TWI844644B - Dry films, hardened materials and electronic parts for hollow devices - Google Patents
Dry films, hardened materials and electronic parts for hollow devices Download PDFInfo
- Publication number
- TWI844644B TWI844644B TW109109596A TW109109596A TWI844644B TW I844644 B TWI844644 B TW I844644B TW 109109596 A TW109109596 A TW 109109596A TW 109109596 A TW109109596 A TW 109109596A TW I844644 B TWI844644 B TW I844644B
- Authority
- TW
- Taiwan
- Prior art keywords
- solvent
- resin layer
- dry film
- resin
- film
- Prior art date
Links
- 239000000463 material Substances 0.000 title claims abstract description 6
- 229920005989 resin Polymers 0.000 claims abstract description 129
- 239000011347 resin Substances 0.000 claims abstract description 129
- 239000002904 solvent Substances 0.000 claims abstract description 77
- 239000011342 resin composition Substances 0.000 claims abstract description 25
- 239000013557 residual solvent Substances 0.000 claims description 58
- 238000009835 boiling Methods 0.000 claims description 12
- 238000007789 sealing Methods 0.000 abstract description 13
- 239000003566 sealing material Substances 0.000 abstract description 11
- 239000010410 layer Substances 0.000 description 99
- 239000003822 epoxy resin Substances 0.000 description 56
- 229920000647 polyepoxide Polymers 0.000 description 56
- -1 SAW devices Substances 0.000 description 28
- 229920002799 BoPET Polymers 0.000 description 27
- 230000001681 protective effect Effects 0.000 description 19
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 18
- 150000001875 compounds Chemical class 0.000 description 17
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 15
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 15
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate group Chemical group [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 15
- 239000011256 inorganic filler Substances 0.000 description 15
- 229910003475 inorganic filler Inorganic materials 0.000 description 15
- 239000007787 solid Substances 0.000 description 15
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 14
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 14
- 229920003986 novolac Polymers 0.000 description 14
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 12
- 238000001035 drying Methods 0.000 description 12
- 239000000758 substrate Substances 0.000 description 12
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 11
- 229920001187 thermosetting polymer Polymers 0.000 description 10
- 238000012360 testing method Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 7
- 238000001723 curing Methods 0.000 description 7
- 125000004185 ester group Chemical group 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- 239000002245 particle Substances 0.000 description 7
- 238000002360 preparation method Methods 0.000 description 7
- 239000004305 biphenyl Substances 0.000 description 6
- 235000010290 biphenyl Nutrition 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000004848 polyfunctional curative Substances 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 5
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 5
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 5
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 5
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 239000003960 organic solvent Substances 0.000 description 5
- 238000004381 surface treatment Methods 0.000 description 5
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 239000006059 cover glass Substances 0.000 description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000005011 phenolic resin Substances 0.000 description 4
- 239000002356 single layer Substances 0.000 description 4
- XOSCKTQMAZSFBZ-UHFFFAOYSA-N 2-[[1-[[2,7-bis(oxiran-2-ylmethoxy)naphthalen-1-yl]methyl]-7-(oxiran-2-ylmethoxy)naphthalen-2-yl]oxymethyl]oxirane Chemical compound C1OC1COC(C=C1C=2CC=3C4=CC(OCC5OC5)=CC=C4C=CC=3OCC3OC3)=CC=C1C=CC=2OCC1CO1 XOSCKTQMAZSFBZ-UHFFFAOYSA-N 0.000 description 3
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 229920001665 Poly-4-vinylphenol Polymers 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000000806 elastomer Substances 0.000 description 3
- 125000003700 epoxy group Chemical group 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 3
- 239000003208 petroleum Substances 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 229920005992 thermoplastic resin Polymers 0.000 description 3
- OUPZKGBUJRBPGC-UHFFFAOYSA-N 1,3,5-tris(oxiran-2-ylmethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound O=C1N(CC2OC2)C(=O)N(CC2OC2)C(=O)N1CC1CO1 OUPZKGBUJRBPGC-UHFFFAOYSA-N 0.000 description 2
- XKZQKPRCPNGNFR-UHFFFAOYSA-N 2-(3-hydroxyphenyl)phenol Chemical compound OC1=CC=CC(C=2C(=CC=CC=2)O)=C1 XKZQKPRCPNGNFR-UHFFFAOYSA-N 0.000 description 2
- CQOZJDNCADWEKH-UHFFFAOYSA-N 2-[3,3-bis(2-hydroxyphenyl)propyl]phenol Chemical compound OC1=CC=CC=C1CCC(C=1C(=CC=CC=1)O)C1=CC=CC=C1O CQOZJDNCADWEKH-UHFFFAOYSA-N 0.000 description 2
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 2
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- JWAZRIHNYRIHIV-UHFFFAOYSA-N 2-naphthol Chemical compound C1=CC=CC2=CC(O)=CC=C21 JWAZRIHNYRIHIV-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- 101100012902 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) FIG2 gene Proteins 0.000 description 2
- 101100233916 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) KAR5 gene Proteins 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 2
- 125000003710 aryl alkyl group Chemical group 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 2
- 238000002296 dynamic light scattering Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- PHTQWCKDNZKARW-UHFFFAOYSA-N isoamylol Chemical compound CC(C)CCO PHTQWCKDNZKARW-UHFFFAOYSA-N 0.000 description 2
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 2
- 229940018564 m-phenylenediamine Drugs 0.000 description 2
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- 125000000962 organic group Chemical group 0.000 description 2
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 2
- KJFMBFZCATUALV-UHFFFAOYSA-N phenolphthalein Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C2=CC=CC=C2C(=O)O1 KJFMBFZCATUALV-UHFFFAOYSA-N 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000002952 polymeric resin Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- UOHMMEJUHBCKEE-UHFFFAOYSA-N prehnitene Chemical compound CC1=CC=C(C)C(C)=C1C UOHMMEJUHBCKEE-UHFFFAOYSA-N 0.000 description 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 2
- 239000000376 reactant Substances 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- DEQUKPCANKRTPZ-UHFFFAOYSA-N (2,3-dihydroxyphenyl)-phenylmethanone Chemical compound OC1=CC=CC(C(=O)C=2C=CC=CC=2)=C1O DEQUKPCANKRTPZ-UHFFFAOYSA-N 0.000 description 1
- GUYIZQZWDFCUTA-UHFFFAOYSA-N (pentadecachlorophthalocyaninato(2-))-copper Chemical compound [Cu+2].N1=C([N-]2)C3=C(Cl)C(Cl)=C(Cl)C(Cl)=C3C2=NC(C2=C(Cl)C(Cl)=C(Cl)C(Cl)=C22)=NC2=NC(C2=C(Cl)C(Cl)=C(Cl)C(Cl)=C22)=NC2=NC2=C(C(Cl)=C(C(Cl)=C3)Cl)C3=C1[N-]2 GUYIZQZWDFCUTA-UHFFFAOYSA-N 0.000 description 1
- KYVBNYUBXIEUFW-UHFFFAOYSA-N 1,1,3,3-tetramethylguanidine Chemical compound CN(C)C(=N)N(C)C KYVBNYUBXIEUFW-UHFFFAOYSA-N 0.000 description 1
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical group C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- JIHQDMXYYFUGFV-UHFFFAOYSA-N 1,3,5-triazine Chemical compound C1=NC=NC=N1 JIHQDMXYYFUGFV-UHFFFAOYSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- FRASJONUBLZVQX-UHFFFAOYSA-N 1,4-dioxonaphthalene Natural products C1=CC=C2C(=O)C=CC(=O)C2=C1 FRASJONUBLZVQX-UHFFFAOYSA-N 0.000 description 1
- BOKGTLAJQHTOKE-UHFFFAOYSA-N 1,5-dihydroxynaphthalene Chemical compound C1=CC=C2C(O)=CC=CC2=C1O BOKGTLAJQHTOKE-UHFFFAOYSA-N 0.000 description 1
- LAVARTIQQDZFNT-UHFFFAOYSA-N 1-(1-methoxypropan-2-yloxy)propan-2-yl acetate Chemical compound COCC(C)OCC(C)OC(C)=O LAVARTIQQDZFNT-UHFFFAOYSA-N 0.000 description 1
- FUWDFGKRNIDKAE-UHFFFAOYSA-N 1-butoxypropan-2-yl acetate Chemical compound CCCCOCC(C)OC(C)=O FUWDFGKRNIDKAE-UHFFFAOYSA-N 0.000 description 1
- LIPRQQHINVWJCH-UHFFFAOYSA-N 1-ethoxypropan-2-yl acetate Chemical compound CCOCC(C)OC(C)=O LIPRQQHINVWJCH-UHFFFAOYSA-N 0.000 description 1
- HTQNYBBTZSBWKL-UHFFFAOYSA-N 2,3,4-trihydroxbenzophenone Chemical compound OC1=C(O)C(O)=CC=C1C(=O)C1=CC=CC=C1 HTQNYBBTZSBWKL-UHFFFAOYSA-N 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- CUDYYMUUJHLCGZ-UHFFFAOYSA-N 2-(2-methoxypropoxy)propan-1-ol Chemical compound COC(C)COC(C)CO CUDYYMUUJHLCGZ-UHFFFAOYSA-N 0.000 description 1
- AUABZJZJXPSZCN-UHFFFAOYSA-N 2-(dimethylamino)phenol Chemical compound CN(C)C1=CC=CC=C1O AUABZJZJXPSZCN-UHFFFAOYSA-N 0.000 description 1
- DJOYTAUERRJRAT-UHFFFAOYSA-N 2-(n-methyl-4-nitroanilino)acetonitrile Chemical compound N#CCN(C)C1=CC=C([N+]([O-])=O)C=C1 DJOYTAUERRJRAT-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- QQZOPKMRPOGIEB-UHFFFAOYSA-N 2-Oxohexane Chemical compound CCCCC(C)=O QQZOPKMRPOGIEB-UHFFFAOYSA-N 0.000 description 1
- MEVBAGCIOOTPLF-UHFFFAOYSA-N 2-[[5-(oxiran-2-ylmethoxy)naphthalen-2-yl]oxymethyl]oxirane Chemical compound C1OC1COC(C=C1C=CC=2)=CC=C1C=2OCC1CO1 MEVBAGCIOOTPLF-UHFFFAOYSA-N 0.000 description 1
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- YTTFFPATQICAQN-UHFFFAOYSA-N 2-methoxypropan-1-ol Chemical compound COC(C)CO YTTFFPATQICAQN-UHFFFAOYSA-N 0.000 description 1
- PYSRRFNXTXNWCD-UHFFFAOYSA-N 3-(2-phenylethenyl)furan-2,5-dione Chemical compound O=C1OC(=O)C(C=CC=2C=CC=CC=2)=C1 PYSRRFNXTXNWCD-UHFFFAOYSA-N 0.000 description 1
- 229940018563 3-aminophenol Drugs 0.000 description 1
- JIGUICYYOYEXFS-UHFFFAOYSA-N 3-tert-butylbenzene-1,2-diol Chemical compound CC(C)(C)C1=CC=CC(O)=C1O JIGUICYYOYEXFS-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 1
- 229910015900 BF3 Inorganic materials 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XZMCDFZZKTWFGF-UHFFFAOYSA-N Cyanamide Chemical compound NC#N XZMCDFZZKTWFGF-UHFFFAOYSA-N 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- 239000004593 Epoxy Chemical class 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 101001121408 Homo sapiens L-amino-acid oxidase Proteins 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- 102100026388 L-amino-acid oxidase Human genes 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- CYTYCFOTNPOANT-UHFFFAOYSA-N Perchloroethylene Chemical group ClC(Cl)=C(Cl)Cl CYTYCFOTNPOANT-UHFFFAOYSA-N 0.000 description 1
