TWI845321B - Edge backlight module and manufacturing method thereof - Google Patents
Edge backlight module and manufacturing method thereof Download PDFInfo
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- TWI845321B TWI845321B TW112119785A TW112119785A TWI845321B TW I845321 B TWI845321 B TW I845321B TW 112119785 A TW112119785 A TW 112119785A TW 112119785 A TW112119785 A TW 112119785A TW I845321 B TWI845321 B TW I845321B
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Abstract
Description
本發明是有關於一種背光模組及其製造方法，且特別是有關於一種側光式背光模組及其製造方法。 The present invention relates to a backlight module and a manufacturing method thereof, and in particular to a side-lit backlight module and a manufacturing method thereof.
目前側光式背光模組廣泛使用於各種電子裝置中，然而，側光式背光模組常具有厚度較厚、散熱效果不好、製作難度高等問題，因此如何在降低側光式背光模組的製作難度的同時符合薄型化與散熱等要求實為一種挑戰。 At present, side-lit backlight modules are widely used in various electronic devices. However, side-lit backlight modules often have problems such as thick thickness, poor heat dissipation effect, and high manufacturing difficulty. Therefore, how to reduce the manufacturing difficulty of side-lit backlight modules while meeting the requirements of thinness and heat dissipation is a challenge.
本發明提供一種側光式背光模組及其製造方法，其可以在降低製作難度的同時符合薄型化與散熱等要求。 The present invention provides a side-lit backlight module and a manufacturing method thereof, which can reduce the difficulty of manufacturing while meeting the requirements of thinness and heat dissipation.
本發明的一種側光式背光模組的製造方法，至少包括以下步驟。提供金屬基板。形成反射層於金屬基板上。分別提供電路板與多個發光元件。將電路板、多個發光元件、金屬基板與其上的反射層結合製作成側光式背光模組。 The manufacturing method of a side-lit backlight module of the present invention comprises at least the following steps. Provide a metal substrate. Form a reflective layer on the metal substrate. Provide a circuit board and a plurality of light-emitting elements respectively. Combine the circuit board, the plurality of light-emitting elements, the metal substrate and the reflective layer thereon to manufacture a side-lit backlight module.
在本發明的一實施例中，上述的將電路板、多個發光元件、金屬基板與其上的反射層結合的步驟更包括以下步驟。接合電路板於金屬基板或反射層的至少一側邊上。接合電路板之後，對金屬基板執行成型製程，以使金屬基板構成環繞空間。接合多個發光元件於電路板上，且使多個發光元件電性連接至電路板。 In one embodiment of the present invention, the above-mentioned step of combining the circuit board, multiple light-emitting elements, the metal substrate and the reflective layer thereon further includes the following steps. Joining the circuit board to at least one side of the metal substrate or the reflective layer. After joining the circuit board, performing a molding process on the metal substrate so that the metal substrate forms a surrounding space. Joining multiple light-emitting elements to the circuit board, and electrically connecting the multiple light-emitting elements to the circuit board.
在本發明的一實施例中，上述的將電路板、多個發光元件、金屬基板與其上的反射層結合的步驟更包括以下步驟。對金屬基板執行成型製程，以使金屬基板形成環繞空間。形成環繞空間之後，接合電路板於金屬基板或反射層的至少一側邊上。接合多個發光元件於電路板上，且使多個發光元件電性連接至電路板。 In one embodiment of the present invention, the above-mentioned step of combining the circuit board, multiple light-emitting elements, the metal substrate and the reflective layer thereon further includes the following steps. Performing a molding process on the metal substrate to form a surrounding space on the metal substrate. After forming the surrounding space, bonding the circuit board to at least one side of the metal substrate or the reflective layer. Bonding multiple light-emitting elements to the circuit board, and electrically connecting the multiple light-emitting elements to the circuit board.
在本發明的一實施例中，上述的反射層藉由塗布製程、噴塗製程或印刷製程接觸形成於金屬基板的表面上。 In one embodiment of the present invention, the above-mentioned reflective layer is formed on the surface of the metal substrate by a coating process, a spraying process or a printing process.
