TWM251296U - Injection molding leadless chip-carrying base - Google Patents

Description

M251296 創作說明（1) 【新型所屬之技術領域】 本創作係一種無引腳晶片承載座，尤指一種射出成型 之無引腳晶片承載座。 【先前技術】 隨著多媒體市場的蓬勃發展’影像感測晶片的應用範 圍亦愈來愈廣，諸如數位相機、電腦、手機、影像辨識裝 置等都應用到影像感測晶片’然而由於影像感測晶片需接 收外界光源以進行影像感測，故其封裝方式與一般晶片有 所不同，而目前業界常用的的影像感測晶片&裝技:包括 陶瓷無引腳晶片承載座（Ceramic Leadless ChipM251296 Creation Instructions (1) [Technical Field of New Type] This creation is a leadless wafer carrier, especially an injection-molded leadless wafer carrier. [Previous technology] With the rapid development of the multimedia market, the scope of application of image sensing chips is becoming wider and wider, such as digital cameras, computers, mobile phones, image recognition devices, etc. are applied to image sensing chips. However, due to image sensing The chip needs to receive an external light source for image sensing, so its packaging method is different from ordinary chips. At present, the image sensing chip commonly used in the industry & mounting technology: including ceramic leadless chip carrier (Ceramic Leadless Chip

Carrier，CLCC )技術及塑膠無引腳晶片承載座（piastic Leadless Chip Carrier，PLCC)技術，其中CLCC 技術如 美國專利公告號第589821號所示，其雖然氣密閉性良好， 能夠延長感測晶片之使用壽命，但由於製程繁瑣、且成本 較高，因而不符合一般市場需求。 而PLCC技術為目前多數業者所採用之封裝方式，其成本雖 較CLCC技術為低，但由於利用PCB板作為基底，故總體尺 寸難以縮小’日後將成為電子產品微型化的關鍵問題。另 外，PLCC之製造多採邊框與基底分別製造，然後再組設在 一起之方式，故在備料及生產的連貫性上有所影響，且 PLCC之製，係採單顆製程，亦即需先將邊框與基底所構成 之基座切單，接著再個別進行晶片黏著等動作，因此製造 速度較慢’製程不穩定因素亦較多。 有鑑於此’本創作針對上述習知技術之困擾，提出一Carrier (CLCC) technology and plastic leadless chip carrier (PLCC) technology. Among them, the CLCC technology is shown in US Patent Publication No. 589821. Although its air tightness is good, it can extend the length of the sensing chip. Service life, but because of the complicated process and high cost, it does not meet the general market requirements. And PLCC technology is the packaging method adopted by most of the industry. Although its cost is lower than CLCC technology, it is difficult to reduce the overall size due to the use of PCBs as a substrate. It will become a key issue for miniaturization of electronic products in the future. In addition, PLCC manufactures multiple frames and substrates separately, and then sets them together, so it affects the continuity of material preparation and production. Moreover, the PLCC system is a single process, which means that it needs to be manufactured first. The pedestal formed by the frame and the substrate is singulated, and then actions such as wafer adhesion are performed individually, so the manufacturing speed is slower, and there are also more process instability factors. In view of this, this creation addresses the problems of the above-mentioned conventional technologies, and proposes a

