M253210 捌、新型說明： 【新型所屬之技術領域】 —本創作為-種改良之液態冷卻器水盤，_是指—種，在由水管 管路所串接的水泵、水盤、鳍片部所構成的—組液態冷卻器上，設計 其中水盤的娜槽，侧先輯結加功彻壁面瞒金屬粒子，加 大了槽内壁之水流接觸面積，而能大幅增進散熱效果之—種液態冷卻 器水盤改良構造。 【先前技術】 應用在電動部的賴冷卻H，設計使_環流_水流取代傳 統風扇式散熱n ’使得冷卻效果Α幅提昇，又因其體積更小而特別 適用在散熱效果要求高的電腦硬體内部，嬖 已知傳嶋冷卻器，其基礎組輸水盤、與一 鰭片部，制由密封的水管管路所串接而構成。 並緊密接觸於電腦⑽發熱元件，㈣水泵打水令水流於水管管路= 2流動，朗片部底端設置風扇，使水ff路内水流麟片部來快 逑降溫。 =賴態冷卻H基雜件及致冷顧可知，@為雜冷卻器包 、一水盤、一鰭片部與-風扇，且於安裝上各該組件 直ttr串接在—起，安裝於㈣㈤、的電職如部時，尤 散=ΐίϊ小的攜帶式電腦内部’除了必需考慮液態冷卻器整體 散效率，其正體體積以及整體所需佔用㈣ ^低，若體積太大财無法小化簡化，不编用於可攜式電耻的 【新型内容】 解決上述傳統缺供種改良之•冷卻11讀，可以有效 M253210 器 本創作的主要目的，是在提供-種新-代改良型液離冷卻 態冷所串接的水栗、水盤、鰭片部所構成的二組液 in叹也、巾水盤，係於其卿射預先經燒結加工，令槽 屬粒子，加大了槽内壁之水流接觸面積，而能大幅= 及,、、、效果之種液態冷卻器水盤。 為了實現上述目的，本創作採用以下技術方案。 在雷最佳實施缺，經改良之液態冷卻11水盤，係專供應用 在電驗u心。該液態冷卻器包括由水㈣路所串接的一水栗、 =盤杜與—‘鰭片部所構成。該水盤係被安裝並緊密接觸於電腦内部 m謂㈣源’由該烟τ水令核於水管#路_環流 動’該制孩&設置風扇，使水管管路内水流纟·部來快速降溫。 上，該水盤，係包括由-設有進、出水口的上蓋，與一設有蜗形 槽的金屬盤，兩元件之間以螺桿_連接而構成m的進水口及 出水口’外部係導通水管管路’内部則分別對應金屬盤上蜗形槽的前 端及後端’形成密封的水流通道。 上述該金屬盤，於組合前係預先在蜗形槽内加入金屬粉末作燒社 加工，令槽内壁面附著金屬粒子，形成婦面，因而加大了 : 水流接觸面積。 蝸形槽内經燒結加工後’在不改變水盤整體體積的情況下，使堝 形槽内壁整體面積增加’流經其中之散熱水流能獲致更大散敎接觸 面，大幅提昇水盤吸熱效率’而特別適合應用於輕薄短小的可 腦上。 以下配合圖示，詳細說明本創作一具體實施例的組件盘 【實施方式】 組液態 後附第-ffl為本創作改良之_冷卻n讀2G，組裝於— 冷卻器上的整體外觀圖。 ' ~ 、 第二圖為本創作水盤20之組件分解圖。 如第-圖所示，本航錢良之讀2G，係專供應電腦内部 6 液態冷卻器。該液態冷卻器，係包括由水管管路 -水盤20、與-鰭片部30所組合構成，其中該水盤=的並 緊密接觸於電腦内部電路板28上的發熱元件29， ^ 水盤20來吸收發熱元件29之熱量。 内 内 上述液$冷卻H ’係由該水泵10打水’令水流於水管管路 循環流動’該鰭片部30 ’包括底端設置了風扇4〇，使水管管路％ 水流經此鰭片部30來快速降溫。 如第二圖，上述水盤20，係包括一上蓋2卜一進水口 ％及一出 水口 25設於上蓋21絲，-設有_槽23的金屬盤22，由複數螺桿 26將之固定在上蓋21底緣，並恰使上蓋21進水口 ％及出水口 ^， 分別對應金屬盤22上竭形槽23的前端及後端，形成密封的水流通道。 第二圖為本創作水盤20組合後剖切圖。 如第三圖，、經組合後的水盤20，於組裝上，係利用複數螺桿27， 將水盤20固定在電腦内部電路板％上，由水盤2〇底部金屬盤π，緊 密接觸電路板28上的發熱元件29以吸收熱量，再流經金屬盤22 蝸形槽23内部的循環水流，使發熱元件29快速降溫。 如第二圖及第三圖中所示，上述該水盤2〇，於組合前，係預先在 金屬盤22的蝸形槽23内，加入金屬粉末作燒結加工，令槽内壁面上 附著金屬粒子，使原來為平滑之槽内壁，經金屬粉末燒結加工而形成 粗糙面，據此加大了槽内壁之表面積，增加了與流經蝸形槽23内水流 之接觸面積。 蝸形槽23内經燒結加工後，在不改變金屬盤22總體積的情況下， 使得螞形槽23賴面積增加，流經其巾之散熱水雜獲致更大散熱接 觸面’大幅提昇了水盤20的吸熱效率，達到本創作的預定目的。 綜上所述’本創作所述之實施例確可達到預期功能及目的，並且， 本創作已詳細說明致使習於此藝者得據以實施。然而以上所舉之實施 例僅用以說明’舉凡所有等效結構之改變及不脫本創作精神之類似修 改’均應隸屬本創作之範嘴。 M253210 ’請惠予審查，並祈及早核准本 為此，爰依法具文提出專利申請 案專利’是為至禱。 【圖式簡單說明】 第-圖為本創作本創作改良之液態冷卻器水盤喊於—組液態冷 器上的整體外觀圖。 第二圖為本創作水盤組件分解圖。 第三圖為將本創作水盤組件組合，並已安裝於發熱元件表面。圖中 已將水盤剖切。 【元件符號簡單說明】 10 水泵 20 水盤 21 上蓋 22 金屬盤 23 蝸形槽 24 進水口 25 出水口 26 螺桿 27 螺桿 28 電路板 29 發熱元件 30 鰭片部 40 風扇 50 管路M253210 新型 Description of the new model: [Technical field to which the new model belongs] — This creation is an improved liquid cooler water tray, _ refers to — a type consisting of a pump, a water tray, and a fin section connected in series by a water pipe. -On the liquid cooler of the group, the na tank of the water pan is designed, and the side first collects and works through the wall to hide the metal particles, which increases the contact area of the water flow on the inner wall of the tank, which can greatly improve the heat dissipation effect.-A liquid cooler water pan Improved structure. [Previous technology] The Lai cooling H applied in the electric department is designed to replace the traditional fan-type heat dissipation n_circulation_water flow to increase the cooling effect A, and it is especially suitable for computer hardware with high cooling effect requirements due to its smaller size. Inside the body, there is a known transmission cooler. The basic set of water delivery plates and a fin part are connected in series by a sealed water pipe. It is in close contact with the heating element of the computer. The pump pumps water to make the water flow in the water pipe line = 2. The fan is set at the bottom of the long film section to make the