TWI847457B - Combined power module - Google Patents
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- TWI847457B TWI847457B TW111150256A TW111150256A TWI847457B TW I847457 B TWI847457 B TW I847457B TW 111150256 A TW111150256 A TW 111150256A TW 111150256 A TW111150256 A TW 111150256A TW I847457 B TWI847457 B TW I847457B
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Abstract
Description
本發明關於一種功率模組，特別是一種組合式的功率模組。The present invention relates to a power module, in particular to a combined power module.
功率模組可將多個功率元件提供實體封裝。這些功率元件通常是功率半導體元件，會以焊接或燒結固定在基板上，並依需求提供電接觸或電絕緣等等。相較於獨立的功率元件，功率模組能夠更可靠地提供較高的功率密度。Power modules can provide physical packaging for multiple power components. These power components are usually power semiconductor components, which are fixed to the substrate by welding or sintering, and provide electrical contact or electrical insulation as required. Compared with independent power components, power modules can provide higher power density more reliably.
目前功率模組的外殼皆為一體式射出成型的設計。然而，在需要將功率模組設計成較複雜或較大尺寸的情況下，一體式的設計可能會導致注料不易而使得外殼成型不完全。再者，在製造外殼時，需要將金屬端子放置於模具中，以在外殼成型後一併完成金屬端子的設置。然而，若是成型失敗，需要另外將金屬端子上的成型材料清除後才能夠再次使用，徒增製造時間。或者直接在下次成型步驟中使用新的金屬端子，以避免浪費時間清理成型失敗的金屬端子，但仍會造成製造成本的增加。此外，在不同的應用場合中，功率模組可能需要設計成不同的尺寸。然而，需要為每一種尺寸的功率模組都建立一種成型模具，亦會增加製造的成本。At present, the shells of power modules are all designed with one-piece injection molding. However, when the power module needs to be designed to be more complex or larger in size, the one-piece design may make it difficult to inject the material and cause the shell to be incompletely molded. Furthermore, when manufacturing the shell, the metal terminals need to be placed in the mold so that the metal terminals can be set together after the shell is molded. However, if the molding fails, the molding material on the metal terminals needs to be cleaned before they can be used again, which increases the manufacturing time. Alternatively, new metal terminals can be used directly in the next molding step to avoid wasting time cleaning the metal terminals that failed to mold, but this will still increase the manufacturing cost. In addition, in different application scenarios, the power module may need to be designed in different sizes. However, the need to establish a molding mold for each size of power module will also increase the manufacturing cost.
本發明在於提供一種組合式功率模組，具有高擴充性。The present invention provides a combined power module with high scalability.
本發明之一實施例所揭露之組合式功率模組，包含一底座構件、一端子構件、一第二端子以及一上蓋。端子構件包含一組裝件以及多個第一端子。組裝件組裝於底座構件。第一端子設置於組裝件。第二端子設置於底座構件。上蓋設置於底座構件並覆蓋至少部分的第一端子與至少部分的第二端子。The combined power module disclosed in one embodiment of the present invention comprises a base component, a terminal component, a second terminal and a cover. The terminal component comprises an assembly component and a plurality of first terminals. The assembly component is assembled on the base component. The first terminal is arranged on the assembly component. The second terminal is arranged on the base component. The cover is arranged on the base component and covers at least part of the first terminal and at least part of the second terminal.
根據上述實施例所揭露的組合式功率模組，藉由將端子構件設計成可組裝於底座構件而使得組合式功率模組具有組合式的結構，可避免單個元件外型過於複雜，而能有利於靈活的外型設計，並可提高成型製造良率。再者，端子構件中的第一端子是在組裝件成型後才設置於組裝件，可避免因為組裝件成型製造失敗時導致清理第一端子或替換新的第一端子所增加的製造成本。並且，在底座構件的各元件因不同需求而有不同尺寸或設置於不同位置時，僅需要在組裝件放置對應到不同接點位置的第一端子即可，不需要再次成型一組新的組裝件，從而節省製造成本，並提高組合式功率模組的擴充性。此外，在需要製造出不同元件尺寸或不同元件配置的組合式功率模組時，僅需要將第一端子與第二端子改變長度或接點位置並搭配不同設計的底座構件之元件即可，不需要改變組裝件的尺寸，從而避免為了組裝件而重新建立成型模具的成本，並使組裝件具有高擴充性。According to the modular power module disclosed in the above-mentioned embodiment, by designing the terminal component to be assembled to the base component so that the modular power module has a modular structure, the appearance of a single component can be avoided from being too complicated, which is conducive to flexible appearance design and can improve the molding and manufacturing yield. Furthermore, the first terminal in the terminal component is set on the assembly after the assembly is formed, which can avoid the increased manufacturing cost of cleaning the first terminal or replacing a new first terminal when the assembly molding and manufacturing fails. Moreover, when the various components of the base component have different sizes or are set at different positions due to different needs, it is only necessary to place the first terminals corresponding to different contact positions on the assembly, and there is no need to mold a new set of assembly parts again, thereby saving manufacturing costs and improving the scalability of the modular power module. In addition, when it is necessary to manufacture modular power modules with different component sizes or different component configurations, it is only necessary to change the length or contact position of the first terminal and the second terminal and match the components of the base component with different designs. There is no need to change the size of the assembly, thereby avoiding the cost of re-establishing a molding mold for the assembly and making the assembly highly scalable.