在本發明的一實施例中，上述的多個發光元件的布設區域下方的電路板中不具有補強材料。 In one embodiment of the present invention, the circuit board below the layout area of the above-mentioned multiple light-emitting elements does not have a reinforcing material.
在本發明的一實施例中，上述的金屬基板具有開口，且反射層的形成區域的邊緣與開口的邊緣具有一距離或切齊。 In one embodiment of the present invention, the metal substrate has an opening, and the edge of the forming area of the reflective layer is at a distance or aligned with the edge of the opening.
在本發明的一實施例中，上述的金屬基板具有開口，且電路板由開口的內部延伸至開口的外部。 In one embodiment of the present invention, the metal substrate has an opening, and the circuit board extends from the inside of the opening to the outside of the opening.
本發明的一種側光式背光模組包括金屬基板、反射層、電路板以及多個發光元件。反射層位於金屬基板上，其中反射層直接接觸金屬基板。電路板位於金屬基板或反射層上。多個發光元件位於電路板上，其中多個發光元件與電路板電性連接。 A side-lit backlight module of the present invention includes a metal substrate, a reflective layer, a circuit board, and a plurality of light-emitting elements. The reflective layer is located on the metal substrate, wherein the reflective layer directly contacts the metal substrate. The circuit board is located on the metal substrate or the reflective layer. A plurality of light-emitting elements are located on the circuit board, wherein a plurality of light-emitting elements are electrically connected to the circuit board.
在本發明的一實施例中，上述的電路板中不具有補強材料。 In one embodiment of the present invention, the above-mentioned circuit board does not have reinforcing material.
在本發明的一實施例中，上述的金屬基板具有彎折部分，且彎折部分包圍反射層與部分電路板。 In one embodiment of the present invention, the metal substrate has a bent portion, and the bent portion surrounds the reflective layer and a portion of the circuit board.
基於上述，本發明預先將反射層製作於金屬基板上，不用額外形成反射片，因此可以降低側光式背光模組的厚度並具有更好的散熱效果，且由於多個發光元件沒有先接合在電路板上，因此可以大幅降低組裝時的難易度，如此一來，可以藉由前述優化的製造方法降低製作難度，且其製造出來的側光式背光模組亦可以符合薄型化與散熱等要求。 Based on the above, the present invention pre-fabricates the reflective layer on the metal substrate, and does not need to form an additional reflective sheet, so the thickness of the side-lit backlight module can be reduced and the heat dissipation effect can be better. Moreover, since the multiple light-emitting elements are not first bonded to the circuit board, the difficulty of assembly can be greatly reduced. In this way, the manufacturing difficulty can be reduced by the above-mentioned optimized manufacturing method, and the manufactured side-lit backlight module can also meet the requirements of thinness and heat dissipation.
為讓本發明的上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。 In order to make the above features and advantages of the present invention more clearly understood, the following is a detailed description of the embodiments with the accompanying drawings.
110:金屬基板 110:Metal substrate
110a:開口 110a: Opening
110b:彎折部分 110b: Bending part
110e、120e:邊緣 110e, 120e: Edge
110s:側邊 110s: Side
110t:表面 110t: Surface
120:反射層 120: Reflective layer
130:電路板 130: Circuit board
132:黏著層 132: Adhesive layer
140:發光元件 140: Light-emitting element
d:距離 d: distance
S100、S200、S300、S400:步驟 S100, S200, S300, S400: Steps
圖1是本發明一些實施例的側光式背光模組的製造流程圖。 Figure 1 is a manufacturing flow chart of a side-lit backlight module of some embodiments of the present invention.
圖2、圖3、圖4A、圖5A是本發明的一些實施例的一種側光式背光模組的部分製造流程的上視示意圖。 Figures 2, 3, 4A, and 5A are top views of a partial manufacturing process of a side-lit backlight module in some embodiments of the present invention.