- 235000010627 Phaseolus vulgaris Nutrition 0.000 description 1
- 244000046052 Phaseolus vulgaris Species 0.000 description 1
- JPYHHZQJCSQRJY-UHFFFAOYSA-N Phloroglucinol Natural products CCC=CCC=CCC=CCC=CCCCCC(=O)C1=C(O)C=C(O)C=C1O JPYHHZQJCSQRJY-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical class CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229920000147 Styrene maleic anhydride Polymers 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 241000779819 Syncarpia glomulifera Species 0.000 description 1
- FZWLAAWBMGSTSO-UHFFFAOYSA-N Thiazole Chemical compound C1=CSC=N1 FZWLAAWBMGSTSO-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000004844 aliphatic epoxy resin Substances 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229920003180 amino resin Polymers 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 150000003934 aromatic aldehydes Chemical group 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- KXHPPCXNWTUNSB-UHFFFAOYSA-M benzyl(trimethyl)azanium;chloride Chemical compound [Cl-].C[N+](C)(C)CC1=CC=CC=C1 KXHPPCXNWTUNSB-UHFFFAOYSA-M 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- ZFVMWEVVKGLCIJ-UHFFFAOYSA-N bisphenol AF Chemical compound C1=CC(O)=CC=C1C(C(F)(F)F)(C(F)(F)F)C1=CC=C(O)C=C1 ZFVMWEVVKGLCIJ-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 150000001718 carbodiimides Chemical class 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- LTYMSROWYAPPGB-UHFFFAOYSA-N diphenyl sulfide Chemical compound C=1C=CC=CC=1SC1=CC=CC=C1 LTYMSROWYAPPGB-UHFFFAOYSA-N 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- YEPPTFLLAIAEGB-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1.OC1=CC=CC=C1 YEPPTFLLAIAEGB-UHFFFAOYSA-N 0.000 description 1
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- FRCAGVUKJQCWBD-UHFFFAOYSA-L iodine green Chemical compound [Cl-].[Cl-].C1=CC(N(C)C)=CC=C1C(\C=1C=CC(=CC=1)[N+](C)(C)C)=C/1C=C(C)C(=[N+](C)C)C=C\1 FRCAGVUKJQCWBD-UHFFFAOYSA-L 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- GJRQTCIYDGXPES-UHFFFAOYSA-N iso-butyl acetate Natural products CC(C)COC(C)=O GJRQTCIYDGXPES-UHFFFAOYSA-N 0.000 description 1
- FGKJLKRYENPLQH-UHFFFAOYSA-M isocaproate Chemical compound CC(C)CCC([O-])=O FGKJLKRYENPLQH-UHFFFAOYSA-M 0.000 description 1
- LADVLFVCTCHOAI-UHFFFAOYSA-N isocyanic acid;toluene Chemical compound N=C=O.CC1=CC=CC=C1 LADVLFVCTCHOAI-UHFFFAOYSA-N 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- OQAGVSWESNCJJT-UHFFFAOYSA-N isovaleric acid methyl ester Natural products COC(=O)CC(C)C OQAGVSWESNCJJT-UHFFFAOYSA-N 0.000 description 1
- 238000007561 laser diffraction method Methods 0.000 description 1
- CWLKGDAVCFYWJK-UHFFFAOYSA-N m-Aminophenol Natural products NC1=CC=CC(O)=C1 CWLKGDAVCFYWJK-UHFFFAOYSA-N 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- UQKAOOAFEFCDGT-UHFFFAOYSA-N n,n-dimethyloctan-1-amine Chemical compound CCCCCCCCN(C)C UQKAOOAFEFCDGT-UHFFFAOYSA-N 0.000 description 1
- FZZQNEVOYIYFPF-UHFFFAOYSA-N naphthalene-1,6-diol Chemical compound OC1=CC=CC2=CC(O)=CC=C21 FZZQNEVOYIYFPF-UHFFFAOYSA-N 0.000 description 1
- MNZMMCVIXORAQL-UHFFFAOYSA-N naphthalene-2,6-diol Chemical compound C1=C(O)C=CC2=CC(O)=CC=C21 MNZMMCVIXORAQL-UHFFFAOYSA-N 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 150000002924 oxiranes Chemical class 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- DGTNSSLYPYDJGL-UHFFFAOYSA-N phenyl isocyanate Chemical compound O=C=NC1=CC=CC=C1 DGTNSSLYPYDJGL-UHFFFAOYSA-N 0.000 description 1
- LYKRPDCJKSXAHS-UHFFFAOYSA-N phenyl-(2,3,4,5-tetrahydroxyphenyl)methanone Chemical compound OC1=C(O)C(O)=CC(C(=O)C=2C=CC=CC=2)=C1O LYKRPDCJKSXAHS-UHFFFAOYSA-N 0.000 description 1
- QCDYQQDYXPDABM-UHFFFAOYSA-N phloroglucinol Chemical compound OC1=CC(O)=CC(O)=C1 QCDYQQDYXPDABM-UHFFFAOYSA-N 0.000 description 1
- 229960001553 phloroglucinol Drugs 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- 150000004714 phosphonium salts Chemical class 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000011941 photocatalyst Substances 0.000 description 1
- 239000001739 pinus spp. Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 239000011164 primary particle Substances 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 239000011163 secondary particle Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 235000017550 sodium carbonate Nutrition 0.000 description 1
- PNGLEYLFMHGIQO-UHFFFAOYSA-M sodium;3-(n-ethyl-3-methoxyanilino)-2-hydroxypropane-1-sulfonate;dihydrate Chemical compound O.O.[Na+].[O-]S(=O)(=O)CC(O)CN(CC)C1=CC=CC(OC)=C1 PNGLEYLFMHGIQO-UHFFFAOYSA-M 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 239000012798 spherical particle Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 229950011008 tetrachloroethylene Drugs 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 125000000101 thioether group Chemical group 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 150000003608 titanium Chemical class 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- GLSQMJPVEVGXMZ-UHFFFAOYSA-N tributyl-(2,5-dihydroxyphenyl)phosphanium;bromide Chemical compound [Br-].CCCC[P+](CCCC)(CCCC)C1=CC(O)=CC=C1O GLSQMJPVEVGXMZ-UHFFFAOYSA-N 0.000 description 1
- XFWZWUGZZIYSLL-UHFFFAOYSA-L tributyl-[16-(tributylazaniumyl)hexadecyl]azanium;dibromide Chemical compound [Br-].[Br-].CCCC[N+](CCCC)(CCCC)CCCCCCCCCCCCCCCC[N+](CCCC)(CCCC)CCCC XFWZWUGZZIYSLL-UHFFFAOYSA-L 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
- ZFEAYIKULRXTAR-UHFFFAOYSA-M triphenylsulfanium;chloride Chemical compound [Cl-].C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 ZFEAYIKULRXTAR-UHFFFAOYSA-M 0.000 description 1
- 229940036248 turpentine Drugs 0.000 description 1
- 150000003672 ureas Chemical class 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
Abstract
本發明係一種中空裝置用乾式薄膜，硬化物及電子零件，其中抑制封閉材料流入至中空裝置之中空部分，可良好進行封閉之本發明的中空裝置用乾式薄膜係具備：於載體膜(2)上含有溶劑之硬化性樹脂組成物所成之樹脂層(3)，該樹脂層(3)係於厚度方向，各至少具備一個前述硬化性樹脂組成物中的溶劑之剩餘含有量為相對多的範圍(3a)，和相對少的範圍(3b)之乾式薄膜，其中前述溶劑之剩餘含有量為相對多的範圍之該溶劑之剩餘含有量，和前述相對少的範圍之該溶劑之剩餘含有量的差為0.2質量%以上。The present invention is a dry film for hollow devices, a hardened material and an electronic component, wherein the flow of a sealing material into the hollow part of the hollow device is suppressed and the sealing can be performed well. The dry film for hollow devices of the present invention comprises: a resin layer (3) formed of a hardening resin composition containing a solvent on a carrier film (2), wherein the resin layer (3) has at least one range (3a) in the thickness direction in which the residual content of the solvent in the hardening resin composition is relatively high, and another range (3b) in which the residual content of the solvent is relatively low, wherein the difference between the residual content of the solvent in the relatively high range and the residual content of the solvent in the relatively low range is 0.2 mass % or more.
Description
本發明係一種中空裝置用乾式薄膜，硬化物及電子零件。The present invention relates to a dry film, a hardened material and an electronic component for a hollow device.
經由近年的小型化而有以樹脂封閉機能元件之電子零件。在以樹脂所封閉之電子零件之中，SAW裝置，石英振動子，壓電振動子等係為了可振動機能元件而於封裝內具有中空部分。在本說明中，將於如此之樹脂封裝內具有中空部分的電子零件，稱為中空裝置。中空裝置係一般，藉由突起電極而連接機能元件於基板，具有經由此突起電極之高度而形成有中空部分於封裝內之構造。Due to the miniaturization in recent years, there are electronic parts with functional components sealed with resin. Among the electronic parts sealed with resin, SAW devices, quartz oscillators, piezoelectric oscillators, etc. have a hollow part in the package in order to vibrate the functional components. In this description, electronic parts with a hollow part in such a resin package are called hollow devices. Hollow devices are generally connected to the substrate through a protruding electrode, and have a structure with a hollow part formed in the package through the height of the protruding electrode.
對於在中空裝置之機能元件的封閉，有著使用乾式薄膜之技術(專利文獻1)。經由使用乾式薄膜之時，作為可抑制在使用液狀封閉材料的分配法中為困難，封閉材料流入至對向於機能元件之主動面所形成之中空部分者。 先前技術文獻 專利文獻There is a technology that uses dry film to seal functional components in hollow devices (Patent Document 1). By using a dry film, it is possible to prevent the sealing material from flowing into the hollow portion formed by the active surface facing the functional component, which is difficult in the method of dispensing liquid sealing materials. Prior Art Documents Patent Documents
專利文獻1：日本特開2006-19714號公報Patent document 1: Japanese Patent Application Publication No. 2006-19714
經由記載於專利文獻1之技術，亦未必可抑制封閉材料流入至中空裝置之中空部分。另一方面，當在封閉時形成大的空間於較機能元件端部為外側時，封閉則成為不充分，亦有在切割時，機能元件間的隔壁則變薄而容易剝離之問題。The technology described in
因此，本發明之目的係提供：抑制封閉材料流入至中空裝置之中空部分，可良好進行封閉之中空裝置用乾式薄膜，該乾式薄膜之樹脂層的硬化物，具有該硬化物之電子零件。Therefore, an object of the present invention is to provide a dry film for a hollow device that can suppress the flow of a sealing material into the hollow portion of the hollow device and can perform good sealing, a cured product of a resin layer of the dry film, and an electronic component having the cured product.
本發明者們係欲解決上述而重複銳意檢討之結果，對於使用於中空裝置之封閉的乾式薄膜，發現由含有溶劑之硬化性樹脂組成物所成之樹脂層則經由具有對於厚度方向，溶劑的剩餘含有量相對多之範圍，和相對少的範圍之時，可有效抑制該樹脂層(亦稱為封閉材料)流入至中空裝置之中空部分，良好進行封閉之情況，而達成本發明。The inventors of the present invention have made repeated and intensive studies to solve the above-mentioned problems. As a result, they have found that, for a dry film used for sealing a hollow device, when a resin layer composed of a curable resin composition containing a solvent has a relatively large range and a relatively small range of residual solvent content in the thickness direction, the resin layer (also referred to as a sealing material) can be effectively suppressed from flowing into the hollow part of the hollow device, thereby achieving good sealing, thereby achieving the present invention.
即，本發明之中空裝置用乾式薄膜係具備：於載體膜上含有溶劑之硬化性樹脂組成物所成之樹脂層，該樹脂層係於厚度方向，各至少具備一個溶劑之剩餘含有量為相對多的範圍，和相對少的範圍之乾式薄膜，其特徵為前述溶劑之剩餘含有量為相對多的範圍之該溶劑之剩餘含有量，和前述相對少的範圍之該溶劑之剩餘含有量的差為0.2質量%以上。 That is, the dry film for hollow devices of the present invention comprises: a resin layer composed of a hardening resin composition containing a solvent on a carrier film, the resin layer having at least one relatively large range and a relatively small range of residual solvent content in the thickness direction, and the difference between the residual solvent content in the relatively large range and the relatively small range is 0.2 mass % or more.
