TWI843617B - Article with embedded heater trace and manufacturing method thereof - Google Patents
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- TWI843617B TWI843617B TW112124196A TW112124196A TWI843617B TW I843617 B TWI843617 B TW I843617B TW 112124196 A TW112124196 A TW 112124196A TW 112124196 A TW112124196 A TW 112124196A TW I843617 B TWI843617 B TW I843617B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 229920001169 thermoplastic Polymers 0.000 claims abstract description 65
- 239000004416 thermosoftening plastic Substances 0.000 claims abstract description 64
- 239000000758 substrate Substances 0.000 claims abstract description 63
- 239000004033 plastic Substances 0.000 claims abstract description 36
- 238000001746 injection moulding Methods 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 239000011347 resin Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 238000005485 electric heating Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
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- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 101000827703 Homo sapiens Polyphosphoinositide phosphatase Proteins 0.000 description 1
- 102100023591 Polyphosphoinositide phosphatase Human genes 0.000 description 1
- 101100233916 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) KAR5 gene Proteins 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
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- 229920001187 thermosetting polymer Polymers 0.000 description 1
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Abstract
一種包埋加熱器跡線的物件及其製造方法，包含：將一加熱器跡線結合於一熱塑性基材的其中一個表面；將附有該加熱器跡線的該熱塑性基材定位在一注塑成型模具的一空腔中；將加熱熔融的一塑料注入該模具中；熔融的該塑料注入模具中與該熱塑性基材接觸時，該熱塑性基材被熔化掉而混合在熔融的該塑料當中，該加熱器跡線被熔融的該塑料全面包覆；以及熔融的該塑料在該模具中完成冷卻程序成型為一物件；該加熱器跡線完全被包埋在該物件中，在該物件的表面沒有曝露任何的該加熱器跡線。 An object with embedded heater traces and a manufacturing method thereof, comprising: combining a heater trace with one of the surfaces of a thermoplastic substrate; positioning the thermoplastic substrate with the heater trace in a cavity of an injection molding mold; injecting a heated and molten plastic into the mold; when the molten plastic is injected into the mold and contacts the thermoplastic substrate, the thermoplastic substrate is melted and mixed in the molten plastic, and the heater trace is fully covered by the molten plastic; and the molten plastic is cooled in the mold to form an object; the heater trace is completely embedded in the object, and no heater trace is exposed on the surface of the object.
Description
本發明技術領域涉及燈罩、透鏡、觀視窗等物件設置電熱元件的方法及其結構。 The technical field of the invention relates to the method and structure of installing electric heating elements on lampshades, lenses, viewing windows and other objects.
燈罩、透鏡等物件，若因濕氣結霧將導致光的行進被阻礙，亦會遮蔽通過該物件的使用者視野。此類物件可通過電熱方式達到防止起霧的目的。例如，在該物件的表面附設電熱絲，當電熱絲通電而產熱時，該物件的表面溫度上升使其不易結霧。 If objects such as lampshades and lenses are fogged by moisture, the light will be blocked and the vision of users passing through the object will be obstructed. Such objects can be prevented from fogging by electric heating. For example, a heating wire is attached to the surface of the object. When the heating wire is energized and generates heat, the surface temperature of the object rises, making it less likely to fog.
US10364954B2(以下簡稱954案)揭露一種照明系統的透鏡加熱系統及方法，包括熱塑性基材，以及在該熱塑性基材上的導電油墨或膜電路。導電油墨或膜電路在產品階段需耦合到加熱器電路。導電油膜或膜電路被印刷在熱塑性基材的表面。 US10364954B2 (hereinafter referred to as Case 954) discloses a lens heating system and method for a lighting system, including a thermoplastic substrate, and a conductive ink or film circuit on the thermoplastic substrate. The conductive ink or film circuit needs to be coupled to a heater circuit at the product stage. The conductive oil film or film circuit is printed on the surface of the thermoplastic substrate.
上述954案的圖16和圖17，帶有印刷導電油墨圖案的熱塑性基材被放置在模具芯的凹部中，導電油墨圖案抵靠模具芯。然後，樹脂注入模中，包覆成型於該熱塑性基材，並且樹脂(透鏡)僅粘合到熱塑性基材的未印刷側。在這種佈置中，導電油墨圖案可以保持暴露在最終的照明系統的透鏡表面。 In Figures 16 and 17 of the above-mentioned 954, the thermoplastic substrate with the printed conductive ink pattern is placed in the recess of the mold core, and the conductive ink pattern is against the mold core. Then, the resin is injected into the mold, overmolded to the thermoplastic substrate, and the resin (lens) is bonded only to the unprinted side of the thermoplastic substrate. In this arrangement, the conductive ink pattern can remain exposed on the lens surface of the final lighting system.