圖6A、圖7A是本發明的一些實施例的一種側光式背光模組的中間製造流程的上視示意圖。 Figure 6A and Figure 7A are top views of the intermediate manufacturing process of a side-lit backlight module in some embodiments of the present invention.
圖4B、圖5B、圖6B、圖7B是分別沿著圖4A、圖5A、圖6A、圖7A之線A-A’的剖面示意圖。 Figures 4B, 5B, 6B, and 7B are schematic cross-sectional views along the line A-A’ of Figures 4A, 5A, 6A, and 7A, respectively.
圖4C、圖5C、圖6C、圖7C是分別沿著圖4A、圖5A、圖6A、圖7A之線B-B’的剖面示意圖。 Figures 4C, 5C, 6C, and 7C are schematic cross-sectional views along the line B-B’ of Figures 4A, 5A, 6A, and 7A, respectively.
圖8A、圖8B、8C是本發明的一些實施例的金屬基板的成型示意圖。 Figures 8A, 8B, and 8C are schematic diagrams of the forming of metal substrates of some embodiments of the present invention.
應說明的是，圖8A、圖8B、8C為求清楚說明，省略繪示反射層、電路板等構件。此外，各種特徵並非按比例繪製，為使論述清晰起見，可任意增大或減小各種特徵的尺寸。 It should be noted that for the sake of clarity, Figures 8A, 8B, and 8C omit components such as the reflective layer and circuit board. In addition, the various features are not drawn to scale, and the sizes of the various features may be arbitrarily increased or decreased for the sake of clarity.
在以下詳細描述中，為了說明而非限制，闡述揭示特定細節之示例性實施例以提供對本發明之各種原理之透徹理解。然而，本領域一般技術者將顯而易見的是，得益於本揭示案，可在脫離本文所揭示特定細節的其他實施例中實踐本發明。此外，可省略對熟知裝置、方法及材料之描述以免模糊對本發明之各種原理之描述。 In the following detailed description, for the purpose of illustration and not limitation, exemplary embodiments that disclose specific details are described to provide a thorough understanding of the various principles of the present invention. However, it will be apparent to one of ordinary skill in the art that, with the benefit of this disclosure, the present invention can be practiced in other embodiments that depart from the specific details disclosed herein. In addition, descriptions of well-known devices, methods, and materials may be omitted to avoid obscuring the description of the various principles of the present invention.
以下將參考圖式來全面地描述本發明的例示性實施例，但本發明還可按照多種不同形式來實施，且不應解釋為限於本文所述的實施例。在圖式中，為了清楚起見，各區域、部位及層的大小與厚度可不按實際比例繪製。為了方便理解，下述說明中相同的元件將以相同之符號標示來說明。 The following will refer to the drawings to fully describe the exemplary embodiments of the present invention, but the present invention can also be implemented in many different forms and should not be construed as being limited to the embodiments described herein. In the drawings, for the sake of clarity, the size and thickness of each region, part and layer may not be drawn in actual proportion. For ease of understanding, the same elements in the following description will be indicated by the same symbols.
除非另有明確說明，否則本文所述任何方法絕不意欲被解釋為要求按特定順序執行其步驟。 Unless expressly stated otherwise, it is in no way intended that any method described herein be construed as requiring that its steps be performed in a specific order.
除非另有定義，本文使用的所有術語(包括技術和科學術 語)具有與本發明所屬領域的普通技術人員通常理解的相同的含義。 Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by ordinary technicians in the field to which the present invention belongs.