在本發明之前述中空裝置用乾式薄膜中，前述樹脂層之厚度為40μm以上者為佳，更且前述溶劑則各含有：沸點為60℃以上，不足130℃之溶劑，和沸點為130℃以上250℃以下之溶劑者為佳。 In the dry film for hollow devices mentioned above in the present invention, the thickness of the resin layer is preferably 40μm or more, and the solvents preferably contain: a solvent with a boiling point of 60°C or more and less than 130°C, and a solvent with a boiling point of 130°C or more and less than 250°C.
本發明之硬化物係其特徵為將前述中空裝置用乾式薄膜之樹脂層進行硬化所得到者。 The hardened product of the present invention is characterized by being obtained by hardening the resin layer of the aforementioned dry film for the hollow device.
本發明之電子零件係其特徵為具有前述硬化物者。 The electronic component of the present invention is characterized by having the aforementioned hardened material.
如根據本發明，在製造中空裝置時，可抑制封閉材料流入至中空裝置之中空部分，良好進行封閉者。另外，如根據本發明，在封閉機能元件時，亦可防止對於機能元件之乾式薄膜的位置偏移者。 According to the present invention, when manufacturing a hollow device, the sealing material can be suppressed from flowing into the hollow part of the hollow device, and the sealing can be performed well. In addition, according to the present invention, when sealing a functional element, the positional displacement of the dry film of the functional element can also be prevented.
1:乾式薄膜 1: Dry film
2:載體膜 2: Carrier film
3:樹脂層 3: Resin layer
4:保護膜 4: Protective film
31:樹脂層 31: Resin layer
[圖1]係本發明之中空裝置用乾式薄膜之一實施形態的模式剖面圖。 [Figure 1] is a schematic cross-sectional view of one embodiment of the dry film for hollow devices of the present invention.
[圖2]係以時間序列之製造工程而說明使用本發明之 中空裝置用乾式薄膜之中空裝置的模式剖面圖。 [Figure 2] is a schematic cross-sectional view of a hollow device using the dry film for hollow devices of the present invention, illustrating the manufacturing process in a time series.
[圖3]係顯示本發明之中空裝置用乾式薄膜之樹脂層的其他形態之模式剖面圖。 [Figure 3] is a schematic cross-sectional view showing other forms of the resin layer of the dry film for hollow devices of the present invention.
將本發明之中空裝置用乾式薄膜(以下，有略稱為「乾式薄膜」者)，使用圖面同時，更具體進行說明。 The dry film for hollow devices of the present invention (hereinafter referred to as "dry film") is described in more detail using drawings.
本發明之中空裝置用乾式薄膜係具備：於載體膜上含有溶劑之硬化性樹脂組成物所成之樹脂層，該樹脂層係於厚度方向，各至少具備一個前述硬化性樹脂組成物中的溶劑之剩餘含有量為相對多的範圍，和相對少的範圍之乾式薄膜，其中前述溶劑之剩餘含有量為相對多的範圍之該溶劑之剩餘含有量，和前述相對少的範圍之該溶劑之剩餘含有量的差為0.2質量%以上。 The dry film for hollow devices of the present invention comprises: a resin layer composed of a hardening resin composition containing a solvent on a carrier film, wherein the resin layer has at least one dry film in which the residual content of the solvent in the hardening resin composition is relatively high and relatively low in the thickness direction, wherein the difference between the residual content of the solvent in the relatively high range and the residual content of the solvent in the relatively low range is 0.2 mass % or more.
圖1係本發明之中空裝置用乾式薄膜之一實施形態的模式剖面圖。圖1之乾式薄膜1係具備：形成於載體膜2上之樹脂層3。樹脂層3係將硬化性樹脂組成物進行塗佈乾燥所得到之構成，而具備：溶劑之剩餘含有量為相對多的範圍3a，和溶劑之剩餘含有量為相對少的範圍3b，範圍3a之溶劑之剩餘含有量，和範圍3b之溶劑之剩餘含有量的差為0.2質量%以上。在中空裝置用乾式薄膜1之使用前，保護樹脂層3之保護膜4則被覆樹脂層3所形成。然而，在圖1中，為了容易理解而以線段區分溶劑之剩餘含有量為相對多的範圍3a，和溶劑之剩餘含有量為相對少的範圍3b，但實際的樹脂層3係不限於有明確的邊界。溶劑之剩餘含有量從自樹脂層3的厚度方向之一方的表面朝向另一方的表面，呈階段性或連續性減少，對於樹脂層3之厚度方向具有溶劑之剩餘含有量之濃度梯度的構成亦可。FIG. 1 is a schematic cross-sectional view of one embodiment of the dry film for hollow devices of the present invention. The
以使用圖2(a)~(d)所示之模式剖面圖之時間序列之製造工程而說明使用圖1之中空裝置用乾式薄膜1的中空裝置10。
圖2(a)係顯示以乾式薄膜1而封閉之前的狀態，藉由突起電極13而連接設置於基板11上之電極襯墊(未顯示於圖)與機能元件12。突起電極的高度係有著大約20μm、而機能元件12之高度係有著大約200~250μm之構成。
接著，如圖2(b)所示，剝離圖1之中空裝置用乾式薄膜1的保護膜4，使樹脂層3的表面對向於機能元件12。
接著，如圖2(c)所示，將中空裝置用乾式薄膜1之樹脂層3，朝向於機能元件12及基板11進行加熱同時進行按壓，使樹脂層3流動於機能元件12周圍而封閉機能元件12。
接著，如圖2(d)所示，在樹脂層3硬化之後，剝離載體膜2，再經由切割而分離成各個中空裝置10。中空裝置10係經由樹脂層3硬化之樹脂封裝14而封閉，具有基板11與機能元件12與兩突起電極13之間成為中空的構造。
中空裝置10係在圖2(c)使樹脂層3流動時，在較突起電極13為外側停止流動，樹脂層3則作為呈未進入至內側的中空部分者則為重要，而較機能元件12端部為外側的空間則作為呈未變大者亦為重要。The
因此，本發明之中空裝置用乾式薄膜係樹脂層係由含有溶劑之硬化性樹脂組成物所成，具備：溶劑之剩餘含有量為相對多的範圍，和溶劑之剩餘含有量為相對少的範圍，前述溶劑之剩餘含有量為相對多的範圍之該溶劑之剩餘含有量，和前述相對少的範圍之該溶劑之剩餘含有量的差為0.2質量%以上。樹脂層中之溶劑之剩餘含有量為相對多的範圍係在封閉時，流動性為高，而樹脂層中之溶劑之剩餘含有量為相對少的範圍係在封閉時，流動性為低。隨之，樹脂層中之溶劑之剩餘含有量為相對低的範圍係在封閉時，成為樹脂層之所謂的芯部，而呈限制樹脂層中的溶劑之剩餘含有量為相對多的範圍之流動而作用。因此，本發明之中空裝置用乾式薄膜係在製造中空裝置時，可抑制封閉材料流入至中空裝置之中空部分。另外，經由溶劑之剩餘含有量為相對多的範圍，亦未有形成大的空間於較機能元件端部為外側而可實現良好的封閉者。Therefore, the dry film for hollow device of the present invention is a resin layer composed of a curable resin composition containing a solvent, and has: a range of a relatively large residual content of the solvent and a relatively small residual content of the solvent, and the difference between the residual content of the relatively large residual content of the solvent and the relatively small residual content of the solvent is 0.2 mass% or more. The range of the relatively large residual content of the solvent in the resin layer has high fluidity when closed, and the range of the relatively small residual content of the solvent in the resin layer has low fluidity when closed. Accordingly, the range in which the residual content of the solvent in the resin layer is relatively low becomes the so-called core of the resin layer during sealing, and acts to restrict the flow of the range in which the residual content of the solvent in the resin layer is relatively high. Therefore, the dry film for hollow device of the present invention can inhibit the flow of sealing materials into the hollow part of the hollow device when manufacturing the hollow device. In addition, a good sealing can be achieved without forming a large space outside the end of the functional element through the range in which the residual content of the solvent is relatively high.
對於抑制封閉材料流入至中空裝置之中空部分，進行良好封閉係無法由全體性減少乾式薄膜的樹脂層之溶劑之剩餘含有量而達成，而依照本發明，於樹脂層中具有溶劑之剩餘含有量為相對多的範圍，和溶劑之剩餘含有量為相對少的範圍，且溶劑之剩餘含有量為相對多的範圍之該溶劑之剩餘含有量，和相對少的範圍之該溶劑之剩餘含有量的差為0.2質量%以上者則為重點。In order to suppress the sealing material from flowing into the hollow part of the hollow device, good sealing cannot be achieved by reducing the residual solvent content of the resin layer of the dry film as a whole. According to the present invention, the resin layer has a relatively large residual solvent content range and a relatively small residual solvent content range, and the difference between the residual solvent content in the relatively large residual solvent content range and the residual solvent content in the relatively small residual solvent range is 0.2 mass % or more.
中空裝置用乾式薄膜之樹脂層係各至少具備一個溶劑之剩餘含有量為相對多的範圍，和硬化性樹脂組成物中之溶劑之剩餘含有量為相對少的範圍。此等範圍係於各樹脂層中亦可有2個以上。The resin layer of the dry film for hollow device has at least one range in which the residual content of the solvent is relatively high and one range in which the residual content of the solvent in the curable resin composition is relatively low. There may be two or more of these ranges in each resin layer.
於圖3，僅以本發明之特徵部分的樹脂層而顯示中空裝置用乾式薄膜之其他例。乾式薄膜之載體膜或保護膜係省略圖示。
圖3所示之樹脂層31係溶劑之剩餘含有量為相對多的範圍31a，和溶劑之剩餘含有量為相對少的範圍31b則各有2處，且2處之樹脂層中之溶劑之剩餘含有量為相對少的範圍31b彼此則呈接合而配置。經由此，樹脂層31係做為全體而於厚度方向的中心部，具備溶劑之剩餘含有量為相對少的範圍31b，而於包含表面之厚度方向之兩端部，具備溶劑之剩餘含有量為相對多的範圍31a。然而，本發明之中空裝置用乾式薄膜係作為全體於厚度方向之中心部，具備溶劑之剩餘含有量為相對多的範圍，而於包含表面之厚度的方向之兩端部，具備溶劑之剩餘含有量為相對少的範圍亦可。FIG3 shows another example of a dry film for a hollow device with only the resin layer of the characteristic part of the present invention. The carrier film or protective film of the dry film is omitted in the figure.
The
中空裝置用乾式薄膜係作為理想的一例，溶劑之剩餘含有量為相對多的範圍之該溶劑之剩餘含有量為0.5質量%以上，更理想係可作為0.6質量%以上5質量%以下，而相對少的範圍之該溶劑之剩餘含有量為不足0.5質量%，更理想係可作為、0.1質量%以上0.4質量%以下者。在如此之乾式薄膜中，經由將範圍的邊界之剩餘含有量作為0.5質量%之時，可有效果進行經由溶劑之剩餘含有量為相對少的範圍而封閉材料流入至中空裝置之中空部分的抑制。另外，作為其他理想的一例，溶劑之剩餘含有量為相對多的範圍之該溶劑之剩餘含有量為2.8質量%以上，更理想係可作為3.0質量%以上5質量%以下，而相對少的範圍之該溶劑之剩餘含有量為不足2.8質量%，更理想係可作為、0.1質量%以上2.5質量%以下者。在如此之乾式薄膜中，亦可有效果進行經由溶劑之剩餘含有量為相對少的範圍而封閉材料流入至中空裝置之中空部分的抑制。As an ideal example of a dry film for hollow devices, the residual content of the solvent in the relatively large range is 0.5 mass% or more, more preferably 0.6 mass% or more and 5 mass% or less, and the residual content of the solvent in the relatively small range is less than 0.5 mass%, more preferably 0.1 mass% or more and 0.4 mass% or less. In such a dry film, by setting the residual content at the boundary of the range to 0.5 mass%, it is possible to effectively suppress the flow of the closed material into the hollow part of the hollow device through the relatively small residual content of the solvent. In addition, as another ideal example, the residual content of the solvent in the relatively large range is 2.8 mass% or more, more preferably 3.0 mass% or more and 5 mass% or less, and the residual content of the solvent in the relatively small range is less than 2.8 mass%, more preferably 0.1 mass% or more and 2.5 mass% or less. In such a dry film, the flow of the sealing material into the hollow part of the hollow device can be effectively suppressed through the relatively small residual content of the solvent.