以上關於本發明內容的說明及以下實施方式的說明係用以示範與解釋本發明的原理，並且提供本發明的專利申請範圍更進一步的解釋。The above description of the content of the present invention and the following description of the implementation method are used to demonstrate and explain the principle of the present invention and provide a further explanation of the scope of the patent application of the present invention.
以下在實施方式中詳細敘述本發明之詳細特徵以及優點，其內容足以使任何熟習相關技藝者瞭解本發明之技術內容並據以實施，且根據本說明書所揭露之內容、申請專利範圍及圖式，任何熟習相關技藝者可輕易地理解本發明相關之目的及優點。以下之實施例進一步詳細說明本發明之觀點，但非以任何觀點限制本發明之範疇。The detailed features and advantages of the present invention are described in detail in the following embodiments, and the content is sufficient for any person skilled in the relevant art to understand the technical content of the present invention and implement it accordingly. According to the content disclosed in this specification, the scope of the patent application and the drawings, any person skilled in the relevant art can easily understand the relevant purposes and advantages of the present invention. The following embodiments further illustrate the viewpoints of the present invention in detail, but do not limit the scope of the present invention by any viewpoint.
請參照圖1至圖5，其中圖1係根據本發明之一實施例所繪示之組合式功率模組的立體示意圖，圖2係圖1之組合式功率模組的另一立體示意圖，圖3係圖1之組合式功率模組的分解示意圖，圖4係圖2之組合式功率模組的分解示意圖，圖5係圖3之組合式功率模組的端子構件的分解示意圖。Please refer to Figures 1 to 5, wherein Figure 1 is a three-dimensional schematic diagram of a combined power module according to an embodiment of the present invention, Figure 2 is another three-dimensional schematic diagram of the combined power module of Figure 1, Figure 3 is an exploded schematic diagram of the combined power module of Figure 1, Figure 4 is an exploded schematic diagram of the combined power module of Figure 2, and Figure 5 is an exploded schematic diagram of the terminal components of the combined power module of Figure 3.
本發明之一實施例提供一種組合式功率模組10，例如應用於高鐵列車等使用高壓電的軌道車輛中。組合式功率模組10包含一底座構件11、一端子構件12、一第二端子13、多個訊號端子14以及一上蓋15。An embodiment of the present invention provides a modular power module 10, which is applied to rail vehicles using high voltage electricity, such as high-speed trains. The modular power module 10 includes a base member 11, a terminal member 12, a second terminal 13, a plurality of signal terminals 14 and a cover 15.
底座構件11包含一底板111、一基板112、一環繞牆113、多個定位柱114以及多個安裝柱115。基板112設置於底板111上，並有多個電子元件EC設置於基板112上。電子元件EC例如為功率晶片(power chip)等等。The base member 11 includes a bottom plate 111, a substrate 112, a surrounding wall 113, a plurality of positioning posts 114 and a plurality of mounting posts 115. The substrate 112 is disposed on the bottom plate 111, and a plurality of electronic components EC are disposed on the substrate 112. The electronic components EC are, for example, power chips and the like.
環繞牆113立於底板111上並圍繞基板112。環繞牆113包含一第一側牆1131、一第二側牆1132、一第三側牆1133以及一第四側牆1134。第一側牆1131與第二側牆1132彼此相對。第三側牆1133與第四側牆1134彼此相對且位於第一側牆1131與第二側牆1132之間。第一側牆1131可在靠近第三側牆1133的一側具有一卡槽1131a。第二側牆1132可在靠近第三側牆1133的一側具有一卡槽1132a。The surrounding wall 113 stands on the bottom plate 111 and surrounds the base plate 112. The surrounding wall 113 includes a first side wall 1131, a second side wall 1132, a third side wall 1133 and a fourth side wall 1134. The first side wall 1131 and the second side wall 1132 are opposite to each other. The third side wall 1133 and the fourth side wall 1134 are opposite to each other and are located between the first side wall 1131 and the second side wall 1132. The first side wall 1131 may have a slot 1131a at a side close to the third side wall 1133. The second side wall 1132 may have a slot 1132 a at a side close to the third side wall 1133 .
定位柱114設置於第四側牆1134相對第三側牆1133的表面並朝向第三側牆1133延伸，如圖4所示。安裝柱115設置於第一側牆1131與第二側牆1132彼此相對的表面並沿垂直底板111的方向延伸。The positioning column 114 is disposed on a surface of the fourth side wall 1134 opposite to the third side wall 1133 and extends toward the third side wall 1133, as shown in FIG4 . The mounting column 115 is disposed on surfaces of the first side wall 1131 and the second side wall 1132 opposite to each other and extends in a direction perpendicular to the bottom plate 111 .
端子構件12包含一組裝件121以及四個第一端子122。組裝件121包含一第一本體部1211、一第二本體部1212、兩個卡鉤1213以及多個凸出部1214。第一本體部1211具有一接合面1211a、兩個容置槽1211b以及多個凹入部1211c。容置槽1211b在接合面1211a連通外界。凹入部1211c例如為圓形盲孔，並從第一本體部1211的接合面1211a凹入。第二本體部1212具有一接合面1212a以及兩個容置槽1212b。容置槽1212b在接合面1212a連通外界。卡鉤1213分別連接第一本體部1211與第二本體部1212。凸出部1214例如圓柱，並從第二本體部1212的接合面1212a凸出。可將凸出部1214設計成在尺寸上等於或略大於凹入部1211c。The terminal component 12 includes an assembly 121 and four first terminals 122. The assembly 121 includes a first body portion 1211, a second body portion 1212, two hooks 1213 and a plurality of protrusions 1214. The first body portion 1211 has a joint surface 1211a, two receiving grooves 1211b and a plurality of recessed portions 1211c. The receiving groove 1211b is connected to the outside at the joint surface 1211a. The recessed portion 1211c is, for example, a circular blind hole and is recessed from the joint surface 1211a of the first body portion 1211. The second body portion 1212 has a joint surface 1212a and two receiving grooves 1212b. The receiving groove 1212b is connected to the outside at the joint surface 1212a. The hook 1213 connects the first body portion 1211 and the second body portion 1212. The protrusion 1214 is, for example, a cylinder and protrudes from the joint surface 1212a of the second body portion 1212. The protrusion 1214 can be designed to be equal to or slightly larger than the recess 1211c in size.