圖1是本發明一些實施例的側光式背光模組的製造流程圖。圖2、圖3、圖4A、圖5A是本發明的一些實施例的一種側光式背光模組的部分製造流程的上視示意圖。圖6A、圖7A是本發明的一些實施例的一種側光式背光模組的中間製造流程的上視示意圖。圖4B、圖5B、圖6B、圖7B是分別沿著圖4A、圖5A、圖6A、圖7A之線A-A’的剖面示意圖。圖4C、圖5C、圖6C、圖7C是分別沿著圖4A、圖5A、圖6A、圖7A之線B-B’的剖面示意圖。圖8A、圖8B、8C是本發明的一些實施例的金屬基板的成型示意圖。 FIG. 1 is a manufacturing flow chart of a side-lit backlight module of some embodiments of the present invention. FIG. 2, FIG. 3, FIG. 4A, and FIG. 5A are top views of a partial manufacturing process of a side-lit backlight module of some embodiments of the present invention. FIG. 6A and FIG. 7A are top views of an intermediate manufacturing process of a side-lit backlight module of some embodiments of the present invention. FIG. 4B, FIG. 5B, FIG. 6B, and FIG. 7B are cross-sectional schematic diagrams along the line A-A' of FIG. 4A, FIG. 5A, FIG. 6A, and FIG. 7A, respectively. FIG. 4C, FIG. 5C, FIG. 6C, and FIG. 7C are cross-sectional schematic diagrams along the line B-B' of FIG. 4A, FIG. 5A, FIG. 6A, and FIG. 7A, respectively. FIG. 8A, FIG. 8B, and FIG. 8C are schematic diagrams of forming a metal substrate of some embodiments of the present invention.
請參考圖1與圖2，首先，提供金屬基板110(步驟S100)，其中金屬基板110的材料包括鐵、不鏽鋼、鋁、鋁合金，但本發明不限於此，金屬基板110亦可以使用其他能夠於後續的製程中承載其上的構件的適宜材料。在此，金屬基板110具有開口110a，且金屬基板110的厚度可以是任何適宜的厚度，本發明不加以限制。
Please refer to FIG. 1 and FIG. 2. First, a
請參考圖1與圖3，接著，於金屬基板110上形成反射層120(步驟S200)，其中反射層120的材料包括高反射的樹脂材料、白色油墨等適宜材料，且反射層120例如是藉由塗布製程、噴塗製程或印刷製程接觸形成於金屬基板110的表面110t上，換句話說，金屬基板110與反射層120之間例如是不設置有其他膜層(如
黏著層或其類似者)，但本發明不限於此。
Please refer to FIG. 1 and FIG. 3. Next, a
在本實施例中，反射層120的形成區域的邊緣120e與開口110a的邊緣110e具有一距離d，因此部分金屬基板110的表面110t被暴露出來，如此一來，後續的電路板130會配置於金屬基板110上被暴露出來的區域並與其直接接觸，因此可以更進一步縮減厚度，但本發明不限於此，在未繪示的實施例中，反射層120的形成區域的邊緣120e與開口110a的邊緣110e切齊，因此與開口110a相鄰的金屬基板110的表面110t沒有暴露出來，如此一來，後續的電路板130會配置於反射層120上並與其直接接觸。
In this embodiment, the
請參考圖1、圖4A至圖4C與圖5A至圖5C，形成反射層120之後，分別提供電路板130與多個發光元件140(步驟S300)，且將電路板130、多個發光元件140、金屬基板110與其上的反射層120結合製作成側光式背光模組100(步驟S400)。據此，本發明預先將反射層120製作於金屬基板110上，不用額外形成反射片，因此可以降低側光式背光模組100的厚度並具有更好的散熱效果，且由於多個發光元件140沒有先接合在電路板130上，因此可以大幅降低組裝時的難易度，如此一來，可以藉由前述優化的製造方法降低製作難度，且其製造出來的側光式背光模組100亦可以符合薄型化與散熱等要求。在此，發光元件140例如是發光二極體(LED)。
1, 4A to 4C, and 5A to 5C, after forming the
在一些實施例中，由於散熱效果的改善，所以可以有效增加發光元件140的壽命，且亦可以提升發光亮度，但本發明不限
於此。
In some embodiments, due to the improvement of heat dissipation effect, the life of the light-emitting
在一些實施例中，反射層120的厚度至少小於60微米，因此相較於現行額外設置的反射片(厚度甚或可以達300微米以上)而言，確實可以有效降低整體結構的厚度，但本發明不限於此，反射層120的厚度可以依照實際設計上的需求而定。
In some embodiments, the thickness of the
在一些實施例中，反射層120的厚度大於25微米，但本發明不限於此。
In some embodiments, the thickness of the