中空裝置用乾式薄膜係溶劑之剩餘含有量為相對多的範圍之該溶劑之剩餘含有量，和相對少的範圍之該溶劑之剩餘含有量的差為0.2質量%以上。根據為0.2質量%以上之時，可有效果進行經由樹脂層中的溶劑之剩餘含有量為相對少的範圍而封閉材料流入至中空裝置之中空部分的抑制與良好的封閉。更理想的差係為0.4質量%以上4質量%以下。The difference between the residual content of the solvent in the range of relatively high residual content of the solvent and the residual content of the solvent in the range of relatively low residual content of the solvent for hollow devices is 0.2 mass % or more. When it is 0.2 mass % or more, the sealing material can be effectively suppressed from flowing into the hollow part of the hollow device through the range of relatively low residual content of the solvent in the resin layer and good sealing can be achieved. The more ideal difference is 0.4 mass % or more and 4 mass % or less.
中空裝置用乾式薄膜係樹脂層的載體膜側之表面，和與該載體膜側相反側(保護膜側)的表面之至少一方則為樹脂層中的溶劑之剩餘含有量為相對多的範圍者為佳。樹脂層之至少一方的表面則經由為樹脂層中的溶劑之剩餘含有量為相對多的範圍之時，如圖2(b)所示，可使該樹脂層中的溶劑之剩餘含有量為相對多的範圍3a的表面對向於機能元件12者。樹脂層中的溶劑之剩餘含有量為相對多的範圍3a係從定位性(貼附性)為高之情況，可抑制乾式薄膜與機能元件12之位置偏移，進而可使封閉時之作業性提升。
In the hollow device dry film, at least one of the surface of the resin layer on the carrier film side and the surface on the opposite side (protective film side) to the carrier film side is preferably in a range where the residual content of the solvent in the resin layer is relatively high. When at least one of the surfaces of the resin layer is in a range where the residual content of the solvent in the resin layer is relatively high, as shown in FIG. 2(b), the surface of the
中空裝置用乾式薄膜之樹脂層的厚度係未特別限定，但大約為40μm以上為佳。經由為40μm以上之時，從樹脂層之一方的表面，使溶劑揮發而該表面及其附近的範圍之溶劑的剩餘含有量則比較於除此以外的範圍，可呈降低0.2質量%以上而製作。樹脂層之厚度的上限值係例如，300μm。 The thickness of the resin layer of the dry film for hollow devices is not particularly limited, but preferably about 40μm or more. When it is 40μm or more, the solvent evaporates from the surface of one side of the resin layer, and the residual content of the solvent in the surface and its vicinity is reduced by 0.2% by mass or more compared to other ranges. The upper limit of the thickness of the resin layer is, for example, 300μm.
然而，中空裝置用乾式薄膜之樹脂層的厚度係可作為與合併機能元件的高度與突起電極之高度的高度略相同的厚度。使用滾筒層疊器或真空層疊器而使具有特定厚度之複數個的樹脂層層積，亦可作為成與合併機能元件的高度與突起電極之高度的高度略相同的厚度。 However, the thickness of the resin layer of the dry film for hollow devices can be set to be approximately the same as the height of the combined functional element and the height of the protruding electrode. By using a roller laminator or a vacuum laminator to stack multiple resin layers with a specific thickness, the thickness can also be set to be approximately the same as the height of the combined functional element and the height of the protruding electrode.
對於製造本發明之中空裝置用乾式薄膜，係例如，控制在使塗佈於載體膜上而形成之樹脂層乾燥時之乾燥條件，從樹脂層之一方的表面使溶劑揮發，而可將該表面及其附近的範圍之溶劑的剩餘含有量，比較於除此以外的範圍，降低0.2質量%以上。塗佈硬化性樹脂組成物於載體膜上之方法係未特別限定，而如將樹脂組成物，以有機溶劑進行稀釋，調整為適當的黏度，由桿塗佈器，模塗佈器，豆號塗佈器，刮刀塗佈機，前緣塗佈器，棒式塗佈器，擠壓塗佈器，反向塗佈器，轉送輥涂布機，凹版印刷塗佈器，噴塗塗佈器等塗佈成均一厚度即可。另外，樹脂組成物的塗佈後，例如，經由以50~130℃之溫度進行 1~200分鐘乾燥之時，可調整溶劑的剩餘含有量者。 In manufacturing the dry film for hollow devices of the present invention, for example, by controlling the drying conditions when drying the resin layer formed by coating on a carrier film, the solvent is volatilized from the surface of one side of the resin layer, and the residual content of the solvent in the surface and its vicinity can be reduced by 0.2 mass % or more compared with the remaining range. The method for coating the curable resin composition on the carrier film is not particularly limited, and the resin composition may be diluted with an organic solvent to adjust the viscosity to a suitable level, and then coated to a uniform thickness by a rod coater, a die coater, a bean coater, a doctor blade coater, a front edge coater, a rod coater, an extrusion coater, a reverse coater, a transfer roll coater, a gravure coater, a spray coater, or the like. In addition, after the resin composition is applied, for example, by drying at a temperature of 50 to 130°C for 1 to 200 minutes, the residual content of the solvent can be adjusted.
作為所塗佈之硬化性樹脂組成物的溶劑，可作為呈各含有沸點為60℃以上，不足130℃之溶劑，和沸點為130℃以上250℃以下之溶劑，經由此，可將樹脂層中的溶劑之剩餘含有量為相對多的範圍，和溶劑之剩餘含有量為相對少的範圍之溶劑的剩餘含有量的差，容易形成為0.2質量%以上者。作為沸點為60℃以上，不足130℃之溶劑，例如，可舉出：甲基乙基酮，1-甲氧基-2-丙醇，乙醇等。作為沸點為130℃以上250℃以下之溶劑，例如，可舉出：環己酮，乙二醇單***乙酸酯，丙二醇單甲醚等。 The solvent of the hardening resin composition to be applied may contain a solvent having a boiling point of 60°C or more and less than 130°C and a solvent having a boiling point of 130°C or more and 250°C or less, thereby making it easy to make the difference in the residual content of the solvent in the resin layer between a relatively large residual content and a relatively small residual content to be 0.2 mass % or more. Examples of the solvent having a boiling point of 60°C or more and less than 130°C include methyl ethyl ketone, 1-methoxy-2-propanol, ethanol, and the like. Examples of solvents having a boiling point of 130°C or higher and 250°C or lower include cyclohexanone, ethylene glycol monoethyl ether acetate, propylene glycol monomethyl ether, etc.
另外，準備溶劑之剩餘含有量少之硬化性樹脂組成物，和溶劑之剩餘含有量多之硬化性樹脂組成物，將一方的硬化性樹脂組成物塗佈於載體膜之後，使其乾燥或未使其乾燥而重疊另一方的硬化性樹脂組成物而進行塗佈之後，經由全體使其乾燥之時，在樹脂層中，亦可將溶劑之剩餘含有量相對多之範圍，與溶劑之剩餘含有量相對少之範圍，呈溶劑之剩餘含有量的差成為0.2質量%以上而形成。 In addition, a hardening resin composition with a small residual solvent content and a hardening resin composition with a large residual solvent content are prepared, and after one of the hardening resin compositions is applied to a carrier film, it is dried or not dried and the other hardening resin composition is applied and overlapped, and when the entirety is dried, in the resin layer, a range with a relatively large residual solvent content and a range with a relatively small residual solvent content can be formed so that the difference in residual solvent content becomes 0.2 mass % or more.
更且，於載體膜上，形成溶劑之剩餘含有量相對多的樹脂層，再於另外準備的載體膜上，形成溶劑之剩餘含有量相對少的樹脂層，再經由將所得到之溶劑之剩餘含有量相對少之樹脂層，重疊層積於上述之溶劑之剩餘含有量相對多的樹脂層之時，在樹脂層中，亦可將溶劑之剩餘含有量相對多的範圍，和溶劑之剩餘含有量相對少之範圍，呈溶劑的剩餘含有量的差成為0.2質量%以上而形成者。Furthermore, a resin layer having a relatively high residual solvent content is formed on a carrier film, and a resin layer having a relatively low residual solvent content is formed on another prepared carrier film, and then the obtained resin layer having a relatively low residual solvent content is stacked on the above-mentioned resin layer having a relatively high residual solvent content. In the resin layer, the difference in the residual solvent content between the range having a relatively high residual solvent content and the range having a relatively low residual solvent content can be formed to be 0.2 mass % or more.
[樹脂層之成分組成]
樹脂層之成分組成係對於溶劑及其剩餘含有量的差以外係未特別限定，但當說明樹脂層之例示的成分組成時，包含無機充填劑，和環氧樹脂，和溶劑者。
[環氧樹脂]
環氧樹脂係具有環氧基的樹脂，而均可使用以往公知之構成。可舉出：於分子中具有2個環氧基的2官能性環氧樹脂，於分子中具有3個以上環氧基的多官能性環氧樹脂等。然而，亦可為氫添加之環氧樹脂。例如，前述樹脂層係亦可含有固形環氧樹脂或液狀環氧樹脂，半固形環氧樹脂或結晶性環氧樹脂等。在本說明書中，固形環氧樹脂係指：40℃，固體狀之環氧樹脂，而半固形環氧樹脂係指：20℃，固體狀，40℃，液體狀之環氧樹脂，液狀環氧樹脂係指：20℃，液體狀之環氧樹脂。液狀的判定係依據有關危險物的試驗及性狀之省令(平成元年自治省令第1號)之附件第2之「液狀之確認方法」而進行。例如，由在日本特開2016-079384號公報之段落23~25記載之方法而進行。另外，結晶性環氧樹脂係指：結晶性強的環氧樹脂，在熔點以下的溫度中，高分子鏈則規則正確而排列，雖為固形樹脂，但對於熔融時，成為液狀樹脂一般的低黏度之熱硬化性的環氧樹脂。[Component composition of resin layer]
The component composition of the resin layer is not particularly limited except for the difference in the solvent and its residual content, but when explaining the exemplary component composition of the resin layer, it includes an inorganic filler, an epoxy resin, and a solvent.
[Epoxy resin]
Epoxy resin is a resin having an epoxy group, and any conventionally known structure can be used. Examples include: a bifunctional epoxy resin having two epoxy groups in the molecule, a multifunctional epoxy resin having three or more epoxy groups in the molecule, etc. However, it may also be an epoxy resin to which hydrogen is added. For example, the resin layer may contain solid epoxy resin, liquid epoxy resin, semi-solid epoxy resin, crystalline epoxy resin, etc. In this specification, solid epoxy resin refers to epoxy resin that is solid at 40°C, semi-solid epoxy resin refers to epoxy resin that is solid at 20°C and liquid at 40°C, and liquid epoxy resin refers to epoxy resin that is liquid at 20°C. The determination of liquid is based on the "Method for Confirming Liquidity" in
作為半固形環氧樹脂係可舉出：DIC公司製EPICLON860、EPICLON900-IM、EPICLON EXA-4816、EPICLON EXA-4822、東都化成公司製EpotohtoYD-134、Mitsubishi Chemical公司製jER834、jER872、住友化學公司製ELA-134等之雙酚A型環氧樹脂；DIC社製EPICLON HP-4032等之萘型環氧樹脂；DIC公司製EPICLON N-740等之苯酚酚醛型環氧樹脂等。Examples of the semi-solid epoxy resin include bisphenol A type epoxy resins such as EPICLON 860, EPICLON 900-IM, EPICLON EXA-4816, and EPICLON EXA-4822 manufactured by DIC Corporation, Epotohto YD-134 manufactured by Tohto Chemical Co., Ltd., jER834 and jER872 manufactured by Mitsubishi Chemical Co., Ltd., and ELA-134 manufactured by Sumitomo Chemical Co., Ltd.; naphthalene type epoxy resins such as EPICLON HP-4032 manufactured by DIC Corporation; and phenol novolac type epoxy resins such as EPICLON N-740 manufactured by DIC Corporation.