每一個第一端子122包含一連接段1221、一彎折段1222以及一接腳段1223。彎折段1222設置於連接段1221與接腳段1223之間。可將每一個彎折段1222設計成在形狀上匹配其中一個容置槽1211b、1212b。Each first terminal 122 includes a connecting section 1221, a bent section 1222, and a connecting section 1223. The bent section 1222 is disposed between the connecting section 1221 and the connecting section 1223. Each bent section 1222 may be designed to match one of the receiving grooves 1211b, 1212b in shape.
以下介紹端子構件12的組裝，首先，如圖5所示，可沿AA、BB方向將第一端子122的彎折段1222從第一本體部1211與第二本體部1212的接合面1211a、1212a放置於各自對應的容置槽1211b、1212b內。接著，可再將第一本體部1211與第二本體部1212的接合面1211a、1212a彼此相對，沿垂直於接合面1211a、1212a的方向將凸出部1214***凹入部1211c，使得第二本體部1212可拆卸地組裝於第一本體部1211。接著，如圖3與圖4所示，可沿CC方向將組裝後的第一本體部1211與第二本體部1212往底板111移動，以將卡鉤1213扣合於卡槽1131a、1132a，使得組裝件121卡合於第一側牆1131與第二側牆1132靠近第三側牆1133的一側，並完成端子構件12至底座構件11的組裝。可將接腳段1223設計成在端子構件12組裝至底座構件11後碰觸到基板112，並可例如透過超音波焊接來將接腳段1223固定至基板112。然而，本發明不以此為限。在部分實施例中，亦可將接腳段設計成在端子構件組裝至底座構件後直接碰觸到基板上的電子元件而建立接腳段與電子元件之間的電性連接。The following describes the assembly of the terminal member 12. First, as shown in FIG5, the bent section 1222 of the first terminal 122 can be placed in the corresponding receiving grooves 1211b and 1212b from the joint surfaces 1211a and 1212a of the first body portion 1211 and the second body portion 1212 along the AA and BB directions. Then, the joint surfaces 1211a and 1212a of the first body portion 1211 and the second body portion 1212 can be placed opposite to each other, and the protrusion 1214 can be inserted into the recess 1211c along a direction perpendicular to the joint surfaces 1211a and 1212a, so that the second body portion 1212 can be detachably assembled to the first body portion 1211. Then, as shown in FIG. 3 and FIG. 4 , the assembled first body portion 1211 and the second body portion 1212 can be moved toward the bottom plate 111 along the CC direction to engage the hook 1213 with the slots 1131a and 1132a, so that the assembly 121 is engaged with the first side wall 1131 and the second side wall 1132 near the third side wall 1133, and the assembly of the terminal component 12 to the base component 11 is completed. The pin section 1223 can be designed to touch the substrate 112 after the terminal component 12 is assembled to the base component 11, and the pin section 1223 can be fixed to the substrate 112, for example, by ultrasonic welding. However, the present invention is not limited thereto. In some embodiments, the pin segment may be designed to directly contact the electronic component on the substrate after the terminal component is assembled to the base component to establish an electrical connection between the pin segment and the electronic component.
第二端子13具有多個連接段131以及一接腳段132。接腳段132設置於連接段131，且具有多個定位孔1321。可將定位柱114***定位孔1321，使得第二端子13設置於第四側牆1134。The second terminal 13 has a plurality of connection sections 131 and a pin section 132. The pin section 132 is disposed on the connection section 131 and has a plurality of positioning holes 1321. The positioning post 114 can be inserted into the positioning hole 1321, so that the second terminal 13 is disposed on the fourth side wall 1134.
訊號端子14例如在安裝柱115射出成型時放置於模穴中以在安裝柱115成型完成後一併完成訊號端子14於安裝柱115的設置，並且訊號端子14用以連接訊號。The signal terminal 14 is placed in the mold cavity when the mounting post 115 is injection molded, so that the signal terminal 14 is installed on the mounting post 115 after the mounting post 115 is molded. The signal terminal 14 is used to connect the signal.
上蓋15具有多個安裝孔151。可將安裝孔151設計成在尺寸上等於或略小於安裝柱115。因此，可將安裝柱115緊配地***安裝孔151，使得上蓋15設置於環繞牆113遠離底板111的一側。設置完成後的上蓋15可覆蓋第一端子122的接腳段1223與第二端子13的接腳段132，將訊號端子14、第一端子122的連接段1221與第二端子13的連接段131暴露於外，並位於第一端子122的連接段1221與第二端子13的連接段131之間。The upper cover 15 has a plurality of mounting holes 151. The mounting holes 151 can be designed to be equal to or slightly smaller in size than the mounting posts 115. Therefore, the mounting posts 115 can be tightly inserted into the mounting holes 151, so that the upper cover 15 is disposed on a side of the surrounding wall 113 away from the bottom plate 111. After being disposed, the upper cover 15 can cover the pin section 1223 of the first terminal 122 and the pin section 132 of the second terminal 13, exposing the signal terminal 14, the connecting section 1221 of the first terminal 122, and the connecting section 131 of the second terminal 13 to the outside, and being located between the connecting section 1221 of the first terminal 122 and the connecting section 131 of the second terminal 13.