water flow section in the water channel quickly cool down. = Lai state cooling H-based miscellaneous parts and refrigeration Gu can know that @ is a miscellaneous cooler package, a water tray, a fin part and a -fan, and each component is directly connected in series on the installation, and is installed in ㈣㈤ ， Electrical power is indispensable, especially in small portable computers. In addition to the overall cooling efficiency of the liquid cooler, the volume of the body and the overall occupation of the unit must be considered low. If the volume is too large, it cannot be reduced and simplified. [New content] not for the portable electric shame [New content] To solve the above-mentioned traditional lack of improvement and improvement • Cooling 11 readings can effectively M253210 The main purpose of this book is to provide-a new-generation improved liquid ionization The two groups of liquid chestnuts, water pans, and fins that are connected in the cold state are connected to the water tank and the water pan. They are sintered in advance to make the tank particles and increase the water flow on the inner wall of the tank. Contact area, and can greatly reduce the liquid cooler water dish. In order to achieve the above purpose, the following technical solutions are used in this creation. In the best implementation of Lei, the improved liquid cooling 11 water pan is specially supplied for electrical testing. The liquid cooler comprises a water chestnut, a pandu and a ‘fin part connected in series by a water tunnel. The water tray is installed and in close contact with the computer's internal source. "The smoke τ water makes the core in the water pipe # 路 _ 环流". The system & sets a fan to make the water flow in the water pipe pipeline quickly. Cool down. In the above, the water pan includes an upper cover provided with an inlet and an outlet, and a metal plate provided with a snail groove. The two components are connected by a screw _ to form the inlet and outlet of the m. The inside of the water pipe pipe corresponds to the front and rear ends of the volute groove on the metal disc to form a sealed water flow channel. Before the combination of the metal disk, metal powder is added to the snail groove in advance for processing. The metal particles are attached to the inner wall surface of the groove to form a woman's surface, thereby increasing the water contact area. After the sintering process in the volute groove, 'the total area of the inner wall of the pot-shaped groove is increased without changing the overall volume of the water pan', and the heat dissipation water flow passing through it can obtain a larger scattered contact surface, which greatly improves the heat absorption efficiency of the water pan. It is especially suitable for light, thin and short brains. The following is a detailed description of the component tray of a specific embodiment of the present invention in conjunction with the illustration. [Embodiment] The liquid state is attached. The -ffl is the overall appearance of the cooler n-read 2G, which is assembled on the cooler. The second picture is an exploded view of the components of the creative water pan 20. As shown in the picture-, this airline Qian Liangzhi 2G is specially designed to supply liquid coolers inside the computer. The liquid cooler is composed of a water pipe line-water tray 20 and a fin part 30, wherein the water tray is in close contact with the heating element 29 on the internal