M241726M241726
【新型所屬之技術領域】 本釗作係有關於一種循 種能快速的將由底座從熱源 個散熱為各角落，同時也可 _该散熱器，而由其它散熱 源元件進行高效率的散熱工 環式散熱器構造，特別是指— 士吸附之熱，均勻的傳送到整 ^由彳盾環冷媒（或水）將熱帶 裝置來協同散熱，以達到對熱 作者。 【先前技 按， 所討論的 影響到其 術瓶頸， 機都是因 器的散熱 普遍被採 用铭合金 藉以跟空 少數使用 而今 在熱源上 冷卻構造 器、硬碟 愈多，運 也愈來愈 術】 電腦微處理 熱門話題， 超頻極限。 不僅影響電 為散熱問題 方式不外乎 用。如所周 ’利用散熱 氣接觸的面 其他材料， ’時下的電 方的空間愈 •，又，在主 、CR-R〇m 、 算速度需求 為明顯，致 ，是現今科技 產生的熱更是 式一直遭遇技 不明原因的當 運用於微處理 其成本低廉已 材料幾乎都採 由空氣帶走， 越好。當然極 而相差太多。 向發展，致使 大或加風扇的 如：微處理 •••等）也愈來 散熱品質訴求 有再改良的必 裔（C P U )的超頻極限 尤其微處理器運作時所 目前對微處理器散熱方 腦本身的穩定度，許多 無法解決所造成β早期 有散熱片及風扇，因為 知，習知散熱片所用的 片的表面積而使得熱得 積越多，達到散熱效果 不過導熱效果並不會因 腦產品均往輕薄短小方 來愈小，而無法裝設太 機内裝設的熱源元件（ 電源裝置、顯示器模組 也愈來愈高，所以對高 對一般的散熱器構造實[Technical field to which the new type belongs] The present invention relates to a method that can quickly dissipate heat from the heat source to each corner by the base. At the same time, it can also use the heat sink and other heat sink components for efficient heat dissipation. The structure of the radiator, especially the heat absorbed by the driver, is evenly transmitted to the entire heat sink by the Shield Ring refrigerant (or water) to achieve heat dissipation. [Previous technical note, the discussion has affected its technical bottlenecks. Machines are commonly used because of the heat dissipation of the device. Therefore, the more the constructors and hard disks are cooled on the heat source, the more they are transported. ] Computer micro-processing hot topics, overclocking limits. Not only does it affect electricity for heat dissipation, it's nothing more than a way to use it. For example, the use of other materials on the surface contacted by the heat-dissipating gas makes the space of the electric side more and more. At the same time, the main, CR-R0m, and computing speed requirements are obvious, which is the heat generated by the current technology. The Shi has been experiencing unexplained technical reasons. When it is used for micro-processing, its low cost is almost all taken away by air, the better. Of course, the difference is too great. To the development, causing large or increased fans (such as: micro-processing •••, etc.) are also increasingly dissipating heat. Quality requirements require further improvement of the overclocking limit (CPU), especially when the microprocessor is operating. The stability of the brain itself, many can not solve the early β caused by a heat sink and a fan, because it is known that the surface area of the heat sink used to make the heat build up more, to achieve the heat dissipation effect, but the heat conduction effect does not depend on the brain The products are smaller and thinner, and it is impossible to install heat source components (power supply units and display modules) that are installed in the machine.
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【新型内容】 本創作彳盾丨进 主機，尤其θ，式散熱裔構造主要目的，即在於改善電腦 效直快速的：ΐ記型電腦内部熱源的散熱問題，使其能有 咬判散熱效果。 為達到Jl、+、 為於：散熱鮮ΐ目的，本創作循環式散熱器構造主要特徵 _有· 9 與底座之間設有盤旋的暗道，在該暗道之 内固:垃W ΐ官’且該熱管的兩端部分別露出散熱器外， 而町· 4 %式冷卻系統之管路，以達到提昇散熱效果之 功妹’ 可提昇該電腦的處理速度與功能者。 【實施方 請參 包拉有散 其特徵在 (本實施 設有/熱 熱器構造 一 (如笫一 請再 式】 2 = 一圖，本創作循環式散熱器構造1 ，其至少 二鰭片10，及與熱源2〇接觸之底座3〇等所組成； •放/熱鰭片10與底座30之間設有盤旋的暗道4〇 將暗道設於底座頂面），在該暗道40之内固 & ’且該熱管50的兩端部51與52分別露出該散 之外，而可連接循環式冷卻系統6〇 營 f所：），達到提昇散熱效果之功效者：路61 ’㊣中之循環式冷卻系_至少 ;熱裝置63之間，即可以管路61連接；：ί: 熱管5〇的端部51與52串聯使用。 、政…為構 包栝有由 浦62與主 造1中之[New content] The main purpose of the creation of the shield, especially the θ, heat sink structure, is to improve the efficiency of the computer: the heat dissipation problem of the internal heat source of the computer, so that it can have a cooling effect. In order to achieve Jl, +, and: for the purpose of fresh heat dissipation, the main characteristics of the structure of the circulation radiator in this creation_ 有 · There is a concealed dark channel between the base and the base, and within the dark channel is fixed: WW 官 官 'and The two ends of the heat pipe are exposed outside the radiator, and the piping of the 4% cooling system is used to achieve the effect of improving the heat dissipation