第5頁 M251296 四、創作說明（2) f射出成型之無引腳 失。 戟座以有效克服習知之缺 【新型内容】 本創作之主要目的李 片承载座，其係於—且右供一種射出成型之無引腳晶 利用-膠體射出成型及複數個導聊之導線架上， 之間，藉此以簡化封^ 1並成型充填於晶座與導腳 本創作之另=步驟，以節省製程成本。 片承巷应^ 的，係提供一種射出成型之益引腳曰 肋條，並可接地以據掉晶座上之雜訊。 “之支撐 本創作之另一目的，係提供一^ 片承載座，其可於黏晶、封蓋型2引腳晶 之動作，藉此能提高製程速率，降低生產成本。 早 片承G作種射出成型之無引腳晶 良好：散熱管ϊ 為金屬材質，故能提供晶片 根據本創作，-射出成型之無引腳晶片承載座包括一 線架，其係由至少一晶座及複數個圍設於晶座周圍之導 ,所構成，此些導腳中至少有二支撐導腳連接至晶座以連 、、、吉晶座與整體導線架，且此二支撐導腳可接地以濾掉晶座 上之雜訊，另有一膠體，其射出成型於導線架之周圍以形 成一邊框，並同時成型充填於晶座及複數個導腳之間，藉 由導線架及膠體射出成型之結構，便可構成一無引腳晶片Page 5 M251296 IV. Creative Instructions (2) f. The halberd effectively overcomes the lack of knowledge. [New content] The main purpose of this creation is a plum bearing holder, which is located on the right side of a lead-free crystal for injection molding-colloidal injection molding and a number of lead frames. In order to save the cost of the process, it can be used to simplify the process of sealing and forming and filling the crystal seat and the guide script. The film bearing lane should be provided with a rib for injection molding, and it can be grounded to remove noise from the crystal base. "The other purpose of supporting this creation is to provide a ^ chip carrier, which can be used for sticking crystals and capping 2 pin crystals, which can increase the process rate and reduce production costs. Early film production G This kind of injection-molded non-lead crystal is good: the heat pipe ϊ is made of metal, so it can provide the wafer. The guide provided around the crystal base is composed of at least two supporting guide legs connected to the crystal base to connect the crystal frame and the integrated lead frame, and the two supporting guide legs can be grounded to filter out For the noise on the crystal base, there is another colloid, which is injection-molded around the lead frame to form a frame, and at the same time, it is filled and filled between the crystal base and a plurality of guide pins, and the structure formed by the lead frame and the colloid is injected. Can form a leadless chip

M251296 四、創作說明（3) - 承載座。 底下藉由具體實施例之說明’再對照所附之圖式，當 更容易瞭解本創作之目的、技術内容、特點及其所達成之 功效。 【實施方式】 本創作係一種射出成型之無引腳晶片承載座〇nject Leadless Chip Carrier，ILCC )，其係利用一膠體射出 成型於一導線架上，藉此簡化無引腳晶片承載座之製程步 驟，進而降低生產成本。 如第一圖所示’其係應用本創作之影像感測器示意 圖，由圖可知，本創作之無引腳晶片承載座包括一導線架 10，其俯視圖如第二圖所示，該導線架1〇包括一晶座12以 及環設於晶座12四周圍之複數個導腳η，此些導腳14中至 〉'有一支撐導腳16與晶座12連接在一起，藉以形成晶座12 與整體導線架1 〇之連結支撐結構；另參照第一圖與第三 圖’ 一膝體18射出成型於導線架1〇周圍以形成一凸起之邊 框20 ’且同時成型於晶座12與複數個導腳14之間，藉此與 導線架1 〇共同構成本創作之結構，並形成一晶片容置空 間。 =參照第一圖，於晶座丨2上可配置一影像感測晶片22，其 =有一上表面與一下表面，該上表面設有複數個銲墊，其 刀別打線連接於複數個導腳14上，而下表面則黏設於晶座 1 2上’且包括影像感測晶片22與打線連接之導線24均位於 本創作所形成之容置空間内，因此，一封蓋2 6可固設於導 M251296M251296 Fourth, creation instructions (3)-bearing seat. Through the description of the specific embodiment below, and comparing with the attached drawings, it will be easier to understand the purpose, technical content, characteristics and effects achieved by this creation. [Embodiment] This creation is an injection-molded leadless chip carrier (ILCC), which uses a colloid to injection-mold on a lead frame, thereby simplifying the manufacturing process of the leadless chip carrier Steps to reduce production costs. As shown in the first figure, 'It is a schematic diagram of the image sensor to which this creation is applied. As can be seen from the figure, the leadless wafer carrier of the creation includes a lead frame 10, and a top view thereof is shown in the second figure. 10 includes a pedestal 12 and a plurality of guide legs η arranged around the pedestal 12. These guide legs 14 are connected to the ”12” and a support guide leg 16 is connected to the pedestal 12 to form the pedestal 12. The supporting structure connected to the overall lead frame 10; see also the first and third figures 'A knee 18 is injection molded around the lead frame 10 to form a raised frame 20' and is simultaneously formed on the crystal base 12 and Between the plurality of guide pins 14, the structure of this creation is formed together with the lead frame 10, and a wafer accommodation space is formed. = Referring to the first figure, an image sensing chip 22 can be arranged on the wafer base 2; it has an upper surface and a lower surface, the upper surface is provided with a plurality of solder pads, and the blades are connected by wires to a plurality of guide pins 14 upper and lower surfaces are glued on the crystal base 12 and the image sensing chip 22 and the wires 24 connected to the wires are located in the accommodation space formed by this creation, so a cover 2 6 can be fixed Based on guide M251296