由於現行的軟性電路板較薄(例如是0.1毫米)，硬挺性較差，因此發光元件打件時常需要設置補強材料(補強材料例如是FR-4、PI膜、PET膜、(也包含複合式PI膜)、鐵、不鏽鋼、鋁、鋁合金、銅、銅合金等適宜材料，厚度例如是介於0.2毫米至0.3毫米之間)，以增加軟性電路板的厚度與硬挺性，提升打件良率，然而，如此一來會導致散熱效果變差，而在本實施例中，電路板130是不具有補強材料的軟性電路板，如此一來，多個發光元件140的布設區域下方的電路板130中不具有補強材料，因此本實施例的降低側光式背光模組100於厚度與散熱效果上皆更具有優勢，但本發明不限於此，電路板130亦可以是軟硬結合板。
Since the current flexible circuit board is relatively thin (for example, 0.1 mm) and has poor stiffness, it is often necessary to set up reinforcing materials (reinforcing materials such as FR-4, PI film, PET film (including composite PI film), iron, stainless steel, aluminum, aluminum alloy, copper, copper alloy and other suitable materials, with a thickness of, for example, between 0.2 mm and 0.3 mm) when punching the light-emitting element to increase the thickness and stiffness of the flexible circuit board and improve the punching efficiency. Yield, however, this will lead to poor heat dissipation effect. In this embodiment, the
在一些實施例中，上述步驟S400更包括對金屬基板110進行成型製程(例如是藉由衝壓、拉伸或其類似製程)，以使金屬基板110具有彎折部分110b(如圖8B與圖8C所示)，且彎折部分110b包圍反射層120與部分電路板130(彎折部分110b可以對應至圖4A、圖5A、圖7A、圖8A的虛線位置)。
In some embodiments, the above step S400 further includes performing a forming process on the metal substrate 110 (for example, by punching, stretching or similar processes) so that the
進一步而言，成型製程可以是如圖8A與圖8B所示，將金屬基板110凸出於反射層120與電路板130的部分彎折(例如是向上彎折)，使電路板130具有的四個彎折部分110b，其中相鄰彎折部分110b之間可以具有縫隙(例如是藉由衝壓、成型、破孔及折邊製程所形成)，但本發明不限於此，成型製程亦可以是如圖8C所示，彎折部分110b可以是使用衝壓、成型、破孔及引伸製程後形成一體成型結構，因此彎折部分110b具有R角且不具有如圖8B的縫隙，以更有效地減少漏光情形的發生。
Furthermore, the molding process may be as shown in FIG. 8A and FIG. 8B, where the
在一實施例中，上述步驟S400的具體製作方式例如是經由圖6A、圖4A、圖5A的順序所製作，亦即如圖6A所示，可以先接合電路板130於金屬基板110的至少一側邊110s上(藉由黏著層132接合於金屬基板110上)，但本發明不限於此，在未繪示的實施例中，可以先接合電路板130於反射層120的至少一側邊上(藉由黏著層132接合於反射層120上)。在此，黏著層132可以是熱固膠、感壓膠或任何其他適宜的黏著材料藉由塗佈、壓合或其他類似製程所形成，本發明不加以限制，且電路板130於開口110a側的部分可以由開口110a的內部延伸至開口110a的外部，且可以依照實際設計上的需求於外部進行折彎。
In one embodiment, the specific manufacturing method of the above-mentioned step S400 is, for example, manufactured in the order of FIG. 6A, FIG. 4A, and FIG. 5A. That is, as shown in FIG. 6A, the
接著，接合電路板130之後，如圖4A所示，對金屬基板110執行成型製程，以使金屬基板110構成環繞空間，然後，如圖5A所示，接合多個發光元件140於電路板130上，且使多個發光元件140電性連接至電路板130，亦即在此製造流程中是先接合電
路板130再執行成型製程，但本發明不限於此。
Next, after the
在另一實施例中，上述步驟S400的具體製作方式亦可以例如是經由圖7A、圖4A、圖5A的順序所製作，亦即如圖7A所示，先對金屬基板110執行成型製程，以使金屬基板110形成環繞空間，換句話說，執行成型製程時電路板130尚未配置於金屬基板110上，接著，如圖4A所示，形成環繞空間之後，接合電路板130於金屬基板110的至少一側邊110s上(在未繪示的實施例中，亦可以接合在反射層120的至少一側邊上)，然後，如圖5A所示，接合多個發光元件140於電路板130上，且使多個發光元件140電性連接至電路板130，亦即在此製造流程中是先執行成型製程再接合電路板130。