在組合式功率模組10組裝完成後，第一端子122可透過連接段1221電性連接外部元件而例如作為組合式功率模組10的輸入或輸出端子，且第二端子13可透過連接段131電性連接外部元件而例如作為組合式功率模組10的輸入或輸出端子。舉例來說，第一端子122或第二端子13可作為組合式功率模組10的直流(DC)正極端子、直流負極端子或交流(AC)端子，本發明不以此為限。After the assembled power module 10 is assembled, the first terminal 122 can be electrically connected to an external element through the connection section 1221 and serve as an input or output terminal of the assembled power module 10, and the second terminal 13 can be electrically connected to an external element through the connection section 131 and serve as an input or output terminal of the assembled power module 10. For example, the first terminal 122 or the second terminal 13 can serve as a DC positive terminal, a DC negative terminal or an AC terminal of the assembled power module 10, but the present invention is not limited thereto.
藉由將端子構件12設計成可組裝於底座構件11，且將端子構件12的組裝件121設計成多件組裝而成的形式，可使得組合式功率模組10具有組合式的結構，可避免單個元件外型過於複雜，而能有利於靈活的外型設計，並可提高成型製造良率。再者，端子構件12中的第一端子122是在組裝件121成型後才設置於組裝件121，可避免因為組裝件121成型製造失敗時導致清理第一端子122或替換新的第一端子122所增加的製造成本。並且，在基板112與電子元件EC因不同需求而有不同尺寸或設置於不同位置時，僅需要在組裝件121放置對應到不同接點位置的第一端子122即可，不需要再次成型一組新的組裝件121，從而節省製造成本，並提高組合式功率模組10的擴充性。此外，在需要製造出不同元件尺寸或不同元件配置的組合式功率模組10時，僅需要將第一端子122的接腳段1223與第二端子13的接腳段132改變長度或接點位置並搭配不同尺寸的基板112即可，不需要改變組裝件121的尺寸，從而避免為了組裝件121而重新建立成型模具的成本，並使組裝件121具有高擴充性。By designing the terminal member 12 to be assembled to the base member 11, and designing the assembly 121 of the terminal member 12 to be assembled into multiple pieces, the modular power module 10 can have a modular structure, which can avoid the appearance of a single component being too complicated, and can be conducive to flexible appearance design, and can improve the molding and manufacturing yield. Furthermore, the first terminal 122 in the terminal member 12 is set on the assembly 121 after the assembly 121 is formed, which can avoid the additional manufacturing cost of cleaning the first terminal 122 or replacing a new first terminal 122 when the molding and manufacturing of the assembly 121 fails. Furthermore, when the substrate 112 and the electronic component EC have different sizes or are arranged at different positions due to different requirements, it is only necessary to place the first terminal 122 corresponding to the different contact positions on the assembly 121, and there is no need to mold a new set of assembly 121 again, thereby saving manufacturing costs and improving the scalability of the modular power module 10. In addition, when it is necessary to manufacture modular power modules 10 with different component sizes or different component configurations, it is only necessary to change the length or contact position of the pin section 1223 of the first terminal 122 and the pin section 132 of the second terminal 13 and match substrates 112 of different sizes, without changing the size of the assembly 121, thereby avoiding the cost of re-establishing a molding mold for the assembly 121 and making the assembly 121 highly scalable.
此外，在設置上蓋15之前，亦可對環繞牆113所圍繞出的內側空間施加密封膠體（未另繪示），以保護電子元件EC等設置於環繞牆113內側的元件，其中密封膠膠體可例如為矽膠(silicone gel)或環氧樹脂(epoxy)等材料，本發明不以此為限。In addition, before installing the upper cover 15, a sealing gel (not shown separately) may be applied to the inner space surrounded by the surrounding wall 113 to protect the electronic components EC and other components disposed inside the surrounding wall 113, wherein the sealing gel may be, for example, a material such as silicone gel or epoxy, but the present invention is not limited thereto.
上蓋15更可具有多個擴孔152。擴孔152連接安裝孔151，且擴孔152的尺寸大於安裝孔151的尺寸。安裝柱115***安裝孔151時亦會一併***擴孔152，且安裝柱115於擴孔152處不與上蓋15實體接觸。由於組合式功率模組10可例如應用於高壓電，即使塑膠材質的上蓋15仍有可能會因為過高電壓的使用環境而被電極化。因此，藉由擴孔152的設計可增加訊號端子14之間沿上蓋15之絕緣表面的路徑（亦可稱為「增加爬電距離」），可避免訊號端子14之間的上蓋15被電極化，進而避免訊號端子14彼此導通而干擾訊號的連接。The upper cover 15 may further have a plurality of expansion holes 152. The expansion holes 152 are connected to the mounting holes 151, and the size of the expansion holes 152 is larger than the size of the mounting holes 151. When the mounting posts 115 are inserted into the mounting holes 151, they are also inserted into the expansion holes 152, and the mounting posts 115 do not physically contact the upper cover 15 at the expansion holes 152. Since the modular power module 10 may be applied to high voltage electricity, even the upper cover 15 made of plastic may still be polarized due to an overly high voltage usage environment. Therefore, the design of the expansion hole 152 can increase the path between the signal terminals 14 along the insulating surface of the upper cover 15 (also called "increasing the creepage distance"), which can prevent the upper cover 15 between the signal terminals 14 from being polarized, thereby preventing the signal terminals 14 from being conductive to each other and interfering with the signal connection.