作為結晶性環氧樹脂係可使用具有聯苯構造，硫化物構造，伸苯基構造，萘構造等之結晶性環氧樹脂者。聯苯形式之環氧樹脂係例如，作為Mitsubishi Chemical公司製jER YX4000、jER YX4000H、jER YL6121H、jER YL6640、jER YL6677所提供，二苯硫醚行環氧樹脂係例如，作為東都化成公司製Epotohto YSLV-120TE所提供，作為伸苯基型環氧樹脂係例如，作為東都化成公司製Epotohto YDC-1312所提供，萘型環氧樹脂係例如，作為DIC公司製EPICLON HP-4032D、EPICLON HP-4700所提供。另外，作為結晶性環氧樹脂，亦可使用東都化成公司製Epotohto YSLV-90C、日產化學公司製TEPIC-S(異氰尿酸三縮水甘油酯)。As the crystalline epoxy resin, those having a biphenyl structure, a sulfide structure, a phenylene structure, a naphthalene structure, etc. can be used. Biphenyl type epoxy resins are provided, for example, as jER YX4000, jER YX4000H, jER YL6121H, jER YL6640, and jER YL6677 manufactured by Mitsubishi Chemical Co., Ltd., diphenyl sulfide type epoxy resins are provided, for example, as Epotohto YSLV-120TE manufactured by Tohto Chemical Co., Ltd., phenylene type epoxy resins are provided, for example, as Epotohto YDC-1312 manufactured by Tohto Chemical Co., Ltd., and naphthalene type epoxy resins are provided, for example, as EPICLON HP-4032D and EPICLON HP-4700 manufactured by DIC Corporation. In addition, as the crystalline epoxy resin, Epotohto YSLV-90C manufactured by Tohto Chemical Industry Co., Ltd. or TEPIC-S (triglycidyl isocyanurate) manufactured by Nissan Chemical Industry Co., Ltd. can also be used.
作為固形氧化樹脂係可舉出：DIC公司製EPICLON HP-4700(萘型環氧樹脂)、日本化藥公司製NC-7000(萘架構含有多官能固形環氧樹脂)等之萘型環氧樹脂；具有日本化藥公司製EPPN-502H(三苯酚環氧樹脂)等之苯酚類與苯酚性羥基之芳香族醛基的縮合物之環氧化物(三苯酚型環氧樹脂)；DIC公司製EPICLON HP-7200H(雙環戊二烯架構含有多官能固形環氧樹脂)等之雙環戊二烯芳烷基型環氧樹脂；日本化藥公司NC-3000H(聯苯架構含有多官能固形環氧樹脂)等之聯苯芳烷基型環氧樹脂；日本化藥公司製NC-3000L等之聯苯/苯酚酚醛型環氧樹脂；DIC公司製EPICLON N660、EPICLON N690、N770、日本化藥公司製EOCN-104S等之酚醛型環氧樹脂；新日鐵住金化學公司製TX0712等之磷含有環氧樹脂；日產化學公司製TEPIC等之三(2,3-環氧丙基)異氰脲酸酯等。Examples of solid epoxy resins include: naphthalene-based epoxy resins such as EPICLON HP-4700 (naphthalene-based epoxy resin) manufactured by DIC Corporation and NC-7000 (naphthalene-structured multifunctional solid epoxy resin) manufactured by Nippon Kayaku Co., Ltd.; epoxides (triphenol-based epoxy resins) of condensates of phenols and aromatic aldehyde groups of phenolic hydroxyl groups such as EPPN-502H (triphenol-based epoxy resin) manufactured by Nippon Kayaku Co., Ltd.; EPICLON HP-4700 (naphthalene-based epoxy resin) manufactured by DIC Corporation and NC-7000 (naphthalene-based multifunctional solid epoxy resin) manufactured by Nippon Kayaku Co., Ltd. HP-7200H (polyfunctional solid epoxy resin containing a polyfunctional structure) and other dicyclopentadiene aralkyl epoxy resins; NC-3000H (polyfunctional solid epoxy resin containing a biphenyl structure) and other biphenyl aralkyl epoxy resins manufactured by Nippon Kayaku Co., Ltd.; NC-3000L and other biphenyl/phenol novolac epoxy resins manufactured by Nippon Kayaku Co., Ltd.; EPICLON N660 and EPICLON Phenolic epoxy resins such as N690, N770, EOCN-104S manufactured by Nippon Kayaku Co., Ltd.; phosphorus-containing epoxy resins such as TX0712 manufactured by Nippon Steel & Sumitomo Chemical Co., Ltd.; tris(2,3-epoxypropyl)isocyanurate such as TEPIC manufactured by Nissan Chemical Co., Ltd.
作為液狀環氧樹脂係可舉出：雙酚A型環氧樹脂，雙酚F型環氧樹脂，雙酚AF型環氧樹脂，苯酚酚醛型環氧樹脂，叔丁基鄰苯二酚型環氧樹脂，縮水甘油胺型環氧樹脂，氨基苯酚型環氧樹脂，脂環式環氧樹脂等。Examples of the liquid epoxy resin include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AF type epoxy resin, phenol novolac type epoxy resin, tert-butyl catechol type epoxy resin, glycidylamine type epoxy resin, aminophenol type epoxy resin, aliphatic epoxy resin, and the like.
本發明之乾式薄膜的樹脂層係作為環氧樹脂以外的熱硬化性樹脂，例如，含有異氰酸酯化合物，封閉型異氰酸酯化合物，胺基樹脂，氧代氮代苯并環己烷樹脂，碳二醯亞胺樹脂，環狀碳酸酯化合物，多官能環氧丙烷化合物，環硫化物樹脂等之公知慣用的熱硬化性樹脂亦可。The resin layer of the dry film of the present invention may be a thermosetting resin other than epoxy resin, for example, a known conventional thermosetting resin containing isocyanate compounds, blocked isocyanate compounds, amino resins, oxynitrobenzocyclohexane resins, carbodiimide resins, cyclic carbonate compounds, polyfunctional epoxypropane compounds, cyclic sulfide resins, etc.
[無機填充劑] 前述樹脂層係含有無機填充劑亦可。經由調配無機填充劑，而可抑制所得到之硬化物的硬化收縮，使密著性，硬度，耐龜裂性等之熱特性提升。作為無機填充劑係可使用以往公知的無機填充劑，未限定特定構成，但例如，可舉出：硫酸鋇，鈦酸鋇，非晶形二氧化矽，結晶性二氧化矽，熔融二氧化矽，球狀二氧化矽等之二氧化矽，滑石，黏土，新堡矽土粒子，水鋁礦，碳酸鎂，碳酸鈣，氧化鈦，氧化鋁，氫氧化鋁，氮化矽，氮化鋁，鋯酸鈣等之體質顏料，或銅，錫，鋅，鎳，銀，鈀，鋁，鐵，鈷，金，白金等之金屬粉體。無機填充劑係球狀粒子為佳。無機填充劑之平均粒子徑(中位直徑，D50)係0.01~20μm為佳。然而，在本說明書中，無機填充劑之平均粒子徑係不僅一次粒子之粒徑，而亦包含二次粒子(凝集體)之粒徑的平均粒子徑。平均粒子徑係可經由雷射繞射式粒子徑分布測定裝置與根據動態光散射法之測定裝置而求得。作為經由雷射繞射法之測定裝置係可舉出：Microtrac･Bel公司製Microtrac MT3300EXII、而作為經由動態光散射法之測定裝置係可舉出：Microtrac･Bel公司製之NanotracWaveII UT151。[Inorganic filler] The aforementioned resin layer may contain an inorganic filler. By adding an inorganic filler, the curing shrinkage of the obtained cured product can be suppressed, thereby improving the thermal properties such as adhesion, hardness, and crack resistance. As the inorganic filler, any conventionally known inorganic filler can be used, and the specific composition is not limited. For example, barium sulfate, barium titanate, amorphous silica, crystalline silica, fused silica, spherical silica, talc, clay, Newcastle silica particles, alumina, magnesium carbonate, calcium carbonate, titanium oxide, aluminum oxide, aluminum hydroxide, silicon nitride, aluminum nitride, calcium zirconate, or metal powders such as copper, tin, zinc, nickel, silver, palladium, aluminum, iron, cobalt, gold, platinum, etc. The inorganic filler is preferably spherical particles. The average particle size (median diameter, D50) of the inorganic filler is preferably 0.01~20μm. However, in this specification, the average particle size of the inorganic filler is not only the particle size of the primary particles, but also the average particle size of the secondary particles (agglomerates). The average particle size can be obtained by a laser diffraction particle size distribution measuring device and a measuring device based on the dynamic light scattering method. As a measuring device based on the laser diffraction method, Microtrac MT3300EXII manufactured by Microtrac Bel can be cited, and as a measuring device based on the dynamic light scattering method, NanotracWaveII UT151 manufactured by Microtrac Bel can be cited.
前述無機填充劑係作為表面處理亦可。作為表面處理係作為經由偶合劑之表面處理，或未導入氧化鋁處理等之有機基的表面處理亦可。無機填充劑之表面處理方法係未特別限定，如使用公知慣用的方法即可，而如以具有硬化性反應基之表面處理劑，例如，作為有機基而具有硬化性反應基之偶合劑等而處理無機填充劑之表面即可。The inorganic filler may be subjected to surface treatment. The surface treatment may be surface treatment with a coupling agent or surface treatment without introducing an organic group such as alumina treatment. The surface treatment method of the inorganic filler is not particularly limited, and a conventionally known method may be used, such as treating the surface of the inorganic filler with a surface treatment agent having a curable reactive group, for example, a coupling agent having a curable reactive group as an organic group.
無機填充劑係亦可以單獨使用1種，而亦可作為2種以上之混合物而使用。無機填充劑之調配量係以乾式薄膜之樹脂層的固體成分全量基準而為10~90質量%為佳。The inorganic filler may be used alone or as a mixture of two or more. The amount of the inorganic filler is preferably 10 to 90% by mass based on the total solid content of the resin layer of the dry film.
[硬化劑] 前述樹脂層係含有硬化劑亦可。作為硬化劑係可舉出：具有苯酚性羥基之化合物，具有聚羧酸及其酸酐，具有氰酸酯基之化合物，具有活性酯基之化合物，具有馬來醯亞胺基之化合物，環脂式烯烴聚合物等。硬化劑係可以單獨1種，或者組合2種以上而使用者。[Hardener] The resin layer may contain a hardener. Examples of the hardener include compounds having a phenolic hydroxyl group, polycarboxylic acid and its anhydride, compounds having a cyanate group, compounds having an active ester group, compounds having a maleimide group, cycloolefin polymers, etc. The hardener may be used alone or in combination of two or more.
作為具有苯酚性羥基之化合物係可使用苯酚酚醛樹脂，烷基苯酚酚醛樹脂、雙酚A酚醛樹脂、雙環戊二烯型苯酚樹脂、Xylok型苯酚樹脂、萜烯變性樹脂、甲酚/萘酚樹脂、聚乙烯苯酚類、苯酚/萘酚樹脂、α-萘酚架構含有苯酚樹脂、三氮雜苯架構含有甲酚酚醛清漆樹脂、聯苯烷基型苯酚樹脂、二甲苯撐基型苯酚酚醛樹脂等之以往公知的構成。As the compound having a phenolic hydroxyl group, a phenol novolac resin, an alkylphenol novolac resin, a bisphenol A novolac resin, a dicyclopentadiene type phenol resin, a Xylok type phenol resin, a terpene modified resin, a cresol/naphthol resin, a polyvinylphenol type, a phenol/naphthol resin, an α-naphthol structure-containing phenol resin, a triazine structure-containing cresol novolac resin, a biphenyl alkyl type phenol resin, a xylene propionyl type phenol novolac resin, or the like, which have a conventionally known structure can be used.