In another embodiment, the specific manufacturing method of the above step S400 can also be manufactured in the order of FIG. 7A, FIG. 4A, and FIG. 5A, that is, as shown in FIG. 7A, the
應說明的是，儘管本文目前的圖式中的發光元件140皆只有設置於一個側邊110s上，但本發明不限於此，在未繪示的實施例中，發光元件140亦可以同時設置於二個、三個或四個側邊上，以電路電性連接所有發光元件140，藉以提升側光式背光模組100的均光效果，其中在該些實施例中，只會有一個使電路板130由內部延伸至外部的開口110a，以降低漏光的機率，但本發明不限於此。
It should be noted that although the light-emitting
在一些實施例中，電路板130於開口110a內的部分可以與金屬基板110具有間隙，亦即電路板130於開口110a內的部分可以不接觸金屬基板110，但本發明不限於此，在未繪示的實施例中，電路板130於開口110a內的部分與金屬基板110不具有間隙，
因此電路板130於開口110a內的部分可以是直接接觸金屬基板110。
In some embodiments, the portion of the
在一些實施例中，發光元件140藉由表面黏著(Surface Mount Device,SMD)製程接合於電路板130上，但本發明不限於此，發光元件140亦可以藉由其他適宜的導電接著材料接合於電路板130上。
In some embodiments, the light-emitting
在一些實施例中，上述側光式背光模組100的反射層120上還可以進一步設置導光板、稜鏡或其他背光模組的組件，其中該些組件的細節(如設置方式等)為所屬技術領域中具有通常知識者所知悉之技術，於此不再贅述。
In some embodiments, a light guide plate, a prism or other backlight module components may be further disposed on the
綜上所述，本發明預先將反射層製作於金屬基板上，不用額外形成反射片，因此可以降低側光式背光模組的厚度並具有更好的散熱效果，且由於多個發光元件沒有先接合在電路板上，因此可以大幅降低組裝時的難易度，如此一來，可以藉由前述優化的製造方法降低製作難度，且其製造出來的側光式背光模組亦可以符合薄型化與散熱等要求。 In summary, the present invention pre-fabricates the reflective layer on the metal substrate, and does not need to form an additional reflective sheet, so the thickness of the side-lit backlight module can be reduced and the heat dissipation effect can be better. Moreover, since the multiple light-emitting elements are not first bonded to the circuit board, the difficulty of assembly can be greatly reduced. In this way, the manufacturing difficulty can be reduced by the aforementioned optimized manufacturing method, and the manufactured side-lit backlight module can also meet the requirements of thinness and heat dissipation.
雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明的精神和範圍內，當可作些許的更動與潤飾，故本發明的保護範圍當視後附的申請專利範圍所界定者為準。 Although the present invention has been disclosed as above by the embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the relevant technical field can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined by the attached patent application.
S100、S200、S300、S400:步驟 S100, S200, S300, S400: Steps
Claims (8)
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| US20220269134A1 (en) | 2010-10-28 | 2022-08-25 | Lg Electronics Inc. | Display apparatus |
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| US20220269134A1 (en) | 2010-10-28 | 2022-08-25 | Lg Electronics Inc. | Display apparatus |
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