值得注意的是，卡槽1131a、1132a的位置並非用來限制本發明。在部分實施例中，卡槽亦可位在第一側牆與第二側牆的任意位置，或是位在第三側牆。It should be noted that the positions of the slots 1131a and 1132a are not intended to limit the present invention. In some embodiments, the slots may be located at any position of the first side wall and the second side wall, or at the third side wall.
接著請參照圖6，係根據本發明之再一實施例所繪示之組合式功率模組的立體示意圖。本發明之再一實施例提供一種組合式功率模組20，其結構類似於前述實施例的組合式功率模組10。為了敘述簡潔，以下僅針對組合式功率模組20與組合式功率模組10不同之處，結合必要元件的說明來描述組合式功率模組20，類似之處將不再贅述。Next, please refer to FIG. 6, which is a three-dimensional schematic diagram of a combined power module according to another embodiment of the present invention. Another embodiment of the present invention provides a combined power module 20, whose structure is similar to the combined power module 10 of the aforementioned embodiment. For the sake of brevity, the following only describes the combined power module 20 in terms of the differences between the combined power module 20 and the combined power module 10, and combines the description of the necessary components to describe the combined power module 20, and the similarities will not be repeated.
在組合式功率模組20中，上蓋25更可具有多個第一切槽253。第一切槽253位於第一端子222與第二端子23之間。藉此，可增加第一端子222與第二端子23之間沿上蓋25之絕緣表面的路徑（增加爬電距離），可避免第一端子222與第二端子23之間的上蓋25被電極化，進而避免第一端子222與第二端子23彼此導通。In the combined power module 20, the upper cover 25 may further have a plurality of first slots 253. The first slots 253 are located between the first terminal 222 and the second terminal 23. Thus, the path between the first terminal 222 and the second terminal 23 along the insulating surface of the upper cover 25 can be increased (creepage distance can be increased), and the upper cover 25 between the first terminal 222 and the second terminal 23 can be prevented from being polarized, thereby preventing the first terminal 222 and the second terminal 23 from being conductive to each other.
在組合式功率模組20中，組裝件221可具有多個第二切槽2215。第二切槽2215位於第一端子222之間。藉此，可增加第一端子222之間沿組裝件221之絕緣表面的路徑（增加爬電距離），可避免第一端子222之間的組裝件221被電極化，進而避免第一端子222彼此導通。In the combined power module 20, the assembly 221 may have a plurality of second slots 2215. The second slots 2215 are located between the first terminals 222. Thus, the path between the first terminals 222 along the insulating surface of the assembly 221 can be increased (creepage distance can be increased), and the assembly 221 between the first terminals 222 can be prevented from being polarized, thereby preventing the first terminals 222 from being conductive to each other.
在組合式功率模組20中，上蓋25更可具有多個第三切槽254。第三切槽254位於安裝柱215上所設置的訊號端子24之間。藉此，可進一步增加訊號端子24之間沿上蓋25之絕緣表面的路徑（增加爬電距離），可進一步避免訊號端子24之間的上蓋25被電極化，進而進一步避免訊號端子24彼此導通而干擾訊號的連接。In the modular power module 20, the upper cover 25 may further have a plurality of third slots 254. The third slots 254 are located between the signal terminals 24 disposed on the mounting posts 215. Thus, the path between the signal terminals 24 along the insulating surface of the upper cover 25 can be further increased (creepage distance can be increased), and the upper cover 25 between the signal terminals 24 can be further prevented from being polarized, thereby further preventing the signal terminals 24 from being connected to each other and interfering with the signal connection.
相較於在組合式功率模組10中，是將第一本體部1211的接合面1211a與第二本體部1212的接合面1212a彼此靠近以組裝第一本體部1211與第二本體部1212，本實施例之組合式功率模組20的第一本體部2211與第二本體部2212的組裝方式有所不同。請一併參照圖7，係圖6之組合式功率模組的端子構件的分解示意圖。Compared to the assembled power module 10, the first body 1211 and the second body 1212 are assembled by bringing the joint surface 1211a of the first body 1211 and the joint surface 1212a of the second body 1212 close to each other, the assembled power module 20 of this embodiment has a different way of assembling the first body 2211 and the second body 2212. Please refer to FIG. 7, which is an exploded schematic diagram of the terminal component of the assembled power module of FIG. 6.