具有前述氰酸酯基之化合物係於一分子中具有2個以上之氰酸酯基(-OCN)的化合物為佳。具有氰酸酯基之化合物係均可使用以往公知之構成者。作為具有氰酸酯基之化合物係例如，可舉出：苯酚酚醛型氰酸酯樹脂，烷基苯酚酚醛型氰酸酯樹脂，雙環戊二烯型氰酸酯樹脂，雙酚A型氰酸酯樹脂，雙酚F型氰酸酯樹脂，雙酚S型氰酸酯樹脂。另外，一部分為作為三氮雜苯化之預聚物亦可。The compound having the aforementioned cyanate group is preferably a compound having two or more cyanate groups (-OCN) in one molecule. The compounds having the cyanate group may all have a conventionally known structure. Examples of the compound having the cyanate group include: phenol novolac type cyanate resin, alkylphenol novolac type cyanate resin, dicyclopentadiene type cyanate resin, bisphenol A type cyanate resin, bisphenol F type cyanate resin, bisphenol S type cyanate resin. In addition, a part of the prepolymer may be triazined.
作為具有市售之氰酸酯基之化合物係可舉出：苯酚酚醛型多官能氰酸酯樹脂(Lonza JAPAN公司製、PT30S)，雙酚A型二氰酸的一部分或全部則作為三氮雜苯化而成為三聚體之預聚物(Lonza JAPAN公司製、BA230S75)，雙環戊二烯構造含有氰酸酯樹脂(Lonza JAPANE公司製、DT-4000、DT-7000)等。Examples of commercially available compounds having a cyanate group include phenol novolac type multifunctional cyanate resin (PT30S manufactured by Lonza Japan Co., Ltd.), a prepolymer in which a part or all of bisphenol A type dicyanate is triphenylated to form a trimer (BA230S75 manufactured by Lonza Japan Co., Ltd.), and a dicyclopentadiene structure-containing cyanate resin (DT-4000, DT-7000 manufactured by Lonza Japan Co., Ltd.).
具有前述活性酯基之化合物係於一分子中具有2個以上之活性酯基的化合物為佳。具有活性酯基之化合物係一般可經由羧酸化合物與羥基化合物之縮合反應而得到。其中，作為羥基化合物而具有使用苯酚化合物或萘酚化合物所得到之活性酯基之化合物為佳。作為苯酚化合物或萘酚化合物係可舉出：對苯二酚，間苯二酚，雙酚A、雙酚F、雙酚S、酸式酚酞、甲基化雙酚A、甲基化雙酚F、甲基化雙酚S、苯酚、o-甲酚、m-甲酚、p-甲酚、鄰苯二酚、α-萘酚、β-萘酚、1,5-二羥基萘、1,6-二羥基萘、2,6-二羥基萘、二羥基二苯甲酮、三羥基二苯甲酮、四羥基二苯甲酮、間苯三酚、苯三酚、聯環戊二烯二酚、苯酚酚醛等。另外，作為具有活性酯基之化合物係亦可為萘二酚烷基/安息香酸型。The compound having the above-mentioned active ester group is preferably a compound having two or more active ester groups in one molecule. The compound having the active ester group can generally be obtained by a condensation reaction of a carboxylic acid compound and a hydroxyl compound. Among them, a compound having an active ester group obtained by using a phenol compound or a naphthol compound as a hydroxyl compound is preferred. Examples of the phenolic compound or naphthol compound include hydroquinone, resorcinol, bisphenol A, bisphenol F, bisphenol S, acid phenolphthalein, methylated bisphenol A, methylated bisphenol F, methylated bisphenol S, phenol, o-cresol, m-cresol, p-cresol, o-catechol, α-naphthol, β-naphthol, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, dihydroxybenzophenone, trihydroxybenzophenone, tetrahydroxybenzophenone, phloroglucinol, pyrogallol, dicyclopentadiene diphenol, phenol novolac, etc. In addition, the compound having an active ester group may be a naphthanediol alkyl/benzoic acid type.
作為具有市售之活性酯基之化合物係可舉出：雙環戊二烯型之二苯酚化合物，例如，HPC8000-65T (DIC公司製)、HPC8100-65T(DIC公司製)、HPC8150-65T (DIC公司製)。Examples of commercially available compounds having an active ester group include dicyclopentadiene-type diphenol compounds, such as HPC8000-65T (manufactured by DIC Corporation), HPC8100-65T (manufactured by DIC Corporation), and HPC8150-65T (manufactured by DIC Corporation).
硬化劑的調配量係例如，對於環氧樹脂100質量份而言為20~100質量份。The amount of the hardener to be mixed is, for example, 20 to 100 parts by mass based on 100 parts by mass of the epoxy resin.
前述樹脂層係含有硬化促進劑亦可。硬化促進劑係使熱硬化反應促進的構成，為了更使密著性，耐藥品性，耐熱性等之特性提升所使用。作為如此之硬化促進劑的具體例係可舉出：咪唑及其衍生物；甲基胍胺、苯代三聚氰胺等之胍胺類；二胺基二苯甲烷、m-苯二胺、m-間苯二甲胺、二胺苯碸、雙氰胺、尿素、尿素衍生物、三聚氰胺、多元醯等之聚胺類；此等之有機酸鹽及/或環氧加成物；三氟化硼之胺錯合物；乙二胺-S-三氮雜苯、2,4-二胺-S-三氮雜苯、2,4-二胺-6-二甲苯基-S-三氮雜苯等之三氮雜苯衍生物類；三甲胺、三乙醇胺、N,N-二甲基正辛胺、N-苄基二甲胺、吡啶、N-苄基二甲胺、六(N-甲基)三聚氰胺、2,4,6-三(二甲氨基苯酚)、四甲基胍、m-胺苯酚等之胺類；聚乙烯苯酚、聚乙烯苯酚溴化物、苯酚酚醛、烷基苯酚酚醛等之多酚類；三丁基膦、三苯膦、三-2-氰乙基膦等之有機膦類；三-n-丁基(2,5-二羥苯基)溴化磷、溴化十六烷基三丁基欙等之鏻鹽類；氯化三甲基苄基銨、苯基四丁基氯化銨等之4級銨鹽類；前述多元酸酐；二苯基碘四氟硼酸鹽、三苯基硫六氟酸酯、2,4,6-三苯基硫基六氟化磷酸等之光陽離子聚合觸媒；苯乙烯-馬來酸酐樹脂；苯基異氰酸酯與二甲胺之等莫耳反應物、或異氰酸甲苯、異佛爾酮二異氰酸酯等之有機聚異氰酸酯與二甲胺之等莫耳反應物、金屬觸媒等之以往公知的硬化促進劑。The resin layer may contain a curing accelerator. The curing accelerator is a component that accelerates the heat curing reaction and is used to improve the properties such as adhesion, chemical resistance, and heat resistance. Specific examples of such curing accelerators include: imidazole and its derivatives; guanamines such as methylguanamine and benzoguanamine; polyamines such as diaminodiphenylmethane, m-phenylenediamine, m-m-phenylenediamine, diamine benzoate, cyanamide, urea, urea derivatives, melamine, and polyacyl groups; organic acid salts and/or epoxy adducts thereof; amine complexes of boron trifluoride; ethylenediamine- Triazine derivatives such as S-triazine, 2,4-diamine-S-triazine, 2,4-diamine-6-xylyl-S-triazine, etc.; trimethylamine, triethanolamine, N,N-dimethyloctylamine, N-benzyldimethylamine, pyridine, N-benzyldimethylamine, hexa(N-methyl)melamine, 2,4,6-tris(dimethylaminophenol), tetramethylguanidine, m-aminophenol Amines such as polyvinylphenol, polyvinylphenol bromide, phenol phenol formaldehyde, alkylphenol phenol formaldehyde, etc.; organic phosphines such as tributylphosphine, triphenylphosphine, tri-2-cyanoethylphosphine, etc.; phosphonium salts such as tri-n-butyl (2,5-dihydroxyphenyl) phosphonium bromide, hexadecyltributylammonium bromide, etc.; quaternary ammonium salts such as trimethylbenzylammonium chloride, phenyltetrabutylammonium chloride, etc.; the aforementioned polyacid anhydrides; The photocatalysts for the ion polymerization of diphenyliodonium tetrafluoroborate, triphenylsulfide hexafluoroester, 2,4,6-triphenylsulfide hexafluorophosphoric acid, etc.; styrene-maleic anhydride resin; equimolar reactants of phenylisocyanate and dimethylamine, or equimolar reactants of organic polyisocyanates such as toluene isocyanate and isophorone diisocyanate and dimethylamine, and metal catalysts are conventionally known hardening accelerators.
硬化促進劑係可單獨使用1種，或混合2種以上使用。硬化促進劑之使用係並非必須，但對於欲特別促進硬化之情況，例如，對於環氧樹脂100質量份而言，可在0.01~5質量份的範圍而使用。金屬觸媒之情況，對於具有氰酸酯基之化合物100質量份而言，以金屬換算，10~550ppm為佳，而25~200ppm為更佳。The curing accelerator may be used alone or in combination of two or more. The use of a curing accelerator is not essential, but in the case of particularly accelerating the curing, for example, it may be used in a range of 0.01 to 5 parts by weight for 100 parts by weight of epoxy resin. In the case of a metal catalyst, the amount of the accelerator is preferably 10 to 550 ppm, and more preferably 25 to 200 ppm, based on the metal conversion, for 100 parts by weight of the compound having a cyanate group.
本發明之乾式薄膜的樹脂層係含有有機溶劑等之溶劑。作為有機溶劑，係雖無特別限制，但可舉出酮類，芳香族碳氫類，乙二醇醚類，乙二醇***醋酸類，酯類，醇類，脂肪族碳氫，石油系溶劑等。具體而言，可舉出：甲基乙基酮、環己酮、甲基丁基酮、甲基異丁基酮等之酮類；甲苯、二甲苯、四甲基苯等之芳香族碳氫類；賽璐索芙、甲賽璐蘇、丁氧基乙醇、卡必醇、二乙二醇甲醚、二乙二醇丁醚、乙二醇單甲基醚、乙二醇單***、乙二醇一丁基醚、丙二醇甲醚、二丙二醇甲醚、二乙二醇二甲醚、三乙二醇單甲醚等之乙二醇醚類；醋酸乙酯、醋酸丁酯、乙酸異丁酯、乙二醇***醋酸酯、二丙二醇甲醚醋酸酯、丙二醇甲基醚醋酸酯、丙二醇乙基醚醋酸酯、丙二醇丁基醚醋酸酯等之酯類；乙醇、丙醇、2-甲氧基丙醇、n-丁醇、異丁醇、異戊醇、乙二醇、丙二醇等之醇類；辛烷、癸烷等之脂肪族碳氫；石油醚、石油腦、氫化石油腦、溶劑石油腦等之石油系溶劑等之其他、N,N-二甲基甲醯胺(DMF)、四氯乙烯、松節油等。另外，亦可使用日本丸善石油化學公司製Swazole1000，Swazole1500，三共化學公司製Solvent#100、Solvent#150，Shell Chemicals Japan公司製ShellsolA100、ShellsolA150，日本出光興產公司製Ipsol 100號，Ipsol 150號等之有機溶劑。有機溶劑係亦可以單獨使用1種，而亦可作為2種以上之混合物而使用。在本發明之乾式薄膜的樹脂層中，係各含有沸點為60℃以上，不足130℃之溶劑與沸點為130℃以上250℃以下之溶劑者為佳。然而，本發明之乾式薄膜的樹脂層係因應必要而更含有沸點超過250℃之溶劑亦可。 The resin layer of the dry film of the present invention contains a solvent such as an organic solvent. The organic solvent is not particularly limited, but includes ketones, aromatic hydrocarbons, glycol ethers, glycol ether acetates, esters, alcohols, aliphatic hydrocarbons, petroleum solvents, and the like. Specifically, ketones such as methyl ethyl ketone, cyclohexanone, methyl butyl ketone, and methyl isobutyl ketone can be cited; aromatic hydrocarbons such as toluene, xylene, and tetramethylbenzene can be cited; glycol ethers such as cellulosic acid, methyl cellulosic acid, butoxyethanol, carbitol, diethylene glycol methyl ether, diethylene glycol butyl ether, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, propylene glycol methyl ether, dipropylene glycol methyl ether, diethylene glycol dimethyl ether, and triethylene glycol monomethyl ether can be cited; ethyl acetate, butyl acetate, isobutyl acetate, Esters such as ethylene glycol ethyl ether acetate, dipropylene glycol methyl ether acetate, propylene glycol methyl ether acetate, propylene glycol ethyl ether acetate, propylene glycol butyl ether acetate, etc.; alcohols such as ethanol, propanol, 2-methoxypropanol, n-butanol, isobutanol, isoamyl alcohol, ethylene glycol, propylene glycol, etc.; aliphatic hydrocarbons such as octane and decane; other petroleum solvents such as petroleum ether, naphtha, hydrogenated naphtha, solvent naphtha, etc.; N,N-dimethylformamide (DMF), tetrachloroethylene, turpentine, etc. In addition, organic solvents such as Swazole 1000 and Swazole 1500 manufactured by Maruzen Petrochemical Co., Ltd., Solvent #100 and Solvent #150 manufactured by Sankyo Chemical Co., Ltd., Shellsol A100 and Shellsol A150 manufactured by Shell Chemicals Japan Co., Ltd., and Ipsol No. 100 and Ipsol No. 150 manufactured by Idemitsu Kosan Co., Ltd. can also be used. The organic solvent can be used alone or as a mixture of two or more. In the resin layer of the dry film of the present invention, it is preferred that the solvents each contain a boiling point of 60°C or more and less than 130°C and a solvent with a boiling point of 130°C or more and less than 250°C. However, the resin layer of the dry film of the present invention may contain a solvent with a boiling point exceeding 250°C as necessary.