線架10周圍之邊框20上’藉以密封 影像感測器之基本架構。 1二間，並形成一 又如第四圖所示，本創作導 裝單元28，每一封裝單 12周圍之複數個導腳14，同樣 2以及裱扠於晶座 14中，？小古I 母—晶座12周圍之導腳 線：ι〇之ii::腳“作為支撐導腳16以連接晶座12與導 另有一膠體18 ’其會射出成型於導線 邊挺* Ϊ 所示，藉此於每一封裝單元28上形成- 即』成葙數Γ成型於每一晶座12及複數個導腳14間，至此 射出成型之無引腳晶片承載座，㊣下來可於 置—影像感測晶μ，並將其上之銲塾打線 =周圍之導腳"上，接著再於每一邊框上固設一= 封之步驟，然後即可進行切單，以形成複數 個如第一圖所示之影像感測器。 另外本創作之導線架係為金屬材質，其中連接於曰 t之支撐導腳可加以接地，以濾掉晶座上之電氣雜訊曰曰 由於晶座與導線架同為金屬材質，故可提供配置於晶座 晶片良好的散熱途徑，至於射出成型之膠體係為塑膠 、’例如液晶樹脂（Liquid Crystal Polyester，The frame 20 around the wire frame 10 is used to seal the basic structure of the image sensor. One and two, and forming one. As shown in the fourth figure, in this creative guide assembly unit 28, a plurality of guide pins 14 around each package 12 are similarly 2 and mounted on the crystal base 14? Xiaogu I Mother—Guideline around the crystal base 12: ι〇ii :: Feet "as the supporting leg 16 to connect the crystal base 12 and the guide with another gel 18 'It will be injection molded on the side of the wire * Ϊ In this way, it is formed on each packaging unit 28-that is, the number Γ is formed between each wafer 12 and a plurality of guide pins 14. At this point, the formed leadless wafer carrier is shot, and it can be placed on the wafer. —The image sensing crystal μ, and the soldering wire on it = the surrounding guide feet ", and then a step of = sealing is fixed on each frame, and then the order can be cut to form a plurality of The image sensor is shown in the first figure. In addition, the lead frame of this creation is made of metal, and the supporting guide pin connected to t can be grounded to filter out electrical noise on the crystal base. The base and the lead frame are both made of metal, so it can provide a good heat dissipation method for the wafer. The plastic system for injection molding is plastic, such as liquid crystal resin (Liquid Crystal Polyester,

Lcp )或聚丙烯酸丁酯（PPA )等。 、&由上述可知，本創作利用膠體射出成型於導線架上， 以，化影像感測器之封裝製程，並藉此降低成本。此外， 更了將連接整體導線架與晶座之支撐導腳接地，以濾掉晶 座上之電氣雜訊。再者，本創作可於黏晶、封蓋等步驟完Lcp) or polybutyl acrylate (PPA). As can be seen from the above, this creation uses colloid injection molding on the lead frame to simplify the packaging process of the image sensor and thereby reduce costs. In addition, the support guide pins connecting the overall lead frame and the base are grounded to filter out electrical noise on the base. In addition, this creation can be completed in steps such as sticking crystals and capping.

M251296M251296

成後’再進行切單之動作，藉此提高製程效率，進而降低 生產成本。 惟以上所述之實施例僅為本創作之較佳實施例而已， 並非用以限定本創作實施之範圍。故凡依本創作申請專利 範圍所述之形狀、構造、特徵及精神所為之均等變化與修 飾，均應包括於本創作之申請專利範圍内。 圖號說明： 10 導線架 12 晶座 14 導腳 16 支撐導腳 18 朦體 20 邊框 22 晶片 24 導線 26 透明封蓋 28 封裝單元After the completion ', the order is cut, thereby improving the process efficiency and reducing the production cost. However, the above-mentioned embodiments are merely preferred embodiments of the present invention, and are not intended to limit the scope of the present invention. Therefore, all changes and modifications of the shape, structure, characteristics and spirit described in the scope of the patent application for this creation shall be included in the scope of the patent application for this creation. Description of drawing number: 10 lead frame 12 crystal base 14 guide pin 16 support guide leg 18 body 20 frame 22 chip 24 wire 26 transparent cover 28 packaging unit