如圖7所示，每一個凸出部2214包含一第一延伸段2214a以及一第二延伸段2214b。第一延伸段2214a設置於第二本體部2212與第二延伸段2214b之間，且第一延伸段2214a的延伸方向與第二延伸段2214b的延伸方向不同。每一個凸出部2214在外觀上類似於一個T字形。可將第一本體部2211的凹入部2211c設計成在形狀上匹配凸出部2214。因此，可在將第一端子222放入第一本體部2211與第二本體部2212後，可沿DD方向將凸出部2214***凹入部2211c，使得第二本體部2212可拆卸地組裝於第一本體部2211，其中DD方向可平行於接合面2211a、2212a的延伸方向。As shown in FIG. 7 , each protrusion 2214 includes a first extension section 2214a and a second extension section 2214b. The first extension section 2214a is disposed between the second body portion 2212 and the second extension section 2214b, and the extension direction of the first extension section 2214a is different from the extension direction of the second extension section 2214b. Each protrusion 2214 is similar to a T-shape in appearance. The recessed portion 2211c of the first body portion 2211 can be designed to match the protrusion 2214 in shape. Therefore, after the first terminal 222 is placed in the first body portion 2211 and the second body portion 2212, the protrusion 2214 can be inserted into the recess 2211c along the DD direction so that the second body portion 2212 can be detachably assembled to the first body portion 2211, wherein the DD direction can be parallel to the extension direction of the joint surfaces 2211a and 2212a.
在前述實施例的組合式功率模組10中，圓形之凹入部1211c與圓柱之凸出部1214的設計並非用來限制本發明。請參照圖8，係根據本發明之另一實施例所繪示之組合式功率模組的端子構件的分解示意圖。本發明之另一實施例提供一種組合式功率模組30，其結構類似於前述實施例的組合式功率模組10。為了敘述簡潔，以下僅針對組合式功率模組30與組合式功率模組10不同之處，結合必要元件的說明來描述組合式功率模組30，類似之處將不再贅述。In the combined power module 10 of the aforementioned embodiment, the design of the circular recessed portion 1211c and the cylindrical protruding portion 1214 is not intended to limit the present invention. Please refer to Figure 8, which is a schematic diagram of the exploded terminal components of the combined power module according to another embodiment of the present invention. Another embodiment of the present invention provides a combined power module 30, whose structure is similar to the combined power module 10 of the aforementioned embodiment. For the sake of brevity, the following only describes the combined power module 30 in combination with the description of necessary components with respect to the differences between the combined power module 30 and the combined power module 10, and the similarities will not be repeated.
在組合式功率模組30中，第一本體部3211的凹入部3211c例如為六角形盲孔，第二本體部3212上所設置的凸出部3214例如為六角柱。In the assembled power module 30 , the recessed portion 3211 c of the first body portion 3211 is, for example, a hexagonal blind hole, and the protruding portion 3214 disposed on the second body portion 3212 is, for example, a hexagonal column.
在前述實施例的組合式功率模組10中，卡鉤1213與卡槽1131a、1132a的設計並非用來限制本發明。請參照圖9，係根據本發明之又一實施例所繪示之組合式功率模組的分解示意圖。本發明之又一實施例提供一種組合式功率模組40，其結構類似於前述實施例的組合式功率模組10。為了敘述簡潔，以下僅針對組合式功率模組40與組合式功率模組10不同之處，結合必要元件的說明來描述組合式功率模組40，類似之處將不再贅述。In the combined power module 10 of the aforementioned embodiment, the design of the hook 1213 and the slots 1131a, 1132a is not intended to limit the present invention. Please refer to FIG. 9, which is a schematic diagram of a combined power module according to another embodiment of the present invention. Another embodiment of the present invention provides a combined power module 40, which has a structure similar to the combined power module 10 of the aforementioned embodiment. For the sake of brevity, the following only describes the combined power module 40 in combination with the description of necessary components with respect to the differences between the combined power module 40 and the combined power module 10, and the similarities will not be repeated.
在組合式功率模組40中，第一側牆4131可改為在靠近第三側牆4133的一側具有一裝配槽4131b。第二側牆4132可改為在靠近第三側牆4133的一側具有一裝配槽4132b。裝配槽4131b、4132b的延伸方向可例如垂直於底板411。組裝件421可改為包含兩個裝配凸部4216。裝配凸部4216分別連接第一本體部4211與第二本體部4212。可將裝配凸部4216設計成在尺寸上等於或略大於裝配槽4131b、4132b。因此，可例如沿圖9之EE方向，將端子構件42往底板411移動，以將裝配凸部4216緊配地***裝配槽4131b、4132b，使得組裝件421設置於第一側牆4131與第二側牆4132靠近第三側牆4133的一側，並完成端子構件42至底座構件41的組裝。In the combined power module 40, the first side wall 4131 may be changed to have a mounting groove 4131b on a side close to the third side wall 4133. The second side wall 4132 may be changed to have a mounting groove 4132b on a side close to the third side wall 4133. The extending direction of the mounting grooves 4131b and 4132b may be, for example, perpendicular to the bottom plate 411. The assembly 421 may be changed to include two mounting protrusions 4216. The mounting protrusions 4216 are respectively connected to the first body part 4211 and the second body part 4212. The mounting protrusions 4216 may be designed to be equal to or slightly larger than the mounting grooves 4131b and 4132b in size. Therefore, for example, the terminal component 42 can be moved toward the base plate 411 along the EE direction of Figure 9 to tightly insert the assembly protrusion 4216 into the assembly grooves 4131b, 4132b, so that the assembly component 421 is arranged on the side of the first side wall 4131 and the second side wall 4132 close to the third side wall 4133, and the assembly of the terminal component 42 to the base component 41 is completed.