(彈性體) (elastic body)
前述樹脂層係含有彈性體亦可。作為彈性體係可使用熱可塑性樹脂，橡膠狀粒子，玻璃轉移點為20℃以下，且重量平均分子量為1萬以上的高分子樹脂等。作為彈性體係可舉出Nagase ChemteX公司製「SG-P3」、「SG-80H」、「SG-600LB」、「SG-280」、「SG-790」、「SG-K2」等。 The resin layer may contain an elastomer. As the elastomer, thermoplastic resins, rubber particles, polymer resins having a glass transition point of 20°C or less and a weight average molecular weight of 10,000 or more may be used. Examples of the elastomer include "SG-P3", "SG-80H", "SG-600LB", "SG-280", "SG-790", "SG-K2", etc. manufactured by Nagase ChemteX.
前述樹脂層係更且因應必要，可使用酞菁藍，酞菁銅綠，碘綠質，雙偶氮黃，結晶紫，氧化鈦，碳黑，萘黑等之以往公知的著色劑，石綿、ORUBEN、有機性搬土、微粉二氧化矽等之以往公知的增黏劑、聚矽氧系、氟素系、高分子系等之消泡劑及/或均染劑、噻唑系、***系、矽烷偶合劑等之密著性賦予劑、難燃劑、鈦酸鹽系、鋁系之以往公知的添加劑類。 The aforementioned resin layer can also be used, if necessary, with conventionally known colorants such as phthalocyanine blue, copper phthalocyanine green, iodine green, disazo yellow, crystal violet, titanium oxide, carbon black, naphthalene black, etc., conventionally known thickeners such as sponge, oruben, organic soil, micro powder silica, etc., defoamers and/or leveling agents such as polysilicone, fluorine, and polymer, adhesion agents such as thiazole, triazole, and silane coupling agents, flame retardants, and conventionally known additives such as titanium salts and aluminum.
[載體膜] [Carrier film]
載體膜係例如，可使用聚乙烯對苯二甲酸酯或聚萘二甲酸乙二酯等之聚酯膜，聚醯亞胺膜，聚醯胺醯亞胺膜，聚乙烯膜，聚四氟乙烯薄膜，聚丙烯薄膜，聚苯乙烯膜等之熱可塑性樹脂所成之薄膜，及表面處理紙等。載體膜之厚度係雖未特別限制者，但在大致10~150μm之範圍，而因應用途作適宜選擇。對於設置載體膜之樹脂層的面係實施脫模處理亦可。 The carrier film may be, for example, a polyester film such as polyethylene terephthalate or polyethylene naphthalate, a film made of a thermoplastic resin such as polyimide film, polyamide imide film, polyethylene film, polytetrafluoroethylene film, polypropylene film, polystyrene film, and surface-treated paper. The thickness of the carrier film is not particularly limited, but is in the range of approximately 10 to 150 μm and is appropriately selected according to the application. The surface on which the resin layer of the carrier film is provided may be subjected to a demolding treatment.
(保護膜) (Protective film)
本發明之乾式薄膜係因應必要，於樹脂層上設置保護膜亦可。保護膜係指以防止塵等附著於乾式薄膜之樹脂層的表面同時，使處理性提升的目的，設置於與樹脂層之載體膜相反的面者。作為保護膜係例如，可使用在前述載體膜所例示之熱可塑性樹脂所成之薄膜，及表面處理的紙等，但保護膜之厚度係未特別限制者，但大約在10~150μm之範圍，因應用途而作適宜選擇。對於設置保護膜之樹脂層的面係實施脫模處理亦可。 The dry film of the present invention may be provided with a protective film on the resin layer as necessary. The protective film is provided on the opposite side of the carrier film of the resin layer in order to prevent dust and the like from adhering to the surface of the resin layer of the dry film and to improve the handling properties. As the protective film, for example, a film made of thermoplastic resin exemplified in the aforementioned carrier film and surface-treated paper may be used. However, the thickness of the protective film is not particularly limited, but is approximately in the range of 10 to 150 μm and is appropriately selected according to the application. The surface of the resin layer on which the protective film is provided may be subjected to a demolding treatment.
以下，顯示本發明之實施例，比較例及試驗例而更具體說明本發明，但本發明則原本並不限定於此等實施例者。然而，表中之組成成分係未特別限制而全為質量份。The following are examples, comparative examples and test examples of the present invention to more specifically illustrate the present invention, but the present invention is not limited to these examples. However, the components in the table are not particularly limited and are all in mass parts.
(熱硬化性樹脂組成物的作成) 將表1所示之處方溶劑放入至容器，溶劑呈未揮發而加溫為50℃，再加上各環氧樹脂而充分進行攪拌而溶解。之後，加上添加劑及無機充填劑，以3支滾輪研磨機進行混勻，更且加上硬化劑，硬化促進劑，高分子樹脂，經由攪拌機而充分進行攪拌而得到熱硬化性樹脂組成物。(Preparation of thermosetting resin composition) Put the prescribed solvent shown in Table 1 into a container, heat the solvent to 50°C without volatile, add each epoxy resin and stir thoroughly to dissolve. Then, add additives and inorganic fillers, mix well with 3 roller grinders, and add hardener, hardening accelerator, and polymer resin, stir thoroughly with a stirrer to obtain a thermosetting resin composition.
※1：雙酚A型環氧樹脂；Mitsubishi Chemical公司製 ※2：苯酚酚醛型環氧樹脂；DIC公司製 ※3：苯酚酚醛型環氧樹脂；DIC公司製 ※4：苯酚酚醛樹脂；日本明和化成公司製 ※5：矽烷化合物；日本信越化學公司製 ※6：球狀二氧化矽；Admatechs公司製 ※7：2-乙基-4-甲基咪唑；日本四國化成工業公司製 ※8：TEISANRESIN，固體成分15%之MEK(甲基乙基酮)溶液 ；Nagase ChemteX公司製。此溶液中之甲基乙基酮係作為沸點為60℃以上，不足130℃之溶劑而活用。 ※1: Bisphenol A type epoxy resin; manufactured by Mitsubishi Chemical Co., Ltd. ※2: Phenol novolac type epoxy resin; manufactured by DIC Corporation ※3: Phenol novolac type epoxy resin; manufactured by DIC Corporation ※4: Phenol novolac type epoxy resin; manufactured by Meiwa Chemical Co., Ltd. ※5: Silane compound; manufactured by Shin-Etsu Chemical Co., Ltd. ※6: Spherical silica; manufactured by Admatechs Corporation ※7: 2-Ethyl-4-methylimidazole; manufactured by Shikoku Chemical Industries, Ltd. ※8: TEISANRESIN, 15% solid content MEK (methyl ethyl ketone) solution; manufactured by Nagase ChemteX Corporation. The methyl ethyl ketone in this solution is used as a solvent with a boiling point of more than 60°C and less than 130°C.
實施例1：1層型乾式薄膜的製作 將所得到之熱硬化性樹脂組成物，使用桿塗佈器而塗佈於PET薄膜(脫模處理PET薄膜；TN200：厚度38μm)，再以由熱風循環式乾燥爐，以100℃進行20分鐘乾燥，在厚度200μm的單面(與PET薄膜相反側的面)得到溶劑之剩餘含有量少之乾式薄膜。然而，對於實施例1之乾式薄膜，於與樹脂層之PET薄膜相反側，層積保護膜。 ＜溶劑之剩餘含有量的測定＞ 使用TG/DTA(TA Instruments公司製TGA 5500)，將乾式薄膜之樹脂層之PET薄膜側與保護膜側各進行5mg程度削除，以10℃/分自30℃升溫至250℃，經由測定以250℃保持30分鐘之後的重量減少之時，確認到在測定樹脂層兩面的溶劑之剩餘含有量時單側的剩餘溶劑則各為0.2質量% (與PET薄膜相反側、即保護膜側)、1.9質量%(PET薄膜側)。Example 1: Preparation of a single-layer dry film The obtained thermosetting resin composition was applied to a PET film (demolded PET film; TN200: thickness 38μm) using a rod coater, and then dried at 100°C for 20 minutes in a hot air circulation drying oven to obtain a dry film with a small amount of residual solvent on a single side (the side opposite to the PET film) with a thickness of 200μm. However, for the dry film of Example 1, a protective film was laminated on the side opposite to the PET film of the resin layer. <Determination of residual solvent content> Using TG/DTA (TGA 5500 manufactured by TA Instruments), 5 mg of each of the PET film side and the protective film side of the resin layer of the dry film was removed, and the temperature was raised from 30°C to 250°C at 10°C/min. When the weight loss was measured after maintaining at 250°C for 30 minutes, it was confirmed that when the residual solvent content on both sides of the resin layer was measured, the residual solvent on one side was 0.2 mass% (the side opposite to the PET film, i.e., the protective film side) and 1.9 mass% (the PET film side).
實施例2：2層型乾式薄膜的製作 將所得到之熱硬化性樹脂組成物，使用桿塗佈器而塗佈於PET薄膜(脫模處理PET薄膜；TN200：厚度38μm)，再以由熱封循環式乾燥爐，以110℃進行15分鐘乾燥，在厚度130μm的單面(與PET薄膜相反側的面)得到溶劑之剩餘含有量少之乾式薄膜。 與實施例1同樣作為，使用TG/DTA，確認到在測定乾式薄膜之樹脂層兩面的溶劑之剩餘含有量時單側的剩餘溶劑量則各為0.3質量%(與PET薄膜相反側、即保護膜側)、1.8質量%(PET薄膜側)。 得到具有將所得到之乾式薄膜之溶劑的剩餘含有量少之樹脂層的面彼此，使用真空加壓層積器MVLP-500(日本名機社製)，以5kgf/cm2 、50℃、30秒、4hPa之條件進行重疊，在厚度260μm之中心部，溶劑的剩餘含有量少之樹脂層的乾式薄膜。Example 2: Preparation of a two-layer dry film The obtained thermosetting resin composition was applied to a PET film (mold-released PET film; TN200: thickness 38μm) using a rod coater, and then dried in a heat-sealed circulating drying oven at 110°C for 15 minutes to obtain a dry film with a low residual solvent content on one side (the side opposite to the PET film) with a thickness of 130μm. In the same manner as in Example 1, TG/DTA was used to confirm that when the residual solvent content on both sides of the resin layer of the dry film was measured, the residual solvent content on one side was 0.3 mass % (the side opposite to the PET film, i.e., the protective film side) and 1.8 mass % (the PET film side). The surfaces of the obtained dry film having a resin layer with a small amount of residual solvent were superimposed on each other using a vacuum pressure laminator MVLP-500 (manufactured by Meiki Co., Ltd.) at 5 kgf/cm 2 , 50° C., 30 seconds, and 4 hPa, and a dry film having a resin layer with a small amount of residual solvent in the center portion with a thickness of 260 μm was obtained.