circuit board 28 of the computer, and the water tray 20 is used for absorption. The heat of the heating element 29. Nene said the above liquid $ cooling H 'is caused by the pump 10 to draw water' to circulate the water flow in the water pipe pipeline. The fin part 30 'includes a fan 40 at the bottom end, so that the water pipe pipeline% water flows through this fin. Department 30 to quickly cool down. As shown in the second figure, the above water tray 20 includes an upper cover 2 a water inlet% and an outlet 25 provided on the upper cover 21 wire-a metal plate 22 provided with a groove 23, which is fixed to the upper cover by a plurality of screws 26 The bottom edge of 21 and the water inlet% and water outlet ^ of the upper cover 21 respectively correspond to the front end and the rear end of the exhaust groove 23 on the metal disc 22 to form a sealed water flow channel. The second picture is a cut-away view of the creative water pan 20 after being assembled. As shown in the third figure, the assembled water pan 20 is assembled with a plurality of screws 27 to fix the water pan 20 on the internal circuit board of the computer. The water pan 20 bottom metal plate π is in close contact with the circuit board 28. The heat generating element 29 absorbs heat, and then flows through the circulating water flow inside the worm groove 23 of the metal disc 22, so that the heat generating element 29 is rapidly cooled. As shown in the second and third figures, before the combination of the water tray 20 mentioned above, metal powder is added to the snail groove 23 of the metal tray 22 for sintering processing, so that metal particles adhere to the inner wall surface of the groove. In order to make the inner wall of the groove which is originally smooth, sintered with metal powder to form a rough surface, the surface area of the inner wall of the groove is increased, and the contact area with the water flowing in the volute groove 23 is increased. After the sintering process in the volute groove 23, the area of the ant groove 23 is increased without changing the total volume of the metal plate 22, and the heat dissipation water flowing through the towel has a larger heat dissipation contact surface. 20 heat absorption efficiency, to achieve the intended purpose of this creation. In summary, the embodiment described in this creation can indeed achieve the intended function and purpose, and this creation has been explained in detail so that the learner can implement it accordingly. However, the above-mentioned embodiments are only used to illustrate that ‘for example, all equivalent structure changes and similar modifications without departing from the spirit of this creation’ should belong to the scope of this creation. M253210 ‘Please review it and pray for its early approval. For this reason, it ’s my prayer to file a patent application according to the law’. [Simplified description of the figure] The first picture is the overall appearance of the liquid cooler water tray on the group of liquid coolers. The second picture is an exploded view of the creative water pan components. The third picture is a combination of the original water pan assembly and the surface of the heating element. The water pan has been cut out. [Simple description of component symbols] 10 Water pump 20 Water tray 21 Upper cover 22 Metal plate 23 Snail groove 24 Water inlet 25 Water outlet 26 Screw 27 Screw 28 Circuit board 29 Heating element 30 Fin part 40 Fan 50 Pipe