TWI844967B - Micro-electromechanical packaging structure - Google Patents
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- TWI844967B TWI844967B TW111136337A TW111136337A TWI844967B TW I844967 B TWI844967 B TW I844967B TW 111136337 A TW111136337 A TW 111136337A TW 111136337 A TW111136337 A TW 111136337A TW I844967 B TWI844967 B TW I844967B
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- 238000004806 packaging method and process Methods 0.000 title abstract description 6
- 239000000758 substrate Substances 0.000 claims abstract description 35
- 230000000149 penetrating effect Effects 0.000 claims abstract description 4
- 239000011148 porous material Substances 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 239000002184 metal Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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本發明是有關於一種微機電元件,且特別是有關於一種微機電封裝結構。The present invention relates to a micro-electromechanical system component, and more particularly to a micro-electromechanical system package structure.
微機電麥克風包括振膜及背極板,其製作在矽晶片上,用以接收聲波並將其轉換為電訊號。微機電麥克風已大量應用在筆記型電腦、智慧型手機以及各類可攜式電子產品。近年來可攜式電子產品的防塵防水功能亦開始受到重視。A MEMS microphone consists of a diaphragm and a back plate, which are made on a silicon chip to receive sound waves and convert them into electrical signals. MEMS microphones have been widely used in laptops, smart phones and various portable electronic products. In recent years, the dustproof and waterproof functions of portable electronic products have also begun to receive attention.
現有的微機電麥克風,為避免環境中的水滴從聲孔進入而造成收音模組的損壞,需在對應收音模組的基板位置上形成多個細孔,這些細孔可避免水滴進入微機電麥克風,但是因細孔的孔徑過小,此增加聲波傳遞至感測模組時的能量損失,進而影響微機電麥克風的收音效能。In order to prevent water droplets from entering the sound hole and causing damage to the sound receiving module, existing MEMS microphones need to form multiple fine holes on the substrate corresponding to the sound receiving module. These fine holes can prevent water droplets from entering the MEMS microphone. However, because the aperture of the fine holes is too small, the energy loss when the sound wave is transmitted to the sensing module is increased, thereby affecting the sound receiving performance of the MEMS microphone.
本發明提供一種微機電封裝結構,適用於微機電麥克風,在基板上形成具備不同口徑的聲孔,口徑大的一側能容納較多個細孔,藉此減少聲波傳遞至感測模組時的能量損失,以維持微機電麥克風的收音效能。The present invention provides a micro-electromechanical system packaging structure suitable for a micro-electromechanical system microphone. Sound holes with different diameters are formed on a substrate. The side with a larger diameter can accommodate more small holes, thereby reducing the energy loss when the sound wave is transmitted to the sensing module, so as to maintain the sound receiving performance of the micro-electromechanical system microphone.
本發明的微機電封裝結構,包括一基板、一感測模組、一防水層以及一蓋體。基板具有一第一表面、一第二表面及貫穿第一表面及第二表面之一聲孔。聲孔具有一上開口以及一下開口,且下開口之口徑大於上開口之口徑。感測模組配置於基板的第一表面且覆蓋上開口。防水層配置於基板的第二表面且覆蓋下開口。防水層具有多個細孔。多個細孔連通聲孔。蓋體配置於第一表面並覆蓋感測模組。The micro-electromechanical system package structure of the present invention includes a substrate, a sensing module, a waterproof layer and a cover. The substrate has a first surface, a second surface and a sound hole penetrating the first surface and the second surface. The sound hole has an upper opening and a lower opening, and the diameter of the lower opening is larger than the diameter of the upper opening. The sensing module is arranged on the first surface of the substrate and covers the upper opening. The waterproof layer is arranged on the second surface of the substrate and covers the lower opening. The waterproof layer has a plurality of fine holes. The plurality of fine holes are connected to the sound hole. The cover is arranged on the first surface and covers the sensing module.