實施例3：1層型乾式薄膜的製作 將所得到之熱硬化性樹脂組成物，使用桿塗佈器而塗佈於PET薄膜(脫模處理PET薄膜；TN201：厚度50μm)，再以由熱風循環式乾燥爐，以100℃進行15分鐘乾燥，在厚度200μm的單面(與PET薄膜相反側的面)得到溶劑之剩餘含有量少之乾式薄膜。 與實施例1同樣作為，使用TG/DTA，確認到在測定乾式薄膜之樹脂層兩面的殘留溶劑之時單側的剩餘溶劑則各為2.3質量%(與PET薄膜相反側)、3.3質量%(PET薄膜側)。Example 3: Preparation of a single-layer dry film The obtained thermosetting resin composition was applied to a PET film (mold-released PET film; TN201: thickness 50 μm) using a rod coater, and then dried in a hot air circulation drying oven at 100°C for 15 minutes to obtain a dry film with a small amount of residual solvent on one side (the side opposite to the PET film) with a thickness of 200 μm. As in Example 1, TG/DTA was used to confirm that when the residual solvent on both sides of the resin layer of the dry film was measured, the residual solvent on one side was 2.3 mass % (the side opposite to the PET film) and 3.3 mass % (the side of the PET film).
比較例1：1層型乾式薄膜的製作 將所得到之熱硬化性樹脂組成物，使用桿塗佈器而塗佈於PET薄膜(脫模處理PET薄膜；TN200：厚度38μm)，再以由熱風循環式乾燥爐，以80℃進行20分鐘乾燥，得到具有厚度200μm的溶劑之剩餘含有量多之樹脂層的乾式薄膜。 與實施例1同樣作為，使用TG/DTA，確認到在測定乾式薄膜之樹脂層兩面的殘留溶劑量時單側的剩餘溶劑量則各為2.5質量%(與PET薄膜相反側、即保護膜側)、2.6質量%(PET薄膜側)。Comparative Example 1: Preparation of a single-layer dry film The obtained thermosetting resin composition was applied to a PET film (mold-released PET film; TN200: thickness 38 μm) using a rod coater, and then dried in a hot air circulation drying oven at 80°C for 20 minutes to obtain a dry film having a resin layer with a thickness of 200 μm and a large amount of residual solvent. As in Example 1, TG/DTA was used to confirm that when the residual solvent amount on both sides of the resin layer of the dry film was measured, the residual solvent amount on one side was 2.5% by mass (the side opposite to the PET film, i.e., the protective film side) and 2.6% by mass (the PET film side).
比較例2：1層型乾式薄膜的製作 將所得到之熱硬化性樹脂組成物，使用桿塗佈器而塗佈於PET薄膜(脫模處理PET薄膜；TN200：厚度38μm)，再以由熱風循環式乾燥爐，以80℃進行45分鐘充分乾燥，得到具有厚度200μm的溶劑之剩餘含有量少之樹脂層的乾式薄膜。 與實施例1同樣作為，使用TG/DTA，確認到在測定乾式薄膜之樹脂層兩面的溶劑之剩餘含有量時單側的剩餘溶劑則各為0.3質量%(與PET薄膜相反側、即保護膜側)、0.35質量%(PET薄膜側)。Comparative Example 2: Preparation of a single-layer dry film The obtained thermosetting resin composition was applied to a PET film (mold-released PET film; TN200: thickness 38μm) using a rod coater, and then fully dried in a hot air circulation drying oven at 80°C for 45 minutes to obtain a dry film having a resin layer with a thickness of 200μm and a small amount of residual solvent. As in Example 1, TG/DTA was used to confirm that when the residual solvent content on both sides of the resin layer of the dry film was measured, the residual solvent on one side was 0.3 mass% (the side opposite to the PET film, i.e., the protective film side) and 0.35 mass% (the PET film side).
＜試驗用基板(晶片零件式樣)的製作＞ 對於厚度1.2mm之玻璃板，將日本太陽油墨製之乾式薄膜PSR-4000AUS410(厚度：20μm)，使用真空加壓層積器MVLP-500((股)日本名機製作所社製)，以0.1MPa、75℃、1分、4hPa之條件進行重疊加熱層積。接著，使用金屬鹵化物燈((股)OAK公司製HMW680GW)，以500mJ/cm2 之曝光量進行圖案曝光。更且，以1質量%之Na2 CO3 水溶液進行顯像，將1mm角之硬化物形成9個於玻璃板上。此1mm角之硬化物係取代中空裝置之突起電極。 於所形成之9個的硬化物上，將18mm角之厚度0.15mm之外蓋玻璃(MATSUNAMI製)，使用真空加壓層積器MVLP-500(日本名機社製)，以0.1MPa、100℃、1分、4hPa之條件對於試驗用基板進行加熱重疊，再由熱風循環乾燥爐，以150℃進行30分鐘加熱，得到試驗用基板。上述外蓋玻璃係取代機能元件，即晶片零件。<Preparation of test substrate (chip part sample)> For a glass plate with a thickness of 1.2mm, a dry film PSR-4000AUS410 (thickness: 20μm) manufactured by Japan Solar Ink was laminated and heated using a vacuum pressure laminator MVLP-500 (manufactured by Nippon Meiki Seisakusho Co., Ltd.) at 0.1MPa, 75℃, 1 minute, and 4hPa. Then, a metal halide lamp (HMW680GW manufactured by OAK Co., Ltd.) was used to expose the pattern at an exposure dose of 500mJ/ cm2 . Furthermore, development was performed using a 1 mass% Na2CO3 aqueous solution to form 9 1mm-square hardened products on the glass plate. This 1mm-square hardened product is a protruding electrode that replaces the hollow device. On the 9 hardened products, a cover glass with a thickness of 0.15mm and a corner of 18mm was placed (made by MATSUNAMI) and the test substrate was heated and superimposed using a vacuum pressure laminator MVLP-500 (made by Japan Meiki Co., Ltd.) at 0.1MPa, 100℃, 1 minute, 4hPa, and then heated at 150℃ for 30 minutes in a hot air circulation drying furnace to obtain a test substrate. The cover glass replaces the functional element, that is, the chip part.
＜評估基板的製作＞ 對於實施例2及比較例1，2之乾式薄膜，使用真空加壓層積器MVLP-500(日本名機社製)，樹脂層則呈接合於試驗用基板之外蓋玻璃，以0.5MPa、100℃、1分、4hPa之條件進行加熱層積，再由熱風循環乾燥爐，以100℃進行30分鐘加熱，之後，剝離PET薄膜，再由熱風循環乾燥爐，以180℃進行60分鐘加熱，使樹脂層硬化，得到試驗用基板。對於實施例1，3之乾式薄膜，係在剝離PET薄膜之後，樹脂層則呈接合於試驗用基板之外蓋玻璃而進行加熱層積，之後剝離保護膜以外係由和實施例2同樣步驟而得到試驗用基板。<Production of evaluation substrate> For the dry films of Example 2 and Comparative Examples 1 and 2, a vacuum pressure laminator MVLP-500 (manufactured by Meiki Co., Ltd., Japan) was used. The resin layer was bonded to the test substrate with a cover glass. The lamination was performed under the conditions of 0.5MPa, 100℃, 1 minute, and 4hPa. The film was then heated at 100℃ for 30 minutes in a hot air circulation drying oven. After that, the PET film was peeled off and heated at 180℃ for 60 minutes in a hot air circulation drying oven to harden the resin layer and obtain the test substrate. For the dry film of Examples 1 and 3, after the PET film is peeled off, the resin layer is bonded to the test substrate and the cover glass is heated and laminated. After that, except for peeling off the protective film, the test substrate is obtained by the same steps as Example 2.
＜位置配合性＞ 對於層積前後的乾式薄膜的位置偏移，以目視進行確認。評估基準係如以下。 〇：偏移無 ×：偏移有<Position matching> The positional deviation of the dry film before and after lamination was visually checked. The evaluation criteria are as follows. 0: No deviation ×: Deviated
＜埋入性＞ 對於層積後之晶片零件背側之樹脂層的埋入性，以光學顯微鏡進行確認。評估基準係如以下。 〇：流入至晶片下部不足100μm ×：流入至晶片下部100μm以上、或於較晶片端部為外側有100μm以上之空間<Embedding property> The embedding property of the resin layer on the back side of the chip component after lamination was confirmed with an optical microscope. The evaluation criteria are as follows. 0: Flowing into the lower part of the chip less than 100μm ×: Flowing into the lower part of the chip more than 100μm, or there is a space of more than 100μm outside the edge of the chip
[表2]
從上述表2所示之結果，實施例1，2，3之乾式薄膜係對於乾式薄膜之位置配合性優越，對於晶片下部之樹脂的流入為少。另一方面，比較例1係樹脂層之流入為多。另外，比較例2係乾式薄膜之位置配合為困難，並且埋入性為不充分。From the results shown in Table 2 above, the dry films of Examples 1, 2, and 3 are superior in positional coordination with respect to the dry films, and the resin inflow to the lower part of the chip is small. On the other hand, the resin inflow to the lower part of the chip is large in Comparative Example 1. Moreover, the positional coordination with respect to the dry films of Comparative Example 2 is difficult, and the embedding property is insufficient.
1:乾式薄膜 1: Dry film
2:載體膜 2: Carrier film
3:樹脂層 3: Resin layer
4:保護膜 4: Protective film
3a,3b:範圍 3a,3b: Scope
Claims (5)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019-067803 | 2019-03-29 | ||
| JP2019067803 | 2019-03-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202044939A TW202044939A (en) | 2020-12-01 |
| TWI844644B true TWI844644B (en) | 2024-06-11 |
Family
ID=
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013121689A1 (en) | 2012-02-15 | 2013-08-22 | 株式会社村田製作所 | Electronic part and method of manufacture thereof |
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013121689A1 (en) | 2012-02-15 | 2013-08-22 | 株式会社村田製作所 | Electronic part and method of manufacture thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP7484980B2 (en) | Cured product and method for producing same, resin sheet and resin composition | |
| JP2008163330A (en) | Polyamide resin-containing varnish | |
| JP7169076B2 (en) | Thermosetting resin composition, dry film, cured product, and electronic component | |
| TWI714240B (en) | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | |
| TW201940334A (en) | Dry film, hardened object, and electronic part provides a dry film with good adhesion between the resin layer and the protective film | |
| JP2023131714A (en) | resin composition | |
| JP2020100699A (en) | Resin composition | |
| TWI844644B (en) | Dry films, hardened materials and electronic parts for hollow devices | |
| KR102313172B1 (en) | Dry film, cured product, and electronic component | |
| JP7133955B2 (en) | Thermosetting resin composition, dry film, cured product, and electronic component | |
| CN113396056B (en) | Dry film for hollow device, cured product, and electronic component | |
| WO2020195843A1 (en) | Dry film, cured article, and electronic component | |
| JP7300601B2 (en) | Thermosetting resin composition, dry film, cured product, and electronic component | |
| US20210363342A1 (en) | Resin composition | |
| JP2022088223A (en) | Resin composition | |
| JP7454394B2 (en) | Dry film, cured product, electronic components, and dry film manufacturing method | |
| WO2020116512A1 (en) | Curable resin composition, dry film, resin-clad copper foil, cured product, and electronic component | |
| CN112940452B (en) | Resin composition | |
| KR102264247B1 (en) | Epoxy resin composition for molding semiconductor, molding film and semiconductor package using the same | |
| JP2022166615A (en) | Manufacturing method of wiring board | |
| JP2024058172A (en) | Resin composition | |
| JP2022094688A (en) | Thermosetting resin composition, and semiconductor device | |
| CN117903563A (en) | Resin composition | |
| KR20150025991A (en) | Adhesive composition for semiconductor, adhesive film, and semiconductive device | |
| CN116615509A (en) | Epoxy resin composition, adhesive film, printed circuit board, semiconductor chip package, semiconductor device, and method for using adhesive film |