在前述實施例的組合式功率模組10中，圓弧形之連接段1221、131的設計並非用來限制本發明。請參照圖10，係根據本發明之又再一實施例所繪之組合式功率模組的立體示意圖。本發明之又再一實施例提供一種組合式功率模組50，其結構類似於前述實施例的組合式功率模組10。為了敘述簡潔，以下僅針對組合式功率模組50與組合式功率模組10不同之處，結合必要元件的說明來描述組合式功率模組50，類似之處將不再贅述。In the combined power module 10 of the aforementioned embodiment, the design of the arc-shaped connecting sections 1221, 131 is not intended to limit the present invention. Please refer to FIG. 10, which is a three-dimensional schematic diagram of a combined power module according to yet another embodiment of the present invention. Yet another embodiment of the present invention provides a combined power module 50, whose structure is similar to the combined power module 10 of the aforementioned embodiment. For the sake of brevity, the following only describes the combined power module 50 in combination with the description of necessary components with respect to the differences between the combined power module 50 and the combined power module 10, and the similarities will not be repeated.
在組合式功率模組50中，第一端子522的連接段5221與第二端子53的連接段531為方形。In the combined power module 50 , the connecting section 5221 of the first terminal 522 and the connecting section 531 of the second terminal 53 are square.
在前述實施例的組合式功率模組10中，圓弧形之連接段1221、131的設計並非用來限制本發明。請參照圖11，係根據本發明之又另一實施例所繪示之組合式功率模組的立體示意圖。本發明之又另一實施例提供一種組合式功率模組60，其結構類似於前述實施例的組合式功率模組10。為了敘述簡潔，以下僅針對組合式功率模組60與組合式功率模組10不同之處，結合必要元件的說明來描述組合式功率模組60，類似之處將不再贅述。In the combined power module 10 of the aforementioned embodiment, the design of the arc-shaped connecting sections 1221, 131 is not intended to limit the present invention. Please refer to FIG. 11, which is a three-dimensional schematic diagram of a combined power module according to yet another embodiment of the present invention. Yet another embodiment of the present invention provides a combined power module 60, whose structure is similar to the combined power module 10 of the aforementioned embodiment. For the sake of brevity, the following only describes the combined power module 60 in combination with the description of necessary components with respect to the differences between the combined power module 60 and the combined power module 10, and the similarities will not be repeated.
在組合式功率模組60中，第一端子622的連接段6221與第二端子63的連接段631在遠離彼此的一側具有倒角，而非單純的方形，藉以增加組合式功率模組60的外觀識別度。In the modular power module 60 , the connecting section 6221 of the first terminal 622 and the connecting section 631 of the second terminal 63 have chamfers on the sides away from each other, rather than being simply square, so as to increase the appearance recognition of the modular power module 60 .
根據上述實施例之組合式功率模組，藉由將端子構件設計成可組裝於底座構件，且將端子構件的組裝件設計成多件組裝而成的形式，可使得組合式功率模組具有組合式的結構，可避免單個元件外型過於複雜，而能有利於靈活的外型設計，並可提高成型製造良率。再者，端子構件中的第一端子是在組裝件成型後才設置於組裝件，可避免因為組裝件成型製造失敗時導致清理第一端子或替換新的第一端子所增加的製造成本。並且，在基板與電子元件因不同需求而有不同尺寸或設置於不同位置時，僅需要在組裝件放置對應到不同接點位置的第一端子即可，不需要再次成型一組新的組裝件，從而節省製造成本，並提高組合式功率模組的擴充性。此外，在需要製造出不同元件尺寸或不同元件配置的組合式功率模組時，僅需要將第一端子的接腳段與第二端子的接腳段改變長度或接點位置並搭配不同尺寸的基板即可，不需要改變組裝件的尺寸，從而避免為了組裝件而重新建立成型模具的成本，並使組裝件具有高擴充性。According to the modular power module of the above-mentioned embodiment, by designing the terminal component to be assembled to the base component, and designing the assembly of the terminal component to be assembled into multiple pieces, the modular power module can have a modular structure, which can avoid the appearance of a single component being too complicated, and can be conducive to flexible appearance design, and can improve the molding and manufacturing yield. Furthermore, the first terminal in the terminal component is set on the assembly after the assembly is formed, which can avoid the increased manufacturing cost of cleaning the first terminal or replacing a new first terminal when the assembly molding and manufacturing fails. Moreover, when the substrate and the electronic components have different sizes or are set at different positions due to different needs, it is only necessary to place the first terminals corresponding to different contact positions on the assembly, and there is no need to mold a new set of assembly parts again, thereby saving manufacturing costs and improving the scalability of the modular power module. In addition, when it is necessary to manufacture a modular power module with different component sizes or different component configurations, it is only necessary to change the length or contact position of the pin segment of the first terminal and the pin segment of the second terminal and match them with substrates of different sizes. There is no need to change the size of the assembly, thereby avoiding the cost of re-establishing a molding mold for the assembly and making the assembly highly scalable.
雖然本發明以前述之諸項實施例揭露如上，然其並非用以限定本發明，任何熟習相像技藝者，在不脫離本發明之精神和範圍內，當可作些許之更動與潤飾，因此本發明之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。Although the present invention is disclosed as above with the aforementioned embodiments, they are not used to limit the present invention. Anyone skilled in similar techniques may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the patent protection scope of the present invention shall be subject to the scope defined by the application patent attached to this specification.