在本發明的一實施例中,上述的多個細孔分佈在下開口垂直投影的區域範圍內且超出上開口垂直投影的區域範圍。In one embodiment of the present invention, the plurality of fine holes are distributed within the area of the vertical projection of the lower opening and beyond the area of the vertical projection of the upper opening.
在本發明的一實施例中,上述的聲孔具自第一表面垂直延伸至第二表面之階梯狀側面。In one embodiment of the present invention, the sound hole has a stepped side surface extending vertically from the first surface to the second surface.
在本發明的一實施例中,上述的聲孔具自第一表面斜向延伸至第二表面之傾斜側面。In one embodiment of the present invention, the sound hole has an inclined side surface extending obliquely from the first surface to the second surface.
在本發明的一實施例中,上述的聲孔的上開口自第一表面垂直延伸一第一厚度,且聲孔自第一厚度處斜向延伸一第二厚度至第二表面,以形成下開口。In an embodiment of the present invention, the upper opening of the sound hole extends vertically from the first surface by a first thickness, and the sound hole extends obliquely from the first thickness by a second thickness to the second surface to form a lower opening.
在本發明的一實施例中,上述的感測模組具有一腔室對應連通於聲孔,且腔室的一內徑匹配於聲孔的上開口之口徑。In one embodiment of the present invention, the sensing module has a chamber corresponding to the sound hole, and an inner diameter of the chamber matches the diameter of the upper opening of the sound hole.
在本發明的一實施例中,上述上開口與下開口之間距大於50um,較佳實施例介於50um至75um之間。In one embodiment of the present invention, the distance between the upper opening and the lower opening is greater than 50um, and in a preferred embodiment, it is between 50um and 75um.
在本發明的一實施例中,上述的各細孔的孔徑位於20um至50um之間,較佳實施例位於34um至42um之間,且多個細孔的數量為8個以上,較佳實施例為31至48個。In one embodiment of the present invention, the diameter of each of the pores is between 20um and 50um, and in a preferred embodiment, it is between 34um and 42um. The number of the pores is more than 8, and in a preferred embodiment, it is 31 to 48.
在本發明的一實施例中,上述的感測模組還包括至少一電極,電極配置在防水層遠離基板的一外表面。In an embodiment of the present invention, the sensing module further comprises at least one electrode, and the electrode is disposed on an outer surface of the waterproof layer away from the substrate.
在本發明的一實施例中,上述的感測模組還包括至少一電極,電極配置在蓋體的一頂面。In an embodiment of the present invention, the sensing module further includes at least one electrode, and the electrode is disposed on a top surface of the cover.
在本發明的一實施例中,還包括一增高層,配置在防水層外且具有對應連通多個細孔的一開孔。In one embodiment of the present invention, a heightening layer is further included, which is disposed outside the waterproof layer and has an opening corresponding to and connecting the plurality of fine holes.
基於上述,本發明的微機電封裝結構,適用於微機電麥克風,在基板上形成具備不同口徑的聲孔,同時在基板上配置防水層,防水層具有多個細孔且對位於聲孔,環境中的聲波依序從細孔傳遞通過聲孔直至感測模組,聲孔口徑大的一側對應於多個細孔,以增加防水層在聲孔範圍內的細孔數量,聲孔口徑小的一側對應銜接感測模組,以使基板之第一表面有足夠之空間乘載感測模組。微機電麥克風可以在不增加整體體積下藉由細孔數量的增加,減少聲波傳遞至感測模組時的能量損失,以維持微機電麥克風的收音效能。Based on the above, the MEMS packaging structure of the present invention is suitable for MEMS microphones. Sound holes with different diameters are formed on the substrate. At the same time, a waterproof layer is configured on the substrate. The waterproof layer has multiple fine holes and is located opposite to the sound holes. The sound waves in the environment are transmitted from the fine holes through the sound holes to the sensing module in sequence. The side with a larger diameter of the sound hole corresponds to multiple fine holes to increase the number of fine holes in the waterproof layer within the range of the sound hole. The side with a smaller diameter of the sound hole corresponds to the connected sensing module so that the first surface of the substrate has enough space to carry the sensing module. The MEMS microphone can reduce the energy loss when the sound wave is transmitted to the sensing module by increasing the number of fine holes without increasing the overall volume, so as to maintain the sound reception performance of the MEMS microphone.