effect, which can increase the processing speed and function of the computer. [Executives please refer to the package and have their characteristics. (This implementation is provided with a / heater structure one (such as 笫 a please repeat it) 2 = a picture, this creative circulation radiator structure 1, which has at least two fins 10, and the base 30 which is in contact with the heat source 20; • There is a convoluted dark channel 40 between the radiator / heating fin 10 and the base 30. The dark channel is set on the top surface of the base), within the dark channel 40 "The two ends 51 and 52 of the heat pipe 50 are exposed outside the fan respectively, and can be connected to the circulating cooling system 60F :), to achieve the effect of improving heat dissipation effect: Road 61 '㊣ 中The circulating cooling system is at least; between the heat devices 63, that is, can be connected by the pipeline 61 ;: ί: the ends 51 and 52 of the heat pipe 50 are used in series. , Government ... for the construction, including the Pu 62 and the master 1
第5頁 M241726 五、創作說明（3) 據上述構造組合使用時，可將本創作循環式散熱器構 造1貼附固疋於熱源（微處理、硬碟^ · ·等）2 0之上，並 在循環式冷卻系統60之管垮61内充填有冷媒（水），而可 由幫浦6 2驅動循環，本創作則可利用冷媒（水）通過散熱 鰭片10與底座30之間的熱管50而使由熱源20產生的熱能均 勻的傳送到該散熱器構造1的各角落，同時也可藉由循環 冷媒（水）將熱帶離該散熱器構造1 ，而由系統附屬之主 政熱裝置6 3來協同散熱，以達到對熱源元件進行高效率的 散熱工作之創作目的者。 如上所述’另請參閱第三圖所示，其中之暗道可分 別於散熱鰭片1 0底面與底座30頂面對應設置形成，並在其 容置熱管50時，得於暗道40與熱管5〇間的間隙 ^ 填，而增加其熱傳導效益；另外，其中之散熱鰭*、n、盥 者得因應其散熱與吸熱的任務需，。而以“的材; 綜上所述，本創作循環式散熱器構造確能 目的，=符合新型專利要件；惟，以上所述者僅= 之較佳實施例而已，大凡依據本創作…J乍 化仍應包含於本專利申請範圍内。 ”、' 種修飾與變 第6頁 M241726 圖式簡單說明 第一圖為本創作的立體分解圖。 第二圖為本創作配合循環構造使用之立體實施例圖。 第三圖為本創作體另一實施例立體圖。 【主要部分的代表符號】 散熱器構造 1 散熱鑛片 10 熱源 2 0 底座 30 暗道 40 熱管 50 循壞式冷卻糸統6 0 端部 5卜52 管路 6 1 幫浦 62 主散熱裝置 63Page 5 M241726 5. Creation instructions (3) When used in combination with the above structure, this creative circulation radiator structure 1 can be attached and fixed to a heat source (micro processing, hard disk ^ · ·, etc.) 2 0, The refrigerant (water) is filled in the tube cooling 61 of the circulating cooling system 60, and the circulation can be driven by the pump 62. In this creation, the refrigerant (water) can be used to pass the heat pipe 50 between the heat dissipation fins 10 and the base 30. The heat energy generated by the heat source 20 is evenly transmitted to all corners of the radiator structure 1. At the same time, the tropical heat can be removed from the radiator structure 1 by circulating refrigerant (water), and the main heating device 6 attached to the system 3 to coordinate heat dissipation, in order to achieve the purpose of efficient heat dissipation of the heat source components. As mentioned above, please also refer to the third figure, where the dark channels can be respectively formed on the bottom surface of the heat sink fin 10 and the top surface of the base 30, and when the heat pipe 50 is accommodated, they are obtained from the dark channel 40 and the heat pipe 5 〇 fill in the gap ^, and increase its heat conduction benefits; In addition, the heat dissipation fins *, n, and the toilet must be based on the task of heat dissipation and heat absorption. And with the "material; In summary, the structure of this creative cyclic radiator can indeed achieve the purpose, = in line with the new patent requirements; however, the above mentioned are only the preferred embodiments of =, generally based on this creation ... Modifications should still be included in the scope of this patent application. "," Modifications and Changes Page 6 M241726 Schematic Brief Description The first picture is a three-dimensional exploded view of the creation. The second figure is a three-dimensional embodiment of the creative use with the circulation structure. The third figure is a perspective view of another embodiment of the creative body. [Representative symbols of the main parts] Heat sink structure 1 Heat sink ore sheet 10 Heat source 2 0 Base 30 Underpass 40 Heat pipe 50 Loop cooling system 6 0 End 5 5 52 Pipe 6 1 Pump 62 Main heat sink 63