上述954案的圖18和圖19，熱塑性基材被放置成抵靠於模具的腔側。然後，樹脂注入模中，成型後，導電油墨圖案被封裝在熱塑性基材以 及樹脂(透鏡)之間。 In Figures 18 and 19 of the above-mentioned 954 case, the thermoplastic substrate is placed against the cavity side of the mold. Then, the resin is injected into the mold, and after molding, the conductive ink pattern is encapsulated between the thermoplastic substrate and the resin (lens).
本發明所欲解決的問題點： Problems that this invention aims to solve:
上開先前技術的圖16和圖17，將熱塑性基材上的導電油墨或膜電路曝露於透鏡的內側和或外側的至少一個。換言之，導電油墨或膜電路不在透鏡的內部。導電油墨或膜電路容易受到環境的影響，例如氧化、塩化。 Referring to Figures 16 and 17 of the prior art, the conductive ink or film circuit on the thermoplastic substrate is exposed to at least one of the inner side and/or outer side of the lens. In other words, the conductive ink or film circuit is not inside the lens. The conductive ink or film circuit is easily affected by the environment, such as oxidation and salination.
導電油墨或膜電路容易發生與熱塑性基材剝離的現象，尤其在樹脂透鏡為多曲率變化時，熱塑性基材因彎曲應力而導致導電油墨或膜電路產生剝離或碎裂。 Conductive ink or film circuits are prone to peeling off from thermoplastic substrates, especially when the resin lens has multiple curvature changes. The thermoplastic substrate may peel off or break due to bending stress.
上開先前技術的熱塑性基材在透鏡中仍然以實體膜層存在，僅管它的厚度很薄，但它仍然是一個實體層。熱塑性基材與樹脂共同支撐著導電油墨或膜電路。在車輛照明燈的例子中，熱塑性基材與樹脂的折射率不同，會影響車燈的出射光，使其發生非預期的折射，影響車燈照明。 The thermoplastic substrate of the previous technology still exists as a solid film layer in the lens. Although it is very thin, it is still a solid layer. The thermoplastic substrate and the resin jointly support the conductive ink or film circuit. In the example of vehicle lighting, the different refractive indices of the thermoplastic substrate and the resin will affect the emitted light of the vehicle lights, causing unexpected refraction and affecting the lighting of the vehicle lights.
本發明解決上述問題的技術方案是：通過本發明的製造方法，將導電油墨或膜電路(在本發明中稱之為加熱器跡線)包埋在透鏡內部，換言之，加熱器跡線不曝露在透鏡的表面。 The technical solution of the present invention to solve the above problem is: through the manufacturing method of the present invention, the conductive ink or membrane circuit (referred to as the heater trace in the present invention) is embedded inside the lens, in other words, the heater trace is not exposed on the surface of the lens.
本發明所技術特徵： Technical features of the invention:
一種包埋加熱器跡線的物件的製造方法，包含： A method for manufacturing an object with embedded heater traces, comprising:
將一加熱器跡線結合於一熱塑性基材的其中一個表面； Bonding a heater trace to one surface of a thermoplastic substrate;
將附有該加熱器跡線的該熱塑性基材定位在一注塑成型模具的一空腔中； Positioning the thermoplastic substrate with the heater trace attached in a cavity of an injection molding mold;
將加熱熔融的一塑料注入該模具中；熔融的該塑料的加熱溫度等 於或高於該熱塑性基材的融點；熔融的該塑料注入模具中與該熱塑性基材接觸時，該熱塑性基材被熔化掉而混合在熔融的該塑料當中，該加熱器跡線被熔融的該塑料全面包覆；以及熔融的該塑料在該模具中完成冷卻程序成型為該物件；該加熱器跡線完全被包埋在該物件中，在該物件的表面沒有曝露任何的該加熱器跡線。 A heated molten plastic is injected into the mold; the heating temperature of the molten plastic is equal to or higher than the melting point of the thermoplastic substrate; when the molten plastic is injected into the mold and contacts the thermoplastic substrate, the thermoplastic substrate is melted and mixed in the molten plastic, and the heater trace is fully covered by the molten plastic; and the molten plastic completes the cooling process in the mold to form the object; the heater trace is completely embedded in the object, and no heater trace is exposed on the surface of the object.