此外,防水層的多個細孔能有效防止水滴進入聲孔而導致感測模組的損壞。In addition, the multiple fine holes in the waterproof layer can effectively prevent water droplets from entering the sound hole and causing damage to the sensor module.
圖1是本發明第一實施例的微機電封裝結構的平面示意圖。圖2是圖1的微機電封裝結構的聲孔與多個細孔的平面示意圖。圖3是圖1的微機電封裝結構結合增高層的平面示意圖。Fig. 1 is a schematic plan view of a MEMS package structure of the first embodiment of the present invention. Fig. 2 is a schematic plan view of a sound hole and a plurality of fine holes of the MEMS package structure of Fig. 1. Fig. 3 is a schematic plan view of the MEMS package structure of Fig. 1 combined with a heightening layer.
參考圖1,本發明的微機電封裝結構適用於微機電麥克風,由基板、感測模組、特定應用積體電路(ASIC)及外殼封裝而成。基板例如是電路板且具有金屬線路,且感測模組及特定應用積體電路電性耦接於基板的金屬線路。此外,特定應用積體電路與感測模組之間透過打線接合而相互耦接。Referring to FIG. 1 , the MEMS package structure of the present invention is applicable to a MEMS microphone, and is formed by a substrate, a sensing module, an application-specific integrated circuit (ASIC), and a housing package. The substrate is, for example, a circuit board and has a metal line, and the sensing module and the application-specific integrated circuit are electrically coupled to the metal line of the substrate. In addition, the application-specific integrated circuit and the sensing module are coupled to each other through wire bonding.
參考圖1,本實施例的微機電封裝結構100包括一基板110、一感測模組120、一防水層130以及一蓋體140。1 , the MEMS package structure 100 of this embodiment includes a substrate 110 , a sensing module 120 , a
基板110具有一第一表面111、一第二表面112及貫穿第一表面111及第二表面112之一聲孔113。聲孔113具有一上開口1131以及一下開口1132,且下開口1132之口徑D2大於上開口1131之口徑D1,其中聲孔113用以傳遞環境中的聲波W。The substrate 110 has a first surface 111, a second surface 112 and a
進一步而言,聲孔113具自第一表面111垂直延伸至第二表面112之階梯狀側面1133,且上開口1131與下開口1132之間距大於50um,於較佳實施例中介於50um至75um之間位於50um至75um之間。其中,聲孔113的口徑D1自第一表面111垂直延伸至25um至37.5um之間,且聲孔113的口徑D2自25um至37.5um處垂直延伸至第二表面112,以形成階梯狀側面1133。Furthermore, the
感測模組120配置於基板110的第一表面111且覆蓋聲孔113的上開口1131。感測模組120為麥克風感測器且具有一腔室121及一振膜122。腔室121對應連通於聲孔113,且腔室121的一內徑的尺寸、形狀匹配於聲孔113的上開口1131之口徑D1。The sensing module 120 is disposed on the first surface 111 of the substrate 110 and covers the upper opening 1131 of the
補充而言,當聲波W通過聲孔113而進入腔室121時,聲波W在腔室121中產生壓差以造成振膜122的振動,振膜122將此振動轉換為電子訊號,再將電子訊號依序傳輸至特定應用積體電路及揚聲器以輸出音訊。In addition, when the sound wave W enters the chamber 121 through the