M251296 圊式簡單說明 第一圖為應用本創作之實施例示意圖。 第二圖為本創作之導線架俯視示意圖。 第三圖為本創作之結構俯視示意圖。 第四圖為本創作具有複數個封裝單元之導線架示意圖。 第五圖為本創作具有複數個射出成型之無引腳晶片承載座 示意圖。M251296 Simple description of the formula The first picture is a schematic diagram of an embodiment to which this creation is applied. The second picture is a schematic plan view of the lead frame of the creation. The third figure is a schematic plan view of the structure of the creation. The fourth figure is a schematic diagram of a lead frame with a plurality of packaging units. The fifth figure is a schematic diagram of a leadless wafer carrier with a plurality of injection moldings.

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Claims (1)

M251296 五、申請專利範圍 ' 申請專利範圍： 1、 一種射出成型之無引腳晶片承載座，其包括： 一導線架，其具有至少一晶座，其周圍則環設有複數個導 腳，該複數個導腳中至少有二支撐導腳連接至該晶座，以 作為該晶座與整體導線架之支撐結構；以及 一膠體’其射出成型於該導線架之周圍以形成一邊框，並 同時充填成型於該晶座與該複數個導腳之間。 2、 如申請專利範圍第1項所述之射出成型之無引腳晶片承 载座，其中該導線架為金屬材質。 i、如申請專利範圍第1項所述之射出成型之無引腳晶片承 載座，其中該膠體為塑膠材質。 4、 、如申請專利範圍第1項所述之射出成型之無引腳晶片承 載座，其中該導線架與該膠體射出成型之結構共同形成一 容置空間。 "" 5、 、如申請專利範圍第4項所述之射出成型之無引腳晶片承 載座，其中該晶座上可配置一晶片，該晶片上配置有複數 個焊塾，其可分別打線連接至該複數個導腳上。 6、 如申請專利範圍第5項所述之射出成型之無引腳晶片承 載座，其中該晶片為影像感測晶片。 7、 、如申請專利範圍第5項所述之射出成型之無引腳晶片承 載座，其中該邊框上可設置一透明封蓋，藉以密封該容置 空間。 8、 如申請專利範圍第丨項所述之射出成型之無引腳晶片承 載座，更可將該支撐導腳接地以濾掉該晶座上之雜訊。M251296 5. Scope of patent application 'Scope of patent application: 1. An injection-molded leadless wafer carrier, including: a lead frame with at least one crystal seat, and a plurality of guide pins around the ring. At least two supporting guide pins of the plurality of guide pins are connected to the crystal base to serve as a supporting structure of the crystal base and the overall lead frame; and a colloid is injected and formed around the lead frame to form a frame, and at the same time Filled and formed between the crystal base and the plurality of guide pins. 2. The leadless wafer carrier for injection molding as described in item 1 of the scope of patent application, wherein the lead frame is made of metal. i. The leadless wafer carrier for injection molding as described in item 1 of the scope of patent application, wherein the colloid is made of plastic. 4. The leadless wafer carrier for injection molding as described in item 1 of the scope of patent application, wherein the lead frame and the colloidal injection molding structure together form a receiving space. " " 5. The leadless wafer carrier for injection molding as described in item 4 of the scope of patent application, wherein a wafer can be arranged on the wafer seat, and a plurality of solder pads are arranged on the wafer, which can be respectively A wire is connected to the plurality of guide pins. 6. The injection-molded leadless wafer carrier as described in item 5 of the scope of patent application, wherein the wafer is an image sensing wafer. 7. The leadless wafer carrier for injection molding as described in item 5 of the scope of patent application, wherein a transparent cover can be set on the frame to seal the accommodation space. 8. According to the injection-molded leadless wafer carrier described in item 丨 of the scope of the patent application, the support guide pin can be grounded to filter out noise on the wafer base.