與先前技術相較，本發明的有益功效在於：本發明之製造方法可將該加熱器跡線完全被包埋在該物件中，在該物件的表面沒有曝露任何的該加熱器跡線。 Compared with the prior art, the beneficial effect of the present invention is that the manufacturing method of the present invention can completely embed the heater trace in the object, and no heater trace is exposed on the surface of the object.
該加熱器跡線完全被包埋在該物件中，可以完全避免加熱器跡線受環境影響而氧化、塩化、剝離、斷裂等問題。 The heater trace is completely embedded in the object, which can completely prevent the heater trace from being affected by the environment and causing oxidation, salination, peeling, and breaking.
該加熱器跡線可以順應該物件的多曲面。 The heater trace can conform to multiple curved surfaces of the object.
用來支撐加熱器跡線的熱塑性基材，在製程的模具中會融熔於塑料中。 The thermoplastic matrix used to support the heater traces is melted into the plastic in the mold during the manufacturing process.
10:加熱器跡線 10: Heater traces
11:連接介面 11: Connection interface
12:熱塑性基材 12: Thermoplastic substrate
13:模具 13: Mould
131:空腔 131: Cavity
132:壁 132: Wall
133:芯 133: Core
14:加熱熔融的塑料 14: Heat the molten plastic
15:物件 15: Objects
S100:步驟 S100: Step
S101:步驟 S101: Step
S102:步驟 S102: Step
S103:步驟 S103: Step
〔圖1〕本發明製造方法流程圖。 [Figure 1] Flow chart of the manufacturing method of the present invention.
〔圖2〕外觀示意圖，描述圖1中步驟S100的加熱器跡線和熱塑性基材的。 [Figure 2] Schematic diagram of the appearance, describing the heater traces and thermoplastic substrate of step S100 in Figure 1.
〔圖3〕剖面示意圖，描述圖1步驟S100的加熱器跡線和熱塑性基材。 [Figure 3] Schematic cross-sectional view illustrating the heater trace and thermoplastic substrate of step S100 of Figure 1.
〔圖4〕剖面示意圖，描述圖1步驟S101的熱塑性基材定位在一注塑成型模具的空腔中。 [Figure 4] Schematic cross-sectional view illustrating the positioning of the thermoplastic substrate in step S101 of Figure 1 in the cavity of an injection molding mold.
〔圖5〕剖面示意圖，描述圖1步驟S102加熱熔融的塑料注入該模具中。 [Figure 5] Schematic cross-sectional view, describing the step S102 of Figure 1 where the heated molten plastic is injected into the mold.
〔圖6〕剖面示意圖，描述圖1在步驟S103中所產生的一個物件。 [Figure 6] Schematic cross-sectional view illustrating an object generated in step S103 of Figure 1.
為便於說明本發明於上述發明內容一欄中所表示的中心思想，茲以具體實施例表達。實施例中各種不同物件係按適於說明之比例、尺寸、變形量或位移量而描繪，而非按實際元件的比例予以繪製，合先敘明。且以下的說明中，相同和對稱配置的元件是以相同的編號來表示。 In order to facilitate the explanation of the central idea of the present invention in the above invention content column, it is expressed by a specific embodiment. The various objects in the embodiment are depicted according to the proportions, sizes, deformations or displacements suitable for the description, rather than being drawn according to the proportions of the actual components. In the following description, the same and symmetrically arranged components are represented by the same number.