10、20、30、40、50、60:組合式功率模組 11、41:底座構件 111、411:底板 112:基板 113:環繞牆 1131、4131:第一側牆 1131a:卡槽 4131b:裝配槽 1132、4132:第二側牆 1132a:卡槽 4132b:裝配槽 1133、4133:第三側牆 1134:第四側牆 114:定位柱 115、215:安裝柱 12、42:端子構件 121、221、421:組裝件 1211、2211、3211、4211:第一本體部 1211a、2211a:接合面 1211b:容置槽 1211c、2211c、3211c:凹入部 1212、2212、3212、4212:第二本體部 1212a、2212a:接合面 1212b:容置槽 1213:卡鉤 1214、2214、3214:凸出部 2214a:第一延伸段 2214b:第二延伸段 2215:第二切槽 4216:裝配凸部 122、222、522、622:第一端子 1221、5221、6221:連接段 1222:彎折段 1223:接腳段 13、23、53、63:第二端子 131、531、631:連接段 132:接腳段 1321:定位孔 14、24:訊號端子 15、25:上蓋 151:安裝孔 152:擴孔 253:第一切槽 254:第三切槽 AA、BB、CC、DD、EE:方向 EC:電子元件 10, 20, 30, 40, 50, 60: modular power module 11, 41: base component 111, 411: bottom plate 112: base plate 113: surrounding wall 1131, 4131: first side wall 1131a: slot 4131b: assembly slot 1132, 4132: second side wall 1132a: slot 4132b: assembly slot 1133, 4133: third side wall 1134: fourth side wall 114: positioning column 115, 215: mounting column 12, 42: terminal component 121, 221, 421: assembly part 1211, 2211, 3211, 4211: first body part 1211a, 2211a: joint surface 1211b: receiving groove 1211c, 2211c, 3211c: recessed part 1212, 2212, 3212, 4212: second body part 1212a, 2212a: joint surface 1212b: receiving groove 1213: hook 1214, 2214, 3214: protruding part 2214a: first extension section 2214b: second extension section 2215: second notch 4216: assembly protrusion 122, 222, 522, 622: first terminal 1221, 5221, 6221: connecting section 1222: Bend section 1223: Pin section 13, 23, 53, 63: Second terminal 131, 531, 631: Connection section 132: Pin section 1321: Positioning hole 14, 24: Signal terminal 15, 25: Upper cover 151: Mounting hole 152: Expansion hole 253: First slot 254: Third slot AA, BB, CC, DD, EE: Direction EC: Electronic component
圖1係根據本發明之一實施例所繪示之組合式功率模組的立體示意圖。 圖2係圖1之組合式功率模組的另一立體示意圖。 圖3係圖1之組合式功率模組的分解示意圖。 圖4係圖2之組合式功率模組的分解示意圖。 圖5係圖3之組合式功率模組的端子構件的分解示意圖。 圖6係根據本發明之再一實施例所繪示之組合式功率模組的立體示意圖。 圖7係圖6之組合式功率模組的端子構件的分解示意圖。 圖8係根據本發明之另一實施例所繪示之組合式功率模組的端子構件的分解示意圖。 圖9係根據本發明之又一實施例所繪示之組合式功率模組的分解示意圖。 圖10係根據本發明之又再一實施例所繪示之組合式功率模組的立體示意圖。 圖11係根據本發明之又另一實施例所繪示之組合式功率模組的立體示意圖。 FIG. 1 is a three-dimensional schematic diagram of a combined power module according to one embodiment of the present invention. FIG. 2 is another three-dimensional schematic diagram of the combined power module of FIG. 1. FIG. 3 is an exploded schematic diagram of the combined power module of FIG. 1. FIG. 4 is an exploded schematic diagram of the combined power module of FIG. 2. FIG. 5 is an exploded schematic diagram of the terminal component of the combined power module of FIG. 3. FIG. 6 is a three-dimensional schematic diagram of a combined power module according to another embodiment of the present invention. FIG. 7 is an exploded schematic diagram of the terminal component of the combined power module of FIG. 6. FIG. 8 is an exploded schematic diagram of the terminal component of the combined power module according to another embodiment of the present invention. FIG. 9 is an exploded schematic diagram of the combined power module according to another embodiment of the present invention. FIG. 10 is a three-dimensional schematic diagram of a combined power module according to yet another embodiment of the present invention. FIG. 11 is a three-dimensional schematic diagram of a combined power module according to yet another embodiment of the present invention.
10:組合式功率模組 111:底板 112:基板 113:環繞牆 1131:第一側牆 1131a:卡槽 1132:第二側牆 1132a:卡槽 1133:第三側牆 1134:第四側牆 115:安裝柱 12:端子構件 121:組裝件 1211:第一本體部 1212:第二本體部 1213:卡鉤 122:第一端子 13:第二端子 14:訊號端子 15:上蓋 151:安裝孔 152:擴孔 CC:方向 EC:電子元件 10: Assembled power module 111: Bottom plate 112: Base plate 113: Surrounding wall 1131: First side wall 1131a: Slot 1132: Second side wall 1132a: Slot 1133: Third side wall 1134: Fourth side wall 115: Mounting column 12: Terminal component 121: Assembly 1211: First body 1212: Second body 1213: Hook 122: First terminal 13: Second terminal 14: Signal terminal 15: Upper cover 151: Mounting hole 152: Expansion hole CC: Direction EC: Electronic component
Claims (10)
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| Application Number | Priority Date | Filing Date | Title |
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| US18/116,763 US20240130055A1 (en) | 2022-10-13 | 2023-03-02 | Combined power module |
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| US202263415953P | 2022-10-13 | 2022-10-13 | |
| US63/415,953 | 2022-10-13 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20200323092A1 (en) | 2019-04-08 | 2020-10-08 | Kevin R. Williams | Condensation resistant power semiconductor module |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20200323092A1 (en) | 2019-04-08 | 2020-10-08 | Kevin R. Williams | Condensation resistant power semiconductor module |
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