擴熱11片421 C供該擴熱韓片421定位於熱導元件21 ;及 ^」，係本新型之實施例之分解示意圖，如圖所示： 夂兀件4適當位置處設置至少一風扇23，並於殼 爷 置有散熱孔32，該散熱孔32與殼體^内外連i了 =經rt·32排出，促使產生—氣流流動的帶走 「所量，可有效達到#光模組2的散熱效果。 -· ΐΐκΜΜ - ，-2圖」’係本新型之熱流示意圖，如圖所 ，產生之熱源將會迅速的傳導至該集熱元件二= 導分佈於集熱元件4上，以有效== ΐϋ 導元件21將集熱元件4所吸收的熱源導引 兀件42上，透過擴熱元件42魏個擴熱韓片421可增加 ^、、面積及分倾熱量於複數倾_片421上,^ 丨 ^吹拂該，元件42，可將擴熱元件42的熱量經孔23 效^出’避免熱里聚集於殼體3内，以達最佳降溫及達良好散熱 惟以上所述者’僅為本新型之較佳實施例而已，當不能 =本新型實施之㉚® ’即大凡依本新型申料纖圍所作 錢化與修飾，皆應仍屬本新型專利涵蓋之範圍内。 句 7 M262969 【圖式簡单說明】 第1圖，係習知背光模組立體結構示意圖。 第2圖，係本新型之實施例之立體結構示意圖 第3圖，係本新型之實施例之分解示意圖。 第4-1 ^ 4_2圖，係本新型之熱流不意圖。 【主要元件符號說明】 2 ........... 背光模組 20、105........冷陰極燈管 3 ........... 殼體 32.............散熱孔 4 .............集熱元件 41 ............熱導元件 42 ............擴熱元件 420 ..... 固定部 421 ............擴熱鰭片 5 ...............風扇 101 ............••燈架 102 .............電力線 103 ...........外部電源端 104 .............焊接點Cathode Fluorescent Lamp (CCFL), which is used to provide the required light f of the display unit, and a housing 3, which is used to house the above-mentioned display unit and backlight module 2. Since the backlight unit 2 has a closed structure and a cold cathode lamp, 20 provides a light source and generates a heat source. If the heat of the backlight module 2 is not effectively dissipated immediately, the temperature in the liquid crystal display screen is likely to rise, thereby causing damage to its internal components. The cold cathode lamp tube 20 and the backlight The electrode at the connection point of module 2 will generate a lot of heat due to the high voltage, which will cause the temperature on both sides of the lamp to rise. Connect a heat-conducting heat-collecting element M262969 backlight module 2 on the side of the system to set the heat-collector 4, the number of yuan to the board 'mainly the back wire group 2 high-temperature rapid conduction parts 21 i'9 in this set A thermal conductive element is connected at the symmetrical position of the thermal element 4 and can be a heat pipe and connected to a heat expansion element 42 for two pounds of heat, and the heat is guided to the heat expansion element 42. The heat expansion element 42 And there is-fixed subscription Composed of the film 421, any-the heat expansion 11 piece 421 C for the heat expansion Korean piece 421 to be positioned on the thermal conductive element 21; and ^ ", is an exploded view of the embodiment of the new model, as shown in the figure: At least one fan 23 is provided at a suitable position of the component 4 and a heat dissipation hole 32 is arranged in the shell. The heat dissipation hole 32 is connected to the inside and the outside of the casing = exhaust through rt · 32 to promote the generation of air flow and take away The amount of heat can effectively achieve the heat dissipation effect of # 光 模 2.-· ΜκΜΜ-, -2 "" This is a schematic diagram of the heat flow of the new model, as shown in the figure, the generated heat source will be quickly conducted to the heat collecting element 2 = The heat conducting element is distributed on the heat collecting element 4 so as to be effective == ΐϋ The heat conducting element 21 guides the heat source absorbed by the heat collecting element 4 to the element 42. Through the heat expanding element 42, the heat spreading Korean pieces 421 can be increased ^ ,, The area and the amount of inclination heat are on the plurality of inclination pieces 421, ^ 丨 ^ blowing this element 42, the heat of the heat expansion element 42 can be effected through the hole 23 to prevent heat from accumulating in the casing 3 to achieve the maximum Good cooling and good heat dissipation, but the above mentioned is only the preferred embodiment of the new model, when it cannot == the implementation of the new model That is to say, the money and modification made by Dawei according to the new application materials should still fall within the scope of the new patent. Sentence 7 M262969 [Brief description of the diagram] Fig. 1 is a schematic diagram of the three-dimensional structure of a conventional backlight module. FIG. 2 is a schematic view of the three-dimensional structure of the embodiment of the present invention. FIG. 3 is an exploded view of the embodiment of the present invention. Figure 4-1 ^ 4_2 is not intended for the heat flow of this new model. [Description of main component symbols] 2 ........... Backlight module 20, 105 ........ Cold cathode lamp tube 3 ........... Housing 32 ............. Cooling holes 4 ............. Heat collecting element 41 ............ Heat conducting element 42 ............ Heat spreading element 420 ..... Fixed part 421 ......... Heat spreading fin 5 ......... ...... fan 101 ............ •• lamp holder 102 ............ power line 103 ............ .External power terminal 104 ............. welding point