如圖1，本發明包埋加熱器跡線的物件的製造方法，該物件15可以是燈罩、視窗、或透鏡；製造方法包含：
As shown in Figure 1, the manufacturing method of the object with embedded heater traces of the present invention, the
步驟S100，將加熱器跡線10結合於一熱塑性基材12的其中一個表面。加熱器跡線10的材料包含但不限於銀、銅、碳或石墨、氧化銦錫。可以使用其他導電材料，只要它們可以滿足各種應用的總體電阻要求。通過已知的絲網印刷、黏貼、塗佈、沈積、顯影蝕刻等技術在熱塑性基材12上建立該加熱器跡線10和其連接介面11。所述的連接介面11全部或一部分超出該熱塑性基材12的邊緣，以便該連接介面11連接到一加熱器電路(圖未示)，該加熱器跡線10被用於該物件15的電熱元件，避免該物件15的濕氣和結霧。可依需求而改變加熱器跡線10在熱塑性基材12表面的分佈位置、圖樣、或密度，不以本發明圖例只是一個例子，並非限制本發明。熱塑性基材12是塑膠材料，通過射出成型方式製成，材料包含但不限於聚碳酸酯(Polycarbonate,PC)。其他的塑膠材料也可以被使用。
Step S100, the
步驟S101，將附有加熱器跡線10的熱塑性基材12定位在一注塑成型模具13的空腔131中，以生產具有電熱元件的物件15。可以將沒有加熱器跡線10的熱塑性基材12的一側靠著空腔131的壁132放置，或者，
將沒有加熱器跡線10的熱塑性基材12的一側與空腔131的壁132保持一個距離，而加熱器跡線10則背對空腔131的壁132，並且與模具13的芯133也保持一個距離。可採取任何已知的模具13設計方案，來達到步驟S101中的熱塑性基材12的定位，而超出該熱塑性基材12邊緣的該連接介面11也可以被模具13所支持。
In step S101, a
步驟S102，加熱熔融的塑料14注入該模具13中。所述的塑料14可以是熱固性塑料(包含但不限於樹脂)或熱塑性塑料(包含但不限於聚碳酸酯)。具體的，注入該模具13中的塑料14與步驟S101中所述的熱塑性基材12為相同材料。熔融的塑料14的加熱溫度等於或略高於(攝氏1~2度)前述步驟中的熱塑性基材12的融點。當熔融的塑料14注入模具13中與所述的熱塑性基材12接觸時，熱塑性基材12可以被熔化掉而混合在熔融的塑料14當中。這樣的好處是，當熱塑性基材12被熔化掉，但加熱器跡線10仍然被熔融的塑料14包覆支撐，因此加熱器跡線10在模具13中不會因失去支撐而變形。熔融的塑料14完全的包覆該加熱器跡線10。
In step S102, the heated molten plastic 14 is injected into the
步驟S103，熔融的塑料14在該模具13中完成冷卻程序成型為該物件15，該加熱器跡線10完全被包埋在該物件15中，在物件15的表面沒有曝露任何的加熱器跡線10。
Step S103, the
如圖2，描述在步驟S100中的加熱器跡線10和熱塑性基材12的示意圖。熱塑性基材12的一個表面結合加熱器跡線10和其連接介面11。所述的連接介面11可以全部或以一部分超出該熱塑性基材12的邊緣。熱塑性基材12是由塑膠材射出成型的一個硬基材。
As shown in FIG. 2 , a schematic diagram of the
如圖3，以剖面示意圖描述在步驟S100中的加熱器跡線10和熱塑
性基材12。
As shown in FIG3 , the
如圖4，以剖面示意圖描述在步驟S101中，熱塑性基材12如何定位在一注塑成型模具13的空腔131中。沒有加熱器跡線10的熱塑性基材12的一側相對於空腔131的壁132。加熱器跡線10背對空腔131的壁132，並且與模具13的芯133保持一個距離。超出該熱塑性基材12邊緣的該連接介面11也可以被模具13所支持。
As shown in FIG4 , a cross-sectional schematic diagram is used to describe how the
如圖5，以剖面示意圖描述在步驟S102中，加熱熔融的塑料14注入該模具13中。熱塑性基材12被熔化掉，以至於熔融的塑料14完全的包覆加熱器跡線10，但沒有包覆該連接介面11。
As shown in FIG5 , a cross-sectional schematic diagram shows that in step S102, the heated molten plastic 14 is injected into the
如圖6，以剖面示意圖描述在步驟S103中所產生的一個物件15。熔融的塑料14完成冷卻程序成型為物件15，該加熱器跡線10完全被包埋在該物件15中，沒有曝露在物件15的表面。
As shown in FIG6 , an
在以上的剖面示意圖中，模具13的空腔131和芯133依據需要而設計為多曲面的輪廓，因此所生產的物件15也會是多曲面的。較佳的，在步驟S100中的熱塑性基材12也可以按照物件15的多曲面需求而預成型為相同多曲面硬膜。佈局在熱塑性基材12上的加熱器跡線10也大致的順應物件15的多曲面。然而，在步驟S100中的熱塑性基材12也可以是平面的，通過模具13的空腔131和芯133的合模和注料，而改變加熱器跡線10使其產生大致符合物件15的多曲面。
In the above cross-sectional diagram, the
同樣的，物件15也可以是平面物件，其內部的加熱器跡線10也是平面的。
Similarly, object 15 may also be a planar object, and the
S100:步驟 S100: Step
S101:步驟 S101: Step
S102:步驟 S102: Step
S103:步驟 S103: Step
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US10364954B2 (en) | 2015-06-15 | 2019-07-30 | J.W. Speaker Corporation | Lens heating systems and methods for an LED lighting system |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10364954B2 (en) | 2015-06-15 | 2019-07-30 | J.W. Speaker Corporation | Lens heating systems and methods for an LED lighting system |
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