參考圖1及圖2,防水層130配置於基板110的第二表面112且覆蓋聲孔113的下開口1132。防水層130具有多個細孔131。多個細孔131連通聲孔113且分佈在下開口1132的範圍中。詳細而言,多個細孔131分佈在下開口1132垂直投影的區域範圍內且超出上開口1131垂直投影的區域範圍,其中多個細孔131均勻分佈在下開口1132的區域範圍內。蓋體140配置於第一表面111並覆蓋感測模組120。Referring to FIG. 1 and FIG. 2 , the
參考圖2,於本實施例中,各細孔131的孔徑位於20um至50um之間,於較佳實施例中位於34um至42um之間,且多個細孔131的數量為31至48個。於本實施例中,細孔131的孔徑需小於等於42um才能達到防水標準且不會導致聲波阻尼過大,但細孔131的孔徑不能小於34um,若細孔131的孔徑小於34um將增加聲波通過各細孔131時的能量損失,此不利於感測模組120的聲波感測。多個細孔131的數量則依據下開口1132之口徑D2的尺寸而調整為31至48個,且均勻分佈在下開口1132的區域範圍中。Referring to FIG. 2 , in this embodiment, the diameter of each
舉例而言,當聲孔113的下開口1132之口徑D2為800 um時,細孔131的數量為31個,當聲孔113的下開口1132之口徑D2為1000 mm時,細孔131的數量為48個。For example, when the diameter D2 of the
於其他實施例中,細孔的數量也可能小於31個或大於48個,此視聲孔的尺寸而定,本發明並未加以限制細孔的數量。In other embodiments, the number of fine holes may be less than 31 or greater than 48, depending on the size of the sound hole. The present invention does not limit the number of fine holes.
參考圖1,感測模組120包括至少一電極123。於本實施例中,至少一電極123的數量為多個,且多個電極123配置在防水層130遠離基板110的一外表面132。1 , the sensing module 120 includes at least one electrode 123 . In this embodiment, there are multiple at least one electrode 123 , and the multiple electrodes 123 are disposed on an outer surface 132 of the
補充而言,多個電極123用以耦接在電腦、筆記型電腦或智慧型手機的主機板上,藉此供應電源至感測模組120。In addition, the plurality of electrodes 123 are coupled to a motherboard of a computer, a laptop or a smart phone to supply power to the sensing module 120.
參考圖3,本實施例的微機電封裝結構100A還包括一增高層150a,配置在防水層130a外且具有對應連通多個細孔131a的一開孔151a。增高層150a用以支撐防水層130a,藉此避免防水層130a直接接觸主機板或其它機構件,而造成防水層130a之多個細孔131a的毀壞。此外,感測模組120a的多個電極123a配置在增高層150a遠離防水層130a的一側。Referring to FIG. 3 , the MEMS package structure 100A of this embodiment further includes a heightened layer 150a, which is disposed outside the waterproof layer 130a and has an opening 151a corresponding to and connected to the plurality of fine holes 131a. The heightened layer 150a is used to support the waterproof layer 130a, thereby preventing the waterproof layer 130a from directly contacting the motherboard or other components, thereby causing damage to the plurality of fine holes 131a of the waterproof layer 130a. In addition, the plurality of electrodes 123a of the sensing module 120a are disposed on a side of the heightened layer 150a away from the waterproof layer 130a.
參考圖4,本實施例的微機電封裝結構100B不同於圖1所示的微機電封裝結構100,差別在於,聲孔113b具自第一表面111b斜向延伸至第二表面112b之傾斜側面1133b。詳細而言,聲孔113b的傾斜側面1133b的寬度自上開口1131b朝下開口1132b的方向延伸漸增,使得基板之第二表面保有足夠之開孔空間之同時,基板之第一表面亦具有足夠的乘載空間。當聲波W自下開口1132b進入聲孔113b時,將沿著寬度漸縮的傾斜側面1133b通過上開口1131b,並且進入感測模組120b的腔室121b中。Referring to FIG. 4 , the MEMS package structure 100B of this embodiment is different from the MEMS package structure 100 shown in FIG. 1 in that the sound hole 113b has an inclined side surface 1133b extending obliquely from the first surface 111b to the second surface 112b. Specifically, the width of the inclined side surface 1133b of the sound hole 113b gradually increases from the upper opening 1131b toward the lower opening 1132b, so that the second surface of the substrate retains sufficient opening space while the first surface of the substrate also has sufficient carrying space. When the sound wave W enters the sound hole 113b from the lower opening 1132b, it will pass through the upper opening 1131b along the inclined side surface 1133b with a gradually decreasing width and enter the cavity 121b of the sensing module 120b.
參考圖5,本實施例的微機電封裝結構100C不同於圖1所示的微機電封裝結構100,差別在於,聲孔113c的上開口1131c自第一表面111c垂直延伸一第一厚度T1,且聲孔113c自第一厚度T1處斜向延伸一第二厚度T2至第二表面112c,以形成下開口1132c。詳細而言,腔室121c的內徑匹配於聲孔113c的上開口1131c之口徑D1,且聲孔113c的寬度自第一厚度T1處朝下開口1132c的方向延伸漸增,使得基板之第二表面保有足夠之開孔空間之同時,基板之第一表面亦具有足夠的乘載空間。Referring to FIG. 5 , the MEMS package structure 100C of the present embodiment is different from the MEMS package structure 100 shown in FIG. 1 in that the upper opening 1131c of the acoustic hole 113c extends vertically from the first surface 111c by a first thickness T1, and the acoustic hole 113c extends obliquely from the first thickness T1 by a second thickness T2 to the second surface 112c to form a lower opening 1132c. Specifically, the inner diameter of the chamber 121c matches the diameter D1 of the upper opening 1131c of the acoustic hole 113c, and the width of the acoustic hole 113c gradually increases from the first thickness T1 toward the lower opening 1132c, so that the second surface of the substrate retains sufficient opening space while the first surface of the substrate also has sufficient carrying space.
參考圖6,本實施例的微機電封裝結構100D不同於圖1所示的微機電封裝結構100,差別在於,感測模組120d包括至少一電極123d。其中,至少一電極123d的數量為多個,且多個電極123d配置在蓋體140d的一頂面。補充而言,多個電極123d用以耦接在電腦、筆記型電腦或智慧型手機的主機板上,藉此供應電源至感測模組120d。Referring to FIG. 6 , the MEMS package structure 100D of this embodiment is different from the MEMS package structure 100 shown in FIG. 1 in that the sensing module 120d includes at least one electrode 123d. There are multiple electrodes 123d, and the multiple electrodes 123d are disposed on a top surface of the cover 140d. In addition, the multiple electrodes 123d are used to couple to a motherboard of a computer, a laptop or a smart phone to supply power to the sensing module 120d.
綜上所述,本發明的微機電封裝結構,適用於微機電麥克風,在基板上形成具備不同口徑的聲孔,同時在基板上配置防水層,防水層具有多個細孔且對位於聲孔,環境中的聲波依序從細孔傳遞通過聲孔直至感測模組,聲孔口徑大的一側對應於多個細孔,以增加防水層在聲孔範圍內的細孔數量,聲孔口徑小的一側對應銜接感測模組,以使基板之第一表面有足夠之空間乘載感測模組。微機電麥克風可以在不增加整體體積下,藉由細孔數量的增加,減少聲波傳遞至感測模組時的能量損失,以維持微機電麥克風的收音效能。In summary, the MEMS packaging structure of the present invention is suitable for MEMS microphones. Sound holes with different diameters are formed on a substrate. A waterproof layer is disposed on the substrate at the same time. The waterproof layer has a plurality of fine holes and is located opposite to the sound holes. Sound waves in the environment are transmitted from the fine holes through the sound holes in sequence to the sensing module. The side with a larger diameter of the sound hole corresponds to a plurality of fine holes to increase the number of fine holes of the waterproof layer within the range of the sound hole. The side with a smaller diameter of the sound hole corresponds to the connected sensing module so that the first surface of the substrate has sufficient space to carry the sensing module. The MEMS microphone can reduce the energy loss when the sound wave is transmitted to the sensing module by increasing the number of fine holes without increasing the overall volume, so as to maintain the sound reception performance of the MEMS microphone.
此外,防水層的多個細孔能有效防止水滴進入聲孔而導致感測模組的損壞。In addition, the multiple fine holes in the waterproof layer can effectively prevent water droplets from entering the sound hole and causing damage to the sensor module.
100、100A、100B、100C、100D:微機電封裝結構
110:基板
111、111b:第一表面
112、112b:第二表面
113、113b、113c:聲孔
1131、1131c:上開口
1132、1132c:下開口
1133、1133b:側面
120、120a、120b、120d:感測模組
121、121b:腔室
122:振膜
123、123a、123d:電極
130、130a:防水層
131、131a:細孔
132:外表面
140、140d:蓋體
150a:增高層
151a:開孔
W:聲波
D1、D2:口徑
T1:第一厚度
T2:第二厚度
100, 100A, 100B, 100C, 100D: MEMS package structure
110: substrate
111, 111b: first surface
112, 112b:
圖1是本發明第一實施例的微機電封裝結構的平面示意圖。 圖2是圖1的微機電封裝結構的聲孔與多個細孔的平面示意圖。 圖3是圖1的微機電封裝結構結合增高層的平面示意圖。 圖4是本發明第二實施例的微機電封裝結構的平面示意圖。 圖5是本發明第三實施例的微機電封裝結構的平面示意圖。 圖6是本發明第四實施例的微機電封裝結構的平面示意圖。 FIG. 1 is a schematic plan view of a microelectromechanical package structure of the first embodiment of the present invention. FIG. 2 is a schematic plan view of a sound hole and a plurality of fine holes of the microelectromechanical package structure of FIG. 1. FIG. 3 is a schematic plan view of the microelectromechanical package structure of FIG. 1 combined with an enhancement layer. FIG. 4 is a schematic plan view of a microelectromechanical package structure of the second embodiment of the present invention. FIG. 5 is a schematic plan view of a microelectromechanical package structure of the third embodiment of the present invention. FIG. 6 is a schematic plan view of a microelectromechanical package structure of the fourth embodiment of the present invention.
100:微機電封裝結構 100:Micro-electromechanical packaging structure
110:基板 110: Substrate
111:第一表面 111: First surface
112:第二表面 112: Second surface
113:聲孔 113: Sound hole
1131:上開口 1131: Upper opening
1132:下開口 1132: Lower opening
1133:側面 1133: Side
120:感測模組 120:Sensor module
121:腔室 121: Chamber
122:振膜 122: Diaphragm
123:電極 123:Electrode
130:防水層 130: Waterproof layer
131:細孔 131: Fine holes
132:外表面 132: External surface
140:蓋體 140: Cover
W:聲波 W: Sound waves
D1、D2:口徑 D1, D2: caliber
Claims (10)
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US18/085,513 US20240034620A1 (en) | 2022-07-26 | 2022-12-20 | Micro-electromechanical packaging structure |
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US202263392137P | 2022-07-26 | 2022-07-26 | |
US63/392,137 | 2022-07-26 |
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TW202404891A TW202404891A (en) | 2024-02-01 |
TWI844967B true TWI844967B (en) | 2024-06-11 |
Family
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Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010113384A1 (en) | 2009-04-01 | 2010-10-07 | パナソニック株式会社 | Semiconductor device and manufacturing method therefor |
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2010113384A1 (en) | 2009-04-01 | 2010-10-07 | パナソニック株式会社 | Semiconductor device and manufacturing method therefor |
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